CN102117704B - Stack type solid electrolytic capacitor and manufacturing method thereof - Google Patents

Stack type solid electrolytic capacitor and manufacturing method thereof Download PDF

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Publication number
CN102117704B
CN102117704B CN201010000154.2A CN201010000154A CN102117704B CN 102117704 B CN102117704 B CN 102117704B CN 201010000154 A CN201010000154 A CN 201010000154A CN 102117704 B CN102117704 B CN 102117704B
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China
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wire frame
positive wire
anodal
electrically connected
capacitance group
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CN201010000154.2A
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CN102117704A (en
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邱继皓
林清封
黄俊嘉
刘建廷
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YUBANG ELECTRONIC (WUXI) CO Ltd
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YUBANG ELECTRONIC (WUXI) CO Ltd
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Abstract

The invention relates to a stack type solid electrolytic capacitor and a manufacturing method thereof; the stack type solid electrolytic capacitor comprises two capacitor sets, an anode conducting device, a cathode conducting device and an encapsulating unit; each capacitor set comprises at least one capacitor cell; the front end of the anode of each capacitor cell is extended to form an anode pin; the anode conducting device is provided with at least one first anode lead frame and at least one second anode lead frame which are respectively and mutually welded with the anode pins of the two capacitor cells; the first anode lead frame and the second anode lead frame are electrically connected with each other; the cathode conducting device is provided with at least one cathode lead frame and a cathode electrically connected with the two capacitor cells with conducting rubber material. Due to the stack type solid electrolytic capacitor and the manufacturing method thereof, the energy needed by welding the anode pin with the anode lead frame can be reduced, so that the alumina dielectric layer is prevented from being damaged and the current leakage can be effectively avoided.

Description

A kind of stack-type solid electrolytic capacitor and manufacture method thereof
Technical field
The present invention relates to a kind of stack-type solid electrolytic capacitor and manufacture method thereof, especially refer to a kind ofly reduce anodal welding energy to avoid producing stack-type solid electrolytic capacitor and the manufacture method thereof of leakage current.
Background technology
Capacitor is the basic module that is widely used in consumer electrical home appliances, computer main frame panel and periphery thereof, power supply unit, communication product and automobile etc., its main effect comprises: filtering, bypass, rectification, coupling, decoupling, phase inversion etc. are one of indispensable assemblies in electronic product.Capacitor, according to different materials and purposes, has different kinds.
In prior art, solid electrolytic capacitor has the advantages such as small size, high capacitance, frequency characteristic be superior, and the decoupling zero cooperation that can be used in the power circuit of central processing unit is used.As shown in Figure 1, existing stack-type solid electrolytic capacitor comprises a plurality of capacitor cell 10b, and wherein each capacitor cell 10b comprises anodal 11b, negative pole 12b and insulating barrier 13b, and insulating barrier 13b is electrically insulated anodal 11b and negative pole 12b each other.Particularly, the negative pole 12b of capacitor cell 10b is storehouse each other, and between adjacent capacitor cell 10b, conducting resin material 5b is set, so that be electrically connected to each other between a plurality of capacitor cell 10b.
The anodal 11b forward end of each capacitor cell 10b extends to form anodal pin 14b, and these anodal pin 14b bendings are also together welded in a positive wire frame 20b to reach electric connection.Yet, when the quantity of capacitor cell 10b the more, be welded in the anodal pin 14b of positive wire frame 20b the more, required welding energy is also higher, the aluminum oxide dielectric layer on the anodal 11b of high welding energy destructible capacitor cell 10b surface (figure is slightly), and cause leakage current.In addition, when the quantity of capacitor cell 10b the more, the capacitor cell 10b far away apart from positive wire frame 20b, the bending amplitude of its anodal pin 14b is larger, this bending amplitude also can be destroyed the structure of anodal 11b and cause leakage current.Above-mentioned leakage current can reduce the quality of solid electrolytic capacitor, can cause short circuit, and shorten its useful life when serious.
Summary of the invention
Technical problem to be solved by this invention, be to provide a kind of stack-type solid electrolytic capacitor and manufacture method thereof, in order to reduce anodal pin welding in the required energy of positive wire frame, make aluminum oxide dielectric layer exempt from destruction, can effectively avoid the generation of leakage current.
In order to solve the problems of the technologies described above, the technical scheme of stack-type solid electrolytic capacitor provided by the invention is:
A stack-type solid electrolytic capacitor, comprises two capacitance group, an anodal electric installation, a negative pole electric installation and an encapsulation unit;
Described in each, capacitance group comprises respectively at least one capacitor cell, each capacitor cell has a positive pole, a negative pole and an insulating barrier, described anodal front end extends to form an anodal pin, described insulating barrier surrounds into a circle coated this anodal part surface, and described negative pole is positioned at this insulating barrier rear coated this anodal part surface;
Described anodal electric installation has at least one the first positive wire frame and at least one the second positive wire frame, described the first positive wire frame and the wherein anodal pin of a capacitance group weld mutually, the anodal pin of described the second positive wire frame and another capacitance group welds mutually, between described the first positive wire frame and the second positive wire frame, is electrically connected mutually;
Described negative pole electric installation has at least one cathode lead frame, and described negative pole electric installation is electrically connected at the negative pole of described two capacitance group with conducting resin material;
This two capacitance group of described package unit covers and this positive and negative electrode electric installation of part.
Further be improved to, described in each, capacitance group has a plurality of capacitor cells, and the mutual storehouse of described capacitor cell, is electrically connected mutually with conducting resin material between the negative pole of every two capacitor cells.
Moreover described negative pole electric installation has a plurality of cathode lead frames, is electrically connected mutually between described cathode lead frame with conducting resin material.
Moreover described conducting resin material is elargol.
Moreover described welding is carried out in the mode of laser or electric resistance welding.
Moreover, between described the first positive wire frame and the second positive wire frame, with conducting resin material, be electrically connected mutually.
Moreover the mode with welding between described the first positive wire frame and the second positive wire frame is electrically connected mutually.
The mark of Fig. 1 is illustrated as: 10b capacitor cell, and 11b is anodal, 12b negative pole, 13b insulating barrier, the anodal pin of 14b, 20b positive wire frame, 5b conducting resin material;
The mark of Fig. 2-4 is illustrated as:
1 capacitance group, 10 capacitor cells, 11 positive poles, 111 aluminium foils, 112 aluminum oxide dielectric layer, 12 negative poles, 121 electroconductive polymer layers, 122 carbon paste layers, 123 conductive adhesive layers, 13 insulating barriers, 14 anodal pins, 2 anodal electric installations, 21 first positive wire framves, 22 second positive wire framves, 3 negative pole electric installations, 30 cathode lead frames, 4 encapsulation units, 5 conducting resin materials.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein, only for description and interpretation the present invention, is not intended to limit the present invention.
Embodiment 1:
As Figure 3-Figure 4, a kind of stack-type solid electrolytic capacitor, it comprises: the anodal electric installation 2 of two capacitance group 1,, a negative pole electric installation 3 and an encapsulation unit 4.
Wherein, each capacitance group 1 comprises respectively at least one capacitor cell 10, each capacitor cell 10 has a positive pole 11, a negative pole 12 and an insulating barrier 13, these positive pole 11 front ends extend and are bent to form an anodal pin 14, this insulating barrier 13 surrounds into the part surface of a circle coated this positive pole 11, this negative pole 12 be shaped as U font, be positioned at the part surface of these insulating barrier 13 rears coated this positive pole 11, this insulating barrier 13 forms insulation effect between this positive pole 11 and this negative pole 12.This positive pole electric installation 2 has at least one the first positive wire frame 21 and at least one the second positive wire frame 22, this the first positive wire frame 21 and the wherein anodal pin 14 of a capacitance group 1 weld mutually, this the second positive wire frame 22 welds mutually with the anodal pin 14 of another capacitance group 1, between this first positive wire frame 21 and this second positive wire frame 22, with conducting resin material 5 or in the mode of welding, is electrically connected mutually.Aforementioned welding can laser or the mode of electric resistance welding carry out.This negative pole electric installation 3 has at least one cathode lead frame 30, and it is electrically connected at the negative pole 12 of this two capacitance group 1 with conducting resin material 5, and above-mentioned conducting resin material 5 can be elargol or any conducting resin material.Coated this two capacitance group 1 of this encapsulation unit 4 and part this positive and negative electrode electric installation (2,3).
As shown in Figure 2, in each capacitor cell 10, this positive pole 11 comprises an aluminium foil 111 and an aluminum oxide dielectric layer 112,
In order to solve the problems of the technologies described above, the technical scheme of the manufacture method of stack-type solid electrolytic capacitor provided by the invention is:
Described manufacture method comprises the steps:
Two capacitance group are provided, each capacitance group comprises respectively at least one capacitor cell, each capacitor cell has a positive pole, a negative pole and an insulating barrier, described anodal front end extends to form an anodal pin, described insulating barrier surrounds into a circle coated this anodal part surface, and described negative pole is positioned at this insulating barrier rear coated this anodal part surface;
Described two capacitance group are electrically connected at respectively to an anodal electric installation and a negative pole electric installation, described anodal electric installation has at least one the first positive wire frame and at least one the second positive wire frame, described the first positive wire frame and the wherein anodal pin of a capacitance group weld mutually, the anodal pin of described the second positive wire frame and another capacitance group welds mutually, between described the first positive wire frame and the second positive wire frame, be electrically connected mutually, described negative pole electric installation has at least one cathode lead frame, with conducting resin material, be electrically connected at the negative pole of two capacitance group, and
With coated described two capacitance group of an encapsulation unit encapsulation and part positive and negative electrode electric installation.
In addition, anodal electric installation of the present invention has a plurality of positive wire framves (at least one the first positive wire frame and at least one the second positive wire frame), the more single positive wire frame of thickness of those positive wire frame storehouses is thick, therefore can dwindle the distance between capacitance outside unit and positive wire frame, and by slowing down the bending amplitude of anodal pin, also can reach the effect of avoiding leakage current.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification, for explaining the present invention, is not construed as limiting the invention together with embodiments of the present invention.In the accompanying drawings:
Fig. 1 is the prior art side-looking structural representation of stack-type solid electrolytic capacitor of the present invention;
Fig. 2 is the generalized section of the Single Capacitance unit of stack-type solid electrolytic capacitor of the present invention;
Fig. 3 is the side-looking structural representation (1) of stack-type solid electrolytic capacitor of the present invention;
Fig. 4 is the side-looking structural representation (2) of stack-type solid electrolytic capacitor of the present invention;
This aluminum oxide dielectric layer 112 is covered in this aluminium foil 111 surfaces, and this aluminum oxide dielectric layer 112 also forms insulation effect between positive pole 11 and negative pole 12.The negative pole 12 that is positioned at these insulating barrier 13 rears sequentially comprises an electroconductive polymer layer 121, a carbon paste layer 122 and a conductive adhesive layer 123 that is U font from the inside to the outside, the part surface of these electroconductive polymer layer 121 coated these aluminum oxide dielectric layer 112, this carbon paste layer 122 is coated on the surface of this electroconductive polymer layer 121, this conductive adhesive layer 123 is coated on the surface of this carbon paste layer 122, and the material of this conductive adhesive layer 123 can be elargol or any conducting resin material.
As shown in Figure 3, this positive pole electric installation 2 has one first positive wire frame 21 and one second positive wire frame 22, this negative pole electric installation 3 has two cathode lead frames 30, in each capacitance group 1, there are a plurality of capacitor cells 10,10 yuan of mutual storehouses of this electric capacity list, are electrically connected mutually with conducting resin material 5 between the negative pole 12 of every two capacitor cells 10.Wherein anodal pin 14 front ends of a capacitance group 1 together weld and are electrically connected at this first positive wire frame 21, anodal pin 14 front ends of another capacitance group 1 together weld and are electrically connected at this second positive wire frame 22, between this first positive wire frame 21 and this second positive wire frame 22, with conducting resin material 5, are electrically connected mutually.Wherein the negative pole 12 of a capacitance group 1 is electrically connected at a wherein cathode lead frame 30 with conducting resin material 5, the negative pole 12 of another capacitance group 1 is electrically connected at another cathode lead frame 30 with conducting resin material 5, between this two cathode lead frame 30, with conducting resin material 5, is electrically connected mutually.As shown in Figure 4, the mode that can also weld between this first positive wire frame 21 and this second positive wire frame 22 is electrically connected mutually.
Certainly, stack-type solid electrolytic capacitor of the present invention is not limited to above-described embodiment, and the number of the first positive wire frame 21, the second positive wire frame 22 and cathode lead frame 30 can adjust according to need.
A manufacture method for stack-type solid electrolytic capacitor, its step comprises:
Two capacitance group 1 are provided, each capacitance group 1 comprises respectively at least one capacitor cell 10, each capacitor cell 10 has a positive pole 11, a negative pole 12 and an insulating barrier 13, these positive pole 11 front ends extend and are bent to form an anodal pin 14, this insulating barrier 13 surrounds into the part surface of a circle coated this positive pole 11, this negative pole 12 be shaped as U font, be positioned at the part surface of these insulating barrier 13 rears coated this positive pole 11, this insulating barrier 13 forms insulation effect between this positive pole 11 and this negative pole 12.While having a plurality of capacitor cell 10 in same capacitance group 1, the mutual storehouse of these capacitor cells 10, is electrically connected mutually with conducting resin material 5 between the negative pole 12 of every two capacitor cells 10.
This two capacitance group 1 is electrically connected at respectively to an anodal electric installation 2 and a negative pole electric installation 3.This positive pole electric installation 2 has at least one the first positive wire frame 21 and at least one the second positive wire frame 22, this the first positive wire frame 21 and the wherein anodal pin 14 of a capacitance group 1 weld mutually, this the second positive wire frame 22 welds mutually with the anodal pin 14 of another capacitance group 1, between this first positive wire frame 21 and this second positive wire frame 22, with conducting resin material 5 or in the mode of welding, be electrically connected mutually, wherein can laser or the mode of electric resistance welding weld.This negative pole electric installation 3 has at least one cathode lead frame 30, it is electrically connected at the negative pole 12 of this two capacitance group 1 with conducting resin material 5, when this negative pole electric installation 3 has a plurality of cathode lead frames 30, between those cathode lead frames 30, with conducting resin material 5, be electrically connected mutually.Above-mentioned conducting resin material 5 can be elargol or any conducting resin material.
With encapsulation unit coated this two capacitance group 1 of 4 encapsulation and this positive and negative electrode electric installation 2,3 of part.
The stack-type solid electrolytic capacitor of the embodiment of the present invention and manufacture method thereof, it has following advantages:
1, the present invention is divided into two capacitance group 1 by capacitor cell 10, and this two capacitance group 1 is welded with at least one the first positive wire frame 21 and at least one the second positive wire frame 22 respectively, between the first positive wire frame 21 and the second positive wire frame 22, the mode with conducting resin material 5 or welding is electrically connected mutually again, thus, the required energy of welding can be shared and reduce to this two capacitance group 1, aluminum oxide dielectric layer 112 can be do not destroyed because welding energy is too high, the excessive or problem of short circuit of leakage current can be effectively avoided.
2, anodal electric installation 2 of the present invention has a plurality of positive wire framves (at least one the first positive wire frame 21 and at least one the second positive wire frame 22), the more single positive wire frame of thickness of these positive wire frame storehouses is thick, therefore can dwindle the distance between capacitance outside unit 10 and positive wire frame, by slowing down the bending amplitude of these anodal pins 14, also can reach the effect of avoiding leakage current.

Claims (10)

1. a stack-type solid electrolytic capacitor, is characterized in that: described stack-type solid electrolytic capacitor comprises two capacitance group, an anodal electric installation, a negative pole electric installation and an encapsulation unit;
Described in each, capacitance group comprises respectively at least one capacitor cell, each capacitor cell has a positive pole, a negative pole and an insulating barrier, described anodal front end extends to form an anodal pin, described insulating barrier surrounds into a circle coated this anodal part surface, and described negative pole is positioned at this insulating barrier rear coated this anodal part surface;
Described anodal electric installation has at least one the first positive wire frame and at least one the second positive wire frame, described the first positive wire frame and the wherein anodal pin of a capacitance group weld mutually, the anodal pin of described the second positive wire frame and another capacitance group welds mutually, between described the first positive wire frame and the second positive wire frame, is electrically connected mutually;
Described negative pole electric installation has a plurality of cathode lead frames, and described negative pole electric installation is electrically connected at the negative pole of described two capacitance group with conducting resin material;
This two capacitance group of described package unit covers and this positive and negative electrode electric installation of part;
Described in each, capacitance group has a plurality of capacitor cells, and the mutual storehouse of described capacitor cell, is electrically connected mutually with conducting resin material between the negative pole of every two capacitor cells;
Between described cathode lead frame, with conducting resin material, be electrically connected mutually.
2. according to the stack-type solid electrolytic capacitor described in claim 1, it is characterized in that: described conducting resin material is elargol.
3. according to the stack-type solid electrolytic capacitor described in claim 1, it is characterized in that: described welding is carried out in the mode of laser or electric resistance welding.
4. according to the stack-type solid electrolytic capacitor described in claim 1, it is characterized in that: between described the first positive wire frame and the second positive wire frame, with conducting resin material, be electrically connected mutually.
5. according to the stack-type solid electrolytic capacitor described in claim 1, it is characterized in that: the mode with welding between described the first positive wire frame and the second positive wire frame is electrically connected mutually.
6. a manufacture method for stack-type solid electrolytic capacitor, is characterized in that:
Described manufacture method comprises the steps:
Two capacitance group are provided, each capacitance group comprises respectively at least one capacitor cell, each capacitor cell has a positive pole, a negative pole and an insulating barrier, described anodal front end extends to form an anodal pin, described insulating barrier surrounds into a circle coated this anodal part surface, and described negative pole is positioned at this insulating barrier rear coated this anodal part surface;
Described two capacitance group are electrically connected at respectively to an anodal electric installation and a negative pole electric installation, described anodal electric installation has at least one the first positive wire frame and at least one the second positive wire frame, described the first positive wire frame and the wherein anodal pin of a capacitance group weld mutually, the anodal pin of described the second positive wire frame and another capacitance group welds mutually, between described the first positive wire frame and the second positive wire frame, be electrically connected mutually, described negative pole electric installation has a plurality of cathode lead frames, with conducting resin material, be electrically connected at the negative pole of two capacitance group, and
With coated described two capacitance group of an encapsulation unit encapsulation and part positive and negative electrode electric installation;
Described in each, capacitance group has a plurality of capacitor cells, and the mutual storehouse of described capacitor cell, is electrically connected mutually with conducting resin material between the negative pole of every two capacitor cells;
Between described cathode lead frame, with conducting resin material, be electrically connected mutually.
7. according to the manufacture method of the stack-type solid electrolytic capacitor described in claim 6, it is characterized in that: described conducting resin material is elargol.
8. according to the manufacture method of the stack-type solid electrolytic capacitor described in claim 6, it is characterized in that: described welding is carried out in the mode of laser or electric resistance welding.
9. according to the manufacture method of the stack-type solid electrolytic capacitor described in claim 6, it is characterized in that: between described the first positive wire frame and the second positive wire frame, with conducting resin material, be electrically connected mutually.
10. according to the manufacture method of the stack-type solid electrolytic capacitor described in claim 6, it is characterized in that: the mode with welding between described the first positive wire frame and the second positive wire frame is electrically connected mutually.
CN201010000154.2A 2010-01-06 2010-01-06 Stack type solid electrolytic capacitor and manufacturing method thereof Expired - Fee Related CN102117704B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456613B (en) * 2012-11-05 2014-10-11 Apaq Technology Co Ltd Improved process for the production of solid-state electrolytic capacitor
TWI626670B (en) * 2016-05-20 2018-06-11 鈺邦科技股份有限公司 Stacked-type solid electrolytic capacitor capable of increasing welding effect and manufacturing method of the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1741213A (en) * 2000-05-26 2006-03-01 松下电器产业株式会社 Solid electrolytic capacitor
CN101317241A (en) * 2005-12-15 2008-12-03 昭和电工株式会社 Capacitor chip and method for manufacturing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1741213A (en) * 2000-05-26 2006-03-01 松下电器产业株式会社 Solid electrolytic capacitor
CN101317241A (en) * 2005-12-15 2008-12-03 昭和电工株式会社 Capacitor chip and method for manufacturing same

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