CN102155634A - LED (light emitting diode) lighting module and method for manufacturing LED lighting module - Google Patents
LED (light emitting diode) lighting module and method for manufacturing LED lighting module Download PDFInfo
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- CN102155634A CN102155634A CN2010101160673A CN201010116067A CN102155634A CN 102155634 A CN102155634 A CN 102155634A CN 2010101160673 A CN2010101160673 A CN 2010101160673A CN 201010116067 A CN201010116067 A CN 201010116067A CN 102155634 A CN102155634 A CN 102155634A
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Abstract
The invention relates to an LED (light emitting diode) lighting module, comprising a metal heat conduction plate, a circuit board, a hot joining layer and a plurality of LED crystal grains, wherein the metal heat conduction plate comprises a bearing surface with a plurality of bearing areas; the circuit board comprises a board body, a bottom surface circuit which is formed at the bottom surface of the board body, a top surface circuit which is formed at the top surface of the board body and a plurality of through holes which penetrate through the board body; the hot joining layer is provided with a lower surface which is connected with the bearing surface and an upper surface which is connected with the bottom surface circuit; and the LED crystal grains are respectively arranged in each through hole, respectively cling to each bearing area, and are electrically connected with the top surface circuit.
Description
Technical field
The present invention relates to a kind of light emitting module, particularly relate to the good LED light emitting module of a kind of thermal diffusivity.
Background technology
Light emitting diode (Light Emitting Diode, LED) have province can, reaction is fast, the life-span is long and little or the like the characteristic of volume, and a majority LED is arranged on the circuit board and is assembled into led module and can substitutes conventional light source.In recent years, along with the brightness of LED and the lifting of power, the heat dissipation problem of led module quietly appears in one's mind.
Because LED in use at present, have only about 20% to convert light to, remaining 80% then converts heat energy to, so if the used heat with LED produced that led module can't be in good time is discharged, the problem that will cause light decay, and overheated led module also can make its application be restricted, and therefore, still has necessity of further improvement for the heat dissipation problem of led module.
Consult Fig. 1, number the radiator structure of the display shown in No. 200722840 as the Taiwan patent disclosure, this radiator structure promptly is to solve the used heat problem that light emitting diode produced.Radiator structure comprises a backboard 10, one circuit board 11 and a luminescence component 13, circuit board 11 is to be arranged on the backboard 10 and to have a copper foil layer 111 and a heat resistant plastice layer 112, circuit board 11 is provided with a perforate 113 that stretches through for the protuberance of backboard 10, luminescence component 13 has a metal pedestal 131, one light-emitting diode chip for backlight unit 132 and an insulator seal piece installing 133, the following loading end 1311 of metal pedestal 131 sees through perforate 113 and is connected with the protuberance contact of backboard 10, insulator seal piece installing 133 is around clad metal pedestal 131, so, by light-emitting diode chip for backlight unit 132 is arranged on the metal pedestal 131, make its used heat be directly conducted to backboard 10, reach the effect of heat radiation by metal pedestal 131.
Yet, this radiator structure is to increase metal pedestal 131 to be set to come heat conduction, so that whole thickness increases, and the insulator seal piece installing 133 in this structure has problem aging, that variable color causes light decay under long-term the use, will cause the problem of electrical connection under long-term the use and have influence on 132 life-spans of light-emitting diode chip for backlight unit, so also have the space of further improvement for the heat dissipation problem of light emitting diode.
Consult Fig. 2, Taiwan patent disclosure as application before the applicant is numbered a kind of area source device for LED shown in No. 200941758, it comprises a metal substrate 15, one is arranged at circuit board 16 and most the light-emitting diode chip for backlight unit 17 that are arranged on the circuit board 16 on this metal substrate 15, in this patent by adjusting metal substrate 15 thickness, and the spacing of 17 of control light-emitting diode chip for backlight unit 17 areas and light-emitting diode chip for backlight unit, reach preferable radiating effect, yet, because the thickness of metal substrate 15 must be greater than 1mm, thus, 15 of metal substrates are difficult to have pliability; If the thickness of metal substrate 15 is reduced, then certainly will influence whole thermal diffusivity, so the present invention will improve research and development for the thermal diffusivity and the pliability of light-emitting diode assembly.
Summary of the invention
Purpose of the present invention is promptly providing a kind of thermal diffusivity good LED light emitting module.
Another object of the present invention is to provide a kind of light, thin LED light emitting module.
Another object of the present invention is to provide a kind of flexual LED light emitting module that has.
So LED light emitting module of the present invention comprises thermal bonding layer and most LED crystal grain of a metal heat-conducting plate, a circuit board, a metal material, the metal heat-conducting plate comprises a loading end, and loading end is formed with most supporting regions; Circuit board comprises that the bottom surface circuit, that a plate body, is formed at plate body bottom surface is formed at the end face circuit of plate body end face and the through hole of most run-through board bodies; The thermal bonding layer has a lower surface that is connected with loading end, and a upper surface that is connected with the bottom surface circuit; LED crystal grain lays respectively in each through hole and is posted by each supporting region, and LED crystal grain is electrically connected with the end face circuit.
Preferably, this thermal bonding layer is that a coat of metal is attached to this bottom surface circuit, and the loading end of this thermal bonding layer and this metal heat-conducting plate is thermal welding.
Preferably, this thermal bonding layer is a scolder, and this circuit board comprises that also one is attached to the coat of metal of this bottom surface circuit, and this coat of metal is borrowed the loading end welding of this thermal bonding layer and this thermal conductive metal plate.
Preferably, the material of the coat of metal of this circuit board is copper or iron, and the material of the loading end of metal heat-conducting plate be tin or silver or nickel one of them, scolder is a scolding tin.
Preferably, the material of the coat of metal of this circuit board is an aluminium, and the material of the loading end of metal heat-conducting plate is a nickel, and scolder is a scolding tin.
Preferably, loading end is that a coat of metal defines.
Preferably, circuit board is that flexible circuit board and metal heat-conducting plate have pliability.
Preferably, the metal heat-conducting plate in the form of sheets and the loading end punching press be formed with most the depressions that are communicated with each through hole respectively, supporting region lays respectively at the interior diapire of depression.
Preferably, the metal heat-conducting plate comprises a bottom surface in contrast to loading end in the form of sheets and also, and the bottom surface punching press is formed with most the protuberances that convexedly stretch in each through hole of circuit board, and supporting region is to be positioned at the protuberance top.
Preferably, the metal heat-conducting plate in the form of sheets, loading end is a flat surfaces, supporting region is respectively the regional area of loading end.
Preferably, the thickness of circuit board is between 0.15 millimeter～1.6 millimeters.
Preferably, the thickness of metal heat-conducting plate is between 0.4 millimeter～1 millimeter.
Preferably, contiguous each through hole of circuit board is formed with most the circuit welding pads that are arranged on the end face circuit, and the LED light emitting module also comprises most the lead pieces that are electrically connected circuit welding pad and LED crystal grain respectively.
Preferably, the LED light emitting module also comprises most the packing colloids that coat LED crystal grain and lead piece respectively.
Preferably, the LED light emitting module also comprises most and is arranged on the end face circuit and around through hole and in order to the retaining edge of block packing colloid.
Preferably, the LED light emitting module also comprises most the perforations that run through circuit board, metal heat-conducting plate and thermal bonding layer up and down, by continuously arranged perforation, makes the LED light emitting module have pliability.
Another object of the present invention is promptly in the manufacture method that a kind of above-mentioned LED light emitting module is provided.
So the manufacture method of LED light emitting module of the present invention comprises the following step:
Steps A: prepare a circuit board and a metal heat-conducting plate, this circuit board comprises an end face circuit, a bottom surface circuit and most the through holes that run through, and this metal heat-conducting plate comprises a loading end, and this loading end is formed with most supporting regions;
Step B: lay a thermal bonding layer, make that the lower surface of this thermal bonding layer is connected with the loading end of this metal heat-conducting plate, the upper surface of this thermal bonding layer is connected with the bottom surface circuit of this circuit board;
Step C: a majority LED crystal grain is abutted in described supporting region respectively; And
Step D: described LED crystal grain is electrically connected with the end face circuit of this circuit board.
Preferably, this step C carries out after this step B, and in this step C, abuts in described supporting region respectively by described LED crystal grain, is that the difference position is in described through hole.
Preferably, in this step B, this thermal bonding layer is the bottom surface circuit formation that metal material is plated on this circuit board, and the lower surface of this thermal bonding layer is to impose thermal welding to be connected with this loading end.
Preferably, the manufacture method of LED light emitting module also comprises a step e: electroplate the bottom surface circuit that a coat of metal is attached to this circuit board, and in this step B, be to use scolder to weld this circuit board and this metal heat-conducting plate as this thermal bonding layer, this thermal bonding layer is to see through this coat of metal to be connected with this bottom surface circuit.
Preferably, in this steps A, described supporting region is to form in this metal heat-conducting plate punching press.
Preferably, in this steps A, this loading end is that metal material is electroplated formation.
Beneficial effect of the present invention is: the LED light emitting module is by the thermal bonding layer structure of bonded circuitry plate and metal heat-conducting plate up and down, and LED crystal grain is arranged at the metal heat-conducting plate and is electrically connected circuit board, to reach the effect that electric heating separates, thus, the heat energy of LED crystal grain is directly derived by the metal heat-conducting plate, makes the LED light emitting module have good thermal diffusivity.No matter LED light emitting module of the present invention is at circuit board 22 and the thickness of metal heat-conducting plate or the spacing distance of two adjacent LED crystal grain, all be to take province's material, space-efficient design, make the LED light emitting module conform with the lightening trend of electronic product.Moreover the circuit board of LED light emitting module of the present invention and metal heat-conducting plate can be flexible circuit board and thin metal plate, promptly have pliability and can be widely used on the electronic product.And aspect the manufacture method of LED light emitting module, the present invention makes circuit board engage with metal heat-conducting by the thermal bonding layer, therefore, proposes a kind of mode of being convenient to make both fluid-tight engagement.
Description of drawings
Fig. 1 is a generalized section, and radiator structure in the past is described;
Fig. 2 is a generalized section, and area source device for LED in the past is described;
Fig. 3 is a generalized section, and the LED light emitting module of first preferred embodiment of the present invention is described;
Fig. 4 is a flow chart of steps, and a preferred embodiment of the manufacture method of this LED light emitting module is described;
Fig. 5 is a generalized section, and the circuit board of this LED light emitting module is described;
Fig. 6 is a generalized section, and the metal heat-conducting plate of this LED light emitting module is described;
Fig. 7 is a generalized section, and the state that this metal heat-conducting plate engages with this circuit board is described;
Fig. 8 is a generalized section, illustrates that the another kind of adhesive body capping changes aspect;
Fig. 9 is a generalized section, and a kind of variation aspect of this first preferred embodiment is described;
Figure 10 is a generalized section, and another variation aspect of this first preferred embodiment is described;
Figure 11 is a generalized section, and another variation aspect of this first preferred embodiment is described;
Figure 12 is a generalized section, and the metal heat-conducting plate of this first preferred embodiment and the aspect that circuit board is provided with most perforations are described;
Figure 13 is a generalized section, and second preferred embodiment of the present invention is described.
The specific embodiment
Understand and realization the present invention for the ease of persons skilled in the art, the present invention is described in detail below in conjunction with drawings and Examples:
Consult Fig. 3, first preferred embodiment for LED light emitting module of the present invention, LED light emitting module 201 comprises the thermal bonding layer 5 of a metal heat-conducting plate 21, a circuit board 22, most LED crystal grain 23, most individual packing colloid 25 and metal materials, circuit board 22 borrows thermal bonding layer 5 to engage up and down with metal heat-conducting plate 21, and LED crystal grain 23 is arranged on the metal heat-conducting plate 21 and expose to circuit board 22, and LED crystal grain 23 is electrically connected with circuit board 22.
Consult Fig. 3, Fig. 6, in more detail, metal heat-conducting plate 21 comprises a bottom surface 210, a loading end 211 and most depressions 212, and loading end 211 is formed with most supporting regions 213.In the present embodiment, bottom surface 210 is two opposing faces of metal heat-conducting plate 21 with loading end 211, described depression 212 is recessed to form downwards by loading end 211 spaced apartly, depression 212 generation types can be that punching press forms, and down do not give prominence to the bottom surface 210 of metal heat-conducting plate 21 toward the depression 212 of lower recess, in other words, the bottom surface 210 of metal heat-conducting plate 21 still is a flat surfaces.In the present embodiment, the supporting region 213 of indication is the inner bottom surface of this depression 212 respectively, so the position of supporting region 213 can be lower than loading end 211, supporting region 213 is can be for LED crystal grain 23 is set.
The preferably, the madial wall of depression 212 can or utilize the reflective characteristic of material itself and forms reflecting surface with as reflector by the coating reflectorized material, will help the better illumination effect of LED crystal grain 23 generations on the supporting region 213.In the present embodiment, metal heat-conducting plate 21 can select thickness between 0.4 millimeter～1 millimeter, and it is flexible that it is had.
Consult Fig. 3, Fig. 5, circuit board 22 comprises that the bottom surface circuit 225, that end face circuit 222, that a plate body 221, is formed at plate body 221 end faces is formed at plate body 221 bottom surfaces electroplates the coat of metal 220 that is formed on bottom surface circuit 225 bottom surfaces, most the through holes 223 that run through plate body 221 and most reflector layers 224, certainly, end face circuit 222, bottom surface circuit 225 and the coat of metal 220 can't be distributed in through hole 223.In the present embodiment, circuit board 22 is a flexible circuit board, and its thickness is between 0.15 millimeter～1.6 millimeters.Reflector layer 224 is the hole walls that are arranged at described through hole 223, and reflector layer 224 can be the hole wall that for example is formed at described through hole 223 through the mode of electrosilvering.
As shown in Figure 4, the manufacture method of LED light emitting module 201 of the present invention preferred embodiment comprises following steps:
Step 901 prepares a circuit board and a metal heat-conducting plate.Cooperating and consult Fig. 5, Fig. 6, in the present embodiment, is the circuit board 22 and metal heat-conducting plate 21 of preparation as above-mentioned structure.
Step 902 is laid a thermal bonding layer, makes that the lower surface of thermal bonding layer is connected with the loading end of metal heat-conducting plate, the upper surface of thermal bonding layer is connected with the bottom surface circuit of circuit board.Cooperate and consult Fig. 7, thermal bonding layer 5 is in order to jointing metal heat-conducting plate 21 and circuit board 22, in the present embodiment, employed thermal bonding layer 5 is scolder (a for example scolding tin), also be, be by the scolding tin solder joints between circuit board 22 and the metal heat-conducting plate 21, make the upper surface of thermal bonding layer (being scolding tin) 5 be connected with the coat of metal 220 of circuit board 22 belows, the lower surface of thermal bonding layer (being scolding tin) 5 then is connected with the loading end 211 of metal heat-conducting plate 21.And engage with circuit board 22 by metal heat-conducting plate 21, each through hole 223 on the circuit board 22 can correspond respectively to each depression 212 of metal heat-conducting plate 21 and be connected.Moreover circuit board 22 also can carry out the reflow operation with after metal heat-conducting plate 21 engages, and makes both combinations more firm.
It is noted that, because circuit board 22 is to see through scolding tin to connect metal conducting strip 21, consider properties of materials, the coat of metal 220 materials by circuit board 22 belows are copper or iron, then the loading end 211 preferable materials of metal heat-conducting plate 21 can be tin or silver or nickel one of them, the coat of metal 220 materials by circuit board 22 belows are aluminium, and then the loading end 211 preferable materials of metal heat-conducting plate 21 can be nickel.Aforementioned so-called loading end 211 is the surface of metal heat-conducting plate 21 itself in the present embodiment, also be, the material of metal heat-conducting plate 21 be tin or silver or nickel one of them, but, by the material of metal heat-conducting plate 21 non-above-mentioned three kinds, then the loading end 211 of indication also can be that the coat of metal by the above-mentioned material of one deck that plates in addition defines, and in other words, this moment, so-called metal heat-conducting plate 21 was to comprise this coat of metal.
Step 903 abuts in each supporting region respectively with a majority LED crystal grain.Cooperate and consult Fig. 3, in the present embodiment, LED crystal grain 23 is to utilize elargol to recline to be fixed in supporting region 213, but not as limit, other can all can be applicable to these LED crystal grain 23 cemented modes on this loading end 211 among the present invention as utilizing materials such as epoxy resin, silicones.
Step 904 is electrically connected LED crystal grain with the end face circuit of circuit board.Cooperate and to consult Fig. 3, present embodiment is in the routing mode plain conductor two ends to be beaten the positive and negative electrode that is connected on LED crystal grain 23 and the circuit welding pad 226 of circuit board 22 end face circuit 221 respectively.
Step 905 coats LED crystal grain with packing colloid.Cooperate and consult Fig. 3, in the present embodiment, be to use point gum machine or reperfusion mode that the packing colloid 25 that is in a liquid state is poured into through hole 223, make packing colloid 25 fill up through hole 223 and depression 212, and packing colloid 25 overflows out through hole 223 and coats and connects line 24, then, mould envelope program is promptly finished in 25 curing of wait packing colloid.Packing colloid 25 can be the insulation material of epoxy resin or other printing opacity, for example: silicones (silicone), UV glue or the like.
The preferably, in step 905, influence outward appearance for avoiding packing colloid 25 arbitrarily to flow when the encapsulating, circuit board 22 for example also can utilize, and the mode of mimeograph is provided with the mark lines and forms the retaining edge 26 of up giving prominence to and center on through hole 223, but block is lived the packing colloid 25 of liquid state whereby, makes packing colloid 25 polymerizable moulding and avoids it toward external diffusion.
As mentioned above, directly recline by LED crystal grain 23 and to be fixed on metal heat-conducting plate 21 and to be electrically connected with the end face circuit 222 of circuit board 22, and cooperate the juncture that sees through thermal bonding layer 5 between circuit board 22 and the metal heat-conducting plate 21, thereby reach thermoelectric effect of separating, and the heat energy that makes LED crystal grain 23 running can directly hand down and be directed at metal heat-conducting plate 21 and shed by metal heat-conducting plate 21, for LED crystal grain 23 preferable help is arranged just on heat dissipation.
In addition, such structural design also can directly utilize the internal face of depression 212 of metal heat-conducting plate 21 as reflector, its benefit is, because the reflector structure is formed in the metal heat-conducting plate 21, cause the weak problem of light so be not easy to be easy to generate material aging because being subjected to the light irradiation of LED crystal grain 23 for a long time.
Moreover, because metal heat-conducting plate 21 all has pliability with circuit board 22, so this LED light emitting module 201 can enlarge its range of application for bending is arranged on the various irregular surfaces, and as shown in figure 12, in order to increase the pliability of whole LED light emitting module 201, circuit board 22 also can be provided with corresponding respectively with metal heat-conducting plate 21 and be most perforations of arranging 6, make and engage with metal heat-conducting plate 21 by circuit board 22, described perforation 6 corresponding connections and, also can make LED light emitting module 201 have more pliability whereby just as running through whole LED light emitting module 201.
In addition, because LED crystal grain 23 is the supporting regions 213 that are arranged at relatively low position, make the integral thickness of LED light emitting module 201 reduce relatively, and, it is 16 millimeters that the thickness of metal heat-conducting plate 21 and circuit board 22 has only the spacing distance of 4 millimeters and two adjacent LED crystal grain 23, and then make LED light emitting module 201 except thickness, on area, also can effectively make full use of or reduce, so, LED light emitting module 201 conforms with the lightening trend of electronic product, and cooperate its flexual characteristics, will can be used as pliability light emitting diode lamp plate.
Consult Fig. 8, in the another kind variation aspect of this first preferred embodiment, packing colloid 25 also can be to cover entire circuit plate 22 end faces, with protection entire circuit plate 22 not contaminated or destructions.
Moreover, as shown in Figure 3, in the present embodiment, toward not outstanding metal heat-conducting plate 21 bottom surfaces 210 of the described depression 212 of lower recess, but also can be the bottom surface 210 of outstanding metal heat-conducting plate 21 and 210 form projections 214 toward the depression 212 of lower recess as shown in Figure 9, in the bottom surface.
Consult Figure 10, for first preferred embodiment of LED light emitting module of the present invention one change aspect again, mainly be the structure of metal heat-conducting plate 31 with aforementioned difference.
Metal heat-conducting plate 31 comprises a bottom surface 310, a loading end 311 and most protuberances 312, loading end 311 is formed with most supporting regions 313, bottom surface 310 is two opposing faces of metal heat-conducting plate 31 with loading end 311, described protuberance 312 compartment of terrains are upwards swelled by loading end 311 and are formed, the described supporting region 313 of indication is respectively the respectively top end face of this protuberance 312, can be for LED crystal grain 23 is set, described protuberance 312 can be metal heat-conducting plate 31 and is formed by bottom surface 310 up punching presses, thereby bottom surface 310 forms most the up grooves 314 of depression.
Because protuberance 312 is to protrude from loading end 311, when so circuit board 22 is arranged at the loading end 311 of metal heat-conducting plate 31, the protuberance 312 of metal heat-conducting plate 31 is to be stretched through the through hole 223 of circuit board 22 and to make supporting region 313 expose to circuit board 22, and LED crystal grain 23 is arranged at the end face circuit 222 of supporting region 313 and electrical connection circuit board 22, structure so, can reach the effect that electric heating separates equally, and the formation of 310 grooves 314 by the bottom surface can increase the area of dissipation of metal heat-conducting plate 31.
Consult Figure 11, be another variation aspect of first preferred embodiment of the present invention, its difference remains and is metal heat-conducting plate 41.
Wherein, the bottom surface 410 of metal heat-conducting plate 41 and loading end 411 are respectively two opposite surfaces of metal heat-conducting plate 41, and bottom surface 410 is flat surfaces with loading end 411, in other words, the supporting region 411 of indication is the regional area of smooth loading end 411, so structure can be reached the effect that electric heating separates equally, makes LED light emitting module 203 have good thermal diffusivity.
Consult Figure 13, second preferred embodiment for LED light emitting module of the present invention, LED light emitting module 204 comprises a metal heat-conducting plate 21, a circuit board 22, most individual LED crystal grain 23 and a thermal bonding layer 5, circuit board 22 borrows thermal bonding layer 5 to engage up and down with metal heat-conducting plate 21, and LED crystal grain 23 is arranged on the metal heat-conducting plate 21 and expose to circuit board 22, and LED crystal grain 23 is electrically connected with circuit board 22.
Yet, the difference of second preferred embodiment and first preferred embodiment is, in the second preferable enforcement, thermal bonding layer 5 is the coat of metal of plating attached to circuit board 22 bottom surface circuit 225, and engaging between circuit board 22 and the metal heat-conducting plate 21 is by directly the mode of thermal bonding layer 5 with thermal welding being engaged with loading end 211 fusions of metal heat-conducting plate 21, make the upper surface of thermal bonding layer (being the coat of metal) 5 be connected with circuit board 22 bottom surface circuit 225, the lower surface of thermal bonding layer (being the coat of metal) 5 then is connected with the loading end 211 of metal heat-conducting plate 21.
In sum, LED light emitting module 201 of the present invention, 202,203,204 by means of reaching circuit board 22 and metal heat-conducting plate 21,31,41 structures that engage up and down, and LED crystal grain 23 is arranged at metal heat-conducting plate 21,31,41 and be electrically connected circuit board 22, reach the effect that electric heating separates, thus, the waste thermal energy of LED crystal grain 23 directly down the conduction and by metal heat-conducting plate 21,31,41 directly shed, make LED light emitting module 201,202,203 have good thermal diffusivity, so not only for LED light emitting module 201,202,203 properties of product can promote to some extent, and also can have more elasticity on the circuit design.
Additional disclosure be, no matter LED light emitting module 201,202,203 of the present invention is at circuit board 22 and the thickness of metal heat-conducting plate 21,31,41 or the spacing distance of two adjacent LED crystal grain 23, all be to take province's material, space-efficient design, make LED light emitting module 201,202,203 conform with the lightening trend of electronic product.Moreover the circuit board of LED light emitting module 201,202,203 of the present invention 22 can be flexible circuit board and thin metal plate with metal heat-conducting plate 21,31,41, promptly has pliability and can be widely used on the electronic product.And aspect the manufacture method of LED light emitting module, the present invention makes circuit board 22 engage with metal heat-conducting plate 21,31,41 by thermal bonding layer 5, therefore, proposes a kind of mode of being convenient to make both fluid-tight engagement, so can reach purpose of the present invention really.
Though described the present invention by embodiment, those of ordinary skills know, without departing from the spirit and substance in the present invention, just can make the present invention that many distortion and variation are arranged, and scope of the present invention is limited to the appended claims.
Claims (22)
1. LED light emitting module, it is characterized in that: this LED light emitting module comprises:
One metal heat-conducting plate comprises a loading end, and this loading end is formed with most supporting regions;
One circuit board comprises that bottom surface circuit, that a plate body, is formed at this plate body bottom surface is formed at end face circuit and most the through holes that connect these plate bodies of this plate body end face;
One thermal bonding layer, for metal material and have a lower surface that is connected with this loading end, and a upper surface that is connected with this bottom surface circuit; And
Most LED crystal grain lay respectively in the described through hole and are posted by respectively this supporting region, and described LED crystal grain is electrically connected with this end face circuit.
2. LED light emitting module as claimed in claim 1 is characterized in that: this thermal bonding layer is that a coat of metal is attached to this bottom surface circuit, and the loading end of this thermal bonding layer and this metal heat-conducting plate is thermal welding.
3. LED light emitting module as claimed in claim 1 is characterized in that: this thermal bonding layer is a scolder, and this circuit board comprises that also one is attached to the coat of metal of this bottom surface circuit, and this coat of metal is borrowed the loading end welding of this thermal bonding layer and this thermal conductive metal plate.
4. LED light emitting module as claimed in claim 3 is characterized in that: the material of this coat of metal is copper or iron, and the material of the loading end of this metal heat-conducting plate be tin or silver or nickel one of them, this scolder is a scolding tin.
5. LED light emitting module as claimed in claim 3 is characterized in that: the material of this coat of metal is an aluminium, and the material of the loading end of this metal heat-conducting plate is a nickel, and this scolder is a scolding tin.
6. as claim 1 to 5 a described LED light emitting module wherein, it is characterized in that: this loading end is that a coat of metal defines.
7. LED light emitting module as claimed in claim 6 is characterized in that: this circuit board is that flexible circuit board and this metal heat-conducting plate have pliability.
8. LED light emitting module as claimed in claim 6 is characterized in that: this metal heat-conducting plate in the form of sheets and this loading end punching press be formed with most and be communicated with the respectively depressions of this through hole respectively, described supporting region lays respectively at the interior diapire of described depression.
9. LED light emitting module as claimed in claim 6, it is characterized in that: this metal heat-conducting plate comprises a bottom surface in contrast to this loading end in the form of sheets and also, this bottom surface punching press is formed with most the protuberances that convexedly stretch in respectively this through hole of this circuit board, and described supporting region is to be positioned at described protuberance top.
10. LED light emitting module as claimed in claim 6 is characterized in that: this metal heat-conducting plate in the form of sheets, this loading end is a flat surfaces, described supporting region is respectively the regional area of this loading end.
11. LED light emitting module as claimed in claim 7 is characterized in that: the thickness of this circuit board is between 0.15 millimeter～1.6 millimeters.
12. LED light emitting module as claimed in claim 11 is characterized in that: the thickness of this metal heat-conducting plate is between 0.4 millimeter～1 millimeter.
13. LED light emitting module as claimed in claim 12, it is characterized in that: contiguous respectively this through hole of this circuit board is formed with most the circuit welding pads that are arranged on this end face circuit, and this LED light emitting module also comprises most the lead pieces that are electrically connected described circuit welding pad and described LED crystal grain respectively.
14. LED light emitting module as claimed in claim 13 is characterized in that: this LED light emitting module also comprises most the packing colloids that coat described LED crystal grain and described lead piece respectively.
15. LED light emitting module as claimed in claim 14 is characterized in that: this LED light emitting module also comprise most up outstanding and by this circuit board around described through hole and in order to the retaining edge of the described packing colloid of block.
16. LED light emitting module as claimed in claim 6, it is characterized in that: the LED light emitting module also comprises most the perforations that run through this circuit board, this metal heat-conducting plate and this thermal bonding layer up and down, by continuously arranged described perforation, make the LED light emitting module have pliability.
17. the manufacture method of a LED light emitting module comprises the following step:
Steps A: prepare a circuit board and a metal heat-conducting plate, this circuit board comprises an end face circuit, a bottom surface circuit and most the through holes that run through, and this metal heat-conducting plate comprises a loading end, and this loading end is formed with most supporting regions;
Step B: lay a thermal bonding layer, make that the lower surface of this thermal bonding layer is connected with the loading end of this metal heat-conducting plate, the upper surface of this thermal bonding layer is connected with the bottom surface circuit of this circuit board;
Step C: a majority LED crystal grain is abutted in described supporting region respectively; And
Step D: described LED crystal grain is electrically connected with the end face circuit of this circuit board.
18. the manufacture method of LED light emitting module as claimed in claim 17 is characterized in that: this step C carries out after this step B, and in this step C, abuts in described supporting region respectively by described LED crystal grain, is that the difference position is in described through hole.
19. the manufacture method of LED light emitting module as claimed in claim 17, it is characterized in that: in this step B, this thermal bonding layer forms for the bottom surface circuit that metal material is plated on this circuit board, and the lower surface of this thermal bonding layer is to impose thermal welding to be connected with this loading end.
20. the manufacture method of LED light emitting module as claimed in claim 17, it is characterized in that: the manufacture method of LED light emitting module also comprises a step e: electroplate the bottom surface circuit that a coat of metal is attached to this circuit board, and in this step B, be to use scolder to weld this circuit board and this metal heat-conducting plate as this thermal bonding layer, this thermal bonding layer is to see through this coat of metal to be connected with this bottom surface circuit.
21. the manufacture method as claim 19 or 20 described LED light emitting modules is characterized in that: in this steps A, described supporting region is to form in this metal heat-conducting plate punching press.
22. the manufacture method as claim 19 or 20 described LED light emitting modules is characterized in that: in this steps A, this loading end is that metal material is electroplated formation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101160673A CN102155634A (en) | 2010-02-11 | 2010-02-11 | LED (light emitting diode) lighting module and method for manufacturing LED lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101160673A CN102155634A (en) | 2010-02-11 | 2010-02-11 | LED (light emitting diode) lighting module and method for manufacturing LED lighting module |
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| CN102954379A (en) * | 2012-06-20 | 2013-03-06 | 林培林 | Straight welded LED(Light Emitting Diode) lamp structure and processing method thereof |
| CN103363363A (en) * | 2012-03-30 | 2013-10-23 | 展晶科技(深圳)有限公司 | Light-emitting diode light bar |
| CN105141369A (en) * | 2015-09-22 | 2015-12-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN105840990A (en) * | 2016-05-31 | 2016-08-10 | 袁志贤 | LED lamp with cooling substrate |
| CN105840989A (en) * | 2016-05-31 | 2016-08-10 | 袁志贤 | LED lamp with light-transmitting covers |
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| CN105141369A (en) * | 2015-09-22 | 2015-12-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN105141369B (en) * | 2015-09-22 | 2018-04-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN105840990A (en) * | 2016-05-31 | 2016-08-10 | 袁志贤 | LED lamp with cooling substrate |
| CN105840989A (en) * | 2016-05-31 | 2016-08-10 | 袁志贤 | LED lamp with light-transmitting covers |
| WO2017206323A1 (en) * | 2016-05-31 | 2017-12-07 | 袁志贤 | Led lamp provided with heat dissipation substrate |
| WO2017206324A1 (en) * | 2016-05-31 | 2017-12-07 | 袁志贤 | Led lamp provided with light transmissive masks |
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Application publication date: 20110817 |