CN102108263A - Insulating adhesive material with high thermal conductivity - Google Patents
Insulating adhesive material with high thermal conductivity Download PDFInfo
- Publication number
- CN102108263A CN102108263A CN2009102450577A CN200910245057A CN102108263A CN 102108263 A CN102108263 A CN 102108263A CN 2009102450577 A CN2009102450577 A CN 2009102450577A CN 200910245057 A CN200910245057 A CN 200910245057A CN 102108263 A CN102108263 A CN 102108263A
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- parts
- adhesive material
- insulating adhesive
- thermal conductivity
- high thermal
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Abstract
The invention relates to an insulating adhesive material with high thermal conductivity, which is prepared by the following raw materials in parts by weight: 1-3 parts of silicon dioxide, 2-5 parts of aluminum oxide, 2-6 parts of aluminum nitride, 4-8 parts of silicate, 5-9 parts of dimethylbenzene, 3-5 parts of polyimide, 1-4 parts of silver paste, 6-9 parts of maleic anhydride and 7-10 parts of ethanol. The insulating adhesive material has the advantages of low cost in formula and simplicity in preparation process, and can be cured rapidly when in use.
Description
Technical field:
The present invention relates to a kind of high heat conductive insulating glue material.
Background technology:
The used high heat conductive insulating glue of domestic production high temperature lifting electromagnet generally is the Resin adhesive from Japanese import at present, it costs an arm and a leg, be difficult to tie in short-term admittedly after being filled into electro-magnet, in order to accelerate to tie solid speed, need long-time energising baking, not only consume electric power, and improved the production cost of electro-magnet, and energising is toasted for a long time, damages the insulativity of electro-magnet inside easily, makes quality product be difficult to guarantee.
Summary of the invention:
Purpose of the present invention just is to provide a kind of high heat conductive insulating glue material, and this material prescription is with low cost, process for preparation is simple, and can tie when using solid fast.
As above design, technical scheme of the present invention is: a kind of high heat conductive insulating glue material is characterized in that: made according to following weight proportion by following raw materials according: silica 1-3 part, aluminum oxide 2-5 part, aluminium nitride 2-6 part, silicate 4-8 part, dimethylbenzene 5-9 part, polyimide 3-5 part, silver slurry 1-4 part, maleic acid anhydride 6-9 part, ethanol 7-10 part.
Advantage of the present invention is: formulation cost is cheap, process for preparation is simple, and can tie when using solid fast.
Embodiment:
Embodiment 1: a kind of high heat conductive insulating glue material, make according to following weight proportion by following raw materials according: silica 1 Kg, aluminum oxide 2Kg, aluminium nitride 2Kg, silicate 4Kg, dimethylbenzene 5Kg, polyimide 3Kg, silver slurry 1Kg, maleic acid anhydride 6Kg, ethanol 7Kg.
Embodiment 2: a kind of high heat conductive insulating glue material, make according to following weight proportion by following raw materials according: silicon-dioxide 3Kg, aluminum oxide 5Kg, aluminium nitride 6Kg, silicate 8Kg, dimethylbenzene 9Kg, polyimide 5Kg, silver slurry 4Kg, maleic acid anhydride 9Kg, ethanol 10Kg.
Embodiment 3: a kind of high heat conductive insulating glue material, make according to following weight proportion by following raw materials according: silicon-dioxide 4Kg, aluminum oxide 4Kg, aluminium nitride 4Kg, silicate 6Kg, dimethylbenzene 7Kg, polyimide 4Kg, silver slurry 2Kg, maleic acid anhydride 8Kg, ethanol 8Kg.
Claims (1)
1. high heat conductive insulating glue material is characterized in that: made according to following weight proportion by following raw materials according: silica 1-3 part, aluminum oxide 2-5 part, aluminium nitride 2-6 part, silicate 4-8 part, dimethylbenzene 5-9 part, polyimide 3-5 part, silver slurry 1-4 part, maleic acid anhydride 6-9 part, ethanol 7-10 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102450577A CN102108263A (en) | 2009-12-24 | 2009-12-24 | Insulating adhesive material with high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102450577A CN102108263A (en) | 2009-12-24 | 2009-12-24 | Insulating adhesive material with high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102108263A true CN102108263A (en) | 2011-06-29 |
Family
ID=44172552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102450577A Pending CN102108263A (en) | 2009-12-24 | 2009-12-24 | Insulating adhesive material with high thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102108263A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412027A (en) * | 2011-12-12 | 2012-04-11 | 江苏冰城电材股份有限公司 | Manufacturing method of H-level and 200-level electromagnetic wire |
-
2009
- 2009-12-24 CN CN2009102450577A patent/CN102108263A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412027A (en) * | 2011-12-12 | 2012-04-11 | 江苏冰城电材股份有限公司 | Manufacturing method of H-level and 200-level electromagnetic wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110629 |