CN102134053A - 双轴mems陀螺仪的制造方法 - Google Patents
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- CN102134053A CN102134053A CN2010100230467A CN201010023046A CN102134053A CN 102134053 A CN102134053 A CN 102134053A CN 2010100230467 A CN2010100230467 A CN 2010100230467A CN 201010023046 A CN201010023046 A CN 201010023046A CN 102134053 A CN102134053 A CN 102134053A
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- 239000000377 silicon dioxide Substances 0.000 claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
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- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
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- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 229910001080 W alloy Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
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- 150000002739 metals Chemical class 0.000 claims description 4
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
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- 230000003247 decreasing effect Effects 0.000 claims description 3
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- 238000001020 plasma etching Methods 0.000 description 3
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CN 201010023046 CN102134053B (zh) | 2010-01-21 | 2010-01-21 | 双轴mems陀螺仪的制造方法 |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103508414A (zh) * | 2013-09-13 | 2014-01-15 | 华中科技大学 | 一种mems陀螺仪芯片双面阳极键合工艺 |
CN103552980A (zh) * | 2013-11-15 | 2014-02-05 | 安徽北方芯动联科微***技术有限公司 | Mems芯片圆片级封装方法及其单片超小型mems芯片 |
CN103922267A (zh) * | 2013-01-10 | 2014-07-16 | 深迪半导体(上海)有限公司 | 一种基于mems的惯性传感器生产及晶圆级封装工艺 |
CN104817055A (zh) * | 2014-01-30 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
CN105084302A (zh) * | 2014-05-19 | 2015-11-25 | 无锡华润上华半导体有限公司 | Mems质量块的制作方法 |
CN105129727A (zh) * | 2014-06-06 | 2015-12-09 | 罗伯特·博世有限公司 | 具有两个半导体构件的、在其之间构造有至少两个严密密封的腔的部件和用于制造两个半导体构件之间的相应键合连接的方法 |
CN103213939B (zh) * | 2012-01-19 | 2016-01-20 | 北京自动化控制设备研究所 | 一种四质量块硅微机电陀螺结构的加工方法 |
CN106315504A (zh) * | 2016-11-05 | 2017-01-11 | 安徽北方芯动联科微***技术有限公司 | 具有垂直压焊块的圆片级封装mems芯片及其制作方法 |
CN110240115A (zh) * | 2015-06-24 | 2019-09-17 | 雷神公司 | 包括双密封环的晶片级mems封装件 |
CN110631568A (zh) * | 2019-09-10 | 2019-12-31 | 东南大学 | 一种基于二维光子晶体腔体结构的新型moems双轴陀螺仪及其加工方法 |
CN111103436A (zh) * | 2018-10-25 | 2020-05-05 | 美国亚德诺半导体公司 | 低噪声多轴加速度计及相关方法 |
CN112461264A (zh) * | 2020-11-20 | 2021-03-09 | 大连理工大学 | 一种石英半球谐振子纳米制造装备 |
CN113607153A (zh) * | 2021-08-30 | 2021-11-05 | 武汉大学 | 一种两轴mems圆环陀螺仪及其制备封装方法 |
Citations (7)
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JPH10154820A (ja) * | 1996-11-25 | 1998-06-09 | Murata Mfg Co Ltd | 振動素子の製造方法 |
WO2004033365A2 (en) * | 2002-10-07 | 2004-04-22 | Freescale Semiconductor, Inc. | Method of forming a sensor for detecting motion |
CN1683234A (zh) * | 2004-04-13 | 2005-10-19 | 财团法人汉城大学校产学协力财团 | 在真空状态下封装mems装置的方法以及用该方法生产的装置 |
KR20050109551A (ko) * | 2003-03-10 | 2005-11-21 | 허니웰 인터내셔널 인코포레이티드 | 글래스-실리콘 mems 공정에서의 매립형 전자 피드스루시스템 및 방법 |
JP2007245339A (ja) * | 2006-03-16 | 2007-09-27 | Commiss Energ Atom | マイクロ電子コンポジット特にmemsの密閉キャビティ内の被包構造 |
US7352040B2 (en) * | 2003-06-04 | 2008-04-01 | Robert Bosch Gmbh | Microelectromechanical systems having trench isolated contacts, and methods for fabricating same |
US20090179233A1 (en) * | 2008-01-16 | 2009-07-16 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (mems) device |
-
2010
- 2010-01-21 CN CN 201010023046 patent/CN102134053B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10154820A (ja) * | 1996-11-25 | 1998-06-09 | Murata Mfg Co Ltd | 振動素子の製造方法 |
WO2004033365A2 (en) * | 2002-10-07 | 2004-04-22 | Freescale Semiconductor, Inc. | Method of forming a sensor for detecting motion |
KR20050109551A (ko) * | 2003-03-10 | 2005-11-21 | 허니웰 인터내셔널 인코포레이티드 | 글래스-실리콘 mems 공정에서의 매립형 전자 피드스루시스템 및 방법 |
US7352040B2 (en) * | 2003-06-04 | 2008-04-01 | Robert Bosch Gmbh | Microelectromechanical systems having trench isolated contacts, and methods for fabricating same |
CN1683234A (zh) * | 2004-04-13 | 2005-10-19 | 财团法人汉城大学校产学协力财团 | 在真空状态下封装mems装置的方法以及用该方法生产的装置 |
JP2007245339A (ja) * | 2006-03-16 | 2007-09-27 | Commiss Energ Atom | マイクロ電子コンポジット特にmemsの密閉キャビティ内の被包構造 |
US20090179233A1 (en) * | 2008-01-16 | 2009-07-16 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (mems) device |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103213939B (zh) * | 2012-01-19 | 2016-01-20 | 北京自动化控制设备研究所 | 一种四质量块硅微机电陀螺结构的加工方法 |
CN103922267A (zh) * | 2013-01-10 | 2014-07-16 | 深迪半导体(上海)有限公司 | 一种基于mems的惯性传感器生产及晶圆级封装工艺 |
CN103508414B (zh) * | 2013-09-13 | 2015-08-19 | 华中科技大学 | 一种mems陀螺仪芯片双面阳极键合工艺 |
CN103508414A (zh) * | 2013-09-13 | 2014-01-15 | 华中科技大学 | 一种mems陀螺仪芯片双面阳极键合工艺 |
CN103552980A (zh) * | 2013-11-15 | 2014-02-05 | 安徽北方芯动联科微***技术有限公司 | Mems芯片圆片级封装方法及其单片超小型mems芯片 |
CN104817055B (zh) * | 2014-01-30 | 2017-06-13 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
CN104817055A (zh) * | 2014-01-30 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
CN105084302A (zh) * | 2014-05-19 | 2015-11-25 | 无锡华润上华半导体有限公司 | Mems质量块的制作方法 |
CN105129727B (zh) * | 2014-06-06 | 2018-10-26 | 罗伯特·博世有限公司 | 具有两个半导体构件的部件和用于制造两个半导体构件之间的键合连接的方法 |
CN105129727A (zh) * | 2014-06-06 | 2015-12-09 | 罗伯特·博世有限公司 | 具有两个半导体构件的、在其之间构造有至少两个严密密封的腔的部件和用于制造两个半导体构件之间的相应键合连接的方法 |
CN110240115A (zh) * | 2015-06-24 | 2019-09-17 | 雷神公司 | 包括双密封环的晶片级mems封装件 |
CN106315504A (zh) * | 2016-11-05 | 2017-01-11 | 安徽北方芯动联科微***技术有限公司 | 具有垂直压焊块的圆片级封装mems芯片及其制作方法 |
CN111103436A (zh) * | 2018-10-25 | 2020-05-05 | 美国亚德诺半导体公司 | 低噪声多轴加速度计及相关方法 |
US11099207B2 (en) | 2018-10-25 | 2021-08-24 | Analog Devices, Inc. | Low-noise multi-axis accelerometers and related methods |
CN110631568A (zh) * | 2019-09-10 | 2019-12-31 | 东南大学 | 一种基于二维光子晶体腔体结构的新型moems双轴陀螺仪及其加工方法 |
CN110631568B (zh) * | 2019-09-10 | 2021-02-09 | 东南大学 | 一种基于二维光子晶体腔体结构的新型moems双轴陀螺仪及其加工方法 |
CN112461264A (zh) * | 2020-11-20 | 2021-03-09 | 大连理工大学 | 一种石英半球谐振子纳米制造装备 |
CN112461264B (zh) * | 2020-11-20 | 2023-04-11 | 大连理工大学 | 一种石英半球谐振子纳米制造装备 |
CN113607153A (zh) * | 2021-08-30 | 2021-11-05 | 武汉大学 | 一种两轴mems圆环陀螺仪及其制备封装方法 |
CN113607153B (zh) * | 2021-08-30 | 2022-11-01 | 武汉大学 | 一种两轴mems圆环陀螺仪及其制备封装方法 |
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