CN102117110A - Notebook computer - Google Patents
Notebook computer Download PDFInfo
- Publication number
- CN102117110A CN102117110A CN2009103127713A CN200910312771A CN102117110A CN 102117110 A CN102117110 A CN 102117110A CN 2009103127713 A CN2009103127713 A CN 2009103127713A CN 200910312771 A CN200910312771 A CN 200910312771A CN 102117110 A CN102117110 A CN 102117110A
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- Prior art keywords
- heat
- cover plate
- notebook computer
- electronic elements
- generating electronic
- Prior art date
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Abstract
The invention discloses a notebook computer, which comprises a bottom plate, a cover plate and a heating electronic element, wherein the bottom plate and the cover plate are combined with each other to form an accommodation space; the heating electronic element is accommodated in the accommodation space; a thermal barrier is arranged over the heating electronic element on the inner surface of the cover plate; the heating electronic element is positioned in an area covered by the thermal barrier; and the thermal barrier prevents heat at the heating electronic element from being directly conducted onto the cover plate positioned over the heating electronic element to make cabinet temperature at the cover plate remarkably higher than that of the other parts to discomfort a user.
Description
Technical field
The invention relates to a kind of portable electron device, refer in particular to a kind of notebook computer.
Background technology
Along with improving constantly of heat-generating electronic elements power, heat dissipation problem more and more is subject to people's attention, all the more so in notebook computer, in order in limited space, to take away the heat that system produces efficiently, industry mainly adopts the heat radiation module of being made up of heat pipe, heating radiator and fan at present, it is installed on heat-generating electronic elements such as the central processing unit (CPU), makes that heat pipe and CPU are hot to be contacted to absorb the heat that it is produced.The heat transfer path of this mode is: the heat that CPU produces passes to heating radiator through heat pipe, and the air-flow that is produced by the fan heat that will reach heating radiator is taken away again.
Yet, along with the progress that science and technology is maked rapid progress, to pursue under the consideration of portability and practicality, present notebook computer on the market generally all tends to make light, thin, short, little, to meet the life style of modern society.Under the design of ultrathin machine, the heating radiator in heat-generating electronic elements and the above-mentioned heat radiation module and the distance of casing upper and lower covers are very near, make the temperature of the casing close on heat-generating electronic elements and heating radiator place apparently higher than other parts, cause on the casing temperature of privileged site too high, can allow the user not feel well.
Summary of the invention
In view of this, be necessary to provide a kind of heat that reduces the heat-generating electronic elements generation to pass to the notebook computer of privileged site on the casing.
A kind of notebook computer, comprise a base plate, a cover plate, a heat-generating electronic elements, this base plate and cover plate make up the back mutually and form a receiving space, this heat-generating electronic elements is contained in this receiving space, be provided with a thermofin on the inside surface of this cover plate directly over this heat-generating electronic elements, this heat-generating electronic elements is positioned at the zone that this thermofin covers.
Compared with prior art, corresponding heat-generating electronic elements place is provided with thermofin on the inside surface of above-mentioned cover plate, the heat that can prevent the heat-generating electronic elements place is directly conducted on the cover plate that is positioned at directly over it, and the casing temperature of avoiding making this place allows the user not feel well apparently higher than other parts.
Description of drawings
Fig. 1 is the three-dimensional exploded view of notebook computer one embodiment of the present invention.
Fig. 2 is the three-dimensional assembly diagram of notebook computer among Fig. 1.
Fig. 3 is the side sectional view of Fig. 2.
Fig. 4 is the side sectional view of heat-generating electronic elements part among Fig. 2.
Fig. 5 utilizes spin coater to apply the synoptic diagram of thermofin shown in Figure 4.
Fig. 6 is the synoptic diagram after heat-barrier material shown in Figure 5 is spread apart.
The main element symbol description
| |
10 |
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11 |
| Heat-generating |
12 |
| |
20 |
| |
22 |
| |
24 |
| |
26 |
| The radiating |
28 |
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30 |
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31 |
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32 |
| Heat- |
32a |
| Outside |
33 |
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34 |
| Receiving |
40 |
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50 |
Embodiment
See also Fig. 1 and Fig. 2, this notebook computer comprises that a base plate 10, is positioned at heat abstractor 20 and on this base plate 10 and is covered on cover plate 30 on this base plate 10, for for purpose of brevity, has omitted the display screen of this notebook computer among the figure.
Please consult Fig. 3 and Fig. 4 simultaneously, this notebook computer also comprises to be located at the circuit board 11 on this base plate 10 and to be located at a heat-generating electronic elements 12 on this circuit board 11.Described base plate 10 and these cover plate 30 common receiving spaces 40 that form.Described circuit board 11, heat-generating electronic elements 12 and heat abstractor 20 are contained in this receiving space 40.
This heat abstractor 20 is used for this heat-generating electronic elements 12 is dispelled the heat as CPU etc.This heat abstractor 20 comprises an absorber plate 22, a heat pipe 24, a radiating fin group 28 and is located at the fan 26 of these radiating fin group 28 1 sides.The lower surface of this absorber plate 22 contacts in order to absorb its heat with this heat-generating electronic elements 12.One end of this heat pipe 24 is connected with the upper surface of this absorber plate 22, and the other end bending extension of this heat pipe 24 is connected with this radiating fin group 28.The heat transferred that the heat-generating electronic elements 12 that this heat pipe 24 is used for that absorber plate 22 is absorbed produces when working is to radiating fin group 28.The air outlet of this fan 26 is over against this radiating fin group 28, thereby the forced draft that this fan 26 produces can directly be taken away the heat on this radiating fin group 28 when flowing through this radiating fin group 28.
Be coated with first thermofin 32 on the inside surface 31 of this cover plate 30 in position, and be coated with second thermofin 34 in position over against radiating fin group 28 over against heat-generating electronic elements 12.This first, second thermofin 32,34 is formed by the very low heat-barrier material of coefficient of heat conductivity.The thickness of this first, second thermofin 32,34 is respectively between 0.3 to 0.5 millimeter.This first, second thermofin 32,34 lay respectively at this heat-generating electronic elements 12 and radiating fin group 28 directly over, and the top that covers this heat-generating electronic elements 12 and radiating fin group 28 respectively over against the zone.Because when this notebook computer uses, heat-generating electronic elements 12 work produce a large amount of heats, make that this heat-generating electronic elements 12 is the highest with the temperature at these radiating fin group 28 places, thermofin 32,34 has covered the zone at this heat-generating electronic elements 12 and the projection place of radiating fin group 28 on the inside surface 31 of cover plate 30, the heat that can prevent this heat-generating electronic elements 12 and these radiating fin group 28 places be directly conducted on this cover plate 30 with this heat-generating electronic elements 12 and radiating fin group 28 over against the position, it is too high and influence is used to avoid making that local temperature appears in cover plate 30.During concrete enforcement, this heat-barrier material can be a thermal insulating coating, because the thermal conductivity coefficient and the thermal diffusion coefficient of thermal insulating coating are very low, the heat transferred that can prevent from well to be given off on heat-generating electronic elements 12 and the radiating fin group 28 is to cover plate 30.
See also Fig. 5, described thermofin the 32, the 34th is coated on by the heat-barrier material 32a that will be paste on the inside surface 31 of cover plate 30, and forms through overbaking.When applying this heat-barrier material 32a,, utilize the vacuum pump of spin coater 50 to hold the outside surface 33 of this cover plate 30 tightly with the inside surface 31 of this cover plate 30 up.Then a certain amount of flowable paste heat-barrier material 32a is placed the inside surface 31 of this cover plate 30, open spin coater 50 and make its high speed rotating, thereby this heat-barrier material 32a is spread apart on the inside surface 31 of this cover plate 30 equably.The speed difference of spin coater 50 runnings, therefore the thickness difference of the thermofin that is obtained can obtain the suitable thermofin of thickness by the rotating speed of control spin coater.See also Fig. 6, treat that heat-barrier material 32a is coated on this cover plate 30 fully after, utilize a well heater (figure do not show) to dry this heat-barrier material 32a, just can obtain heat insulation layer 32,34.
Because cover plate 30 is provided with thermofin 32,34 corresponding to the higher heat-generating electronic elements 12 of heat in the notebook computer and the position of radiating fin group 28, the heat that can prevent this heat-generating electronic elements 12 and radiating fin group 28 is directly conducted on the cover plate 30 that is positioned at directly over heat-generating electronic elements 12 and the radiating fin group 28, avoid this cover plate 30 near the temperature of the position of heat-generating electronic elements 12 and radiating fin group 28 apparently higher than other parts, allow the user not feel well.This thermofin 32,34 has very thin thickness, very light weight, characteristics that volume is very little, neither can take space bigger in the notebook computer, also can not hinder the normal operation of notebook computer.
Claims (7)
1. notebook computer, comprise a base plate, a cover plate, a heat-generating electronic elements, this base plate and cover plate make up the back mutually and form a receiving space, this heat-generating electronic elements is contained in this receiving space, it is characterized in that: be provided with a thermofin on the inside surface of this cover plate directly over this heat-generating electronic elements, this heat-generating electronic elements is positioned at the zone that this thermofin covers.
2. notebook computer as claimed in claim 1 is characterized in that: described thermofin is coated on the inside surface of this cover plate.
3. notebook computer as claimed in claim 1 is characterized in that: also comprise in the described receiving space heat abstractor, this heat abstractor comprise with the hot heat pipe that is connected of heat-generating electronic elements and with the hot radiating fin group that is connected of this heat pipe.
4. notebook computer as claimed in claim 3 is characterized in that: be provided with another thermofin on the inside surface of described cover plate directly over the radiating fin group, this another thermofin covers the zone at this radiating fin group place.
5. notebook computer as claimed in claim 1 is characterized in that: described thermofin is formed in the inside surface extension of cover plate by the heat-barrier material of paste.
6. notebook computer as claimed in claim 5 is characterized in that: described heat-barrier material is a thermal insulating coating.
7. notebook computer as claimed in claim 1 is characterized in that: the thickness of described thermofin is 0.3 to 0.5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103127713A CN102117110A (en) | 2009-12-31 | 2009-12-31 | Notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103127713A CN102117110A (en) | 2009-12-31 | 2009-12-31 | Notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102117110A true CN102117110A (en) | 2011-07-06 |
Family
ID=44215911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103127713A Pending CN102117110A (en) | 2009-12-31 | 2009-12-31 | Notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102117110A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103999014A (en) * | 2011-11-15 | 2014-08-20 | 汉高知识产权控股有限责任公司 | Electronic devices assembled with thermally insulating layers |
| CN105210005A (en) * | 2013-03-16 | 2015-12-30 | 汉高知识产权控股有限责任公司 | Electronic devices assembled with heat absorbing and/or thermally insulating composition |
| CN108811432A (en) * | 2017-04-28 | 2018-11-13 | 广达电脑股份有限公司 | Electronic device and heat dissipation module thereof |
| CN108990365A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Radiator structure, shell and electronic equipment |
| US10481653B2 (en) | 2013-12-19 | 2019-11-19 | Henkel IP & Holding GmbH | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith |
| WO2022019909A1 (en) * | 2020-07-23 | 2022-01-27 | Hewlett-Packard Development Company, L.P. | Thermal management devices |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2463873Y (en) * | 2001-02-13 | 2001-12-05 | 吴玉鹤 | Modular small computer mainframe |
| CN1591844A (en) * | 2003-08-29 | 2005-03-09 | 吕声木 | Semiconductor CPU radiator |
| CN101187824A (en) * | 2006-11-15 | 2008-05-28 | 乐金电子（昆山）电脑有限公司 | Portable computer hard disk drive mounting structure |
| CN101581958A (en) * | 2008-05-14 | 2009-11-18 | 富准精密工业(深圳)有限公司 | Notebook PC with radiating device |
-
2009
- 2009-12-31 CN CN2009103127713A patent/CN102117110A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2463873Y (en) * | 2001-02-13 | 2001-12-05 | 吴玉鹤 | Modular small computer mainframe |
| CN1591844A (en) * | 2003-08-29 | 2005-03-09 | 吕声木 | Semiconductor CPU radiator |
| CN101187824A (en) * | 2006-11-15 | 2008-05-28 | 乐金电子（昆山）电脑有限公司 | Portable computer hard disk drive mounting structure |
| CN101581958A (en) * | 2008-05-14 | 2009-11-18 | 富准精密工业(深圳)有限公司 | Notebook PC with radiating device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103999014A (en) * | 2011-11-15 | 2014-08-20 | 汉高知识产权控股有限责任公司 | Electronic devices assembled with thermally insulating layers |
| KR101848539B1 (en) | 2011-11-15 | 2018-04-12 | 헨켈 아이피 앤드 홀딩 게엠베하 | Electronic devices assembled with thermally insulating layers |
| CN103999014B (en) * | 2011-11-15 | 2019-03-12 | 汉高知识产权控股有限责任公司 | The electronic equipment assembled using thermal insulation layer |
| CN105210005A (en) * | 2013-03-16 | 2015-12-30 | 汉高知识产权控股有限责任公司 | Electronic devices assembled with heat absorbing and/or thermally insulating composition |
| US10481653B2 (en) | 2013-12-19 | 2019-11-19 | Henkel IP & Holding GmbH | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith |
| US11155065B2 (en) | 2013-12-19 | 2021-10-26 | Henkel IP & Holding GmbH | Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith |
| CN108811432A (en) * | 2017-04-28 | 2018-11-13 | 广达电脑股份有限公司 | Electronic device and heat dissipation module thereof |
| CN108811432B (en) * | 2017-04-28 | 2020-03-27 | 广达电脑股份有限公司 | Electronic device and heat dissipation module thereof |
| CN108990365A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Radiator structure, shell and electronic equipment |
| WO2022019909A1 (en) * | 2020-07-23 | 2022-01-27 | Hewlett-Packard Development Company, L.P. | Thermal management devices |
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Application publication date: 20110706 |