CN102161135A - Lead-free welding tin wire and water-soluble welding flux used by same - Google Patents
Lead-free welding tin wire and water-soluble welding flux used by same Download PDFInfo
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- CN102161135A CN102161135A CN2011100790196A CN201110079019A CN102161135A CN 102161135 A CN102161135 A CN 102161135A CN 2011100790196 A CN2011100790196 A CN 2011100790196A CN 201110079019 A CN201110079019 A CN 201110079019A CN 102161135 A CN102161135 A CN 102161135A
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Abstract
The invention discloses a lead-free welding tin wire and a water-soluble welding flux used by the same. The lead-free welding tin wire comprises a copper-tin alloy wire provided with a hole cavity and the water-soluble welding flux arranged in the hole cavity; the proportion of the copper-tin alloy wire and the water-soluble welding flux is as follows: 2.0-2.2wt% of the water-soluble welding flux and the balance of the copper-tin alloy wire, wherein the copper-tin alloy wire comprises the following components: 0.75-1.0wt% of Cu and the balance of Sn; the water-soluble welding flux comprises the following components: 20-30wt% of coconut oil alkyl carbinamine, 30-40wt% of octadecyl amine polyoxyethylene ether, 1-3wt% of diethylammonium chloride and the balance of water-soluble macromoleclar polymer; the ammonium salt halogenide is diethylammonium chloride; and the water-soluble macromoleclar polymer is polyethylene glycol with the molecular weight of 200-2000. The lead-free welding tin wire provided by the invention has better welding performance and the water-soluble welding flux provided by the invention has better wettability.
Description
Technical field
The invention belongs to the scaling powder technical field, be specifically related to a kind of lead-free soldering wire and used water-soluble flux thereof.
Background technology
Soldering paste is slurry or the body of paste that is evenly mixed by solder alloy powder, pasty state scaling powder, it is indispensable raw material in electronic product surface installation technique (SMT) process, be widely used in Reflow Soldering, be used to realize machinery and electrical interconnection between electronic devices and components and substrate.Arrival along with the unleaded epoch of SMT, aspect scolder, successfully developed Sn-Ag system at present, Sn-Cu system, the Pb-free solder material of multiple formulations such as Sn-Ag-Cu system, because the unable chemical property of lead-free solder is (as fusing point, surface tension and oxidation resistance etc.) change cause original welding procedure to change, pre-heating temperature elevation speed obviously reduces, the active region mean temperature improves about 10 degrees centigrade, the backflow peak temperature brings up to 235～240 by 201～225, thereby to the activation characteristic of SMT with solder(ing) paste, heat endurance, hear resistance and volatility etc. have proposed new requirement, can not apply in the welding procedure of existing electronic product, and because it contains lead, the Halogen lamp LED noxious material does not meet the requirement of world's environmental protection trend.
Six kinds of harmful substances that RoHS (harmful substance restriction) instruction of implementing on July 1st, 2006 bans use of in electronic product and printed circuit board (PCB) only limit PBDEs (PBDE), the PBBs (PBB) that contains in the halogen.But in fact, except that PBDEs, PBBs, contain under the circuit board of halogen and the unburnt situation of electronic product and can produce many byproducts, comprise dioxin (Dioxin) and furfuran compound (Furan-likecompound), and acidity or corrosive gas, these byproducts are equally to environment and people's healthy potential serious harm.Along with the whole world is more and more higher to requirement on environmental protection; people halogen-free manufacturing wiring board has been stipulated used electronic welding material, resin and the material of strengthening the property in the high-load of halogen, halogen-free become RoHS on July 1st, 2006 (harmful substance restriction) instruction that continues and implement since green revolution again of electron trade.
Tradition solder stick scaling powder prime cost is rosin, halogen material and solvent, and its halogen residue is many, has not met the development of current environmental protection trend, and will clean with freon after its welding, has caused very big harm to environment especially.For being suitable for current environmental protection trend, electronics, the many producers of electrical equipment and solder field have dropped into the scientific research that a large amount of technical forces carry out the halogen-free electronic product, strive releasing high-quality halogen-free lead-free soldering flux system product.
Summary of the invention
The purpose of this invention is to provide a kind of lead-free soldering wire with better welding performance.
Another object of the present invention provides a kind of water-soluble flux that has better wettability and exempt to clean.
The technical scheme that realizes first purpose of the present invention is: a kind of lead-free soldering wire comprises signal bronze silk that is provided with vestibule and the water-soluble flux that is arranged in the described vestibule; The proportioning of described signal bronze silk and water-soluble flux is:
Water-soluble flux 2.0～2.2%;
Signal bronze silk surplus;
Wherein said signal bronze silk comprises following component:
Cu 0.75～1.0％；
The Sn surplus;
Wherein said water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 20～30%;
Stearylamine APEO 30～40%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent;
Described ammonium salt class halide is diethylamine hydrochloride;
Described high molecular weight water soluble polymer is that molecular weight is 200 to 2000 polyethylene glycol.
Such scheme is further preferably: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 24～28%;
Stearylamine APEO 34～38%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
Such scheme is further preferably: the molecular weight of described polyethylene glycol is 1500 to 2000, and hydroxyl value is 51～79.
Such scheme is further preferably: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 26%;
Stearylamine APEO 36%;
Diethylamine hydrochloride 2%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
The technical scheme that realizes second purpose of the present invention is: a kind of water-soluble flux that is used for the Pb-free solder material comprises following component:
Cocounut oil kiber alkyl amine 20～30%;
Stearylamine APEO 30～40%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent;
Described ammonium salt class halide is diethylamine hydrochloride;
Described high molecular weight water soluble polymer is that molecular weight is 200 to 2000 polyethylene glycol.
Such scheme is further preferably: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 24～28%;
Stearylamine APEO 34～38%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
Such scheme is further preferably: the molecular weight of described polyethylene glycol is 1500 to 2000, and hydroxyl value is 51～79.
Such scheme is further preferably: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 26%;
Stearylamine APEO 36%;
Diethylamine hydrochloride 2%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
The present invention has positive effect: the water-soluble flux among (1) the present invention adopts high molecular weight water soluble polymer to substitute rosin as carrier owing to do not contain resin, is beneficial to the postwelding water and cleans, and reduces the environmental pollution of using chloride cleaning agent to bring.Simultaneously; the scaling powder system of the cocounut oil kiber alkyl amine of cation surfactant and non-ionic surface active agent stearylamine APEO; reduced the interfacial tension on scolder and PCB surface; can be wetting quickly when welding; do not corrode solder horn, better removed the oxide of welding position, make the wetting welding position of tin energy; thereby low smog, nothing are splashed when realizing welding, and the welding position of protection solder joint can not continue oxidation when welding.
The specific embodiment
(embodiment 1, lead-free soldering wire)
Present embodiment is a kind of lead-free soldering wire, includes the signal bronze silk and the water-soluble flux that is arranged in the described vestibule of vestibule; The proportioning of described signal bronze silk and water-soluble flux is:
Water-soluble flux 2.0%;
Signal bronze silk 98%;
Wherein said signal bronze silk comprises following component:
Cu 0.75％；
Sn 99.25％；
Wherein said water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 20%;
Stearylamine APEO 30%;
Diethylamine hydrochloride 1%;
High molecular weight water soluble polymer 49%;
Above-mentioned percentage is mass percent;
Described ammonium salt class halide is diethylamine hydrochloride;
Described high molecular weight water soluble polymer is that molecular weight is 200 to 600, hydroxyl value is 51～64 polyethylene glycol.
Each material and proportioning thereof see Table 1 in the present embodiment.
(embodiment 2, lead-free soldering wire)
Embodiment 2 is substantially the same manner as Example 1, and difference is: the proportioning of signal bronze silk and water-soluble flux is in the present embodiment:
Water-soluble flux 2.2%;
Signal bronze silk 97.8%;
In addition, the proportioning of the used water-soluble flux of present embodiment and embodiment 1 are different; Relevant parameter sees Table 1 in the present embodiment.
(embodiment 3, lead-free soldering wire)
Embodiment 3 is substantially the same manner as Example 1, and difference is: the proportioning of signal bronze silk and water-soluble flux is in the present embodiment:
Water-soluble flux 2.1%;
Signal bronze silk 97.9%;
In addition, the proportioning of the used water-soluble flux of present embodiment and embodiment 1 are different; Relevant parameter sees Table 1 in the present embodiment.
(embodiment 4 to embodiment 6, lead-free soldering wire)
Embodiment 4 to embodiment 6 is substantially the same manner as Example 3, and difference is: proportioning and the embodiment 3 of each embodiment are different among the embodiment 4 to embodiment 6.
Table 1
(embodiment 7, water-soluble flux)
Present embodiment is the foregoing description 1 used water-soluble flux, comprises following component:
Cocounut oil kiber alkyl amine 20%;
Stearylamine APEO 30%;
Diethylamine hydrochloride 1%;
High molecular weight water soluble polymer 49%;
Above-mentioned percentage is mass percent;
Described ammonium salt class halide is diethylamine hydrochloride;
Described high molecular weight water soluble polymer is that molecular weight is 200 to 600, hydroxyl value is 51～64 polyethylene glycol.
Each material and proportioning thereof see Table 2 in the present embodiment.
(embodiment 8 to embodiment 12, water-soluble flux)
Embodiment 8 to embodiment 12 is substantially the same manner as Example 7, and difference is: set of dispense is than different with embodiment 7 among embodiment 8 to embodiment 12 each embodiment, and each embodiment relevant parameter sees Table 2.
Table 2
The foregoing description 1 to embodiment 6 is respectively got three parts of materials, carry out the practical operation test.Practical effect shows: can wetting faster (it is fast just to go up tin) during welding; do not corrode solder horn; better removed the oxide of welding position; make that scolding tin can wetting preferably welding position; low smog, nothing are splashed during welding, and the protection welding position can not continue oxidation when welding.
In addition, according to GB/T20422-2006, SJ/T11273-2002 standard it is tested, test event and parameter thereof see Table 3.
Table 3
Obviously, the above embodiment of the present invention only is for example of the present invention clearly is described, and is not to be qualification to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give exhaustive to all embodiments.And these belong to conspicuous variation or the change that connotation of the present invention extends out and still belong to protection scope of the present invention.
Claims (8)
1. a lead-free soldering wire comprises signal bronze silk that is provided with vestibule and the water-soluble flux that is arranged in the described vestibule; The proportioning of described signal bronze silk and water-soluble flux is:
Water-soluble flux 2.0～2.2%;
Signal bronze silk surplus;
Wherein said signal bronze silk comprises following component:
Cu 0.75～1.0％；
The Sn surplus;
Wherein said water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 20～30%;
Stearylamine APEO 30～40%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent;
Described ammonium salt class halide is diethylamine hydrochloride;
Described high molecular weight water soluble polymer is that molecular weight is 200 to 2000 polyethylene glycol.
2. lead-free soldering wire according to claim 1 is characterized in that: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 24～28%;
Stearylamine APEO 34～38%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
3. lead-free soldering wire according to claim 2 is characterized in that: the molecular weight of described polyethylene glycol is 1500 to 2000, and hydroxyl value is 51～79.
4. lead-free soldering wire according to claim 2 is characterized in that: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 26%;
Stearylamine APEO 36%;
Diethylamine hydrochloride 2%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
5. water-soluble flux that is used for the Pb-free solder material comprises following component:
Cocounut oil kiber alkyl amine 20～30%;
Stearylamine APEO 30～40%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent;
Described ammonium salt class halide is diethylamine hydrochloride;
Described high molecular weight water soluble polymer is that molecular weight is 200 to 2000 polyethylene glycol.
6. the water-soluble flux that is used for the Pb-free solder material according to claim 5 is characterized in that: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 24～28%;
Stearylamine APEO 34～38%;
Diethylamine hydrochloride 1～3%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
7. the water-soluble flux that is used for the Pb-free solder material according to claim 6 is characterized in that: the molecular weight of described polyethylene glycol is 1500 to 2000, and hydroxyl value is 51～79.
8. the water-soluble flux that is used for the Pb-free solder material according to claim 7 is characterized in that: described water-soluble flux comprises following component:
Cocounut oil kiber alkyl amine 26%;
Stearylamine APEO 36%;
Diethylamine hydrochloride 2%;
The high molecular weight water soluble polymer surplus;
Above-mentioned percentage is mass percent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110079019 CN102161135B (en) | 2011-03-30 | 2011-03-30 | Lead-free welding tin wire and water-soluble welding flux used by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110079019 CN102161135B (en) | 2011-03-30 | 2011-03-30 | Lead-free welding tin wire and water-soluble welding flux used by same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102161135A true CN102161135A (en) | 2011-08-24 |
| CN102161135B CN102161135B (en) | 2013-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110079019 Active CN102161135B (en) | 2011-03-30 | 2011-03-30 | Lead-free welding tin wire and water-soluble welding flux used by same |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922163A (en) * | 2012-11-01 | 2013-02-13 | 青岛英太克锡业科技有限公司 | Lead-free aluminum solder wire and preparation method thereof |
| CN102941415A (en) * | 2012-12-11 | 2013-02-27 | 北京达博长城锡焊料有限公司 | Halogen-free no-clean type lead-free solder wire and preparation method thereof |
| CN103909358A (en) * | 2014-03-13 | 2014-07-09 | 江苏科技大学 | Water-washing type solder paste and preparation method thereof |
| CN106514057A (en) * | 2016-12-20 | 2017-03-22 | 厦门市及时雨焊料有限公司 | Washable flux paste and soldering paste and production method thereof |
| CN107186389A (en) * | 2017-05-04 | 2017-09-22 | 深圳市堃琦鑫华股份有限公司 | A kind of wire of built-in reducing agent and preparation method thereof, application |
| CN108367394A (en) * | 2016-08-19 | 2018-08-03 | 千住金属工业株式会社 | Anti- Fe corrosion solder alloy, welding wire, cored solder wire, covers scaling powder soft solder, soldered fitting and soft soldering method at cored soft solder |
| CN108581276A (en) * | 2018-05-16 | 2018-09-28 | 深圳市绿色千田锡业科技有限公司 | A kind of water solubility lead-free soldering wire |
| CN113798724A (en) * | 2021-10-13 | 2021-12-17 | 浙江强力控股有限公司 | Soldering tin wire free of soldering flux and preparation method thereof |
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| CN101596656A (en) * | 2009-07-02 | 2009-12-09 | 东莞市中实焊锡有限公司 | A kind of aqueous cleaning soldering flux for lead-free soldering and preparation method thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922163A (en) * | 2012-11-01 | 2013-02-13 | 青岛英太克锡业科技有限公司 | Lead-free aluminum solder wire and preparation method thereof |
| CN102941415A (en) * | 2012-12-11 | 2013-02-27 | 北京达博长城锡焊料有限公司 | Halogen-free no-clean type lead-free solder wire and preparation method thereof |
| CN103909358A (en) * | 2014-03-13 | 2014-07-09 | 江苏科技大学 | Water-washing type solder paste and preparation method thereof |
| CN103909358B (en) * | 2014-03-13 | 2016-01-13 | 江苏科技大学 | A kind of washing tin cream and preparation method thereof |
| CN108367394A (en) * | 2016-08-19 | 2018-08-03 | 千住金属工业株式会社 | Anti- Fe corrosion solder alloy, welding wire, cored solder wire, covers scaling powder soft solder, soldered fitting and soft soldering method at cored soft solder |
| CN108367394B (en) * | 2016-08-19 | 2019-12-24 | 千住金属工业株式会社 | Fe corrosion-resistant solder alloy, cored solder, welding wire, cored welding wire, flux-coated solder, soldered joint and soldering method |
| US10717158B2 (en) | 2016-08-19 | 2020-07-21 | Senju Metal Industry Co., Ltd. | Solder alloy for preventing Fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method |
| CN106514057A (en) * | 2016-12-20 | 2017-03-22 | 厦门市及时雨焊料有限公司 | Washable flux paste and soldering paste and production method thereof |
| CN106514057B (en) * | 2016-12-20 | 2018-08-14 | 厦门市及时雨焊料有限公司 | A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof |
| CN107186389A (en) * | 2017-05-04 | 2017-09-22 | 深圳市堃琦鑫华股份有限公司 | A kind of wire of built-in reducing agent and preparation method thereof, application |
| CN108581276A (en) * | 2018-05-16 | 2018-09-28 | 深圳市绿色千田锡业科技有限公司 | A kind of water solubility lead-free soldering wire |
| CN113798724A (en) * | 2021-10-13 | 2021-12-17 | 浙江强力控股有限公司 | Soldering tin wire free of soldering flux and preparation method thereof |
| CN113798724B (en) * | 2021-10-13 | 2022-09-27 | 浙江强力控股有限公司 | Soldering tin wire free of soldering flux and preparation method thereof |
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