CN102126764A - Etching waste water processing method of silicon wafer and processing device - Google Patents
Etching waste water processing method of silicon wafer and processing device Download PDFInfo
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- CN102126764A CN102126764A CN2010105776839A CN201010577683A CN102126764A CN 102126764 A CN102126764 A CN 102126764A CN 2010105776839 A CN2010105776839 A CN 2010105776839A CN 201010577683 A CN201010577683 A CN 201010577683A CN 102126764 A CN102126764 A CN 102126764A
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- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W10/00—Technologies for wastewater treatment
- Y02W10/30—Wastewater or sewage treatment systems using renewable energies
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Abstract
A task of the invention is realize the following functions in a method of adding acid in etching waste water of silicon wafer for precipitating silicon dioxide and performing solid liquid separation for the precipitated silicon dioxide: reducing a necessary adding amount of flocculant, reducing the volume of the generated sludge, reducing water content of the sludge, improving dehydration property and realizing water quality stability of the processed water. For settling the task, after the acid is combined with partial solid liquid separation sludge, the mixture is added into the etching waste water of the silicon wafer. Through adding acid into the sludge and mixing, the surface of the sludge is modified by the acid therefore the silicon dioxide is precipitated from the surface of the sludge. As a result, the amount of the water absorbed by the sludge can be maximumly restrained. Therefore, the sludge with low water content and excellent dehydration property can be obtained. Furthermore the necessary adding amount of the flocculant is little, and therefore the amount of the generated sludge is reduced. Furthermore solid-liquid separation performance of the sludge is improved, and therefore the quality of the processed water is stable.
Description
Technical field
The present invention relates to a kind of wastewater treatment method and treatment unit of being discharged during with aqueous sodium hydroxide solution etching silicon wafer, particularly in the etching waste water of this silicon wafer, add acid and separate out silicon-dioxide (SiO
2) and to this silicon-dioxide (SiO
2) carry out in the method for solid-liquid separation, can realize reducing the necessary addition of flocculation agent, volume (minimizing of mud growing amount), reduction moisture percentage in sewage sludge and raising dehydration property and realization water quality treatment stable treated method and the treatment unit that minimizing generates mud.
Background technology
The silicon wafer manufacturing process that is used for individual pieces of semiconductor elements such as unicircuit such as IC, LSI, transistor or diode, all sword stapling machines or scroll saw cut off by vertical pulling method (CZ method) or float and melt the monocrystalline that method (FZ method) obtains in utilizing, then periphery is carried out chamfer machining, and in order to improve Flatness, after utilizing free abrasive that major surfaces is carried out attrition process, carry out Wet-type etching to remove the machining deformation that in these operations, puts on wafer, carry out mirror polish then.
With regard to the Wet-type etching of removing above-mentioned machining deformation, for example by the acid etching of using the mixing acid of forming by hydrofluoric acid, nitric acid, acetic acid, with the alkaline etching that utilizes alkali such as sodium hydroxide, potassium hydroxide, but consider the good advantage of wafer Flatness after the etching, be extensive use of alkaline etching in recent years always, particularly, extensively utilize the etching (patent documentation 1) of adopting aqueous sodium hydroxide solution.
In the alkaline etching of the silicon wafer that utilizes aqueous sodium hydroxide solution, contain the Si of silicon wafer and the resultant of reaction water glass (Na of sodium hydroxide
2SiO
3) and the waste water of residual hydrogen sodium oxide be discharged from.
In the past, the etching waste water of this silicon wafer (former water) was to handle by following method as shown in Figure 2: to acid that reactive tank 1 adds sulfuric acid etc. in order in and sodium hydroxide in the waste water, make silicon-dioxide (SiO by following reaction simultaneously
2) separate out from water glass, next add polymer coagulant and the solids component of separating out is carried out agglomeration process toward collection surface 2, carry out solid-liquid separation at settling bath 3 then.
Na
2SiO
3+H
2SO
4→SiO
2+H
2O+Na
2SO
4
In addition, as containing SiO
2Method of wastewater treatment, disclose a kind of in waste water, add aluminum compound such as poly aluminium chloride and sulfuric acid and carry out agglomeration process after, by adding alkali the pH value is adjusted to 6～8, adds polymer coagulant then and carry out the isolating treatment process of coagulative precipitation (patent documentation 2).
In addition, thereby adding alkaline agent in containing the waste water of metal carries out in the wastewater treatment of solid-liquid separation the solids component of separating out, be rich in the method for the high density metal hydroxides mud of concentrated property and dehydration property excellence as acquisition, HDS method (high-density slurry method, High Density Solid method) is arranged.This method is not directly to add alkaline agent in the waste water that contains metal, but with wastewater treatment in institute's separated portions mud method of adding after mixing mutually, this method is also referred to as alkaline sludge method (for example, patent documentation 3).
Patent documentation 1: Japanese kokai publication hei 11-171693 communique
Patent documentation 2: No. 3340029 communique of Japanese Patent
Patent documentation 3: Japanese kokai publication hei 7-241572 communique
The acid of in the etching waste water of silicon wafer, adding sulfuric acid etc. with in and sodium hydroxide in the waste water, make silicon-dioxide (SiO simultaneously
2) separate out and this silicon-dioxide of separating out is carried out in the previous methods of agglomeration separation, because isolating mud is gel as a rule, so the water ratio height of separated sludge, can't obtain the mud of dehydration property excellence.In order to address the above problem, increase the necessary addition of flocculation agent, its result exists that the mud generating capacity increases, the water quality treatment problem of unstable.
Summary of the invention
In order to solve above-mentioned existing problem, the objective of the invention is to, provide a kind of and in the etching waste water of silicon wafer, add acid and separate out silicon-dioxide (SiO
2) and the silicon-dioxide of separating out carried out in the method for solid-liquid separation, can realize reducing flocculation agent necessary addition, volume that minimizing generates mud, reduce moisture percentage in sewage sludge and improve dehydration property and realize water quality treatment stable treated method and treatment unit.
The inventor etc. attentively study in order to solve above-mentioned problem, and it found that, by with adding the acid of waste water to, as adding with the mixture of solid-liquid separation mud, can solve above-mentioned problem thus.
The present invention is the invention of finishing on the basis of above-mentioned viewpoint, below is main points of the present invention.
[1] a kind of etching method of wastewater treatment of silicon wafer, it is to add acid in the waste water that discharged, that contain water glass and sodium hydroxide when utilizing aqueous sodium hydroxide solution that silicon wafer is carried out etching and separate out silicon-dioxide, and this silicon-dioxide of separating out is carried out the treatment process of solid-liquid separation, it is characterized in that, with described acid as with added in the described waste water by the mixture of the part mud of solid-liquid separation.
[2] as the etching method of wastewater treatment of [1] described silicon wafer, it is characterized in that, add described mixture to described waste water after, add polymer coagulant and carry out agglomeration process, and agglomeration process water is carried out solid-liquid separation.
[3] as the etching method of wastewater treatment of [1] or [2] described silicon wafer, it is characterized in that, described mixture is added in the described waste water, thereby the pH value is adjusted to 7～8.
[4] as the etching method of wastewater treatment of each described silicon wafer in [1]～[3], it is characterized in that, mix described solid-liquid separation mud and acid, so that according to SS (Suspended Solid, the suspended solids) concentration that generates with described sour blended sludge quantity (returned sluge flow) and sludge concentration (returned sluge concentration), described waste water (former water) flow and former water, and the return sludge ratio R that calculates according to following formula reaches 5～80.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates)
[5] a kind of etching wastewater treatment equipment of silicon wafer, it is to add acid in the waste water that discharged, that contain water glass and sodium hydroxide when utilizing aqueous sodium hydroxide solution that silicon wafer is carried out etching and separate out silicon-dioxide, and described silicon-dioxide of separating out is carried out the treatment unit of solid-liquid separation, it is characterized in that, comprise: mixing device, it mixes described acid and by the part mud of solid-liquid separation; And, adding set, it adds the mixture from described mixing device in the described waste water to.
[6] as the etching wastewater treatment equipment of [5] described silicon wafer, it is characterized in that, comprising: coacervation device, add polymer coagulant and carry out agglomeration process in the waste water that is added with described mixture; And equipment for separating liquid from solid carries out solid-liquid separation to agglomeration process water.
[7] as the etching wastewater treatment equipment of [5] or [6] described silicon wafer, it is characterized in that, in described waste water, add described mixture, thereby the pH value is adjusted to 7～8.
[8] as the etching wastewater treatment equipment of each described silicon wafer in [5]～[7], it is characterized in that, in described mixing device, mix described solid-liquid separation mud and described acid, so that according to the SS concentration that generates with described sour blended sludge quantity (returned sluge flow) and sludge concentration (returned sluge concentration), described waste water (former water) flow and former water, and the return sludge ratio R that calculates according to following formula reaches 5～80.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates)
According to the present invention, in the etching waste water of silicon wafer, add acid and separate out silicon-dioxide (SiO
2) and the described silicon-dioxide of separating out carried out in the method for solid-liquid separation, add in the waste water by after making acid and part solid-liquid separation mud mixing, can reduce the necessary addition of flocculation agent, volume, reduction moisture percentage in sewage sludge and the raising dehydration property that minimizing generates mud and the stability that realizes water quality treatment thus, can effectively handle.
Description of drawings
Fig. 1 is the system diagram of an embodiment of the embodiment of the etching wastewater treatment equipment of expression silicon wafer of the present invention;
Fig. 2 represents the system diagram of treatment process in the past.
The explanation of Reference numeral
1 reactive tank
2 collection surfaces
3 settling baths
4 tempering tanks
Embodiment
Below, with reference to accompanying drawing the etching method of wastewater treatment of silicon wafer of the present invention and the embodiment of treatment unit are elaborated.
Fig. 1 is the system diagram of an embodiment of the embodiment of the etching wastewater treatment equipment of expression silicon wafer of the present invention.
The invention is characterized in, separate out silicon-dioxide (SiO in the etching waste water of silicon wafer, adding acid
2), and when this silicon-dioxide of separating out carried out solid-liquid separation, with acid as with added in the etching waste water of silicon wafer by the mixture of the part mud of solid-liquid separation (below, sometimes this mixture is called " modified sewage sludge ").
In the device of Fig. 1, former water (the etching waste water of silicon wafer) is imported to reactive tank 1 back to be added modified sewage sludge from tempering tank 4 and is mixed and carry out neutralizing treatment, neutralizing treatment water imported to collection surface 2 and add polymer coagulant to be mixed and carry out agglomeration process, agglomeration process water is imported to settling bath 3 carry out solid-liquid separation, and by pump P
1The part separated sludge is back in the tempering tank 4.
In tempering tank 4, with mud and the H that refluxes
2SO
4Mixed and prepare modified sewage sludge Deng acid, this modified sewage sludge is fed into reactive tank 1, carries out the neutralizing treatment of former water thus.
The lingering section of separated sludge is discharged to outside the system by pump P2 in the settling bath 3.In addition, the branch of solid-liquid separation is dried up in settling bath 3 is discharged to outside the system as treating water.
In the device of Fig. 1, the backflow pipe arrangement of separated sludge is provided with under meter FC and sludge concentration meter SS, according to SS (Suspended Solid, the suspended solids) growing amount of these observed values and raw water flow and former water, control pump P
1Sludge back flow quantity so that return sludge ratio R reaches prescribed value.
[mechanism of action]
In the present invention, by adding the acid of former water to, as carrying out the blended modified sewage sludge with part solid-liquid separation mud and adding in the former water, can realize reducing the necessary addition of flocculation agent, the volume that minimizing generates mud, the dehydration property that improves separated sludge, raising sludge concentration thus and reduce sludge moisture content, and then can realize the excellent effect that water quality treatment is stable, for being described as follows of this mechanism of action.
That is, with in the past HDS method in the same manner, by in mud, adding acid and being mixed, utilize acid that Sludge Surface is carried out modification, thereby make silicon-dioxide (SiO
2) separate out in Sludge Surface, its result can minimally suppresses the water yield drawn by mud.
Therefore, can access the mud that water ratio is low and dehydration property is excellent, and because the necessary addition of flocculation agent reduces, the mud growing amount can reduce also thus, the solid-liquid separation of mud is improved, thereby water quality treatment is also stable.
[the etching waste water of silicon wafer]
The etching waste water of the silicon wafer of handling in the present invention is the waste water of being discharged when utilizing aqueous sodium hydroxide solution that silicon wafer is carried out etching, contains the water glass (Na that reaction generated of silicon and sodium hydroxide usually
2SiO
3) and residue sodium hydroxide, its water quality is according to the different treatment condition in the etching work procedure etc. and different, but as a rule, the content of water glass is about 50～5000mg/L with the Si scaled value, pH is about 9～12.
As such silicon wafer etching waste water, can enumerate solar cell particularly and make waste water, liquid crystal board manufacturing waste water and silicon wafer manufacturing waste water etc.
[acid]
As the acid of in the neutralizing treatment of the etching waste water of this silicon wafer, using, can use mineral acids such as sulfuric acid, hydrochloric acid.Usually use sulfuric acid.
In the present invention, acid is added to as the modified sewage sludge that mixes with separated sludge in the silicon wafer etching waste water as former water, its addition is, the acid amount that the sodium hydroxide in the former water of neutralizing is required and make silicon-dioxide separate out the total amount of required acid amount from water glass by following reaction can determine aptly according to the water quality of former water.
Na
2SiO
3+H
2SO
4→SiO
2+H
2O+Na
2SO
4
The treatment condition of etching work procedure in source take place and difference in the addition of acid according to former water, for example, when waste water was the common silicon wafer etching waste water of pH value 13, vitriolic necessity addition was about 20000mg/L.
As a rule, acid is the interpolation of modified sewage sludge, is that the mode that the pH value according to mixed and modified mud post neutralization treating water in former water reaches about 7～8 is added.
[agglomeration process]
By in former water, adding acid and being mixed in the neutralizing treatment water that obtains, add flocculation agent and carry out agglomeration process, can improve the solid-liquid separation of mud thus.
As the flocculation agent that is used for agglomeration process, the polymer coagulant of the granulation effect excellence of preferred mud.
As polymer coagulant, can be in cationic polymer flocculant, anionic property polymer coagulant, Amphiphatic high polymer flocculation agent and the nonionic polymer coagulant any one, but consider from the charge neutralization aspect, special preferred anionic polymer coagulant, for example, can use partial hydrolystate or acrylamide and acrylic acid multipolymer etc. of polyacrylamide.These polymer coagulants can be used alone, and also can two or more mixing use.
Addition for polymer coagulant has no particular limits, and can select the addition that suits can obtaining good flocculating result, but be generally about 3～8mg/L.
[solid-liquid separation]
Agglomeration process water among Fig. 1 by solid-liquid separation, divides dried uply to be discharged to outside the system as treating water in settling bath 3, and the part of separated sludge is back to tempering tank 4, and nubbin is discharged to outside the system as residual sludge simultaneously.
[return sludge ratio R]
In the present invention, preferably according to raw water quality, sludge concentration etc., adjust in the separated sludge and to mix with acid and add sludge back flow quantity in the former water to, and SS concentration that generates in preferably will concentration, raw water flow and former water treatment (the SS concentration that former water generates) and the return sludge ratio R by following formula calculating according to returned sluge flow, returned sluge, be controlled at 5～80, especially preferably be controlled at 15～30.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates)
If return sludge ratio R is too small, then can't fully obtain the effect of the present invention that refluxes and to bring by mud, if return sludge ratio R is excessive, then the capacity in the treatment system increases and cause the maximization of each treatment trough in rain, and is therefore not preferred.
In addition, the SS concentration (g/L) that generates in former water treatment is by Si concentration (g/L) * Na
2SiO
3/ Si and calculating.
[preparation of modified sewage sludge]
In the present invention, the mixing portion separated sludge adds in the former water as modified sewage sludge with acid and with it.For the sour combined amount of this moment, as mentioned above,, be set at the neutralization that can make the residual hydrogen sodium oxide and silicon-dioxide the amount of all fully carrying out of separating out from water glass according to the water quality of former water.Usually, as shown in Figure 1, when adding in the former water after making modified sewage sludge when mix returned sluge and acid in tempering tank 4, the acid of being added can make the pH value of this modified sewage sludge reach about 4～6.
In addition, in the present invention, importantly thereby mixing sludge and acid are carried out adding in the former water after the modification to Sludge Surface by acid fully, therefore, as shown in Figure 1, tempering tank 4 preferably is set, with mixing acid and mud, and preferably this mixing time, be that detention time of mud in the tempering tank 4 is 1～10 minute.If this mixing time is too short, then can't utilize acid that Sludge Surface is carried out modification fully, in addition, even this mixing time is very long, above-mentioned effect also can't be further improved, and brings the apprentice of mixing time that increase is arranged, and is therefore unfavorable on the contrary.
In addition, Fig. 1 represents an embodiment of embodiment of the present invention, and the present invention is not limited to any device shown in Figure 1.
For example, as equipment for separating liquid from solid, except settling bath, can also use membrane separation unit etc.
In addition, also can be following manner: the leading portion at reactive tank be provided with the adjustment groove, in advance the pH value of former water is adjusted by this adjustment groove, makes its pH value that reaches regulation, for example, makes the pH value reach 9.5～11.5 and imports to reactive tank afterwards.At this moment, no matter what kind of change is the water quality of former water have, and can make the sour addition to tempering tank keep constant, can carry out stable treated.
The present invention be when utilizing aqueous sodium hydroxide solution that silicon wafer is carried out etching waste water that discharged, that contain water glass and sodium hydroxide as process object, but the effect that obtains by modified sewage sludge of the present invention is not limited to this waste water, and it is also effective to the wastewater treatment that contains alkaline silicate and alkali.
Embodiment
Below, enumerate embodiment and comparative example the present invention is carried out more specific description.
Embodiment 1
The silicon wafer etching waste water of pH value 13.0, Si concentration 2000mg/L is used as former water, handles by device shown in Figure 1.The SS amount that produces from this waste water is 4g/L.Using sulfuric acid, use Network リ Off ロ Star Network (registered trademark) PA823 (the acrylamide anionic property polymer coagulant that Kurita Water Industries Ltd makes) as polymer coagulant as acid, is 5mg/L with respect to the addition of the polymer coagulant of waste water.
Capacity of each groove (size) and pH condition are as follows.
＜reactive tank 1 〉
Capacity: 1.0L
pH：7～8
＜collection surface 2 〉
Capacity: 1.0L
pH：7～8
＜settling bath 3 〉
Size: diameter 250mm, vertical tube part height 300mm
pH：7～8
＜tempering tank 4 〉
Capacity: 0.3L
pH：4～6
Former water is to handle according to the flow of 3.0L/hr.
The part solid-liquid separation mud of settling bath 3 is back to tempering tank 4, in this tempering tank 4, adds and mixing sulfuric acid to returned sluge, so that the pH value in the groove reaches 4～6.The residence time that returned sluge is trapped in tempering tank 4 is 3 minutes.
Add modified sewage sludge to reactive tank 1, make that the waste water ph in the reactive tank 1 reaches 7～8, and at collection surface 2, add polymer coagulant to carry out agglomeration process, carry out solid-liquid separation at settling bath 3 then to the effluent liquid of reactive tank 1 from tempering tank 4.In solid-liquid separation mud, except the mud that is back to tempering tank 4, the mud of nubbin is discharged to outside the system.Branch is dried up then to be taken out as treating water.
Sludge back flow quantity to tempering tank 4 is that 1.0L/hr, returned sluge concentration are 100g/L.Therefore, return sludge ratio R=(1L/hr * 100g/L)/(3L/hr * 4g/L)=8.3.
At this moment, in resulting solid-liquid separation mud, utilize pressure filter that the solid-liquid separation mud outside the system of being discharged to is dewatered, detect the concentration of dewatered sludge and the Si concentration of water ratio and treating water, and the results are shown in the table 1.
Comparative example 1
Directly add in the reactive tank 1 so that the pH value in the reactive tank 1 reaches 7～8 except the backflow of in embodiment 1, not carrying out solid-liquid separation mud, with sulfuric acid, other and embodiment 1 handle in the same manner, by pressure filter resulting solid-liquid separation mud is dewatered equally, and detect the Si concentration of this dewatered sludge concentration and water ratio, treating water, the results are shown in the table 1.
Comparative example 2
Except in embodiment 1, do not mix returned sluge and acid, but the part of the solid-liquid separation mud sludge back flow quantity with the 1.0L/hr identical with embodiment 1 directly is back in the reactive tank 1, in reactive tank 1, directly add sulfuric acid simultaneously so that the pH value in the reactive tank 1 reaches beyond 7～8, other and embodiment 1 handle in the same manner, by pressure filter resulting solid-liquid separation mud is dewatered equally, and detect the Si concentration of dewatered sludge concentration and water ratio, treating water, the results are shown in the table 1.
Table 1
Therefore as known from Table 1, according to the present invention, the dehydration property of solid-liquid separation mud is improved, and can obtain the mud of the low and high density of water ratio, can obtain the mud that volume is reduced thus, can obtain the good treating water of water quality simultaneously.
Claims (10)
1. the etching method of wastewater treatment of a silicon wafer, be to add acid in the waste water that discharged, that contain water glass and sodium hydroxide when utilizing aqueous sodium hydroxide solution that silicon wafer is carried out etching and separate out silicon-dioxide, and this silicon-dioxide of separating out is carried out the treatment process of solid-liquid separation, it is characterized in that
With described acid as with added in the described waste water by the mixture of the part mud of solid-liquid separation.
2. the etching method of wastewater treatment of silicon wafer as claimed in claim 1 is characterized in that, add described mixture to described waste water after, add polymer coagulant and carry out agglomeration process, and agglomeration process water is carried out solid-liquid separation.
3. the etching method of wastewater treatment of silicon wafer as claimed in claim 1 is characterized in that, described mixture is added in the described waste water, thereby the pH value is adjusted to 7～8.
4. the etching method of wastewater treatment of silicon wafer as claimed in claim 2 is characterized in that, described mixture is added in the described waste water, thereby the pH value is adjusted to 7～8.
5. as the etching method of wastewater treatment of each described silicon wafer in the claim 1～4, it is characterized in that,
Mix described solid-liquid separation mud and acid so that according to described sour blended returned sluge flow and returned sluge concentration, described waste water be the SS concentration that the flow of former water and former water generate, and the return sludge ratio R that calculates according to following formula reaches 5～80,
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates).
6. the etching wastewater treatment equipment of a silicon wafer, be to add acid in the waste water that discharged, that contain water glass and sodium hydroxide when utilizing aqueous sodium hydroxide solution that silicon wafer is carried out etching and separate out silicon-dioxide, and this silicon-dioxide of separating out is carried out the treatment unit of solid-liquid separation, it is characterized in that, comprising:
Mixing device mixes described acid and by the part mud of solid-liquid separation; And,
Adding set adds the mixture from described mixing device in the described waste water to.
7. the etching wastewater treatment equipment of silicon wafer as claimed in claim 6 is characterized in that, also comprises:
Coacervation device adds polymer coagulant and carries out agglomeration process in the waste water that is added with described mixture; And,
Equipment for separating liquid from solid carries out solid-liquid separation to agglomeration process water.
8. the etching wastewater treatment equipment of silicon wafer as claimed in claim 6 is characterized in that, described mixture is added in the described waste water, thereby the pH value is adjusted to 7～8.
9. the etching wastewater treatment equipment of silicon wafer as claimed in claim 7 is characterized in that, described mixture is added in the described waste water, thereby the pH value is adjusted to 7～8.
10. as the etching wastewater treatment equipment of each described silicon wafer in the claim 6～9, it is characterized in that, in described mixing device, mix described solid-liquid separation mud and described acid, so that according to described sour blended returned sluge flow and returned sluge concentration, described waste water be the SS concentration that raw water flow and former water generate, and the return sludge ratio R that calculates according to following formula reaches 5～80.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates).
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|---|---|---|---|
| JP2010009259A JP5440199B2 (en) | 2010-01-19 | 2010-01-19 | Silicon wafer etching wastewater treatment method and treatment apparatus |
| JP2010-009259 | 2010-01-19 |
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| CN104649494A (en) * | 2015-01-30 | 2015-05-27 | 绍兴奇彩化工有限公司 | Method for treating silica sol wastewater and co-producing sodium salt |
| CN105384275A (en) * | 2014-08-28 | 2016-03-09 | 英飞凌科技股份有限公司 | method of removing particulate silicon from an effluent water |
| CN110023250A (en) * | 2016-12-09 | 2019-07-16 | 奥加诺株式会社 | For handling the processing system and processing method of the water containing silica |
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| CN103086555A (en) * | 2011-10-31 | 2013-05-08 | 库特勒自动化***(苏州)有限公司 | Treatment system and treatment method for silicon wafer etching waste water |
| JP6859123B2 (en) * | 2017-02-10 | 2021-04-14 | 株式会社クラレ | Silica-containing water treatment method and its treatment equipment |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3881704A (en) * | 1971-06-24 | 1975-05-06 | Lord Mayor Aldermen Cit | Water treatment apparatus |
| JPS63256106A (en) * | 1987-04-13 | 1988-10-24 | Toyota Motor Corp | Treatment of waste liquid of water-soluble coolant |
| JPH07241572A (en) * | 1994-03-07 | 1995-09-19 | Kurita Water Ind Ltd | Treatment of metal-containing waste water |
| JPH1034161A (en) * | 1996-07-22 | 1998-02-10 | Ebara Corp | Treatment of silica-containing waste water |
| JPH1157740A (en) * | 1997-08-25 | 1999-03-02 | Ebara Corp | Flocculating treatment of water |
| US6099748A (en) * | 1997-12-11 | 2000-08-08 | Shin-Etsu Handotai Co., Ltd. | Silicon wafer etching method and silicon wafer etchant |
| CN1317610A (en) * | 2001-05-30 | 2001-10-17 | 潍坊学院 | Alkaline pulping process of wheel straw without drainage of black liquid |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55149121A (en) * | 1979-05-02 | 1980-11-20 | Kimura Kakoki Kk | Treatment of reactive dye dyeing waste water containing sodium silicate |
| DD296471A5 (en) * | 1990-07-05 | 1991-12-05 | Veb Spurenmetalle Freiberg,De | METHOD FOR THE CONTINUOUS AND CONTROLLED EXTINGUISHING OF FINE-DISTRIBUTED SILICON FROM A CURRENT OF CORROSIVE GRINDING TRUE |
| JPH08276191A (en) * | 1995-02-06 | 1996-10-22 | Mitsubishi Materials Corp | Recovery of silica in aqueous solution and seeds used therein |
| JP2001129308A (en) * | 1999-11-01 | 2001-05-15 | Ebara Corp | Flocculation and precipitation facility and flocculation and precipitation method |
| JP4554917B2 (en) * | 2003-12-09 | 2010-09-29 | 旭化成ケミカルズ株式会社 | Recovery method of caustic aqueous solution for silicon wafer etching and caustic aqueous solution recovered thereby |
| JP2006026543A (en) * | 2004-07-16 | 2006-02-02 | Kurita Water Ind Ltd | Apparatus and method for removing silica |
| JP2007029802A (en) * | 2005-07-25 | 2007-02-08 | Fuji Xerox Co Ltd | Discharge water treatment method |
-
2010
- 2010-01-19 JP JP2010009259A patent/JP5440199B2/en not_active Expired - Fee Related
- 2010-12-03 CN CN201010577683.9A patent/CN102126764B/en active Active
- 2010-12-16 TW TW099144157A patent/TWI560150B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3881704A (en) * | 1971-06-24 | 1975-05-06 | Lord Mayor Aldermen Cit | Water treatment apparatus |
| JPS63256106A (en) * | 1987-04-13 | 1988-10-24 | Toyota Motor Corp | Treatment of waste liquid of water-soluble coolant |
| JPH07241572A (en) * | 1994-03-07 | 1995-09-19 | Kurita Water Ind Ltd | Treatment of metal-containing waste water |
| JPH1034161A (en) * | 1996-07-22 | 1998-02-10 | Ebara Corp | Treatment of silica-containing waste water |
| JPH1157740A (en) * | 1997-08-25 | 1999-03-02 | Ebara Corp | Flocculating treatment of water |
| US6099748A (en) * | 1997-12-11 | 2000-08-08 | Shin-Etsu Handotai Co., Ltd. | Silicon wafer etching method and silicon wafer etchant |
| CN1317610A (en) * | 2001-05-30 | 2001-10-17 | 潍坊学院 | Alkaline pulping process of wheel straw without drainage of black liquid |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105384275A (en) * | 2014-08-28 | 2016-03-09 | 英飞凌科技股份有限公司 | method of removing particulate silicon from an effluent water |
| CN104649494A (en) * | 2015-01-30 | 2015-05-27 | 绍兴奇彩化工有限公司 | Method for treating silica sol wastewater and co-producing sodium salt |
| CN104649494B (en) * | 2015-01-30 | 2016-05-04 | 浙江奇彩环境科技股份有限公司 | A kind of method of processing of Ludox waste water and coproduction sodium salt |
| CN110023250A (en) * | 2016-12-09 | 2019-07-16 | 奥加诺株式会社 | For handling the processing system and processing method of the water containing silica |
| CN110023250B (en) * | 2016-12-09 | 2022-06-03 | 奥加诺株式会社 | Treatment system and treatment method for treating water containing silicon dioxide |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011147847A (en) | 2011-08-04 |
| CN102126764B (en) | 2014-01-29 |
| TW201125825A (en) | 2011-08-01 |
| TWI560150B (en) | 2016-12-01 |
| JP5440199B2 (en) | 2014-03-12 |
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