CN102120920B - 各向异性导电粘性复合物和膜,及电路连接结构 - Google Patents
各向异性导电粘性复合物和膜,及电路连接结构 Download PDFInfo
- Publication number
- CN102120920B CN102120920B CN201010622496.8A CN201010622496A CN102120920B CN 102120920 B CN102120920 B CN 102120920B CN 201010622496 A CN201010622496 A CN 201010622496A CN 102120920 B CN102120920 B CN 102120920B
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- China
- Prior art keywords
- particle
- anisotropic conductive
- electrode
- conductive film
- copper nuclear
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/017—Antistatic agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0131246 | 2009-12-24 | ||
KR1020090131246A KR101219139B1 (ko) | 2009-12-24 | 2009-12-24 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102120920A CN102120920A (zh) | 2011-07-13 |
CN102120920B true CN102120920B (zh) | 2014-07-23 |
Family
ID=44186071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010622496.8A Active CN102120920B (zh) | 2009-12-24 | 2010-12-24 | 各向异性导电粘性复合物和膜,及电路连接结构 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9035192B2 (zh) |
KR (1) | KR101219139B1 (zh) |
CN (1) | CN102120920B (zh) |
TW (1) | TWI618094B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101279980B1 (ko) * | 2010-12-29 | 2013-07-05 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
KR101151366B1 (ko) * | 2011-11-24 | 2012-06-08 | 한화케미칼 주식회사 | 도전성 입자 및 이의 제조방법 |
KR101321368B1 (ko) * | 2011-12-20 | 2013-10-28 | 금호석유화학 주식회사 | 도전성 복합 미립자 및 이를 포함하는 도전성 페이스트 조성물 |
US9598776B2 (en) | 2012-07-09 | 2017-03-21 | Pen Inc. | Photosintering of micron-sized copper particles |
JP5942261B2 (ja) * | 2012-09-28 | 2016-06-29 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、プリント配線板 |
KR101665160B1 (ko) | 2013-05-31 | 2016-10-11 | 제일모직주식회사 | 이방성 도전 필름, 이의 조성물 및 이를 이용한 디스플레이 장치 |
CN105453001B (zh) * | 2013-07-31 | 2018-10-16 | 3M创新有限公司 | 将电子部件粘结到图案化纳米线透明导体 |
CN105593796B (zh) * | 2013-09-30 | 2019-01-04 | 3M创新有限公司 | 用于图案化的纳米线透明导体上的印刷导电图案的保护性涂层 |
CN104951156A (zh) * | 2014-03-31 | 2015-09-30 | 宸盛光电有限公司 | 电容式触控装置 |
US11901325B2 (en) | 2015-01-13 | 2024-02-13 | Dexerials Corporation | Multilayer substrate |
ITUB20155111A1 (it) * | 2015-11-04 | 2017-05-04 | St Microelectronics Srl | Dispositivo a semiconduttore e relativo procedimento |
KR102549530B1 (ko) * | 2016-06-21 | 2023-06-30 | 삼성디스플레이 주식회사 | 전자 장치의 제조 방법 및 전자 장치 |
US10327332B2 (en) * | 2016-10-06 | 2019-06-18 | Microsoft Technology Licensing, Llc | Connecting a flexible circuit to other structures |
KR101979078B1 (ko) * | 2017-04-10 | 2019-05-16 | 한국과학기술원 | 솔더 코팅된 금속 도전 입자를 사용한 이방성 전도 필름 |
KR102180143B1 (ko) * | 2017-12-29 | 2020-11-17 | 국도화학 주식회사 | 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및/또는 이를 포함하는 반도체 장치 |
JP2019125529A (ja) * | 2018-01-18 | 2019-07-25 | タツタ電線株式会社 | 導電性接着フィルム及びそれを用いた電磁波シールドフィルム |
JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
JP7046351B2 (ja) | 2018-01-31 | 2022-04-04 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
KR102152376B1 (ko) * | 2018-09-11 | 2020-09-04 | 엔트리움 주식회사 | 방열 입자 및 이를 이용한 열 계면 물질 |
CN112965305B (zh) * | 2020-07-08 | 2023-11-17 | 友达光电股份有限公司 | 显示面板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101111903A (zh) * | 2005-02-09 | 2008-01-23 | 积水化学工业株式会社 | 导电性微粒、各向异性导电材料以及导电连接方法 |
Family Cites Families (10)
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US5928568A (en) * | 1996-06-24 | 1999-07-27 | Delco Electonics Corporation | Thick film circuit having conductor composition with coated metallic particles |
CN1159973C (zh) | 1999-11-24 | 2004-08-04 | 吴桂时 | 抑制乳酸菌添加剂和用其所制成的酸牛奶及制作方法 |
EP1291453A1 (en) * | 2000-05-30 | 2003-03-12 | Nkk Corporation | Organic coating covered steel sheet |
KR100786544B1 (ko) * | 2000-09-14 | 2007-12-21 | 도와 홀딩스 가부시끼가이샤 | 도전성 페이스트용 구리 분말 |
JP3473601B2 (ja) * | 2000-12-26 | 2003-12-08 | 株式会社デンソー | プリント基板およびその製造方法 |
JP2003045228A (ja) * | 2001-08-01 | 2003-02-14 | Hitachi Chem Co Ltd | 導電ペースト |
CN101065204B (zh) * | 2004-09-29 | 2010-06-16 | Tdk株式会社 | 导电性粒子的制造方法、导电性糊料及电子部件的制造方法 |
US20080160309A1 (en) * | 2005-02-09 | 2008-07-03 | Takashi Kubota | Electrically Conductive Fine Particles, Anisotropic Electrically Conductive Material, and Electrically Conductive Connection Method |
JP4814277B2 (ja) | 2008-04-18 | 2011-11-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 接合体、該接合体の製造方法、及び該接合体に用いられる異方性導電膜 |
JP4795397B2 (ja) | 2008-06-17 | 2011-10-19 | 株式会社 イグスンド ジャパン | アルミ缶の粉末化方法および粉末製造装置 |
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2009
- 2009-12-24 KR KR1020090131246A patent/KR101219139B1/ko active IP Right Grant
-
2010
- 2010-12-21 US US12/974,476 patent/US9035192B2/en active Active
- 2010-12-23 TW TW099145504A patent/TWI618094B/zh active
- 2010-12-24 CN CN201010622496.8A patent/CN102120920B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101111903A (zh) * | 2005-02-09 | 2008-01-23 | 积水化学工业株式会社 | 导电性微粒、各向异性导电材料以及导电连接方法 |
Also Published As
Publication number | Publication date |
---|---|
US9035192B2 (en) | 2015-05-19 |
TW201131583A (en) | 2011-09-16 |
KR101219139B1 (ko) | 2013-01-07 |
KR20110074321A (ko) | 2011-06-30 |
CN102120920A (zh) | 2011-07-13 |
US20110155430A1 (en) | 2011-06-30 |
TWI618094B (zh) | 2018-03-11 |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Han Guojingjidao Patentee after: Samsung SDI Co.,Ltd. Address before: Han Guoqingshangbeidao Patentee before: CHEIL INDUSTRIES Inc. |
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CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191204 Address after: Seoul, South Kerean Patentee after: GUKTOH CHEMICAL Co.,Ltd. Address before: Han Guojingjidao Patentee before: Samsung SDI Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220913 Address after: Gyeonggi Do, South Korea Patentee after: Guo Dujianduansucai Address before: Seoul, South Kerean Patentee before: GUKTOH CHEMICAL Co.,Ltd. |
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TR01 | Transfer of patent right |