CN102156256A - Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC) - Google Patents
Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC) Download PDFInfo
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- CN102156256A CN102156256A CN2011100442889A CN201110044288A CN102156256A CN 102156256 A CN102156256 A CN 102156256A CN 2011100442889 A CN2011100442889 A CN 2011100442889A CN 201110044288 A CN201110044288 A CN 201110044288A CN 102156256 A CN102156256 A CN 102156256A
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Abstract
The invention discloses a burning test method of the combination and encapsulation of a microprogrammed control unit (MCU) and a touch integrated circuit (IC). The method comprises a tester, and comprises the following steps: compiling a burning program; converting the burning program into a binary system pattern; and placing the combined and encapsulated product on the tester and carrying out burning test. The test method provided by the invention is simple, test personnel can perform burning directly according to the burning program through the tester without burning the combined product in advance. in the method, the combined product does not need burning in advance, test time is saved; moreover, a burner is not used, thereby lowering the loss rate of the equipment.
Description
Technical field
The present invention relates to the test integrated method of a kind of burning, refer in particular to the method for MCU and the burning of touch-control IC assembled package test.
Background technology
Now, along with the continuous quickening of social rhythm, the client is the more and more strictness of every test duration requirement of touch-control IC for the touch-control chip, and in order to satisfy client's demand, the manufacturer that produces touch-control IC need finish the test event of a product in the shortest time.In the existing method, combined test for MCU (memory controller) and touch-control IC generally need utilize cd-rom recorder and test machine, because for the assembled package product, effectively simplify the pin number according to customer requirement, the pin that some touch-control IC links to each other with MCU is not pulled out, so must transform the test that realizes inner pin by the MCU external pin, be specially external pin that pours into specific program realization MCU and the inside pin that will survey and directly be communicated with.And existing burning all is by the cd-rom recorder burning program, this combination product is placed on the test machine tests then, has finally realized the purpose of test touch-control IC by the external pin of MCU.Said method has not only been used cd-rom recorder and has also been used test machine, has also consumed equipment so increased the test duration.
So how just to seem particularly important for the user provides a kind of simple more burning method of testing.
Summary of the invention
The actual technical matters to be solved of the present invention is how to provide a kind of at the product of MCU and touch-control IC assembled package can reduce the test duration and can reduce the method for testing of equipment loss rate again.
In order to realize above-mentioned purpose of the present invention, the invention provides the method for a kind of MCU and touch-control IC assembled package test burning, comprise test machine, its step is as follows: write burning program and convert thereof into scale-of-two pattern form; The assembled package product is seated in carries out burning test on the test machine.
Method of testing of the present invention, not only simple, and also the tester no longer needs burning in advance at combination product, and can be directly with the purpose of burning program by test machine realization burning.The present invention is owing to no longer needing burning in advance, so saved the test duration; And no longer utilize cd-rom recorder, also reduced the proportion of goods damageds of equipment.
Description of drawings
Fig. 1 is the structural representation of assembled package product of the present invention;
Fig. 2 is the method flow diagram of assembled package product burning test of the present invention.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples.
Please refer to shown in Figure 1, MCU of the present invention and touch-control IC assembled package product 1, wherein, the described MCU pin that links to each other with the inside of touch-control IC is not pulled out encapsulation, claims its inner pin, as the pin A1 that draws from touch-control IC; And, claim that these test pin are external pin, as the pin B1 that draws from MCU for the pin that the MCU from described encapsulating products and touch-control IC directly pull out.Following mask body is discussed the burning method of testing to the assembled package product.
Please refer to shown in Figure 2ly, at first the function that realizes according to concrete needs MCU is write out corresponding formula, and needs MCU to realize the corresponding connection of inside pin of external pin and touch-control IC among the present invention; After finishing the burning formula that realizes above-mentioned functions, secondly, burning program is changed into scale-of-two also be consistent with test pattern form; So-called pattern is meant a kind of binary file that set form is arranged, when carrying out each project testing, promptly to pattern that can realize its test function of test machine input.Because program of so-called burning just is meant program is poured into the MCU the inside, will wipe the content of MCU respective regions before pouring into, and promptly needs to realize wiping the function of described MCU content; And then the program of burning is irritated into, promptly need to realize being communicated with the correlation function of the inner pin of described touch-control IC by the external pin of described MCU; Whether inspection at last is correct, promptly needs to realize detecting by the pin of described MCU the function of touch-control IC.And above-mentioned steps can realize by operational order, just can put in place burning is disposable so we want the binary program the inside of burning to add the aforesaid operations instruction.Be that complete burning program need add the scale-of-two burning program that corresponding above-mentioned binary operation instruction could constitute complete burning program, final disposable assurance burning is accurate.
After the combinations thereof encapsulating products being placed to the relevant position of test machine, because the burning pin that described program can make touch-control IC goes out conversion of signals so that the test machine test by the pin of MCU, and above-mentioned binary burning program will be discerned by described test machine, and final the realization will be realized the object run of MCU in the external burning pin input MCU of above-mentioned binary burning program by MCU.Because described assembled package product is drawn touch-control IC by the external pin of MCU inside pin, so just can realize burning when being placed to the assembled package product on the described test machine, so after burning is finished on the test machine, just can directly test touch-control IC.
Because the scale-of-two that the present invention has adopted test machine to discern forms, thus for the assembled package product, no longer need burning in advance, and, continue to finish the purpose of test touch-control IC then directly with the purpose of burning program by test machine realization burning.And the present invention compares classic method, by improvement program, has realized the integrated of burning and test, combination product directly just can be finished on test machine, so no longer need to utilize cd-rom recorder, not only improved the test duration, and reduced the coefficient of losses of machine.
Claims (10)
1. the method for MCU and touch-control IC assembled package test burning comprises test machine, and its step is as follows:
Write burning program and convert thereof into scale-of-two pattern form;
The assembled package product is seated in carries out burning test on the test machine.
2. the method for claim 1, it is characterized in that: described pattern is meant a kind of binary file that set form is arranged.
3. the method for claim 1 is characterized in that: after described assembled package product is seated on the test machine, realize burning by binary pattern form earlier, begin then to test.
4. the method for claim 1, it is characterized in that: described burning program need realize wiping the function of described MCU content.
5. method as claimed in claim 4 is characterized in that: described burning program need realize reading in by the pin of MCU the correlation function of touch-control IC.
6. method as claimed in claim 5 is characterized in that: described burning program need realize detecting by the pin of MCU the function of touch-control IC.
7. the method for claim 1 is characterized in that: the inside pin of described touch-control IC and the corresponding connection of the external pin of described MCU.
8. the method for claim 1 is characterized in that: the inside pin that described program can make touch-control IC goes out conversion of signals so that the test machine test by the pin of MCU.
9. as claim 7 or 8 described methods, it is characterized in that: described inner pin is meant that the described MCU pin that links to each other with the inside of touch-control IC do not pull out the pin of encapsulation.
10. method as claimed in claim 7 is characterized in that: described external pin is meant the pin that MCU from described encapsulating products and touch-control IC directly pull out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110044288.9A CN102156256B (en) | 2011-02-24 | 2011-02-24 | Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110044288.9A CN102156256B (en) | 2011-02-24 | 2011-02-24 | Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102156256A true CN102156256A (en) | 2011-08-17 |
| CN102156256B CN102156256B (en) | 2014-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110044288.9A Active CN102156256B (en) | 2011-02-24 | 2011-02-24 | Burning test method of combination and encapsulation of microprogrammed control unit (MCU) and touch integrated circuit (IC) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105699884A (en) * | 2016-01-13 | 2016-06-22 | 深圳市博巨兴实业发展有限公司 | Multichip packaging test method based on MCU |
| CN109633419A (en) * | 2018-11-06 | 2019-04-16 | 珠海欧比特宇航科技股份有限公司 | A kind of chip detecting method based on ATE |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1419203A (en) * | 2001-11-13 | 2003-05-21 | 德泰科技股份有限公司 | Network rewriting and recording system, and method thereof |
| CN1614558A (en) * | 2003-11-06 | 2005-05-11 | 联想(北京)有限公司 | Burn recording method and system |
| CN1740992A (en) * | 2004-08-26 | 2006-03-01 | 鸿富锦精密工业（深圳）有限公司 | The BIOS on-line rewriting method |
| CN1916876A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for burning chip |
| CN101409109A (en) * | 2007-10-09 | 2009-04-15 | 南茂科技股份有限公司 | System for testing and recording automation storage die set |
| CN101769970A (en) * | 2008-12-29 | 2010-07-07 | 优方科技股份有限公司 | Method for producing touch control procedure |
-
2011
- 2011-02-24 CN CN201110044288.9A patent/CN102156256B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1419203A (en) * | 2001-11-13 | 2003-05-21 | 德泰科技股份有限公司 | Network rewriting and recording system, and method thereof |
| CN1614558A (en) * | 2003-11-06 | 2005-05-11 | 联想(北京)有限公司 | Burn recording method and system |
| CN1740992A (en) * | 2004-08-26 | 2006-03-01 | 鸿富锦精密工业（深圳）有限公司 | The BIOS on-line rewriting method |
| CN1916876A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for burning chip |
| CN101409109A (en) * | 2007-10-09 | 2009-04-15 | 南茂科技股份有限公司 | System for testing and recording automation storage die set |
| CN101769970A (en) * | 2008-12-29 | 2010-07-07 | 优方科技股份有限公司 | Method for producing touch control procedure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105699884A (en) * | 2016-01-13 | 2016-06-22 | 深圳市博巨兴实业发展有限公司 | Multichip packaging test method based on MCU |
| CN109633419A (en) * | 2018-11-06 | 2019-04-16 | 珠海欧比特宇航科技股份有限公司 | A kind of chip detecting method based on ATE |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102156256B (en) | 2014-01-15 |
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