CN102065643A - Method for making circuit board - Google Patents
Method for making circuit board Download PDFInfo
- Publication number
- CN102065643A CN102065643A CN2009103098443A CN200910309844A CN102065643A CN 102065643 A CN102065643 A CN 102065643A CN 2009103098443 A CN2009103098443 A CN 2009103098443A CN 200910309844 A CN200910309844 A CN 200910309844A CN 102065643 A CN102065643 A CN 102065643A
- Authority
- CN
- China
- Prior art keywords
- hole
- opening
- pad
- circuit board
- coverlay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309844A CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309844A CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102065643A true CN102065643A (en) | 2011-05-18 |
CN102065643B CN102065643B (en) | 2012-10-17 |
Family
ID=44000656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910309844A Active CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102065643B (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103325771A (en) * | 2012-03-22 | 2013-09-25 | 矽品精密工业股份有限公司 | Interposer and electrical testing method thereof |
CN103687324A (en) * | 2013-10-31 | 2014-03-26 | 胜宏科技(惠州)股份有限公司 | Thin plate solder mask printing method |
CN104470211A (en) * | 2013-09-24 | 2015-03-25 | 深南电路有限公司 | PCB machining method and PCB |
CN104703390A (en) * | 2013-12-06 | 2015-06-10 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
CN105764234A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Circuit board structure and manufacturing method thereof |
CN106304627A (en) * | 2015-05-13 | 2017-01-04 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
CN104582243B (en) * | 2013-10-16 | 2018-07-27 | 易鼎股份有限公司 | Optical positioning structure of circuit substrate |
CN110557882A (en) * | 2018-05-30 | 2019-12-10 | 纬颖科技服务股份有限公司 | circuit board for transmitting and testing high-speed signal |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101153887B (en) * | 2006-09-28 | 2010-12-15 | 比亚迪股份有限公司 | Special circuit board for detecting FPC impact deflection and detecting method thereof |
CN100472772C (en) * | 2007-05-15 | 2009-03-25 | 日月光半导体制造股份有限公司 | Circuit board and circuit structure |
CN101442901B (en) * | 2007-11-22 | 2011-11-16 | 比亚迪股份有限公司 | Method for composing multilayer printed circuit board |
-
2009
- 2009-11-17 CN CN200910309844A patent/CN102065643B/en active Active
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103325771A (en) * | 2012-03-22 | 2013-09-25 | 矽品精密工业股份有限公司 | Interposer and electrical testing method thereof |
CN104470211A (en) * | 2013-09-24 | 2015-03-25 | 深南电路有限公司 | PCB machining method and PCB |
CN104470211B (en) * | 2013-09-24 | 2018-02-27 | 深南电路股份有限公司 | Pcb board processing method and pcb board |
CN104582243B (en) * | 2013-10-16 | 2018-07-27 | 易鼎股份有限公司 | Optical positioning structure of circuit substrate |
CN103687324A (en) * | 2013-10-31 | 2014-03-26 | 胜宏科技(惠州)股份有限公司 | Thin plate solder mask printing method |
CN104703390B (en) * | 2013-12-06 | 2017-12-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
CN104703390A (en) * | 2013-12-06 | 2015-06-10 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
CN105764234A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Circuit board structure and manufacturing method thereof |
CN105764234B (en) * | 2014-12-19 | 2019-01-25 | 鹏鼎控股(深圳)股份有限公司 | Board structure of circuit and preparation method thereof |
CN106304627A (en) * | 2015-05-13 | 2017-01-04 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
CN106304627B (en) * | 2015-05-13 | 2019-10-29 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
CN110557882A (en) * | 2018-05-30 | 2019-12-10 | 纬颖科技服务股份有限公司 | circuit board for transmitting and testing high-speed signal |
US10775427B2 (en) | 2018-05-30 | 2020-09-15 | Wiwynn Corporation | Circuit board for transmitting high speed signal and for said signal to be detected |
Also Published As
Publication number | Publication date |
---|---|
CN102065643B (en) | 2012-10-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170306 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |