CN102111991B - 一种通孔回流类器件的焊接方法及印刷电路板 - Google Patents
一种通孔回流类器件的焊接方法及印刷电路板 Download PDFInfo
- Publication number
- CN102111991B CN102111991B CN201110053726A CN201110053726A CN102111991B CN 102111991 B CN102111991 B CN 102111991B CN 201110053726 A CN201110053726 A CN 201110053726A CN 201110053726 A CN201110053726 A CN 201110053726A CN 102111991 B CN102111991 B CN 102111991B
- Authority
- CN
- China
- Prior art keywords
- hole
- leg
- backflow
- printing
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims abstract description 33
- 239000006071 cream Substances 0.000 claims abstract description 24
- 238000005516 engineering process Methods 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims description 19
- 238000010992 reflux Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000047 product Substances 0.000 description 5
- 238000009736 wetting Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110053726A CN102111991B (zh) | 2011-03-07 | 2011-03-07 | 一种通孔回流类器件的焊接方法及印刷电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110053726A CN102111991B (zh) | 2011-03-07 | 2011-03-07 | 一种通孔回流类器件的焊接方法及印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102111991A CN102111991A (zh) | 2011-06-29 |
CN102111991B true CN102111991B (zh) | 2012-09-05 |
Family
ID=44175962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110053726A Active CN102111991B (zh) | 2011-03-07 | 2011-03-07 | 一种通孔回流类器件的焊接方法及印刷电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102111991B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024084302A1 (en) * | 2022-10-19 | 2024-04-25 | International Business Machines Corporation | Reworking solder component without part removal |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102658410B (zh) * | 2012-04-11 | 2015-08-05 | 深圳市天威达电子有限公司 | 印刷线路板与过孔元件的焊接方法及用该方法焊接的印刷线路板 |
CN102892256B (zh) * | 2012-09-28 | 2016-04-27 | 广州视睿电子科技有限公司 | 印刷电路板表面贴装电子元件的方法 |
CN105338757A (zh) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | 一种印刷电路板制作方法及印刷电路板 |
CN107171158B (zh) * | 2017-04-18 | 2019-06-07 | 深圳市宇隆宏天科技有限公司 | 一种usb type-c模组的生产方法 |
CN108289389A (zh) * | 2018-01-11 | 2018-07-17 | 郑州云海信息技术有限公司 | 一种基于自动贴片添加锡块的通孔回流焊接 |
CN108336624B (zh) * | 2018-03-22 | 2024-01-26 | 深圳捷创电子科技有限公司 | 一种连接器的焊接工艺 |
CN112153826A (zh) * | 2019-06-28 | 2020-12-29 | 株洲中车时代电气股份有限公司 | 一种插针焊接方法 |
CN111654981A (zh) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | 一种pcba柔性电路板的smt回流焊工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101111130A (zh) * | 2007-08-21 | 2008-01-23 | 无锡荣志电子有限公司 | 在印刷电路板上贴装连接器的工艺方法 |
CN101227801A (zh) * | 2007-01-19 | 2008-07-23 | 株式会社东芝 | 印刷电路板和电子设备 |
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2011
- 2011-03-07 CN CN201110053726A patent/CN102111991B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101227801A (zh) * | 2007-01-19 | 2008-07-23 | 株式会社东芝 | 印刷电路板和电子设备 |
CN101111130A (zh) * | 2007-08-21 | 2008-01-23 | 无锡荣志电子有限公司 | 在印刷电路板上贴装连接器的工艺方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024084302A1 (en) * | 2022-10-19 | 2024-04-25 | International Business Machines Corporation | Reworking solder component without part removal |
Also Published As
Publication number | Publication date |
---|---|
CN102111991A (zh) | 2011-06-29 |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
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Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181225 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |