CN102109286B - 散热器总成 - Google Patents

散热器总成 Download PDF

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CN102109286B
CN102109286B CN201110052090A CN201110052090A CN102109286B CN 102109286 B CN102109286 B CN 102109286B CN 201110052090 A CN201110052090 A CN 201110052090A CN 201110052090 A CN201110052090 A CN 201110052090A CN 102109286 B CN102109286 B CN 102109286B
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heat
heat pipe
clip
radiator assembly
contacting surface
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CN102109286A (zh
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黄崇贤
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Priority to US13/176,748 priority patent/US9175911B2/en
Priority to DE202011050778U priority patent/DE202011050778U1/de
Priority to JP2011004298U priority patent/JP3170897U/ja
Priority to KR2020110007128U priority patent/KR200465922Y1/ko
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/001Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
    • F28F9/002Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core with fastening means for other structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明涉及一种散热器总成,包括一热管、复数金属支撑件以及一固定簧片;该热管设有一第一热源接触面;该复数金属支撑件分别设有一第二热源接触面;该固定簧片包括一热管结合部,以无锡紧配的方式与该热管结合;复数支撑部,该每一支撑部分别与一该金属支撑件结合;以及复数固定部,用以固定于一设有热源之基座上;其中,该热管与该固定簧片结合后,该热管之第一热源接触面会突出于该固定簧片,且该金属支撑件之第二热源接触面系与该热管之第一热源接触面在同一水平面上;藉此本发明不仅可使热源的热直接传至热管提升热的传导效果外,亦可同时减少散热装置的重量;此外,在加工上因采无锡紧配的方式,不仅可降低成本,加工上亦较为简单。

Description

散热器总成
技术领域
本发明系为一种散热器总成,尤只一种利用热管直触热源提升热传导效率之散热器总成。
背景技术
请参阅图1至图3,一种习知散热装置,其包括一热管a、一固定座b、二锁固簧片d以及一均热板e,该固定座b设有一凹槽c,将该热管a以锡膏焊接的方式固定于该固定座b之凹槽c内;二锁固簧片d系结合于该固定座b的两侧;均热板e将该均热板e以锡膏焊接的方式设置于该热管a与该固定座b的底部。该散热装置系利用螺丝f穿过该锁固簧片d将该散热装置锁固于设有热源之板体上,并藉由该均热板e与热源做接触,使热藉由该均热板e导热至该热管a,以达成散热之功效。如前述习知的散热装置主要有下述两缺点:1、热源的热须透过均热板导热至该热管,热的传导较差且增加散热装置整体的重量;2、固定座与热管间的结合系以锡膏焊接的方式结合,不仅会影响热的传导外,加工上亦较为复杂。
发明内容
本发明主要目的在于提供一种重量轻、成本低、加工简便且可提高热传导性的散热器总成。
为实现上述之目的,本发明采取如下技术方案:
一种散热器总成,包括:一热管、复数金属支撑件以及一固定簧片;该热管,设有一第一热源接触面;该复数金属支撑件,分别设有一第二热源接触面;该固定簧片包括:一热管结合部,以无锡紧配的方式与该热管结合;复数支撑部,该每一支撑部分别与一该金属支撑件结合;以及复数固定部,用以固定于一设有热源之基座上;其中,该热管与该固定簧片结合后,该热管之第一热源接触面会突出于该固定簧片,且该金属支撑件之第二热源接触面系与该热管之第一热源接触面在同一水平面上。
本发明之散热器总成,不仅可使热源的热直接传至热管提升热的传导效果外,且因少了均热板的设置使散热装置的重量亦随之降低;此外,在加工上因采无锡紧配的方式,不仅可降低成本,加工上亦较为简单。
附图说明
图1是习式散热装置之仰视图。
图2是习式散热装置之侧视图。
图3是习式散热装置之侧视分解图。
图4是本发明散热器总成之侧视图。
图5是本发明散热器总成之侧视分解图。
图6是本发明散热器总成之俯视图。
图7是本发明散热器总成之仰视图。
图8是本发明散热器总成之具使用状态说明图(一)。
图9是本发明散热器总成之具使用状态说明图(二)。
附图标号说明:
a热管    b固定座
c凹槽    d锁固簧片
e均热板  f螺丝
1热管    11第一热源接触面
2金属支撑件   21第二热源接触面
3固定簧片     31热管结合部
32支撑部      33固定部
34肋部        8螺丝
9热源         91基座。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步描述。
请参阅图4至图9所示,一种散热器总成,包括热管1、二金属支撑件2、一固定簧片3,其中:
热管1,设有一第一热源接触面11;
二金属支撑件2,分别设有一第二热源接触面21;以及
固定簧片3,该固定簧片3包括热管结合部31,较佳的系呈一倒锥形缺口,并以无锡紧配的方式与该热管结合;二支撑部32,该每一支撑部32分别与一该金属支撑件结合2;以及四固定部33,用以固定于一设有热源9之基座91上;
所述固定簧片3并非完全包覆该热管1,使该热管1与该固定簧片3结合后,该热管1之第一热源接触面11会突出于该固定簧片3,且该金属支撑件2之第二热源接触面21系与该热管1之第一热源接触面在11同一水平面上。
本发明之散热器总成系将该金属支撑件2之第二热源接触面21与该热管1之第一热源接触面11直触所欲散热之热源9表面,再利用复数螺丝8将该固定簧片3之四个固定部33锁固于设有热源9之基座91上;藉此,可使热管1直触热源9,提升热的传导效果,且因采无锡紧配的方式,加工上亦较为便利。
另,为增加该固定簧片3之支撑力,较佳的可于该固定簧片3之热管结合部31与支撑部32间设置复数个肋部34。
另,该金属支撑件2不仅可用来做为支撑使用,更有均温导热之功效,较佳的系将该金属支撑件2与该热管1相接触,如此还可辅助固定该热管1。
另,为达到最佳的导热效果,较佳的,该金属支撑件2之第二热源接触面21之面积与该热管1之第一热源接触面11之面积总合应大于所欲散热之热源9表面。
另,该固定簧片3与该金属支撑件2的结合方式,系可选用一体成型的方式或铆接的方式做结合。
另,该固定簧片3较佳的系为不锈钢之固定簧片;该金属支撑件2较佳的系为铝材、铜材或其它金属导热材之支撑件;该固定簧片3之顶部厚度较佳的系控制在0.5mm以内
以上所述,仅是本发明较佳实施例而已,并非对本发明的技术范围作任何限制,故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰,均仍属于本发明技术方案的范围内。 

Claims (9)

1.一种散热器总成,其特征在于:包括
一热管,设有一第一热源接触面;
复数金属支撑件,分别设有一第二热源接触面;以及
一固定簧片,该固定簧片包括一热管结合部、复数支撑部以及复数固定部,该热管结合部以无锡紧配的方式与该热管结合;所述每一支撑部分别与一该金属支撑件结合;所述固定部用以固定于一设有热源之基座上;
其中,该热管与该固定簧片结合后,该热管之第一热源接触面会突出于该固定簧片,且该金属支撑件之第二热源接触面系与该热管之第一热源接触面在同一水平面上。
2.如权利要求1所述之散热器总成,其特征在于:该固定簧片与该金属支撑件系一体成型。
3.如权利要求1所述之散热器总成,其特征在于:该固定簧片与该金属支撑件系以铆接的方式结合。
4.如权利要求1所述之散热器总成,其特征在于:该固定簧片系为不锈钢之固定簧片。
5.如权利要求1所述之散热器总成,其特征在于:该固定簧片之热管结合部与支撑部间设有至少一肋部。
6.如权利要求1所述之散热器总成,其特征在于:该金属支撑件系为铝材、铜材或其它金属导热材之支撑件。
7.如权利要求1所述之散热器总成,其特征在于:该金属支撑件与该热管系相接触。
8.如权利要求1所述之散热器总成,其特征在于:该金属支撑件之第二热源接触面之面积与该热管之第一热源接触面之面积总合大于所欲散热之热源表面。
9.如权利要求1所述之散热器总成,其特征在于:该固定簧片之热管结合部系呈一倒锥形缺口。
CN201110052090A 2011-03-04 2011-03-04 散热器总成 Active CN102109286B (zh)

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CN201110052090A CN102109286B (zh) 2011-03-04 2011-03-04 散热器总成
US13/176,748 US9175911B2 (en) 2011-03-04 2011-07-06 Heat sink assembly
DE202011050778U DE202011050778U1 (de) 2011-03-04 2011-07-20 Kühlkörper-Baugruppe
JP2011004298U JP3170897U (ja) 2011-03-04 2011-07-25 放熱器アセンブリ
KR2020110007128U KR200465922Y1 (ko) 2011-03-04 2011-08-05 히트싱크 구조체

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US9175911B2 (en) 2015-11-03
US20120222836A1 (en) 2012-09-06
JP3170897U (ja) 2011-10-06
KR200465922Y1 (ko) 2013-03-18
CN102109286A (zh) 2011-06-29
KR20120006357U (ko) 2012-09-12

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