CN102076203B - For the radiator of press pack and cooling and packaging laminate - Google Patents
For the radiator of press pack and cooling and packaging laminate Download PDFInfo
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- CN102076203B CN102076203B CN200910252631.1A CN200910252631A CN102076203B CN 102076203 B CN102076203 B CN 102076203B CN 200910252631 A CN200910252631 A CN 200910252631A CN 102076203 B CN102076203 B CN 102076203B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to for the radiator of press pack and cooling and packaging laminate.Provide the radiator (300) for directly cooling at least one electronic installation packaging (20).Electronic installation packaging has upper contact surface (22) and lower contact surface (24).Radiator comprises the cooling piece (310) formed by least one thermally-conductive materials.Cooling piece restriction is configured to receive the multiple of cooling agent and enters manifold (12), and is configured to multiple discharge manifolds (14) of discharging cooling agent.It is staggered for entering manifold and discharging manifold.Cooling piece also defines and is configured to come from the cooling agent that enters manifold and by coolant feed to the multiple milli passages (16) discharging manifold in order to receive.Milli passage and enter manifold and discharge manifold and be also configured to, in order to the one by contacting with cooling agent direct in upper contact surface and lower contact surface that direct cooling electronic device packs, make radiator be integrally formed formula radiator.
Description
Technical field
The present invention relates generally to power electronics devices, and the improvement type related more specifically to for power electronics devices cools.
Background technology
High power conversion device such as middle pressure industrial drives device, the frequency converter for oil gas, traction driver, flexible AC transmit (FACT) device, and other high power switching device, as rectifier and inverter, generally include press pack (press-pack) power device with liquid cools.The limiting examples of power device comprises integral gate change transistor (IGCT), diode, Insulated Gate Bipolar transistor (IGBT), thyristor and gate level turn-off thyristor (GTO).Press pack device is advantageous particularly for high-power applications, and the benefit of press pack comprises two-sided cooling, and the situation that there will not be plasma to explode between age at failure.
In order to construct the high power conversion device circuit using press pack device, usually sandwich radiator and press pack device to form lamination (stack).The power converter lamination of prior art level uses the conventional liquid cooling radiator with the larger cooling duct of diameter usually.Radiator and power device are not integrated in the power converter lamination of prior art level.In some applications, hot lipid layer be arranged in press pack device and liquid cooling heat radiator between each press pack device and liquid cooling heat radiator.In other applications, at least some layer in these layers is only kept together by pressure, and do not have hot fat between which.This layout creates significant contact impedance.Other weak point of this power converter lamination comprises has higher thermal impedance from semiconductor junction to liquid, and makes the Structure and energy of stacked wafer module comparatively complicated due to the number of included part.
Therefore, it is desirable that, improve hot property and the packaging of the power converter lamination using press pack device.More specifically, it is desirable that, the thermal impedance reduced from semiconductor junction to liquid is to improve reliability and/or power density.It is further desirable that, provide the relatively simple stack configuration of one to improve maintenanceability.
Summary of the invention
In brief, one aspect of the present invention is a kind of radiator for directly cooling at least one electronic installation packaging (package).This electronic installation packaging has upper contact surface and lower contact surface.Radiator comprises the cooling piece formed by least one thermally-conductive materials.Cooling piece defines and is configured to receive the multiple of cooling agent and enters manifold, and is configured to the multiple discharge manifolds discharging cooling agent.It is staggered for entering manifold and discharging manifold.Cooling piece also defines and is configured to come from the cooling agent that enters manifold and by coolant feed to the multiple milli passages (millichannel) discharging manifold in order to receive.Milli passage and enter manifold and discharge manifold and be also configured to, in order to the one by directly contacting with cooling agent in the upper contact surface packed of direct cooling electronic device and lower contact surface, make radiator be integrally formed formula radiator.
Another aspect of the present invention is the cooling and the packaging laminate that comprise at least one radiator.This radiator comprises cooling piece, this cooling piece limits: be configured to the multiple multiple discharge manifolds entering manifold, be configured to discharge cooling agent receiving cooling agent, and is configured to come from the cooling agent that enters manifold and by coolant feed to multiple milli passages of discharging manifold in order to receive.It is staggered for entering manifold and discharging manifold.Lamination also comprises at least one electronic installation packaging with upper contact surface and lower contact surface.Manifold becomes to be adjacent to the corresponding contact surface in upper contact surface and lower contact surface with milli channel setting, for directly cooling this corresponding surface by directly contacting with cooling agent, makes radiator be integrally formed formula radiator.
Accompanying drawing explanation
When with reference to accompanying drawing study carefully describe in detail as follows time, these and other feature of the present invention, aspect and advantage will become and be easier to understand, and the similar label in institute's drawings attached represents similar part, in the accompanying drawings:
Fig. 1 depicts the electronic installation packaging with upper radiator and lower radiator;
Fig. 2 shows the radiator having and be incorporated into milli passage in single cooling piece and manifold;
Fig. 3 shows the cross section of the radial milli passage for the radiator in Fig. 2 or Fig. 4; And
Fig. 4 shows the fansink designs adding radial passage number;
Fig. 5 shows the cooling and packaging laminate that are configured for multiple electronic installation packaging;
Fig. 6 is the sectional view that the manifold in Fig. 2 or Fig. 4 is arranged;
Fig. 7 shows the sealing arrangement for double surface radiators of the present invention; And
Fig. 8 is the sectional view illustrating that the skew manifold for double surface radiators embodiment of the present invention is arranged.
Although above-mentioned figure lists alternative, also can visualize other embodiments of the invention, will mention as in following discussion.In all cases, present disclosure is all that unrestriced mode introduces illustrated embodiment of the present invention by representative.Those skilled in the art can design multiple other amendment and embodiments of falling in the scope and spirit of the principle of the invention.The second surface 5 that the first surface 3 of Parts List 2 radiator enters chamber 4 radiator discharge chamber 10 radiator 11 entry port 12 enter upper contact surface 23 wafer 24 electronic installation bag that manifold 13 discharge port 14 discharges manifold 16 milli passage 20 electronic installation packaging (press pack) 21 semiconductor device 22 electronic installation packaging hold thermal coefficient of expansion (CTE) matching disc 26 press pack housing 27 times thermal coefficient of expansion (CTE) matching disc 28 top electrode 29 bottom electrodes 100 on contact surface 25 cool and packaging laminate 300 radiator 302 for accommodating groove 304 packing ring (O shape circle) 310 cooling pieces of O shape circle
Embodiment
Referring to figs. 1 through Fig. 4, describe the radiator 300 for directly cooling at least one electronic installation packaging 20.Such as, as shown in fig. 1, exemplary electronic installation packaging 20 has upper contact surface 22 and lower contact surface 24.Radiator 300 comprises the cooling piece 310 formed by least one thermally-conductive materials.Such as, as shown in figs. 2 and 4, cooling piece 310 defines and is configured to receive the multiple of cooling agent and enters manifold 12, and is configured to the multiple discharge manifolds 14 discharging cooling agent.Such as, as shown in Fig. 2, Fig. 4, Fig. 6 and Fig. 8, entering manifold and discharging manifold is staggered (alternate mixed).Cooling piece 310 also defines and is configured to come from the cooling agent that enters manifold and by coolant feed to multiple milli passages 16 of discharging manifold in order to receive.Milli passage 16 and enter manifold 12 and discharge manifold 14 be also configured in order to by with cooling agent directly contact direct cooling electronic device pack 20 upper contact surface 22 and lower contact surface 24 in a contact surface, make radiator be integrally formed formula radiator.More specifically, manifold 12,14 and milli passage 16 are arranged to be adjacent to a corresponding contact surface in contact surface 22 and lower contact surface 24, for cooling this corresponding surface by directly contacting with cooling agent.According to more specifically embodiment, milli passage 16 and enter manifold 12 and discharge the corresponding contact surface that manifold 14 is configured in upper contact surface 22 in order to cooling agent to be flowed to equably cooled electronic installation packaging and lower contact surface 24.
Therefore, radiator 300 is integral in electronic installation packaging 20, and wherein, radiator 300 packs 20 by directly contacting cooling electronic device with cooling agent.In other words, the milli passage 16 of integrated radiator 300 and enter manifold 12 and discharge manifold 14 and open wide in the side in the face of power device packaging 20, makes the cooling agent flowing through milli passage 16 directly can contact power device packaging 20.This layout is the remarkable improvement of self-contained (self-contained) radiator to prior art, in the self-contained radiator of prior art, cooling agent is included in radiator, and therefore must indirectly cool this device via radiator shell.By removing these additional thermospheres, integrated radiator 300 of the present invention provides and cools the enhancing of power device.
Cooling piece 310 can use various thermally-conductive materials to be formed, its nonrestrictive example comprise copper, aluminium, nickel, molybdenum, titanium, they alloy, metal matrix composite materials as aluminium silicon carbide (AlSiC), aluminium graphite, and pottery as silicon nitride ceramics.Cooling piece can carry out casting and/or machine work.Such as, cooling piece 310 can be cast, and carries out machine work afterwards in order to limit fine feature and surface requirements further.
The limiting examples of cooling agent comprises deionized water and other non-electrically conductive liquid.
For specific embodiment, manifold 12,14 have the diameter being relatively greater than milli passage 16.In a limiting examples, the width of milli passage is in the scope of about 0.5mm to about 2.0mm, and the degree of depth of milli passage is in the scope of about 0.5mm to about 2mm.Specifically, the thickness of passage can be specified to the pressure uniformity guaranteed on semiconductor.By making the pressure distribution on semiconductor more even, the performance of semiconductor would not suffer damage.In addition, it should be noted that milli passage 16 and manifold 12,14 can have multiple section shape, include but not limited to annular, circle, trapezoidal, triangle, and square/rectangle cross section.Channel shape is selected based on application scenario and manufacturing constraints, and can affect applicable manufacture method and cooling agent stream.Advantageously, milli passage 16 is incorporated in radiator 10 to increase significantly and amasss from the heat transfer surface of semiconductor device 20 to cooling agent.
In shown layout, enter manifold 12 and discharge manifold 14 and be arranged to circle (herein also referred to as axis) layout, and milli passage 16 is arranged to radial arrangement.In another example (not shown), enter manifold 12 and discharge manifold 14 and be arranged to radial arrangement, and milli passage 16 is arranged to circle (axis) layout.As used herein, phrase " circular arrangement " and " axial arranged " should be understood to hold and are connected radial passage (milli passage or manifold, this depends on embodiment) bending and straight " circle " path (or manifold or passage in the least, this depends on embodiment).
For the exemplary arrangement shown in Fig. 2 and Fig. 4, cooling piece 310 is also defined for the groove 302 that collecting packing ring 304 (see Fig. 7) is enclosed as O shape.As shown in Figure 7, packing ring 304 is for being sealed to adjacent electronic installation packaging 20 by radiator 300.Such as, as shown in Figure 6, cooling agent is fed in radiator 300 via entering chamber 3.As shown in Figure 6, then cooling agent flows into via entry port 11 and enters in manifold (the concentric manifolds section replaced) 12.Such as, as shown in Figure 6, after through milli passage 16 (see Fig. 2 or Fig. 4), cooling agent is disposed to discharge chamber 5 from discharge manifold 14 (the concentric manifolds section that other replaces) via discharge port 13.
Fig. 3 shows the cross section of radial passage 16 as radial milli passage.Fig. 4 show increase radial passage number to reduce pressure drop and correspondingly to improve the design of cooling effectiveness.More specifically, for the exemplary arrangement shown in Fig. 4, the radial passage number close to cooling piece 310 periphery is larger relative to the radial passage number close to cooling piece 310 center.This layout allow for given space and processing constraint comprise additional radial passage.
Advantageously, such as, as shown in Fig. 2 to Fig. 4, by by milli passage with enter/discharge manifold and be incorporated to single cooling piece 310, assembling process is simplified.Specifically, single cooling piece 310 is used to eliminate demand to link two components.As an alternative, radiator 300 can use packing ring 304 if O shape coil assembly is to be sealed on adjacent device package 20, and this packing ring 304 provides steadily and surely and simply seals between adjacent members.
For the exemplary embodiment described above with reference to Fig. 1 to Fig. 4, upper contact surface 22 and lower contact surface 24 can be circular cross-section, and cooling piece 310 can be cylindrical (that is, dish type or ice hockey shape (hockey-puck) are arranged).But, also other geometry be can use, square and square-section included but not limited to.For exemplary arrangement depicted in figure 1, electronic installation packaging 20 is press pack 20.Although provided below is exemplary press pack structure come for illustration of object, the present invention is not limited to any specific apparatus structure.In instances, press pack 20 comprises and is formed at least one semiconductor device 21 on wafer 23, upper thermal coefficient of expansion (CTE) matching disc 25 and lower matched coefficients of thermal expansion plate 27, and top electrode 28 and bottom electrode 29.Such as, as shown in fig. 1, wafer 23 is arranged on CTE plate 25, and between 27, top electrode 28 is arranged on above CTE plate 25, and lower CTE plate 27 is arranged on the top of bottom electrode 29.For the embodiment of press pack, wafer 23, CTE plate 25,27 and electrode 28, each in 29 all can have circular cross-section.The limiting examples of semiconductor device comprises IGCT, GTO and IGBT.The present invention obtains application on the semiconductor device be made up of various semiconductor, the limiting examples of semiconductor comprises silicon (Si), carborundum (SiC), gallium nitride (GaN), and GaAs (GaAs).Such as, as shown in fig. 1, press pack generally includes insulation (such as, pottery) housing 26.Although Fig. 1 shows radiator at housing 26 extension, in other embodiments, the cooling piece 310 of radiator 300 can be arranged in housing 26.In addition, electrode 28,29 scopes that vertically can extend beyond housing 26, and such as, between the neighboring that compliance seal is arranged on electrode 28 (and 29) and housing 26.In addition, the extended housing of radiator 300 (as shown in the figure), to allow electric connection and other device for settling needs to cool.Therefore, cooling piece 310 can have the diameter being greater than housing 26.
Radiator 300 can be one side or two-sided.Such as, for embodiment depicted in figure 5, one side depicted as by upper radiator and lower radiator 300, and the radiator 300 of centre is two-sided.Double surface radiators is configured for directly cooling multiple (specifically two) electronic installation packaging 20.As shown in Figure 5, for double surface radiators 300, cooling piece 310 has first surface 2 and second surface 4.Milli passage 16, enter manifold 12 and discharge first subset (subset) of manifold 14 and be formed in the first surface 2 of cooling piece 310.(such as, see the layout in Fig. 2 and Fig. 4.) similar, milli passage 16, enter manifold 12 and discharge the second subset of manifold 14 and be formed in the second surface 4 of cooling piece 310.(such as, see the layout in Fig. 2 and Fig. 4.) the first subset construction of milli passage becomes in order to directly to cool by directly contacting with cooling agent the upper contact surface 22 that one of them electronic installation pack 20, in the least the second subset of passage is then configured in order to directly to cool by directly contacting with cooling agent the lower contact surface 24 that wherein another electronic installation packs 20.
Fig. 8 depicts the arranged offset entering manifold and discharge manifold for double surface radiators.As shown in Figure 8, the manifold 12 that enters in the first subset departs from and enters manifold in the second set.Similar, the discharge manifold 14 in the first subset departs from the discharge manifold in the second set.More specifically, the manifold that enters in the first subset is positioned to relative with the discharge manifold in the second subset.Similar, the discharge manifold in the first subset be positioned to in the second subset to enter manifold relative.This arranged offset has multiple advantage.By the manifold (discharge manifold) being loaded with hot fluid on the first cooling surface is positioned to relative with the manifold (entering manifold) being loaded with cold fluid on another cooling surface, and enters manifold and align and discharge the situation that manifold aligns and compare " thermal diffusion " that achieve better in manifold.In addition, arranged offset improves speed and the pressure distribution of cooling agent, and all these contributes to the performance improving radiator.
Advantageously, radiator 300 provides the heat trnasfer of enhancing for the conventional chilling of power device.Conventional diffusers is not attached in press pack, but self-contained, and cooling agent does not contact power device wherein, but is enclosed in radiator.Therefore, conventional diffusers comprises shell, and this shell is connected on press pack via the hot lipid layer increasing thermal resistance usually.Therefore, conventional diffusers comprises additional thermosphere (shell), and this can hinder heat trnasfer.On the contrary, radiator 300 is arranged to be attached in press pack, carrys out direct cooling power device, thus strengthen heat trnasfer by the direct contact of cooling agent.In addition, cooling agent is transported on cooled apparatus surface by staggered admission passage and passing away equably, and milli passage increases long-pending to the heat transfer surface of the cooling agent this integrated radiator from power device.For the embodiment shown in Fig. 1 to Fig. 4, radiator 300 is suitable for using together in conjunction with existing electronic equipment packaging 20 such as press pack 20.Therefore, radiator 300 can be formed when modifier is not packed and cool conventional press pack power device integratedly.In addition, by milli passage with enter/discharge manifold and be incorporated in single cooling piece 310 and simplify assembling process.
With reference to Fig. 5, describe the embodiment of cooling of the present invention and packaging laminate 100.Cooling and packaging laminate 100 comprise at least one radiator 300, this radiator 300 comprises cooling piece 310, cooling piece 310 defines the multiple multiple discharge manifolds 14 entering manifold 12, be configured to discharge cooling agent being configured to receive cooling agent, and is configured to come from the cooling agent that enters manifold and by coolant feed to multiple milli passages 16 of discharging manifold in order to receive.Radiator 300 describes hereinbefore, and therefore just no longer repeats the various details of the various embodiments of radiator.Cooling and packaging laminate 100 also comprise at least one electronic installation packaging 20 with upper contact surface 22 and lower contact surface 24.Manifold 12,14 and milli passage 16 are arranged to be adjacent to a corresponding contact surface in contact surface 22 and lower contact surface 24, for by directly cooling this corresponding surface with direct contact of cooling agent, make radiator be integrally formed formula radiator.
Be described above the exemplary materials for radiator 300.Describe above with reference to Fig. 2, Fig. 6 and Fig. 8 enter manifold 12 and discharge manifold 14.For the embodiment shown in Fig. 6, cooling agent flows to radiator 300 via entering chamber 3, and discharges via discharge chamber 5.The various structures of milli passage 16 are being described above with reference to Fig. 2 to Fig. 4.Manifold and being oppositely disposed in of passage of milli are described above with reference to Fig. 2 and Fig. 4.In one embodiment, enter manifold 12 and discharge manifold 14 and be arranged to radial arrangement, and milli passage 116 is arranged to circle (or more common axis) layout.In the embodiment shown in Fig. 2 and Fig. 4, milli passage 16 is arranged to radial arrangement, and enters manifold 12 and discharge manifold 14 and be arranged to circular arrangement.
In order to strengthen cooling, the radiator 300 in lamination 100 can use the milli channels designs shown in Fig. 4.As described above, Fig. 4 shows increases radial passage number to reduce pressure drop and correspondingly to improve the design of cooling effectiveness.More specifically, for the exemplary arrangement shown in Fig. 4, the radial passage number close to cooling piece 310 periphery is larger relative to the radial passage number close to cooling piece 310 center.This layout allowed given space and processing constraint under comprise additional radial passage.
Exemplary arrangement shown in Fig. 5 shows the cooling construction of upper radiator and lower radiator 300 and the two-sided intermediate heat sink 300 with one side.For shown embodiment, lamination 100 comprises multiple radiator 300 and multiple electronic installation packaging 20.As shown in the figure, radiator 300 and electronic installation packaging 20 are alternately arranged.More specifically, and as described above, for the embodiment shown in Fig. 5, at least one radiator 300 wherein comprises double surface radiators.Double surface radiators comprises the cooling piece 310 with first surface 2 and second surface 4.Milli passage 16, enter manifold 12 and discharge the first subset of manifold 14 and be formed in the first surface 2 of cooling piece 310.Similar, milli passage 16, enter manifold 12 and discharge the second subset of manifold 14 and be formed in the second surface 4 of cooling piece 310.First subset construction of milli passage 16 becomes in order to utilize cooling agent to cool the upper contact surface 22 of one of them electronic installation packaging 20.Similar, the second subset construction of milli passage 16 becomes the lower contact surface 24 in order to utilize cooling agent to cool wherein another electronic installation packaging 20.As described in above with reference to Fig. 8, double surface radiators can in conjunction with entering manifold and discharging the arranged offset of manifold, in order to improve radiator performance further.
For cooling and packaging laminate 100, radiator 300 is sealed on the corresponding contact surface in the upper contact surface 22 of electronic installation packaging 20 and lower contact surface 24, the cooling agent making to flow through milli passage by with cooling agent direct contact direct cooling electronic device pack 20 upper contact surface and lower contact surface in this corresponding contact surface.For Fig. 2 and exemplary arrangement depicted in figure 7, each cooling piece 310 all further defines at least one groove 302.Such as, as shown in Figure 7, lamination 100 also comprise be arranged in groove 302 for radiator 300 is sealed to corresponding electronic installation packaging 20 at least one packing ring 304.In the particular embodiment, packing ring 304 comprises O shape circle.Advantageously, this assembling process is relatively simple and sane, needs less manufacturing step, and eliminates the demand of comparatively complicated packaging technology as welding or other metal connecting technology.
It should be noted that the specific arrangements shown in Fig. 5 is only exemplary, and cooling and packaging laminate 100 can comprise the electronic installation packaging 20 of arbitrary number, and for the radiator 300 of correspondence of cooling electronic device packaging.One of them of multiple benefit of the present invention is its flexibility cooling the device package of desired number and modularization.
For above with reference to the exemplary embodiment described by Fig. 5, each contact surface in upper contact surface 22 and lower contact surface 24 all can be circular cross-section, and each cooling piece 310 all can be cylindrical cross-section (that is, dish type or ice spherical arrangement).But, and as described above, also other geometry can be used, include but not limited to square and square-section.According to more specifically embodiment, electronic installation packaging 20 is press pack 20.As described above, the invention is not restricted to any specific apparatus structure.But, provide press pack structure exemplary as follows for illustrative purposes.Such as, as shown in fig. 1, in instances, press pack 20 comprises at least one semiconductor device 21 be formed on wafer 23.Such as, as shown in fig. 1, press pack 20 also comprises thermal coefficient of expansion (CTE) matching disc 25 and lower matched coefficients of thermal expansion plate 27, and top electrode 28 and bottom electrode 29.Wafer 23 is arranged on CTE plate 25, between 27.Top electrode 28 is arranged on above CTE plate 25, and lower CTE plate 27 is arranged on above bottom electrode 29.Wafer 23, CTE plate 25,27 and electrode 28, each in 29 all has circular cross-section.Such as, as shown in figure 1 and figure 5, for shown press pack embodiment, lamination 100 also comprises insulation (such as, pottery) housing 26.As described above, although Fig. 1 and Fig. 5 shows radiator at housing 26 extension, in other embodiments, the cooling piece 310 of radiator 300 is arranged in housing 26.
Advantageously, cooling and packaging laminate 100 provide the heat trnasfer of enhancing for conventional chilling power device, have sane and simple sealing arrangement.Such as, radiator can use relatively simple O shape coil assembly to be sealed on adjacent device package.In addition, in the particular embodiment, by making cooling agent directly contact the upper contact surface 22 of press pack 20 and lower contact surface 24 to strengthen heat trnasfer.In addition, by narrow and dark milli passage 16 is directly positioned at below power device, can farthest aggrandizement apparatus heat transfer surface area that liquid is engaged.Compared to the conventional stacked wafer module of press pack device and liquid cooling radiator, thermal resistance greatly reduces, and pressure drop and flow velocity relatively low.By realizing relatively high flow velocity with lower pressure drop, enhance cooling.
By providing higher reliability and larger margin of operation by improving hot property, radiator 300 and cooling and packaging laminate 100 just desirable especially for needing the application of very high reliability, these application examples drive if any the liquefied natural gas (LNG) of oil gas and pipeline, the seabed conveying of oil gas and distributing, and drive.In addition, radiator 300 can use in numerous applications with cooling and packaging laminate 100, and limiting examples wherein comprises high-power applications, as metal rolled machine, papermaking machine and pulling equipment etc.
Although only illustrate and describe some embodiments of the present invention herein, those skilled in the art can expect some modifications and variations.Therefore, be to be understood that, desirably claims contain fall into all such modifications in true spirit of the present invention and change.
Claims (22)
1. one kind for directly cool at least one electronic installation packaging radiator, described electronic installation packaging has upper contact surface and lower contact surface, described radiator comprises the cooling piece formed by least one thermally-conductive materials, and wherein, described cooling piece limits:
Be configured to receive the multiple of cooling agent and enter manifold;
Be configured to the multiple discharge manifolds discharging described cooling agent, wherein, described in enter manifold and described discharge manifold is staggered; And
Be configured in order to receive come from described in enter manifold described cooling agent and by described coolant feed to multiple milli passages of described discharge manifold, wherein, described milli passage and described in enter manifold and described discharge manifold and be also configured to, in order to by contacting the contact surface directly cooled in upper contact surface and lower contact surface that described electronic installation packs with described cooling agent direct, make described radiator be integrally formed formula radiator.
2. radiator according to claim 1, is characterized in that, described in enter manifold and radial arrangement is arranged to by described discharge manifold, and wherein, the circular layout of described milli channel setting.
3. radiator according to claim 1, is characterized in that, described milli channel setting is radially arranged, and wherein, described in enter manifold and circular arrangement is arranged to by described discharge manifold.
4. radiator according to claim 1, it is characterized in that, described at least one thermally-conductive materials is selected from the group be made up of copper, aluminium, nickel, molybdenum, titanium, copper alloy, nickel alloy, molybdenum alloy, titanium alloy, aluminium silicon carbide (AlSiC), aluminium graphite and silicon nitride ceramics.
5. radiator according to claim 1, it is characterized in that, described radiator is used for the multiple electronic installation packaging of directly cooling, wherein, described cooling piece has first surface and second surface, wherein, described milli passage, described the first subset entering manifold and described discharge manifold is formed in the first surface of described cooling piece, wherein, described milli passage, described the second subset entering manifold and described discharge manifold is formed in the second surface of described cooling piece, wherein, milli passage and enter manifold and discharge described first subset construction of manifold becomes to utilize described cooling agent directly cool described electronic installation pack in the upper contact surface packed of an electronic installation, and wherein, milli passage and enter manifold and discharge described second subset construction of manifold become to utilize described cooling agent directly cool described electronic installation pack in another electronic installation bag hold contact surface.
6. radiator according to claim 5, it is characterized in that, enter manifold described in described first subset to depart from described in the second set and enter manifold, and wherein, the described discharge manifold in described first subset departs from the described discharge manifold in described second set.
7. radiator according to claim 1, is characterized in that, the cross section of described milli passage, described in enter the cross section of manifold and the cross section of described discharge manifold from by annular, circular, trapezoidal, triangle, and to select in the group that forms of square-section.
8. radiator according to claim 1, is characterized in that, described in enter manifold with corresponding one that discharges manifold and milli channels configuration and becomes in order to cooling agent is flowed to equably in upper contact surface and lower contact surface that cooled electronic installation packs.
9. radiator according to claim 1, is characterized in that, described cooling piece is also defined for the groove of collecting packing ring.
10. radiator according to claim 9, is characterized in that, described packing ring comprises O shape circle.
11. radiators according to claim 1, it is characterized in that, described milli channel setting is radially arranged, wherein, describedly enter manifold and circular arrangement is arranged to by described discharge manifold, and wherein, the radial passage number close to described cooling piece periphery is larger relative to the radial passage number close to described cooling piece center.
12. 1 kinds of coolings and packaging laminate, comprising:
Comprise at least one radiator of cooling piece, described cooling piece defines the multiple multiple discharge manifolds entering manifold, be configured to discharge described cooling agent being configured to receive cooling agent, and be configured in order to receive come from described in enter manifold described cooling agent and by described coolant feed to multiple milli passages of described discharge manifold, wherein, manifold is entered described in and described discharge manifold is staggered; And
Comprise at least one electronic installation packaging of contact surface and lower contact surface,
Wherein, described manifold, described discharge manifold and the described milli channel setting of entering becomes to be adjacent to a corresponding contact surface in described upper contact surface and described lower contact surface, for by directly cooling described respective surfaces with direct contact of described cooling agent, described radiator is made to be integrally formed formula radiator.
13. laminations according to claim 12, is characterized in that, described in enter manifold and radial arrangement is arranged to by described discharge manifold, and wherein, the circular layout of described milli channel setting.
14. laminations according to claim 12, is characterized in that, described milli channel setting is radially arranged, and wherein, described in enter manifold and circular arrangement is arranged to by described discharge manifold.
15. laminations according to claim 12, it is characterized in that, described cooling piece comprises at least one thermally-conductive materials selected from the group be made up of copper, aluminium, nickel, molybdenum, titanium, copper alloy, nickel alloy, molybdenum alloy, titanium alloy, aluminium silicon carbide (AlSiC), aluminium graphite and silicon nitride ceramics.
16. laminations according to claim 12, is characterized in that, described lamination comprises multiple radiator and multiple electronic installation packaging, and wherein, described radiator and described electronic installation packaging are alternately arranged.
17. laminations according to claim 16, it is characterized in that, at least one radiator in described radiator comprises double surface radiators, wherein, described double surface radiators comprises the cooling piece with first surface and second surface, wherein, described milli passage, described the first subset entering manifold and described discharge manifold is formed in the first surface of described cooling piece, wherein, described milli passage, described the second subset entering manifold and described discharge manifold is formed in the second surface of described cooling piece, wherein, milli passage and the described first subset construction one-tenth that enters manifold and discharge manifold in order to by contact with described cooling agent direct directly cool described electronic installation pack in the upper contact surface packed of an electronic installation, and wherein, milli passage and the described second subset construction one-tenth that enters manifold and discharge manifold in order to by contact with described cooling agent direct directly cool described electronic installation pack in another electronic installation bag hold contact surface.
18. laminations according to claim 17, it is characterized in that, enter manifold described in described first subset to depart from described in the second set and enter manifold, and wherein, the described discharge manifold in described first subset departs from the described discharge manifold in described second set.
19. laminations according to claim 12, is characterized in that, also comprise insulation shell, and wherein, at least one radiator described and described electronic installation packaging are arranged in described housing.
20. laminations according to claim 12, is characterized in that, each cooling piece also limits groove, and wherein, described lamination also comprises at least one packing ring be arranged in described groove, and it is for being sealed to corresponding electronic installation packaging by described radiator.
21. laminations according to claim 20, is characterized in that, described packing ring comprises O shape circle.
22. laminations according to claim 12, it is characterized in that, described milli channel setting is radially arranged, wherein, describedly enter manifold and circular arrangement is arranged to by described discharge manifold, and wherein, the radial passage number close to corresponding cooling piece periphery is larger relative to the radial passage number close to described cooling piece center.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910252631.1A CN102076203B (en) | 2009-11-24 | 2009-11-24 | For the radiator of press pack and cooling and packaging laminate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910252631.1A CN102076203B (en) | 2009-11-24 | 2009-11-24 | For the radiator of press pack and cooling and packaging laminate |
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| CN102076203A CN102076203A (en) | 2011-05-25 |
| CN102076203B true CN102076203B (en) | 2015-11-25 |
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| CN102905505B (en) * | 2011-07-29 | 2015-11-25 | 欧姆龙株式会社 | A kind of radiator structure of Double-side heating element |
| KR101459857B1 (en) * | 2012-12-27 | 2014-11-07 | 현대자동차주식회사 | Heat sink one body type power module |
| CN107818951B (en) * | 2017-10-12 | 2019-08-09 | 南京帕尔斯电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
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|---|---|---|---|---|
| US4010489A (en) * | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
| US4614227A (en) * | 1983-11-02 | 1986-09-30 | Bbc Brown, Boveri & Company Limited | Cooling body for the liquid cooling of high-power semiconductor components |
| US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
| CN1956647A (en) * | 2005-10-25 | 2007-05-02 | 国际商业机器公司 | Cooling apparatus and method of manufacturing the same |
| CN101103659A (en) * | 2004-11-24 | 2008-01-09 | 通用电气公司 | Heat sink with microchannel cooling for power devices |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001095688A1 (en) * | 2000-06-05 | 2001-12-13 | The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon | Multiscale transport apparatus and methods |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4010489A (en) * | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
| US4614227A (en) * | 1983-11-02 | 1986-09-30 | Bbc Brown, Boveri & Company Limited | Cooling body for the liquid cooling of high-power semiconductor components |
| US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
| CN101103659A (en) * | 2004-11-24 | 2008-01-09 | 通用电气公司 | Heat sink with microchannel cooling for power devices |
| CN1956647A (en) * | 2005-10-25 | 2007-05-02 | 国际商业机器公司 | Cooling apparatus and method of manufacturing the same |
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