CN102097317B - Method for manufacturing totally packaged switching power supply triode - Google Patents
Method for manufacturing totally packaged switching power supply triode Download PDFInfo
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- CN102097317B CN102097317B CN201010571610.9A CN201010571610A CN102097317B CN 102097317 B CN102097317 B CN 102097317B CN 201010571610 A CN201010571610 A CN 201010571610A CN 102097317 B CN102097317 B CN 102097317B
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- power supply
- triode
- product
- switching power
- supply triode
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a method for manufacturing a totally packaged switching power supply triode, aiming to provide a switching power supply triode which increases the radiation power of elements, prompts the stability of products and saves the cost. The method for manufacturing the totally packaged switching power supply triode is characterized by comprising the following steps of arranging a product, after aluminum wires are bonded, on a shaping stamping rail, and applying the certain pressure on the foot of the triode to make the whole surface of a frame smooth, wherein the thickness of a plastic package material on the back surface of the molded power supply triode is 0.7mm. The invention is mainly applied to a power switch triode of a television circuit board.
Description
Technical field
The present invention relates to the production method of triode, particularly relate to the production method of a kind of total incapsulation dress Switching Power Supply triode.
Background technology
Switching Power Supply is mainly used in TV set power switch, the switch protections such as hardware electric tool, this circuit design requires that electric current is large usually, the electronic product that power is high, Switching Power Supply mainly contains total incapsulation dress and half bag packaged type, the Switching Power Supply triode back side plastic packaging material general thickness that total incapsulation dress mode carries out producing is 0.9-1.0mm, its thickness have impact on the thermal diffusivity of Switching Power Supply greatly, when dispelling the heat bad, again extreme influence is produced to electronic product performance, therefore the impact of full packet switch power Yin Wendu is made to be generally 68-70 DEG C, just do not ensure the job stability of triode under these conditions.
Summary of the invention
The invention discloses the production method of a kind of total incapsulation dress Switching Power Supply triode, the power supply triode back side plastic packaging material thickness produced in order to solve prior art is that the heat radiation that 0.9-1.0mm produces is bad, and temperature rise is fast, the problems such as unstable properties.
For solving the problem, the technology of the present invention solution is: a kind of production method of total incapsulation dress Switching Power Supply triode, by carrying out spread sheet to chip, bonding die, welding wire, bonding aluminium wire, front baking, mold pressing, solidification produce full packet switch power supply triode, it is characterized in that: after carrying out bonding aluminium wire, product is placed on integer punching press track, certain pressure is applied to pin and makes whole framework surfacing.
Further, described pressure is 0.1mpa.
Further, its plastic packaging material thickness of described mold pressing is 0.65-0.75mm.
Further, its plastic packaging material thickness of described mold pressing is 0.7mm.
The invention has the beneficial effects as follows: the Switching Power Supply triode back side plastic packaging material thickness produced by the present invention is 0.7mm, add the radiating efficiency of total incapsulation dress switch triode, make its fin closer to external device, the heat that ensure that on fin can transmit faster and better and come, ensure that the operating efficiency of components and parts, work that can be more stable.
Detailed description of the invention
Below the specific embodiment of the present invention is described in further detail.
A kind of production method of total incapsulation dress Switching Power Supply triode, by carrying out spread sheet to chip, bonding die, welding wire, bonding aluminium wire, front baking, mold pressing, solidification produce full packet switch power supply triode, it is characterized in that: after carrying out bonding aluminium wire, product is placed on integer punching press track, certain pressure is applied to pin and makes whole framework surfacing.
Described pressure is 0.1mpa.
Its plastic packaging material thickness of described mold pressing is 0.65-0.75mm.
Its plastic packaging material thickness of described mold pressing is 0.7mm.
After chip being carried out successively the operation such as spread sheet, bonding die, bonding aluminium wire, the product set is placed on integer punching press track and carries out the process of punching press integer, the product set is put into baking oven after integer process completes with 120 DEG C of front bakings 4 hours.After front baking completes by plastic packaging material by the temperatures system 160 second of mold pressing process at 170 DEG C, the thickness of plastic packaging material on it is made to be 0.7mm, again product is put into after baking oven smokes cooling in 48 hours with the temperature of 165 DEG C and namely solidify, thereafter surface spikes is removed, again through sticky tin process, the high pressure that product after process strictly must carry out 3500V surveys Insulation test, is passed through and cuts muscle, get final product packed and transported after electrical quantity screening by the product of Insulation test.
Claims (2)
1. the production method of a total incapsulation dress Switching Power Supply triode, by carrying out spread sheet to chip, bonding die, welding wire, bonding aluminium wire, front baking, mold pressing, solidification produce full packet switch power supply triode, it is characterized in that: after carrying out bonding aluminium wire, product is placed on integer punching press track, certain pressure is applied to pin and makes whole framework surfacing; Described pressure is 0.1mpa; Its plastic packaging material thickness of described mold pressing is 0.65-0.75mm.
2. the production method of a total incapsulation dress Switching Power Supply triode, by carrying out spread sheet to chip, bonding die, welding wire, bonding aluminium wire, front baking, mold pressing, solidification produce full packet switch power supply triode, it is characterized in that: after chip being carried out successively spread sheet, bonding die, the operation of bonding aluminium wire the product set is placed on integer punching press track and carries out the process of punching press integer, the product set is put into baking oven after integer process completes with l20 DEG C of front baking 4 hours; After front baking completes by plastic packaging material by the temperatures l60 second of mold pressing process at 170 DEG C, the thickness of plastic packaging material on it is made to be 0.7mm, again product is put into after baking oven smokes cooling in 48 hours with the temperature of 165 DEG C and namely solidify, thereafter surface spikes is removed, again through sticky tin process, the high pressure that product after process must carry out 3500V surveys Insulation test, is passed through and cuts muscle, get final product packed and transported after electrical quantity screening by the product of Insulation test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010571610.9A CN102097317B (en) | 2010-12-01 | 2010-12-01 | Method for manufacturing totally packaged switching power supply triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010571610.9A CN102097317B (en) | 2010-12-01 | 2010-12-01 | Method for manufacturing totally packaged switching power supply triode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102097317A CN102097317A (en) | 2011-06-15 |
| CN102097317B true CN102097317B (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010571610.9A Active CN102097317B (en) | 2010-12-01 | 2010-12-01 | Method for manufacturing totally packaged switching power supply triode |
Country Status (1)
| Country | Link |
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| CN (1) | CN102097317B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162194A (en) * | 1996-02-26 | 1997-10-15 | 摩托罗拉公司 | Method for mfg. electronic element with organic substrate |
| TW200504902A (en) * | 2003-07-25 | 2005-02-01 | Shinkawa Kk | Wire-bonding method |
| CN201134427Y (en) * | 2007-12-27 | 2008-10-15 | 上海旭福电子有限公司 | Insulated reinforced packaging structure with radiating fin exposed outside |
| CN101404261A (en) * | 2008-10-28 | 2009-04-08 | 深圳市晶导电子有限公司 | Triode and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7014093B2 (en) * | 2003-06-26 | 2006-03-21 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
-
2010
- 2010-12-01 CN CN201010571610.9A patent/CN102097317B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162194A (en) * | 1996-02-26 | 1997-10-15 | 摩托罗拉公司 | Method for mfg. electronic element with organic substrate |
| TW200504902A (en) * | 2003-07-25 | 2005-02-01 | Shinkawa Kk | Wire-bonding method |
| CN201134427Y (en) * | 2007-12-27 | 2008-10-15 | 上海旭福电子有限公司 | Insulated reinforced packaging structure with radiating fin exposed outside |
| CN101404261A (en) * | 2008-10-28 | 2009-04-08 | 深圳市晶导电子有限公司 | Triode and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102097317A (en) | 2011-06-15 |
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Owner name: FOSHAN NANHAI HONGQIAN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHUANG YUQIAO Effective date: 20130128 |
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Free format text: CORRECT: ADDRESS; FROM: 528200 FOSHAN, GUANGDONG PROVINCE TO: 528000 FOSHAN, GUANGDONG PROVINCE |
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Effective date of registration: 20130128 Address after: 528000, room 3, building 1, Nanhai digital new town, Nanhai Road, Nanhai District, Foshan, Guicheng, Guangdong 1107, China Applicant after: Foshan Nanhai Hongqian Electronic Co., Ltd. Address before: 528200, Foshan, Guangdong Province Nanhai District Guicheng street, South Road, No. 39, Jiangnan, 1202 homes, Wang Yuan, room 15 Applicant before: Zhuang Yuqiao |
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Address after: 528216 Guangdong province Foshan City Danzao Town Nanhai District Xin'an community the Bund Jinning No. 3 Patentee after: Guangdong macro dried Polytron Technologies Inc Address before: 528000, room 3, building 1, Nanhai digital new town, Nanhai Road, Nanhai District, Foshan, Guicheng, Guangdong 1107, China Patentee before: Foshan Nanhai Hongqian Electronic Co., Ltd. |