CN102157676A - Ultrathin type surface-mounted electropolar pedestal and manufacturing process thereof - Google Patents
Ultrathin type surface-mounted electropolar pedestal and manufacturing process thereof Download PDFInfo
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- CN102157676A CN102157676A CN2011100057222A CN201110005722A CN102157676A CN 102157676 A CN102157676 A CN 102157676A CN 2011100057222 A CN2011100057222 A CN 2011100057222A CN 201110005722 A CN201110005722 A CN 201110005722A CN 102157676 A CN102157676 A CN 102157676A
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- pedestal
- electric polarization
- surface mount
- fiber cloth
- piezoelectric crystal
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004744 fabric Substances 0.000 claims abstract description 37
- 239000003365 glass fiber Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000009413 insulation Methods 0.000 claims abstract description 24
- 125000006850 spacer group Chemical group 0.000 claims abstract description 24
- 239000013078 crystal Substances 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 238000007731 hot pressing Methods 0.000 claims abstract description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 239000007769 metal material Substances 0.000 claims description 39
- 230000010287 polarization Effects 0.000 claims description 34
- 239000010410 layer Substances 0.000 claims description 25
- 239000000047 product Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000000839 emulsion Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000004816 latex Substances 0.000 claims description 6
- 229920000126 latex Polymers 0.000 claims description 6
- 239000011265 semifinished product Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 229920006334 epoxy coating Polymers 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- -1 polytetrafluoroethylene Polymers 0.000 abstract description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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Abstract
The invention relates to an ultrathin type surface-mounted electropolar pedestal and a manufacturing process thereof, belonging to the technical field of piezoelectric crystal devices. The ultrathin type surface-mounted electropolar pedestal comprises glass fiber cloth, a high-temperature resistant coating and a copper foil, wherein the high-temperature resistant coating comprises a polytetrafluoroethylene coating or an epoxy resin coating, and total thickness is less than 0.25 millimeters. The manufacturing process comprises the following steps of: soaking; sintering; cutting; laminating; covering the copper foil; carrying out hot pressing; etching; cutting; and punching. The piezoelectric crystal device comprises a piezoelectric crystal element and an insulation spacer; an electrode part comprises a lead of the piezoelectric crystal element; and the insulation spacer and an electrode form the electropolar pedestal. By means of the manufacturing method, the electropolar pedestal with an ultrathin structure can be obtained by utilizing the hot pressing composition of a novel lamellar pedestal material and the copper foil; therefore, the traditional all-metal packaging SMD (Surface Mounted Device) product of an electronic element is further miniaturized and laminated, thereby reducing the product size and the production cost; in addition, the invention can promote the update of an electronic technology and a frequency element and is beneficial to the need of the development of national economy informatization.
Description
Technical field
The present invention relates to the electrode assembly and the manufacturing process thereof of all-metal material packaged type piezoelectric crystal, the manufacturing process of especially a kind of ultrathin surface mount electric polarization pedestal and this electric polarization pedestal, and the surface mount piezoelectric crystal unit that adopts this electric polarization pedestal.
Background technology
Development trend along with the Xiao Xingization ﹑ portability of electronic terminal product, the frequency components and parts are subjected to the influence of its insulation spacer, can not develop to Pian Shiization ﹑ electric polarization direction well, existing 49S/SMD insulation spacer is to adopt thermostability engineering plastic injection mo(u)ldings such as PPS, PPA, be subjected to material restriction itself, the actual used thickness of this type of insulation spacer is the thinnest at present is 0.40mm; And SNC/SUB or 2PD/4PD etc. have the insulation spacer of electrode, be with electrode with injection molded types of engineering plastics such as PPS ﹑ PPA, perhaps electrode is embedded on the insulation spacer of injection mo(u)lding in advance, its actual used thickness is the thinnest to be 1.5mm.
More than two kinds of insulation spacers seriously restricted the encapsulation of piezoelectric crystal all-metal and developed to Pian Shiization ﹑ electric polarization direction.At present, external chip components and parts have been the industry of a maturation, adopt ceramic/metal and ceramic/glass packing forms mostly, yet above-mentioned two kinds of encapsulating structures all are to adopt base of ceramic, just adopt different packing forms.But the restriction (above-mentioned three kinds of material dependence on import) that these two kinds of packing forms are subjected to its encapsulating material (pedestal, loam cake, glass cement) cost and resource provisioning with and the process attribute restriction, influenced the development of domestic chip type components and parts always.
Summary of the invention
At the deficiency of above existing chip type components and parts encapsulation technology equipment, the purpose of this invention is to provide the manufacturing process of a kind of ultrathin surface mount electric polarization pedestal and this electric polarization pedestal, and the piezoelectric crystal unit that adopts this electric polarization pedestal.
The objective of the invention is by realizing by the following technical solutions:
Ultrathin surface mount electric polarization pedestal, comprise the non-metallic material bed of material and the metal material layer that is located on the non-metallic material bed of material, the described non-metallic material bed of material and metal material layer interconnect fixing and form overall structure, described metal material layer is provided with telegraph circuit, and the thickness of described metal material layer is smaller or equal to 1/2nd of gross thickness.
As the preferred technical solution of the present invention, the gross thickness of the described non-metallic material bed of material and metal material layer is smaller or equal to 0.40 millimeter.
As the preferred technical solution of the present invention, be coated with high-temperaure coating on the described non-metallic material bed of material.
As the preferred technical solution of the present invention,
Described nonmetallic materials comprise glass fabric;
Described high-temperaure coating comprises polytetrafluorethylecoatings coatings or epoxy coating;
Described metal material comprises Copper Foil, aluminium foil or silver foil.
As the preferred technical solution of the present invention, the gross thickness of the described non-metallic material bed of material, high-temperaure coating and metal material layer is smaller or equal to 0.25 millimeter.
As the preferred technical solution of the present invention, described metal material layer is provided with at least two sheet metals that are spaced from each other as telegraph circuit, has through hole on the described every sheet metal.
The manufacturing process of ultrathin surface mount electric polarization pedestal, this technology may further comprise the steps:
(1) with alkali-free glass fiber cloth dipping back sintering, obtains impregnated glass-fiber cloth;
(2) impregnated glass-fiber cloth that above-mentioned steps is obtained cuts, and obtains the impregnated glass-fiber cloth sheet;
(3) the single-layer glass fiber varnished cloth sheet that step (2) is obtained carries out lamination, obtains the impregnated glass-fiber cloth sheet of multilayer;
(4) single face covers Copper Foil on the single or multiple lift impregnated glass-fiber cloth sheet of step (2) or step (3) acquisition, forms the impregnated glass-fiber cloth copper-clad plate through hot pressing;
(5) the impregnated glass-fiber cloth copper-clad plate that step (4) is obtained is according to the designing requirement etching of product circuit;
(6) product that step (5) is obtained cuts into the strip semi-finished product according to designing requirement;
(7) above-mentioned strip semi-finished product are die-cut into the electric polarization pedestal.
As the preferred technical solution of the present invention, the impregnated material that described step (1) adopts comprises ptfe emulsion or epoxy resin latex.
As the preferred technical solution of the present invention, described epoxy resin latex is the Halogenless fire retarded epoxy resin emulsion.
The surface mount piezoelectric crystal unit, comprise all-metal encapsulation piezoelectric crystal components and parts and insulation spacer, the electrode part of this device is made of the lead-in wire of piezoelectric crystal components and parts, described insulation spacer and described electrode promptly are above-mentioned ultrathin surface mount electric polarization pedestals, and described piezoelectric crystal components and parts are located on the electric polarization pedestal and with described telegraph circuit and are connected.
The invention has the beneficial effects as follows: with respect to prior art, the present invention adopts new manufacturing process to obtain new chip pedestal material, and utilizes new chip pedestal material and Copper Foil hot pressing compound, the electric polarization pedestal of acquisition superthin structure.The present invention makes the traditional further Xiao of the all-metal encapsulation SMD product Xingization ﹑ chip type of electronic devices and components, has reduced small product size.
The present invention makes traditional 49S/SMD insulation spacer thickness reduce to 0.25 millimeter from 0.45 millimeter, and SNC/SUB or 2PD/4PD insulation spacer thickness are reduced to 0.25 millimeter from 1.5 millimeters; The present invention can combine the insulation spacer of different size together, and effectively reduces production costs.
The present invention helps the SMD product Xiao Xingization ﹑ chip type of traditional all-metal encapsulation dissimilar various insulation spacers and by same principle insulator and electrode is combined together, can effectively reduce product cost; The present invention has novel structure, production efficiency height, superior performance, is produced on a large scale; has good industrial prospect; promote the SMD product of all-metal encapsulation to develop to Xiao Xingization ﹑ chip type direction; promote electronic technology and frequency components and parts to update, help the needs of IT application in the national economy development.
Description of drawings
The invention will be further described below in conjunction with accompanying drawing and specific embodiment:
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a cross section structure schematic diagram of the present invention.
Embodiment
Ultrathin surface mount electric polarization pedestal, comprise the non-metallic material bed of material and the metal material layer that is located on the non-metallic material bed of material, the described non-metallic material bed of material and metal material layer interconnect fixing and form overall structure, described metal material layer is provided with telegraph circuit, and the thickness of described metal material layer is smaller or equal to 1/2nd of gross thickness.
As depicted in figs. 1 and 2, in the present embodiment, the non-metallic material bed of material of the present invention is a glass fibre layer of cloth 1, is coated with the high temperature resistant polytetrafluorethylecoatings coatings 3 of one deck on the glass fibre layer of cloth 1; As another kind of execution mode, high-temperaure coating 3 also can adopt epoxy coating.Metal material layer of the present invention comprises copper foil layer, and copper foil layer comprises two copper foils 2 that are spaced from each other as telegraph circuit, has through hole 4 on the described every copper foil 2.As another kind of execution mode, Copper Foil 2 of the present invention also can adopt aluminium foil, silver foil or other metal material.About 0.20 millimeter of the thickness of described glass fibre layer of cloth 1 of present embodiment and high temperature resistant polytetrafluorethylecoatings coatings 3, about 0.05 millimeter of the thickness of Copper Foil 2, the gross thickness of glass fibre layer of cloth 1, polytetrafluorethylecoatings coatings 3 and Copper Foil 2 is smaller or equal to 0.25 millimeter.
The manufacturing process of ultrathin surface mount electric polarization pedestal, this technology may further comprise the steps:
(1) with alkali-free glass fiber cloth dipping back sintering, obtains impregnated glass-fiber cloth;
(2) impregnated glass-fiber cloth that above-mentioned steps is obtained cuts, and obtains the impregnated glass-fiber cloth sheet;
(3) the single-layer glass fiber varnished cloth sheet that step (2) is obtained carries out lamination, obtains the impregnated glass-fiber cloth sheet of multilayer;
(4) single face covers Copper Foil on the single or multiple lift impregnated glass-fiber cloth sheet of step (2) or step (3) acquisition, forms the impregnated glass-fiber cloth copper-clad plate through hot pressing;
(5) the impregnated glass-fiber cloth copper-clad plate that step (4) is obtained is according to the designing requirement etching of product circuit;
(6) product that step (5) is obtained cuts into the strip semi-finished product according to designing requirement;
(7) use punch press to be die-cut into the electric polarization pedestal above-mentioned strip semi-finished product.
In the present embodiment, the impregnated material that described step (1) adopts comprises ptfe emulsion or epoxy resin latex, and described epoxy resin latex is the Halogenless fire retarded epoxy resin emulsion.
The surface mount piezoelectric crystal unit, comprise all-metal encapsulation piezoelectric crystal components and parts and insulation spacer, the electrode part of this device is made of the lead-in wire of piezoelectric crystal components and parts, described insulation spacer and described electrode promptly are the described ultrathin surface mount electric polarization pedestals of above embodiment, and described piezoelectric crystal components and parts are located on the electric polarization pedestal and with described telegraph circuit and are connected.
The present invention is a material revolution to the little type ﹑ chip type of traditional all-metal encapsulation SMD product, adopting polytetrafluoroethylene glass fabric or epoxy resin fiberglass cloth is base material, single face hot pressing Copper Foil is designed to the SMD electrode special, according to supporting size through punching molding, with the insulation spacer electric polarization of the SMD product of different electrodes.Two kinds of base materials of the present invention are because of having glass fabric as supporting and apply resistant to elevated temperatures polytetrafluoroethylene or epoxy resin, can make new material that this technology obtains when the processing components and parts, through Hui Liu Han ﹑ wave-soldering do not warp, indeformable, good insulating properties is arranged again simultaneously.
The present invention is with 49S/SMD insulation spacer and SNC/SUB or the thorough slimming of 2PD/4PD insulation spacer, well 49S/SMD insulation spacer and SNC/SUB or 2PD/4PD insulation spacer is combined together.Solved insulation spacer such as PPS ﹑ PPA simultaneously and when the Reflow Soldering overtemperature, be out of shape, warp, and the problem of embrittlement in the course of processing, the root problem that existing product is unfavorable for carrying out ultrathin processing thoroughly solved.
Use the ultrathin surface mount electric polarization of the present invention pedestal, can be with traditional piezoelectric crystal all-metal encapsulating products Xiao Xingization ﹑ chip type, part substitutes the product of ceramic packaging, thereby solves the deficiency that the traditional handicraft attribute brings, and reduces cost of labor and material cost greatly.
Claims (10)
1. ultrathin surface mount electric polarization pedestal, comprise the non-metallic material bed of material and the metal material layer that is located on the non-metallic material bed of material, the described non-metallic material bed of material and metal material layer interconnect fixing and form overall structure, it is characterized in that: described metal material layer is provided with telegraph circuit, and the thickness of described metal material layer is smaller or equal to 1/2nd of gross thickness.
2. according to the described ultrathin surface mount electric polarization pedestal of claim 1, it is characterized in that: the gross thickness of the described non-metallic material bed of material and metal material layer is smaller or equal to 0.40 millimeter.
3. according to claim 1 or 2 described ultrathin surface mount electric polarization pedestals, it is characterized in that: be coated with high-temperaure coating on the described non-metallic material bed of material.
4. according to the described ultrathin surface mount electric polarization pedestal of claim 3, it is characterized in that: described nonmetallic materials comprise glass fabric;
Described high-temperaure coating comprises polytetrafluorethylecoatings coatings or epoxy coating;
Described metal material comprises Copper Foil, aluminium foil or silver foil.
5. according to the described ultrathin surface mount electric polarization pedestal of claim 4, it is characterized in that: the gross thickness of the described non-metallic material bed of material, high-temperaure coating and metal material layer is smaller or equal to 0.25 millimeter.
6. according to the described ultrathin surface mount electric polarization pedestal of claim 1, it is characterized in that: described metal material layer is provided with at least two sheet metals that are spaced from each other as telegraph circuit, has through hole on the described every sheet metal.
7. according to the manufacturing process of the described ultrathin surface mount electric polarization pedestal of claim 1, it is characterized in that this technology may further comprise the steps:
(1) with alkali-free glass fiber cloth dipping back sintering, obtains impregnated glass-fiber cloth;
(2) impregnated glass-fiber cloth that above-mentioned steps is obtained cuts, and obtains the impregnated glass-fiber cloth sheet;
(3) the single-layer glass fiber varnished cloth sheet that step (2) is obtained carries out lamination, obtains the impregnated glass-fiber cloth sheet of multilayer;
(4) single face covers Copper Foil on the single or multiple lift impregnated glass-fiber cloth sheet of step (2) or step (3) acquisition, forms the impregnated glass-fiber cloth copper-clad plate through hot pressing;
(5) the impregnated glass-fiber cloth copper-clad plate that step (4) is obtained is according to the designing requirement etching of product circuit;
(6) product that step (5) is obtained cuts into the strip semi-finished product according to designing requirement;
(7) above-mentioned strip semi-finished product are die-cut into the electric polarization pedestal.
8. according to the manufacturing process of the described ultrathin surface mount electric polarization pedestal of claim 7, it is characterized in that: the impregnated material that described step (1) adopts comprises ptfe emulsion or epoxy resin latex.
9. the manufacturing process of described according to Claim 8 ultrathin surface mount electric polarization pedestal is characterized in that: described epoxy resin latex is the Halogenless fire retarded epoxy resin emulsion.
10. surface mount piezoelectric crystal unit, comprise all-metal encapsulation piezoelectric crystal components and parts and insulation spacer, the electrode part of this device is made of the lead-in wire of piezoelectric crystal components and parts, it is characterized in that: described insulation spacer and described electrode promptly are ultrathin surface mount electric polarization pedestals as claimed in claim 1, and described piezoelectric crystal components and parts are located on the electric polarization pedestal and with described telegraph circuit and are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100057222A CN102157676A (en) | 2011-01-12 | 2011-01-12 | Ultrathin type surface-mounted electropolar pedestal and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100057222A CN102157676A (en) | 2011-01-12 | 2011-01-12 | Ultrathin type surface-mounted electropolar pedestal and manufacturing process thereof |
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| Publication Number | Publication Date |
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| CN102157676A true CN102157676A (en) | 2011-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100057222A Pending CN102157676A (en) | 2011-01-12 | 2011-01-12 | Ultrathin type surface-mounted electropolar pedestal and manufacturing process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107517043A (en) * | 2017-08-10 | 2017-12-26 | 烟台明德亨电子科技有限公司 | A kind of SMD quartz crystal resonator processing method and its resonator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
| CN101800523A (en) * | 2009-02-10 | 2010-08-11 | 日本电波工业株式会社 | Crystal oscillator with pedestal |
-
2011
- 2011-01-12 CN CN2011100057222A patent/CN102157676A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101800523A (en) * | 2009-02-10 | 2010-08-11 | 日本电波工业株式会社 | Crystal oscillator with pedestal |
| CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107517043A (en) * | 2017-08-10 | 2017-12-26 | 烟台明德亨电子科技有限公司 | A kind of SMD quartz crystal resonator processing method and its resonator |
| CN107517043B (en) * | 2017-08-10 | 2023-10-20 | 四川明德亨电子科技有限公司 | SMD quartz crystal resonator processing method and resonator thereof |
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Application publication date: 20110817 |