CN102104029B

CN102104029B - Integrated circuit patch for being attached on smart card

Info

Publication number: CN102104029B
Application number: CN200910261346.6A
Authority: CN
Inventors: 罗焕金; 张华鼎; 林进生; 林志成
Original assignee: Mxtran Inc
Current assignee: Mxtran Inc
Priority date: 2009-12-22
Filing date: 2009-12-22
Publication date: 2013-02-13
Anticipated expiration: 2029-12-22
Also published as: CN102104029A

Abstract

The embodiment of the invention discloses an integrated circuit patch attaching to a smart card. The integrated circuit patch comprises a flexible circuit board, a first group electrical contact pad, a second group electrical contact pad and an integrated circuit chip. The first group electrical contact pad is arranged on a first surface of the flexible circuit board and used for electrically connecting the smart card; the second group electrical contact pad is arranged on a second surface of the flexible circuit board; and the integrated circuit chip is arranged on the flexible circuit board and bonded with a lead foot of the flexible circuit board to form electrical connection, and the sum of the thickness of the flexible circuit board and the integrated circuit chip is not more than 0.5 millimeter.

Description

Be used for being attached at the integrated circuit paster of smart card

Technical field

The present invention relates to be attached at the integrated circuit paster on the smart card.

Background technology

In the prior art, whether the function that mobile phone can use or Communications service (for example mobile network's bank service) usually rely on the SIM/USIM card and can support and decide.Taiwan number of patent application 94106675 dual universal integrated circuit card (uicc) system of portable apparatus " be used for " that propose for this reason, " Double IC card system " that Taiwan number of patent application 94217529 proposes, " the Functional module improvement structure for expanded andenhanced SIM card " that U.S. Patent Application Publication No. US2007/0262156 proposes, " the Multiple Interface Card in A Mobile Phone " that U.S. Patent Application Publication No. US2009/0061933 proposes proposes certain methods and breaks through the restriction that traditional SIM/USIM card causes.

In addition, the employed SIM/USIM card paster of mobile phone (film) is arranged also on the market, Wei Tongka (the http://www.vibo.com.tw/CWS/Consumer_05_08_08 that for example can release with reference to the VIBO company in Taiwan,, .html).Wei Tongka and this type of paster are a diaphragm type paster basically, and the user can be attached at this paster traditional SIM card, and inserts simultaneously mobile phone, via mobile phone STK option, can use the original function that SIM card did not provide or application program.

But above-mentioned technology is subject to the configuration of mobile phone inner structure mostly, perhaps need original SIM card additional processing (for example dig a hole or cut card), even need the know-how personnel to finish smoothly, belong to inconvenience in fact in the use, and above-mentioned processing behavior is in some country even need the agreement of the telecommunications company of distribution SIM card.

Summary of the invention

One of characteristics of integrated circuit paster are in the embodiment of the invention: integrated circuit (IC) chip is omitted traditional encapsulation step, does not particularly need to cover the Encapsulation Moulds material.Integrated circuit (IC) chip directly is bonded on the flexible circuit board, so thickness can reduce, and when smart card is combined, and does not need smart card additional processing (for example dig a hole or cut card), and still can use the reader device of general intelligence card or slot to carry out access.

According to one embodiment of the invention, the integrated circuit paster that is used for being attached at smart card comprises flexible circuit board, first group of electric contact mat, second group of electric contact mat and integrated circuit (IC) chip.Flexible circuit board has relative first surface and second; First group of electric contact mat is arranged at first surface, and is used for being electrically connected smart card; Second group of electric contact mat is arranged at second; Integrated circuit (IC) chip is arranged on this flexible circuit board, and engages (bonding) with the pin (lead) of flexible circuit board and form and be electrically connected, and wherein the thickness sum of flexible circuit board and integrated circuit (IC) chip is no more than 0.5mm.In addition, in another embodiment of the present invention, device for mobile communication have the SIM/USIM card and with aforesaid integrated circuit paster, wherein integrated circuit paster is attached on the SIM/USIM card.

With reference to following explanation and appended claim or utilize embodiments of the present invention as mentioned below, can more understand these characteristics of the present invention and advantage.

Description of drawings

In order to understand immediately advantage of the present invention, please refer to as shown in drawings certain specific embodiments, describe above the present invention of summary in detail.Only describe typical specific embodiment of the present invention and therefore it is not considered as limiting protection range of the present invention in the situation that understand these diagrams, with extra definition and details the present invention is described with reference to the accompanying drawings, in the accompanying drawing:

Fig. 1 is a kind of schematic diagram of the integrated circuit paster according to the present invention's one specific embodiment;

Fig. 2 is a kind of schematic diagram of the flexible circuit board according to the present invention's one specific embodiment;

Fig. 3 is a kind of integrated circuit paster according to the present invention's one specific embodiment and the schematic diagram of smart card;

Fig. 4 is a kind of integrated circuit paster according to the present invention's one specific embodiment and the end view of smart card; And

Fig. 5 is a kind of device for mobile communication according to the present invention's one specific embodiment.

Symbol description

100 integrated circuit pasters, 102 flexible circuit boards

103 pins, 104 integrated circuit (IC) chip

200 smart cards, 300 device for mobile communication

302SIM/USIM card slot 304 battery covers

The face of C1, C2 electric contact mat S1, S2 flexible circuit board

D1 flexible circuit plate thickness

The thickness sum of d2 flexible circuit board and integrated circuit (IC) chip

Embodiment

Fig. 1 is the positive and negative view of embodiment of the invention integrated circuit paster 100.Integrated circuit paster 100 comprises flexible circuit board 102, first group of electric contact mat C1, second group of electric contact mat C2 and integrated circuit (IC) chip 104.Flexible circuit board (flexible printcircuit board) 102 has relative first surface S1 and second S2; First group of electric contact mat C1 is arranged at first surface S1, and is used for being electrically connected smart card 200 (being shown in Fig. 3); Second group of electric contact mat C2 is arranged at second S2; Integrated circuit (IC) chip 104 is arranged on the flexible circuit board 102, and engages (bonding) with the pin (lead) 103 of flexible circuit board 102 and form and be electrically connected.

Fig. 2 has then further shown the positive and negative view of flexible circuit board 102.As can be seen from Fig. 2, being arranged at first group of electric contact mat C1 of first surface S1, the second group of electric contact mat C2 that is arranged at second S2 and integrated circuit (IC) chip 104 is electrically connected by the circuit on the flexible circuit board 102.The circuit of flexible circuit board 102 can be printed circuit or forms with the mode of chemical deposition.

Among Fig. 1 and Fig. 2, first group of electric contact mat C1 of first surface S1 has bump structure (also can with reference to figure 4), and second group of electric contact mat C2 of second S2 then has the concave point structure, and both are positioned at position corresponding on the flexible circuit board 102.But in other not shown embodiment, as long as electric contact mat C1 can carry out electrical contact with the smart card that will attach, and electric contact mat C2 can carry out with the access device (not icon) of general intelligence card electrical contact, then electric contact mat C1 and second group of electric contact mat C2 can lay respectively at different positions, or having different shape and structures, the present invention does not want to be limited.

Preferably, such as Fig. 1 and shown in Figure 2, the positional structure of first group of electric contact mat C1 meets ISO7816-2, thereby be electrically connected the smart card under the ISO7816 standard, the positional structure of second group of electric contact mat C2 also meets ISO7816-2 simultaneously, thereby is electrically connected the smart card access device (for example SIM/USIM card slot or the intelligent card reader in the mobile phone) under the ISO7816 standard.

As shown in Figure 3 and Figure 4, integrated circuit (IC) chip 104 is preferably disposed on first surface S1, namely towards the face of smart card 200.First surface S1 has double faced adhesive tape, and 3M film VHB adhesive tape F-9460PC for example is in order to be attached at the surface of smart card 200.When integrated circuit paster 100 attached smart card 200, integrated circuit (IC) chip 104 integral body were positioned at outside smart card 200 surfaces.Though thereby integrated circuit (IC) chip 104 do not have the Encapsulation Moulds material to cover, both are protected also can to utilize smart card 200 and flexible circuit board 102.But integrated circuit (IC) chip 104 also can be arranged at second S2, and the present invention does not want to be limited.

Integrated circuit (IC) chip 104 directly engages with the pin 103 of flexible circuit board 102 by anisotropy (anisotropy) conducting resinl (ACF), and perhaps integrated circuit (IC) chip 104 engages with the pin 103 of flexible circuit board 102 by gold thread joint (GGI).In this embodiment, integrated circuit (IC) chip 104 does not cover Encapsulation Moulds material (molding) (for example epoxy resin); Relatively, can only be coated with one deck UV glue on the integrated circuit (IC) chip 104 and strengthen fixing effect, therefore can significantly reduce the thickness of integrated circuit (IC) chip 104, and when being attached at smart card 200, with regard to the step that can not dig a hole or cut card at smart card 200.

As shown in Figure 4, flexible circuit board 102 is no more than 0.5mm with the thickness d 2 of integrated circuit (IC) chip 104, preferably is no more than 0.4mm; And flexible circuit board 102 thickness d 1 own are no more than 0.2mm, and preferably are about 0.15mm.And in general, the thickness of smart card 200 is about 0.75-0.8mm.

Fig. 5 has shown a kind of device for mobile communication 300 in the embodiment of the invention, and device for mobile communication 300 has SIM/USIM card slot 302, battery cover 304, and SIM/USIM card 200 as shown in Figure 3 and Figure 4 and attach integrated circuit paster 100 on it.SIM/USIM card 200 can together be put into slot 302 with the integrated circuit paster 100 that attaches on it, and by 302 accesses of slot; At this moment via the STK option in the device for mobile communication 300, function or the Communications service that can use integrated circuit paster 100 additionally to provide.The function or the Communications service that provide about integrated circuit paster 100 can be with reference to the explanations of each file of prior art, do not add at this and give unnecessary details.

Additionally it should be noted that, the smart card in this specification comprises the integrated circuit card that meets under the ISO7816 standard, is not limited to the employed SIM/USIM card of mobile phone; And about the exemplary applications of smart card, can be with reference to http://www.smartcardalliance.org, and the present invention does not want to be limited.

In the situation that do not break away from the present invention's spirit or necessary characteristic, can other particular form embody the present invention.Should only be considered as the each side of described specific embodiment explanatory and non-limiting.Therefore, category of the present invention is shown in claims but not shown in above stated specification.All drop on the equivalent meaning of the application's claim and the change in the scope should be considered as dropping in the category of the application's scope of patent protection.

Claims

1. an integrated circuit paster is used for being attached at a smart card, and described integrated circuit paster comprises:

Flexible circuit board has relative first surface and second;

First group of electric contact mat is arranged at described first surface, and is used for being electrically connected this smart card;

Second group of electric contact mat is arranged at described second; And

Integrated circuit (IC) chip, be arranged on the described flexible circuit board, and be oriented to that described integrated circuit (IC) chip is covered by described smart card when described integrated circuit paster is attached on the described smart card, and engage with the pin of described flexible circuit board and form with described first group of electric contact mat and described second group of electric contact mat and to be electrically connected;

Wherein, the thickness sum of described flexible circuit board and described integrated circuit (IC) chip is no more than 0.5mm.

2. integrated circuit paster according to claim 1, wherein, described integrated circuit (IC) chip is arranged at described first surface.

3. integrated circuit paster according to claim 1, wherein, the setting of described second group of electric contact mat meets ISO7816-2.

4. integrated circuit paster according to claim 1, wherein, described integrated circuit (IC) chip engages with the pin of described flexible circuit board by anisotropic conductive (ACF).

5. integrated circuit paster according to claim 1, wherein, described integrated circuit (IC) chip engages (GGI) technology by gold thread and engages with the pin of described flexible circuit board.

6. integrated circuit paster according to claim 1, wherein, described integrated circuit (IC) chip there is no the Encapsulation Moulds material and covers.

7. integrated circuit paster according to claim 1, wherein, the thickness of described flexible circuit board is no more than 0.2mm.

8. integrated circuit paster according to claim 1, wherein, the thickness sum of described flexible circuit board and described integrated circuit (IC) chip is no more than 0.4mm.

9. device for mobile communication has a SIM/USIM card and such as each integrated circuit paster in the claim 1 to 8, described integrated circuit paster is attached on the described SIM/USIM card.

10. device for mobile communication according to claim 9, wherein, described integrated circuit (IC) chip integral body is positioned at outside the surface of described smart card.