CN102123563B - 一种陶瓷pcb电路板的制作方法 - Google Patents
一种陶瓷pcb电路板的制作方法 Download PDFInfo
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- CN102123563B CN102123563B CN 201110079000 CN201110079000A CN102123563B CN 102123563 B CN102123563 B CN 102123563B CN 201110079000 CN201110079000 CN 201110079000 CN 201110079000 A CN201110079000 A CN 201110079000A CN 102123563 B CN102123563 B CN 102123563B
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CN 201110079000 CN102123563B (zh) | 2011-03-30 | 2011-03-30 | 一种陶瓷pcb电路板的制作方法 |
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CN 201110079000 CN102123563B (zh) | 2011-03-30 | 2011-03-30 | 一种陶瓷pcb电路板的制作方法 |
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CN102123563A CN102123563A (zh) | 2011-07-13 |
CN102123563B true CN102123563B (zh) | 2013-05-08 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106304624A (zh) * | 2016-08-28 | 2017-01-04 | 广西小草信息产业有限责任公司 | 一种集成***中的pcb电路板及其制作方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102692000A (zh) * | 2012-06-04 | 2012-09-26 | 山西山地新源科技有限公司 | 用于led大功率照明模组的石墨基板及制作工艺 |
CN102883539B (zh) * | 2012-10-17 | 2015-04-08 | 厦门爱谱生电子科技有限公司 | 一种采用插接连接的柔性电路板制造工艺改进方法 |
CN103025130B (zh) * | 2012-12-06 | 2015-04-01 | 南京中江新材料科技有限公司 | 一体化多功能氧化铝陶瓷电子制冷散热器及其制作方法 |
CN105820557B (zh) * | 2016-04-25 | 2019-02-01 | 惠州市环美盛新材料有限公司 | 一种阻燃导热尼龙及其制备方法 |
CN106587970A (zh) * | 2016-12-16 | 2017-04-26 | 东莞市翔龙能源科技有限公司 | 一种辐射散热的led陶瓷基板及其制备方法 |
CN108257922A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN108257923A (zh) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | 一种散热基板及其制备方法和应用以及电子元器件 |
CN110586935B (zh) * | 2019-10-29 | 2021-12-17 | 常州品睿电子科技有限公司 | 一种用于cpu散热的铜-电气石复合散热材料的制造方法 |
CN115172571B (zh) * | 2022-07-15 | 2023-04-07 | 广州市明电照明科技有限公司 | 一种圆形超匀光led芯片及其切割和封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101130461A (zh) * | 2006-08-22 | 2008-02-27 | 于深 | 半导体照明散热衬底基板材料 |
CN101767481A (zh) * | 2009-01-06 | 2010-07-07 | 金安国纪科技股份有限公司 | 高导热覆铜板的制备方法 |
CN201556637U (zh) * | 2009-04-16 | 2010-08-18 | 张成邦 | 一种大功率led封装基板 |
Family Cites Families (1)
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JP2009292683A (ja) * | 2008-06-05 | 2009-12-17 | Wicera Co Ltd | 電波遮蔽セラミックス及びその製造方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101130461A (zh) * | 2006-08-22 | 2008-02-27 | 于深 | 半导体照明散热衬底基板材料 |
CN101767481A (zh) * | 2009-01-06 | 2010-07-07 | 金安国纪科技股份有限公司 | 高导热覆铜板的制备方法 |
CN201556637U (zh) * | 2009-04-16 | 2010-08-18 | 张成邦 | 一种大功率led封装基板 |
Non-Patent Citations (4)
Title |
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JP特开2009-292683A 2009.12.17 |
李长虹.石墨对三氧化二铝/铜金属陶瓷复合材料摩擦磨损性能的影响.《摩擦学学报》.2004,第24卷(第6期),572-574. * |
穆柏春等.稀土对Al2O3陶瓷烧结温度、显微组织和力学性能的影响.《中国稀土学报》.2002,第20卷(第增刊期),104-106. * |
许崇海等.含碳添加剂Al2O3基陶瓷复合材料的增韧机理.《无机材料学报》.2001,第16卷(第2期),256-261. * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106304624A (zh) * | 2016-08-28 | 2017-01-04 | 广西小草信息产业有限责任公司 | 一种集成***中的pcb电路板及其制作方法 |
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CN102123563A (zh) | 2011-07-13 |
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