CN102074565A - Concave-surface image sensor - Google Patents
Concave-surface image sensor Download PDFInfo
- Publication number
- CN102074565A CN102074565A CN2010105153895A CN201010515389A CN102074565A CN 102074565 A CN102074565 A CN 102074565A CN 2010105153895 A CN2010105153895 A CN 2010105153895A CN 201010515389 A CN201010515389 A CN 201010515389A CN 102074565 A CN102074565 A CN 102074565A
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- China
- Prior art keywords
- image sensor
- concave
- semiconductor
- concave surface
- pixel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/702—SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention relates to a concave-surface image sensor, wherein a semiconductor concave surface is arranged on a semiconductor substrate, pixels are uniformly arranged on the semiconductor concave surface, and the ray reflected on a subject is imaged on the pixels through a convex lens or a pinhole. In the invention, the pixel arrangement of a traditional CCD (Charge-Coupled Device) image sensor and an MOS (Metal Oxide Semiconductor) image sensor is adjusted, and the pixels originally arranged on a plane are changed to be arranged on a concave surface, so that the resolutions of any parts at a unit angle of a shot scenery photo are all the same, the shot pictures are not dislocated when being spliced, the spliced panoramic picture is not dislocated when being seen from the front, rear, left, right, upper and lower directions, and the concave-surface image sensor is particularly suitable for being applied to street-scene views similar to Google Earth.
Description
Affiliated technical field
The present invention relates to a kind of imageing sensor, especially take a picture and to carry out seamless link and become the pixel (photosensitive unit) of panoramic pictures to be distributed in CCD or cmos sensor on the concave surface semiconductor chip.
Background technology
Ccd image sensor and cmos image sensor are widely used in Digital Video and the digital camera, CCD and the CMOS main distinction on making is that CCD is integrated on the semiconductor single crystal material, and CMOS is integrated on the semi-conducting material that is referred to as metal oxide, operation principle does not have the difference of essence, simple in order to describe, mainly mention ccd image sensor below.CCD is a kind of semiconductor device, can be converted into digital signal to optical image, and the small photoactive substance of the last implantation of CCD is called pixel.The pixel count that comprises on CCD is many more, its screen resolution that provides is also just high more, the effect of CCD is just as film, but it is that image pixel is converted to digital signal, at present, pixel on ccd image sensor and the cmos image sensor is fitly to be arranged on the semiconductor on a plane, be each pixel all at grade, this just makes the resolution of different piece of the photo of taking the photograph slightly different, picture mid portion resolution is than resolution is slightly high all around, mid-resolution is high more more, the resolution of scenery imaging that is the unit angle is different, if browse individual picture, this difference is that naked eyes are indiscoverable, but when we become panoramic pictures to the plurality of pictures montage, this difference just may be found, inconsistent phenomenon will appear in the picture that montage becomes, present many people like Google Earth, when you browse Google Earth streetscape view, will find that dislocation appears in the part panoramic pictures, particularly top resolution and other parts differ bigger, and this image that influences very much environment is by perfect reproduction.
Summary of the invention
Overcome the existing ccd image sensor defective slightly different in order to have now with the resolution of picture that cmos image sensor is taken the photograph, the present invention to the pixel arrangement of existing ccd image sensor and cmos image sensor from newly arranging, make the resolution of photo any part of shooting all the same, institute does not misplace when taking the photograph the plurality of pictures montage, the panoramic pictures that montage becomes comprises the front, back, left, right, up, down and watches all natures, dislocation, the different phenomenon of resolution can not occur, the environment picture is reappeared by perfection.
The technical solution adopted for the present invention to solve the technical problems is:
The one side of semiconductor chip is processed into concave surface, pixel is arranged on the semiconductor of concave surface equably, be with the difference of existing ccd image sensor and cmos image sensor, prior art is that pixel arrangement is had on the semiconductor chip on plane, and the present invention has pixel arrangement on the semiconductor chip of concave surface, the light of subject reflection will change ccd image sensor and cmos image sensor unit's angle different situation of the resolution of imaging on transducer of prior art as dropping on the pixel that is arranged on the concave surface by convex lens or pin hole.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Accompanying drawing is a principle of the invention schematic diagram.
1. semiconductor chips among the figure, 2. semiconductor concave surface, 3. pixel, 4. convex lens, 5. object, 6. opticpath, the 7. intersection point of the picture of object and pixel.
Embodiment
In the embodiment of accompanying drawing, we are that the present invention is further described for example to implement a kind of concave surface imageing sensor:
In the accompanying drawings, semiconductor concave surface 2 is arranged on the semiconductor chip 1, on semiconductor concave surface 2, be furnished with pixel 3 equably, the light of reflection focuses on the intersection point 7 of object and pixel through convex lens 4 along opticpath 6 on the object 5, certainly convex lens 4 also can be replaced by pin hole, when the CCD surface is subjected to irradiate light, each sensitization unit is that pixel 3 can be reflected in electric charge on the assembly, the signal that all sensitization units produced adds together, just constituted a complete picture, CCD can be transformed into electric charge to light, convert digital signal to by the analog to digital converter chip, digital signal is preserved by the flash memory or the built-in hard disk card of camera inside after overcompression, thereby can give computer transfer of data easily, and, revise image with imagination as required by means of the processing means of computer.
Because the present invention is arranged in pixel 3 on the semiconductor chip 1 with concave surface, the light of object 5 reflections will change ccd image sensor and cmos image sensor unit's angle different situation of the resolution of imaging on transducer of prior art as dropping on the pixel 3 that is arranged on the concave surface by convex lens 4 or pin hole.
Since semiconductor chip need be on concave surface laying out pixel, again neither the plane, so production technology is slightly different, the structure of matter and size and detail circuits structure thereof as for pixel, can remain unchanged, these have been unusual mature technique, are not described in detail in this.
Claims (1)
1. concave surface imageing sensor, it is characterized in that: pixel (3) is arranged on the semiconductor concave surface (2) of semiconductor chip (1) equably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105153895A CN102074565A (en) | 2010-10-19 | 2010-10-19 | Concave-surface image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105153895A CN102074565A (en) | 2010-10-19 | 2010-10-19 | Concave-surface image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102074565A true CN102074565A (en) | 2011-05-25 |
Family
ID=44033030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105153895A Pending CN102074565A (en) | 2010-10-19 | 2010-10-19 | Concave-surface image sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102074565A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437168A (en) * | 2011-11-12 | 2012-05-02 | 袁毅 | Image sensor with unevenly-arranged pixels |
| CN107959781A (en) * | 2017-12-11 | 2018-04-24 | 信利光电股份有限公司 | A kind of camera module and its adjustment control method |
| CN108111732A (en) * | 2017-12-27 | 2018-06-01 | 信利光电股份有限公司 | A kind of camera module |
| CN112532942A (en) * | 2020-11-30 | 2021-03-19 | 黑龙江合师惠教育科技有限公司 | Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060256229A1 (en) * | 2005-05-11 | 2006-11-16 | Sony Ericsson Mobile Communications Ab | Digital cameras with triangulation autofocus systems and related methods |
| CN200950632Y (en) * | 2006-09-18 | 2007-09-19 | 王皆胜 | Non-planar image sensor of electronic digital camera |
| CN101668115A (en) * | 2008-09-03 | 2010-03-10 | 中国科学院自动化研究所 | Multi-lens multi-resolution camera |
| US20100128137A1 (en) * | 2008-11-21 | 2010-05-27 | Eastman Kodak Company | Extended depth of field for image sensor |
-
2010
- 2010-10-19 CN CN2010105153895A patent/CN102074565A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060256229A1 (en) * | 2005-05-11 | 2006-11-16 | Sony Ericsson Mobile Communications Ab | Digital cameras with triangulation autofocus systems and related methods |
| CN200950632Y (en) * | 2006-09-18 | 2007-09-19 | 王皆胜 | Non-planar image sensor of electronic digital camera |
| CN101668115A (en) * | 2008-09-03 | 2010-03-10 | 中国科学院自动化研究所 | Multi-lens multi-resolution camera |
| US20100128137A1 (en) * | 2008-11-21 | 2010-05-27 | Eastman Kodak Company | Extended depth of field for image sensor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437168A (en) * | 2011-11-12 | 2012-05-02 | 袁毅 | Image sensor with unevenly-arranged pixels |
| CN107959781A (en) * | 2017-12-11 | 2018-04-24 | 信利光电股份有限公司 | A kind of camera module and its adjustment control method |
| CN107959781B (en) * | 2017-12-11 | 2020-07-31 | 信利光电股份有限公司 | Camera module and adjustment control method thereof |
| CN108111732A (en) * | 2017-12-27 | 2018-06-01 | 信利光电股份有限公司 | A kind of camera module |
| CN112532942A (en) * | 2020-11-30 | 2021-03-19 | 黑龙江合师惠教育科技有限公司 | Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110525 |