CN102130571B - Power supply package and device thereof - Google Patents
Power supply package and device thereof Download PDFInfo
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- CN102130571B CN102130571B CN2011100682469A CN201110068246A CN102130571B CN 102130571 B CN102130571 B CN 102130571B CN 2011100682469 A CN2011100682469 A CN 2011100682469A CN 201110068246 A CN201110068246 A CN 201110068246A CN 102130571 B CN102130571 B CN 102130571B
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- power supply
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- supply energy
- converting unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The embodiment of the invention discloses a power supply package which comprises a power supply energy conversion unit, wherein the power supply energy conversion unit is used for realizing conversion among different characteristic electric energies; a heat-conducting current-carrying plate is arranged on the power supply energy conversion unit, a current-carrying heat-conducting substrate is arranged under the power supply energy conversion unit; and at least one metalized welding ball is arranged below the power supply energy conversion unit. Through the heat-conducting and current-carrying plate for transferring heat upwards and the metalized welding ball for transferring heat downwards, thermal resistance which is upward from a heat point of the power supply energy conversion unit inside a power supply to a heat radiator at the top and thermal resistance which is downward from the heat point to an external printed circuit board at the bottom are remarkably reduced. The invention has the advantages of upward and downward dual-surface heat radiating capacities and high heat radiating efficiency.
Description
Technical field
The present invention relates to power technique fields, relate in particular to the power module encapsulation technology.
Background technology
Along with constantly reducing of the continuous increase of the field devices power such as telecommunications, server, volume, the application of power space is also more and more compacter, and the high power density power supply has become one of following developing direction.
The heat-sinking capability of power package has directly determined the hot property of power supply, and the performances such as the power output of high temperature lower module, efficiency.Account for the plate area for reducing power supply, the both direction up and down of general power module generally all can be installed heating element, for improving the heat-sinking capability of power module, usually adopts the power module top to add the form that the traditional heat-dissipating device is combined with heat conductive pad or heat-conducting glue.
In realizing process of the present invention, the inventor finds that at least there is following problem in prior art: existing structure has caused the difference of the upper and lower both direction heat-sinking capability of power supply energy converting unit, because the below components and parts do not have corresponding radiator, below causing, the heat dissipation problem of components and parts becomes the heat radiation bottleneck of power module.
Summary of the invention
The purpose of the embodiment of the present invention is the defect for above-mentioned prior art, and a kind of power package and device thereof of high efficiency and heat radiation is provided.
The technical scheme that the embodiment of the present invention is taked to achieve these goals is:
A kind of power package, comprise the power supply energy converting unit, described power supply energy converting unit is for realizing the conversion between the different characteristic electric flux, it is characterized in that, cover the conductive and heat-conductive plate on described power supply energy converting unit, be provided for conducting the conductive and heat-conductive substrate of power supply energy conversion unit electric flux and heat under described power supply energy modular converter, described conductive and heat-conductive substrate below arranges at least one metallization soldered ball.
The embodiment of the present invention also provides a kind of power package device, comprise the power supply energy converting unit, described power supply energy converting unit comprises between one group of semiconductor device, one group of passive device and a set of pieces conducts electricity electric connecting member, for realizing the conversion between the different characteristic electric flux; Cover the conductive and heat-conductive plate on described power supply energy converting unit, be provided for conducting the conductive and heat-conductive substrate of power supply energy conversion unit electric flux and heat under described power supply energy modular converter, described conductive and heat-conductive substrate below arranges at least one metallization soldered ball.
Described heat-conductivity conducting plate comprises body and the first extension, described body extends at least from the top down two edges and forms the first extension, at least one components and parts of described body and power supply energy converting unit or the electrical connection of electrically conductive coupling part, at least one components and parts of described conductive and heat-conductive substrate and power supply energy converting unit or the electrical connection of electrically conductive coupling part.
Described the first extension edge extends to form the second extension, the salient point copline of the lower surface of described the second extension and described metallization soldered ball.
The salient point of the lower surface of described the second extension and described metallization soldered ball is welded on printed circuit board (PCB).
The beneficial effect that the technical scheme that the embodiment of the present invention provides is brought is: the embodiment of the present invention is by the heat-conductivity conducting plate upwards conducted heat, and the metallization soldered ball conducted heat downwards; Significantly reduce to reach down to the thermal resistance between the bottom external printed circuit board (PCB) upward to top heat sink from power supply internal electric source energy conversion unit focus, having upwards and downward two-side radiation ability, radiating efficiency is high.
The accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
A kind of power module encapsulation bottom view that Fig. 1 provides for the embodiment of the present invention;
A kind of power module encapsulation top view that Fig. 2 provides for the embodiment of the present invention;
A kind of power module encapsulation profile that Fig. 3 provides for the embodiment of the present invention;
A kind of power module packaging system profile that Fig. 4 embodiment of the present invention provides;
The another kind of power module encapsulation bottom view that Fig. 5 provides for the embodiment of the present invention;
The another kind of power module encapsulation top view that Fig. 6 provides for the embodiment of the present invention.
In figure: 100 power package, 1001 heat-conductivity conducting plates, 1,002 second extensions, 1003 bodies, 1004 power supply energy converting units, 1,005 first extensions, 1010 conductive and heat-conductive substrates, 1011 times heat conducting disk, conductive plate on 1012,1013 thermal insulation layers, 1020 metallization soldered balls, 1030 components and parts, 1031 semiconductor device, 1032 electrically conductive coupling parts, 1040 thermal plastic insulations, 1050 electrical connections.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
Referring to Fig. 1, Fig. 2 and Fig. 3, a kind of power package, comprise power supply energy converting unit 1004 (dotted line frame inner assembly in figure), power supply energy converting unit 1004 comprises one group of semiconductor device, conduct electricity electric connecting member between one group of passive device and a set of pieces, for realizing on the conversion electric power energy conversion unit 1004 between the different characteristic electric flux covering heat-conductivity conducting plate 1001, the power supply energy converting unit is provided for conducting the conductive and heat-conductive substrate 1010 of power supply energy conversion unit 1004 electric fluxs and heat for 1004 times, conductive and heat-conductive substrate 1010 belows arrange at least one metallization soldered ball 1020,
In the embodiment of the present invention, the connected mode of heat-conductivity conducting plate and power supply energy converting unit does not limit, and the embodiment of the present invention is by the heat-conductivity conducting plate upwards conducted heat, and the metallization welded ball array conducted heat downwards; Significantly reduce from power supply internal electric source energy conversion unit focus upward to top heat sink and down to bottom external PCB (Printed Circuit Board, printed circuit board (PCB)) thermal resistance between, have the downward two-side radiation ability that upwards reaches, radiating efficiency is high.
Referring to Fig. 1, Fig. 2 and Fig. 3, further, heat-conductivity conducting plate 1001 comprises body 1003 and the first extension 1005, the edge that body 1003 extends two ends from the top down forms two the first extensions 1005, and body 1003 is electrically connected with at least one components and parts 1030 or the electrically conductive coupling part 1032 of power supply energy converting unit 1004.Conductive and heat-conductive substrate 1010 is electrically connected with at least one components and parts 1030 or the electrically conductive coupling part 1032 of power supply energy converting unit 1004.
The present embodiment heat-conductivity conducting plate lower cover is established the power supply energy converting unit, the function that not only there is two-side radiation, and the electrical connection by heat-conductivity conducting plate and power supply energy converting unit, reach the conductive and heat-conductive substrate and be connected with the electrical equipment of power supply energy converting unit, reduced the stray inductance that lead-in wire brings, and reduce the electric stress problem of device of introducing, reduce line loss.
Referring to Fig. 3, for the ease of connecting PCB board, the first extension 1005 edges extend to form the salient point copline of lower surface with the metallization soldered ball 1020 of the second extension 1002, the second extensions 1002.The heater members of power supply energy converting unit is connected with the second extension 1002 by after insulation processing.
The part heater members of power supply energy converting unit, further can pass through insulation processing, the passage that is connected with the second extension 1002 and conducts heat as upwards.Second extension 1002 at two ends forms the input and output pin of power supplys, as being connected of power supply and external circuit.The array of metallization soldered ball 1020 further can be used as non-power supply input and output pin, only realizes the power supply heat is passed to the passage of external circuit.
Referring to Fig. 3, power supply energy converting unit 1004 comprises electrically conductive coupling part 1032 between one group of semiconductor device 1031, a constituent element device 1030 and a set of pieces, for realizing the conversion between the different characteristic electric flux; Electrically conductive coupling part 1032 can provide the connected mode of electrical interconnection for metallic plate or pcb board etc.
Referring to Fig. 3, conductive and heat-conductive substrate 1010 comprises upper and lower conductive layers and thermal insulation layer 1013, described upper and lower conductive layers is realized electrical connection by via hole or metal derby, be provided with thermal insulation layer 1013 between described upper and lower conductive layers, described upper conductive layer upper surface is provided with conductive plate 1012, on upper conductive plate 1012, the components and parts in power supply energy converting unit 1004 are set, upper conductive plate 1012 electrical connection power supply energy converting units 1004, the heater members of power supply energy converting unit 1004 is connected with upper conductive plate 1012, described lower conductiving layer lower surface is provided with lower conductive plate 1011, metallization soldered ball 1020 correspondences are arranged on lower heat conducting disk 1011 times, 1004 electrical connections of the upper conductive layer of conductive and heat-conductive substrate 1010 and power supply energy converting unit, the upper conductive plate 1012 of conductive layer and lower conductive plate 1011 electric interconnections of lower conductiving layer on corresponding identical electrical network.
The upper conductive layer of the embodiment of the present invention has a plurality of upper conductive plates 1012, and lower conductiving layer has a plurality of lower conductive plates 1011; A plurality of metallization soldered balls 1020 are deposited on lower conductive plate 1011, the heater members of power supply energy converting unit 1004 further can be connected with upper conductive plate 1012, then successively by upper conductive layer, thermal insulation layer 1013 and lower conductiving layer, heat is delivered to lower conductive plate 1011, metallization soldered ball 1020 by metal array is passed to external circuit by power supply energy converting unit heat again, as the passage of downward heat transfer.The conductive and heat-conductive substrate 1010 of the embodiment of the present invention can adopt direct bonding copper clad laminate (DBC) Direct Bond Copper; Have the following advantages: owing to adopting thick copper, good conduction and heat-sinking capability are arranged; And copper and pottery have very strong cementability; And copper and silicon has thermal coefficient of expansion CTE (Coefficient of thermalexpansion) coupling preferably, so this kind of conductive and heat-conductive substrate has longer life-span, good mechanical strength and mechanical stability of cycle; Conductive and heat-conductive substrate 1010 also can adopt PCB, but other using ceramic material as the conductive and heat-conductive substrate of thermal insulation layer also matched coefficients of thermal expansion CTE after, be applied in herein as the conductive and heat-conductive substrate.(for example low-temperature sintered ceramics substrate LowTemperature Co-Fired Ceramic (LTCC), high temperature sintering ceramic substrate High temperature co-fired ceramic (HTCC))
Referring to Fig. 3, as preferably, between heat-conductivity conducting plate 1001 or conductive and heat-conductive substrate 1010 and power supply energy converting unit 1004, be provided with the insulating heat-conductive sheet, also can fill thermal plastic insulation 1040.
Heater element in power supply energy converting unit 1004, do not needing and heat-conductivity conducting plate 1001 or 1010 electrical connections of conductive and heat-conductive substrate, only need to conduct heat and while needing electrical isolation by heat-conductivity conducting plate 1001 or conductive and heat-conductive substrate 1010, can adopt the insulating heat-conductive sheet to be placed in 1010 of the heater element of power supply energy converting unit 1004 and metallic plate conductive plate 1001 or conductive and heat-conductive substrates, heat further is uniformly distributed, and minimizing power supply energy converting unit part of devices contacts with external environment condition, improves power supply reliability.
Referring to Fig. 4, a kind of power package device, 200 of high efficiency and heat radiation power package 100 and outside pcb boards weld together by scolding tin 300, and the lower surface of the second extension 1002 is welded on pcb board 200 with the salient point of metallization soldered ball 1020; The metallization welded ball array conducted heat downwards transmits the power supply heat to outside pcb board 200; Strengthening power supply dispels the heat downwards.
Referring to Fig. 5 and Fig. 6, a kind of power package 100, comprise heat-conductivity conducting plate 1001, heat-conductivity conducting plate 1001 belows arrange the power supply energy converting unit, power supply energy converting unit below arranges conductive and heat-conductive substrate 1010, conductive and heat-conductive substrate 1010 belows arrange a plurality of metallization soldered balls 1020, metallization soldered ball 1020 forms array, heat-conductivity conducting plate 1001 extends from the top down four edges and forms the first extension, the first extension extends to lower surface again and forms the second extension 1002, the second extension 1002 forms lower surface with the salient point copline of metallization soldered ball 1020 arrays of metal array, the input and output pin that lower surface is power supply, as being connected of power supply and external circuit.The part heat generating spot of power supply energy converting unit 1004, further can pass through insulation processing, the passage that is connected with the second extension 1002 and conducts heat as upwards.
The embodiment of the present invention is by the heat-conductivity conducting plate upwards conducted heat, and the metallization welded ball array conducted heat downwards; Significantly reduce from power supply internal electric source energy conversion unit focus to the thermal resistance top heat sink and bottom external PCB, there is good two-side radiation ability, can realize identical or higher power grade with less package dimension, significantly improve the power density of power module; Reduced by the upper conductive plate of heat-conductivity conducting plate, conductive and heat-conductive substrate and the electrical connection of power supply energy converting unit the stray inductance that lead-in wire brings, and reduced by the electric stress problem of the device of its introducing, reduced line loss.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (9)
1. a power package, comprise the power supply energy converting unit, described power supply energy converting unit is for realizing the conversion between the different characteristic electric flux, it is characterized in that, cover the heat-conductivity conducting plate on described power supply energy converting unit, be provided for conducting the conductive and heat-conductive substrate of power supply energy conversion unit electric flux and heat under described power supply energy modular converter, described conductive and heat-conductive substrate below arranges at least one metallization soldered ball;
Wherein, described heat-conductivity conducting plate comprises body and the first extension, described body extends at least from the top down two edges and forms the first extension, described the first extension edge extends to form the second extension, the salient point copline of the lower surface of described the second extension and described metallization soldered ball, at least one components and parts of described body and power supply energy converting unit or the electrical connection of electrically conductive coupling part, described the second extension becomes the input and output pin of power supply.
2. power package according to claim 1, is characterized in that, at least one components and parts of described conductive and heat-conductive substrate and power supply energy converting unit or the electrical connection of electrically conductive coupling part.
3. power package according to claim 1, is characterized in that, the heater members of described power supply energy converting unit is connected with described the second extension.
4. power package according to claim 2, is characterized in that, described electrically conductive coupling part comprises metallic plate or pcb board.
5. power package according to claim 1, it is characterized in that, be provided with insulating heat-conductive sheet or thermal plastic insulation between described heat-conductivity conducting plate and described power supply energy converting unit, between described conductive and heat-conductive substrate and described power supply energy converting unit, be provided with insulating heat-conductive sheet or thermal plastic insulation.
6. according to the described power package of claim 1-5 any one, it is characterized in that, described conductive and heat-conductive substrate comprises upper and lower conductive layers, described upper and lower conductive layers connects by via hole or metal derby, be provided with thermal insulation layer between described upper and lower conductive layers, described upper conductive layer upper surface is provided with conductive plate, and the components and parts of described power supply energy converting unit are set on described upper conductive plate, described lower conductiving layer lower surface is provided with lower conductive plate, and described metallization soldered ball correspondence is arranged under described lower conductive plate.
7. the power package of stating according to claim 6, is characterized in that, between described upper conductive layer and power supply energy converting unit, is electrically connected; Described upper conductive plate and lower conductive plate electric interconnection.
8. the power package of stating according to claim 6, is characterized in that, the heater members of described power supply energy converting unit is connected with described upper conductive plate.
9. a power package device, comprise power package as claimed in claim 1, it is characterized in that, the salient point of the lower surface of described the second extension and described metallization soldered ball is welded on printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100682469A CN102130571B (en) | 2011-03-21 | 2011-03-21 | Power supply package and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100682469A CN102130571B (en) | 2011-03-21 | 2011-03-21 | Power supply package and device thereof |
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| Publication Number | Publication Date |
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| CN102130571A CN102130571A (en) | 2011-07-20 |
| CN102130571B true CN102130571B (en) | 2013-12-04 |
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| CN2011100682469A Active CN102130571B (en) | 2011-03-21 | 2011-03-21 | Power supply package and device thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103212763A (en) * | 2013-04-11 | 2013-07-24 | 中国电子科技集团公司第十四研究所 | LTCC (Low Temperature Co-fired Ceramic) device assembly welding method |
| CN110739282A (en) * | 2019-10-15 | 2020-01-31 | 唐博汶 | Power device packaging structure and module power supply |
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| US6972216B2 (en) * | 2001-12-21 | 2005-12-06 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same |
| CN1893061A (en) * | 2005-07-08 | 2007-01-10 | 乾坤科技股份有限公司 | Package structure of power power-supply module |
| CN101110397A (en) * | 2006-07-18 | 2008-01-23 | 日月光半导体制造股份有限公司 | Chip packaging structure |
| CN101465342A (en) * | 2007-12-19 | 2009-06-24 | 台达电子工业股份有限公司 | Encapsulation structure for power-supply module |
| CN101661913A (en) * | 2008-08-27 | 2010-03-03 | 日月光半导体制造股份有限公司 | Chip scale package structure and fabrication method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101207044A (en) * | 2006-12-18 | 2008-06-25 | 矽品精密工业股份有限公司 | Heat dissipation type semiconductor package part and method for making the same |
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2011
- 2011-03-21 CN CN2011100682469A patent/CN102130571B/en active Active
Patent Citations (6)
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|---|---|---|---|---|
| US6972216B2 (en) * | 2001-12-21 | 2005-12-06 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same |
| CN1532922A (en) * | 2003-03-26 | 2004-09-29 | 矽品精密工业股份有限公司 | Semiconductor package part with radiation fin |
| CN1893061A (en) * | 2005-07-08 | 2007-01-10 | 乾坤科技股份有限公司 | Package structure of power power-supply module |
| CN101110397A (en) * | 2006-07-18 | 2008-01-23 | 日月光半导体制造股份有限公司 | Chip packaging structure |
| CN101465342A (en) * | 2007-12-19 | 2009-06-24 | 台达电子工业股份有限公司 | Encapsulation structure for power-supply module |
| CN101661913A (en) * | 2008-08-27 | 2010-03-03 | 日月光半导体制造股份有限公司 | Chip scale package structure and fabrication method thereof |
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| CN102130571A (en) | 2011-07-20 |
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