CN102068207B - Heating and heat-insulating carrier - Google Patents
Heating and heat-insulating carrier Download PDFInfo
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- CN102068207B CN102068207B CN200910226451.6A CN200910226451A CN102068207B CN 102068207 B CN102068207 B CN 102068207B CN 200910226451 A CN200910226451 A CN 200910226451A CN 102068207 B CN102068207 B CN 102068207B
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Abstract
The invention discloses a heating and heat-insulating carrier, which is suitable for directly carrying foodstuffs requiring heat insulation. The heating and heat-insulating carrier comprises a carrier body and at least one high-melting-point electric heating alloy pattern, wherein the carrier body is provided with a first surface and a second surface, which are opposite to each other; the foodstuffs are suitable to being directly placed on the first surface; the second surface is made of ceramics or glass; the high-melting-point electric heating alloy pattern is spread onto the second surface; one resistance value of the high-melting-point electric heating alloy pattern is substantively between 0.5 ohm and 50 ohms; and one melting point of the high-melting-point electric heating alloy pattern is more than or equal to 1,100 DEG C.
Description
Technical field
The present invention relates to a kind of carrier, and particularly relate to a kind of carrier in order to heating and thermal insulation.
Background technology
Heat-preservation conditioning container is common in kitchen cooking apparatus, and its function is food to remain on tepid state.In general, the heat insulation effect of heat-preservation conditioning container is preferably and food materials is remained on about 50 ~ 80 DEG C.By the heat insulation function of heat-preservation conditioning container, people are when taking food, and food still maintains certain temperature, and it is ice-cold cold to be unlikely ice, unhealthful and oral erotism.
Common heat preserving mode has the design of passive pattern, such as thermos cup, or the design of active pattern, such as grill pan.The container that the INSULATION DESIGN of passive pattern mainly utilizes multilayer insulant to be formed completely cuts off outside air, and therefore internal tank not easily passs through the extraneous exchange temperature of conduction or convection current and container.But, the design of passive pattern still can make temperature leak because of heat radiation and minority conduction pattern.In other words, the design of passive pattern cannot keep tepid state for a long time, and in order to reach heat insulation effect, the thickness of heat insulation layer must be very thick, therefore also causes the problem that volume is excessive or volume is too small to produce.
Initiatively mostly the design of pattern is that the element utilizing alternating current electrified regulation to have Electrothermal Properties as nickel filament etc. carrys out indirect container.In addition, initiatively the design of pattern is still needed and is arranged one group of temperature-sensitive sticker and temperature control component.Mutually feedback by temperature-sensitive sticker and temperature control component that to control heating curves temperature required to maintain.This method shortcoming is that indirectly mode of heating efficiency is lower, and the setting of temperature-sensitive sticker and temperature control component adds the complexity of container.
Summary of the invention
The object of the present invention is to provide a kind of heating and thermal insulation carrier, can directly be heated by energising and there is the function of heating and thermal insulation.
For reaching above-mentioned purpose, the present invention proposes a kind of heating and thermal insulation carrier, is suitable for directly carrying for food materials of insulation.Heating and thermal insulation carrier comprises a carrier bodies and at least one high-melting-point electrothermal alloy pattern.Carrier bodies has a first surface and one second, and first surface is relative with second.Food materials are suitable for directly being positioned on first surface.The material of second is pottery or a glass.High-melting-point electrothermal alloy pattern application is on second.One resistance value of high-melting-point electrothermal alloy pattern is essentially 0.5 ohm to 50 ohm, and a fusing point of high-melting-point electrothermal alloy pattern is greater than or equal to 1100 DEG C.
In one embodiment of this invention, the material of above-mentioned high-melting-point electrothermal alloy pattern comprises a metal alloy or a ceramic-metal alloy.
In one embodiment of this invention, the material of above-mentioned high-melting-point electrothermal alloy pattern comprises molybdenum alloy, nickel-chromium alloy, cobalt alloy, nickel alloy or tungsten-cobalt carbide alloy.
In one embodiment of this invention, the material of above-mentioned high-melting-point electrothermal alloy pattern is not leaded in fact (substantially lead-free).
In one embodiment of this invention, above-mentioned high-melting-point electrothermal alloy pattern is coated on second by a plasma spraying.Specifically, plasma spraying comprises that a plasma hot melt penetrates method, an arc heat plasma spraying, a flame hot-melting penetrate method or the hot plasma spraying of a high-speed flame.
In one embodiment of this invention, above-mentioned high-melting-point electrothermal alloy pattern is a linear pattern, and a live width of high-melting-point electrothermal alloy pattern is greater than 3mm.
In one embodiment of this invention, the above-mentioned thickness of high-melting-point electrothermal alloy pattern application on second is 20 μm ~ 500 μm.
In one embodiment of this invention, above-mentioned carrier bodies comprises a first body and one second body.Second body and first body are close to each other, and the material of first body be glass or pottery and high-melting-point electrothermal alloy pattern application on first body.
In one embodiment of this invention, above-mentioned carrier bodies is a dish, one bowl, one pot, one glass or a platform.
Based on above-mentioned, the present invention forms high-melting-point electrothermal alloy pattern in the one side of carrier bodies in the mode of spraying.High-melting-point electrothermal alloy pattern upon power-up can by heat temperature raising, and high-melting-point electrothermal alloy pattern has specific resistance to be warming up to specified temp upon power-up.Thus, heating and thermal insulation carrier of the present invention can be heated by the mode of direct-electrifying in high-melting-point electrothermal alloy pattern and be reached the effect of insulation.In addition, high-melting-point electrothermal alloy pattern of the present invention is made with gunite, and therefore high-melting-point electrothermal alloy pattern does not need adopt the making of the mode of high temperature sintering and help avoid the injury that high temperature sintering causes carrier bodies.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 illustrates the heating and thermal insulation carrier schematic diagram into one embodiment of the invention;
Fig. 2 A and Fig. 2 B illustrates as plasma spraying forms the electron micrograph that coating and sintering process form coating on base material on base material respectively;
Fig. 3 A illustrates the top view of the high-melting-point electrothermal alloy pattern into one embodiment of the invention;
Fig. 3 B illustrates the partial cutaway schematic of the heating and thermal insulation carrier into one embodiment of the invention;
Fig. 4 illustrates the heating and thermal insulation carrier partial cutaway schematic into another embodiment of the present invention;
Fig. 5 illustrates the heating curve after into the heating and thermal insulation carrier energising of one embodiment of the invention, and wherein transverse axis is the time, and the longitudinal axis is temperature;
After Fig. 6 heating and thermal insulation carrier illustrated as another embodiment of the present invention is energized under the state of splendid attire water, the intensification bottom water and heating and thermal insulation carrier distributes, and wherein transverse axis is the time, and the longitudinal axis is temperature.
Main element symbol description
12,14: base material
20,40: coating
22,42: particle
100,200: heating and thermal insulation carrier
110,210: carrier bodies
112: first surface
114: the second
120: high-melting-point electrothermal alloy pattern
212: first body
214: the second bodies
500: heating curve
610,620: heat up distribution
T: thickness
W: live width
Detailed description of the invention
Fig. 1 illustrates the heating and thermal insulation carrier schematic diagram into one embodiment of the invention.Please refer to Fig. 1, heating and thermal insulation carrier 100 comprises a carrier bodies 110 and at least one high-melting-point electrothermal alloy pattern 120.Carrier bodies 110 has first surface 112 and one second face 114, and first surface 112 is relative with the second face 114.The material in the second face 114 is pottery or a glass.High-melting-point electrothermal alloy pattern 120 is coated on the second face 114.In addition, carrier bodies 110 is suitable for the directly food materials (do not illustrate) of carrying for being incubated, and that is, food materials can directly be positioned on first surface 112.In the present embodiment, carrier bodies 110 is for platform, but carrier bodies 110 can for plate, bowl, pot, cup or other directly can carry the container of food materials in other examples.
It is worth mentioning that, high-melting-point electrothermal alloy pattern 120 only can coat the bottom of carrier bodies 110.If carrier bodies 110 is made by transparent materials such as glass, then can keep transparent character.User can see the food materials in heating and thermal insulation carrier 100 easily, and increases convenience when using.Certainly, such design also can avoid decorative pattern designed on plate, bowl, bowl, cup equivalent-load device body 110 or pattern is covered by high-melting-point electrothermal alloy pattern 120, thus has more advantage attractive in appearance.
In design in the past, mostly the heating of food materials is to utilize extra heater to carry out the food materials of indirect splendid attire in pot, bowl, dish, cup.But, high-melting-point electrothermal alloy pattern 120 can convert electrical energy into heat energy upon power-up, is positioned over food materials in carrier bodies 110 or carrier bodies 110 for heating.That is, the design of the present embodiment can directly utilize the high-melting-point electrothermal alloy pattern 120 on pot, bowl, dish, cup to produce electrocaloric effect to heat food materials.Therefore, the design of the present embodiment can provide direct splendid attire and heats the heating and thermal insulation carrier 100 of food materials and have higher ease of use.
In addition, the design of heater in the past needs to be formed on device body by the material with Electrothermal Properties by the mode of sintering.In order to avoid device body damages because sintering temperature is too high, the material with Electrothermal Properties also must have the characteristic of low melting point.For example, the thermo electric material of this kind of low melting point characteristic such as has the materials such as aluminium, silver, copper.In fact, in order to reduce the manufacture craft temperature needed for sintering, also must have in the material of Electrothermal Properties at these and adding plumbous grade for low melting material.So, easily cause the pollution of food materials when heater is in the past used for directly heating food materials, certainly also can cause the pollution of environment.
In the present embodiment, high-melting-point electrothermal alloy pattern 120 is coated on the second face 114 by a plasma spraying.Common plasma spraying comprises that a plasma hot melt penetrates method, an arc heat plasma spraying, a flame hot-melting penetrate method or the hot plasma spraying of a high-speed flame.Plasma spraying be by fusing after metal dust or metal bar, direct spraying in the second face 114 to form required high-melting-point electrothermal alloy pattern 120.
Fig. 2 A and Fig. 2 B is respectively plasma spraying on base material, forms the electron micrograph that coating and sintering process form coating on base material.From Fig. 2 A, the coating 20 that plasma spraying is formed on the base substrate 12 is structurally form by the particle 22 of multiple flat is stacking.In addition, base material 12 does not affect by manufacture craft.From Fig. 2 B then, in the coating 40 that sintering process is formed on base material 14, particle 42 granule boundary presents the kenel to granular center depression.In fact, because high temperature during sintering, there is the phenomenon of diffusion (such as body diffusion, grain boundary decision, diffusion into the surface etc.) at the edge of particle 42.That is, such high temperature also may make base material 14 in the process of sintering, similar diffusion phenomena occur and change the state of its script.
Continue referring to Fig. 1, in the manufacturing process of plasma spraying, carrier bodies 110 does not need to be heated or toast, and does not have the infringement that hot manufacture craft causes.In addition, plasma spraying need not to add plumbous and so on low melting material in order to avoid hot manufacture craft to the infringement of carrier bodies 110.So the material of high-melting-point electrothermal alloy pattern 120 is not leaded in fact (substantially lead-free), and can not cause the pollution of environment or food materials.Further, carrier bodies 110 is not easy to suffer damage, so a fusing point of high-melting-point electrothermal alloy pattern 120 can greater than or equal to 1100 DEG C because of the temperature of plasma spraying.
In addition, the available function of Heat preservation carrier 100 is except heating, and the food materials that carrier bodies 110 is loaded of still needing remain on certain temperature and are beneficial to be eaten at any time.In general, food materials temperature time suitable is preferably 50 DEG C-80 DEG C.Therefore, a resistance value of high-melting-point electrothermal alloy pattern 120 is essentially 0.5 ohm to 50 ohm to have the limit that specifically heats up.
For example, the material of high-melting-point electrothermal alloy pattern 120 can be a metal alloy or a ceramic-metal alloy.In addition, the material meeting aforesaid properties such as has molybdenum alloy, nickel-chromium alloy, cobalt alloy, nickel alloy, tungsten-cobalt carbide alloy or the alloy material being substrate with above-mentioned alloy.These materials are not easily also not easily deteriorated with other substance reactions, so adopt these materials to contribute to improving the service life of Heat preservation carrier 100.
It is worth mentioning that, the resistivity of these materials above-mentioned is greater than the metal materials such as silver, aluminium, copper, therefore can have larger elasticity in the adjustment of resistance.For example, if good conductor material, such as silver, reach the resistance value of 50 ohm, then must reduce live width during pattern layout and increase line length.Such layout type will make manufacture craft degree of difficulty increase.So, adopt the larger alloy of resistivity can be easier to the resistance value reached needed for the present embodiment.
Because spray fusing method can form the pattern of different external forms according to different demand, therefore the present embodiment can realize required resistance value by the external form layout of high-melting-point electrothermal alloy pattern 120.For example, Fig. 3 A and Fig. 3 B illustrates the top view of high-melting-point electrothermal alloy pattern into one embodiment of the invention and the partial cutaway schematic of heating and thermal insulation carrier respectively.Referring to Fig. 3 A and Fig. 3 B, high-melting-point electrothermal alloy pattern 120 is such as a linear pattern, and a live width W of high-melting-point electrothermal alloy pattern 120 is greater than 3mm.
In addition, the present embodiment adopts plasma spraying to form high-melting-point electrothermal alloy pattern 120, so the thickness T of high-melting-point electrothermal alloy pattern 120 can need with manufacture craft and be increased to suitable thickness.For example, the thickness T on the second face 114 coated by high-melting-point electrothermal alloy pattern 120 is 20 μm ~ 500 μm.By such pattern layout, the resistance value of high-melting-point electrothermal alloy pattern 120 can drop in the scope of 0.5 ohm to 50 ohm.Certainly, above pattern layout mode only illustrates, in fact high-melting-point electrothermal alloy pattern 120 layout can along with material select and meltallizing manufacture craft technological process and adjust to some extent and change.
In addition, carrier bodies 110 can be not only made up of single kind of material.Fig. 4 illustrates the heating and thermal insulation carrier partial cutaway schematic into another embodiment of the present invention.Please refer to Fig. 4, the carrier bodies 210 of heating and thermal insulation carrier 200 comprises first body 212 and one second body 214.Second body 214 is close to each other with first body 212, and the material of first body 212 is glass or pottery, and high-melting-point electrothermal alloy pattern 120 is coated on first body 212.
That is, the complex structure body that carrier bodies 210 can be made up of different materials, and high-melting-point electrothermal alloy pattern 120 is configured on the first body 212 of glass or metal.In fact, in the present embodiment and above-described embodiment, glass material can be tempered glass, quartz glass, devitrified glass or glass ceramics etc.Ceramic then can be the various ceramic materials that may be used for splendid attire food materials.
Fig. 5 illustrates the heating curve after into the heating and thermal insulation carrier energising of one embodiment of the invention, and wherein transverse axis is the time, and the longitudinal axis is temperature.Please refer to Fig. 5, the heating and thermal insulation carrier that the present embodiment adopts is the material using molybdenum as high-melting-point electrothermal alloy pattern.Meanwhile, when making high-melting-point electrothermal alloy pattern, under the technological process of plasma spraying is included in the electric current of 170A-200A, the voltage of 25V-30V and the air pressure of 60psi, spray with electric arc plasma spraying.The high-melting-point electrothermal alloy pattern of the present embodiment passes into the direct current of 120W, and be such as the voltage of 12V and the electric current of 10A, then its intensification situation is as shown in heating curve 500.
From heating curve 500, the intensification limit of high-melting-point electrothermal alloy pattern, about about 60 DEG C, so use the heating and thermal insulation carrier of the present embodiment food materials can be maintained at about 60 DEG C, and is convenient to take at any time.In addition, the heating and thermal insulation carrier of the present embodiment utilizes lower powered direct current just can heat, and is not easy the danger of electricity consumption.
After Fig. 6 heating and thermal insulation carrier illustrated as another embodiment of the present invention is energized under the state of splendid attire water, the intensification bottom water and heating and thermal insulation carrier distributes, and wherein transverse axis is the time, and the longitudinal axis is temperature.Please refer to Fig. 6, the heating and thermal insulation carrier that the present embodiment adopts is the material using nickel-chromium alloy as high-melting-point electrothermal alloy pattern.Meanwhile, the heating and thermal insulation carrier of the present embodiment is loaded with water.The high-melting-point electrothermal alloy pattern of the present embodiment passes into the direct current of 120W, such as, be the voltage of 12V and the electric current of 10A, then bottom heating and thermal insulation carrier with the intensification situation of water respectively as shown in intensification distribution 610 and 620.
From intensification distribution 610, under the state being loaded with water, the intensification limit of the high-melting-point electrothermal alloy pattern made with nickel-chromium alloy is about about 50 DEG C.The water of heating and thermal insulation carrier inside also can be heated to about 50 DEG C.In addition, intensification distribution 610 is quite high with intensification distribution 620 correlation, and the direct heating design that represent the present embodiment provides the quite good efficiency of heating surface.
In sum, the present invention adopts high-melting-point material and directly on the tool face of carrying food materials, forms electrothermal alloy pattern in the mode of meltallizing, can direct-fired Vessel Design so the invention provides one.Moreover in the present invention, by the planning of resistance value, high-melting-point electrothermal alloy pattern has certain intensification limit.So the food materials of splendid attire can be remained on certain temperature and can be eaten at any time by heating and thermal insulation carrier of the present invention.Therefore, heating and thermal insulation carrier has pretty good ease of use.In addition, in the selection of material, high-melting-point electrothermal alloy pattern is not leaded in fact and have the advantage of environmental protection.Again furthermore, high-melting-point electrothermal alloy pattern of the present invention is made with gunite, and therefore high-melting-point electrothermal alloy pattern does not need adopt the making of the mode of high temperature sintering and help avoid the injury that high temperature sintering causes carrier bodies.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; this operator is familiar with in any art; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with appended claim of protection scope of the present invention.
Claims (9)
1. a heating and thermal insulation carrier, be suitable for the directly food materials of carrying for being incubated, this heating and thermal insulation carrier comprises:
Carrier bodies, there is first surface and second, this first surface is relative with this second, these food materials are suitable for directly being positioned on this first surface and this material of second is glass, wherein this carrier bodies comprises first body and second body of different materials, and this second body and this first body are close to each other; And
At least one high-melting-point electrothermal alloy pattern, coat on this second, one resistance value of this high-melting-point electrothermal alloy pattern is essentially 0.5 ohm to 50 ohm, and a fusing point of this high-melting-point electrothermal alloy pattern is greater than or equal to 1100 DEG C, this high-melting-point electrothermal alloy pattern is coated on this second by plasma spraying by stacking wherein this high-melting-point electrothermal alloy pattern that forms of the particle of multiple flat.
2. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this high-melting-point electrothermal alloy pattern comprises metal alloy or ceramic-metal alloy.
3. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this high-melting-point electrothermal alloy pattern comprises molybdenum alloy, nickel-chromium alloy, cobalt alloy, nickel alloy or tungsten-cobalt carbide alloy.
4. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this high-melting-point electrothermal alloy pattern is not leaded in fact.
5. heating and thermal insulation carrier as claimed in claim 1, wherein this plasma spraying comprises plasma heat plasma spraying, arc heat plasma spraying, flame hot-melting penetrate method or the hot plasma spraying of high-speed flame.
6. heating and thermal insulation carrier as claimed in claim 1, wherein this high-melting-point electrothermal alloy pattern is linear pattern, and the live width of this high-melting-point electrothermal alloy pattern is greater than 3mm.
7. heating and thermal insulation carrier as claimed in claim 1, wherein the thickness of this high-melting-point electrothermal alloy pattern application on this second is 20 μm ~ 500 μm.
8. heating and thermal insulation carrier as claimed in claim 1, wherein the material of this first body be this glass or this pottery and this high-melting-point electrothermal alloy pattern application on this first body.
9. heating and thermal insulation carrier as claimed in claim 1, wherein this carrier bodies is dish, bowl, pot, cup or platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910226451.6A CN102068207B (en) | 2009-11-20 | 2009-11-20 | Heating and heat-insulating carrier |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910226451.6A CN102068207B (en) | 2009-11-20 | 2009-11-20 | Heating and heat-insulating carrier |
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| CN102068207A CN102068207A (en) | 2011-05-25 |
| CN102068207B true CN102068207B (en) | 2015-05-20 |
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| CN200910226451.6A Active CN102068207B (en) | 2009-11-20 | 2009-11-20 | Heating and heat-insulating carrier |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104947105A (en) * | 2014-03-31 | 2015-09-30 | 佛山市顺德区美的电热电器制造有限公司 | Manufacturing method of metal part and patterns and/or characters on metal part |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2075407U (en) * | 1989-05-08 | 1991-04-17 | 王汉春 | Ceramic (glass) electric heater using electrothermic film |
| CN1073896A (en) * | 1991-12-30 | 1993-07-07 | 上海交通大学 | Spray method for electrothermal coating of enamelled plate |
| CN2772173Y (en) * | 2005-01-21 | 2006-04-12 | 林正平 | Film heating assembly |
| CN201234365Y (en) * | 2008-07-24 | 2009-05-06 | 马孟骅 | Crystalline glass electric heating membrane heating cooking board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050205548A1 (en) * | 2004-01-29 | 2005-09-22 | Tim Olding | Integrated thin high temperature heaters |
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2009
- 2009-11-20 CN CN200910226451.6A patent/CN102068207B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2075407U (en) * | 1989-05-08 | 1991-04-17 | 王汉春 | Ceramic (glass) electric heater using electrothermic film |
| CN1073896A (en) * | 1991-12-30 | 1993-07-07 | 上海交通大学 | Spray method for electrothermal coating of enamelled plate |
| CN2772173Y (en) * | 2005-01-21 | 2006-04-12 | 林正平 | Film heating assembly |
| CN201234365Y (en) * | 2008-07-24 | 2009-05-06 | 马孟骅 | Crystalline glass electric heating membrane heating cooking board |
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| CN102068207A (en) | 2011-05-25 |
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