CN102064140B - Packaging structure and making process thereof - Google Patents
Packaging structure and making process thereof Download PDFInfo
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- CN102064140B CN102064140B CN2010105061910A CN201010506191A CN102064140B CN 102064140 B CN102064140 B CN 102064140B CN 2010105061910 A CN2010105061910 A CN 2010105061910A CN 201010506191 A CN201010506191 A CN 201010506191A CN 102064140 B CN102064140 B CN 102064140B
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- substrate
- interfacial agents
- adhesive coating
- encapsulating structure
- interfacial
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Abstract
The invention discloses a packaging structure and a making process thereof. The packaging structure comprises a first substrate, a second substrate, an interface agent and an adhering layer, wherein the interface agent is arranged on the first surface of the first base plate so as to improve the smoothness of the first surface; the adhering layer is combined with the first base plate and the second base plate, and the adhering layer is in contact with the interface agent. Part of adhering layer permeates into the interface agent and adhered on the first surface. The invention also discloses a package making process.
Description
Technical field
The present invention relates to a kind of encapsulating structure, and particularly relate to a kind of display encapsulating structure.
Background technology
LCD (Liquid Crystal Display; LCD) have that high image quality, volume are little, in light weight, low voltage drive, low consumpting power and advantages of wide application range; So be widely used in Portable TV, mobile phone, shot with video-corder projector, in consumer electronics such as notebook computer and desktop display or the computer product, become the main flow of display.
Along with the development of portable electronic devices, these display screen regular meeting collocation contact panels use as touch control screen.Mostly manufacture craft now is to adopt optical cement as paste medium, and under near the state of vacuum, pastes display screen and contact panel with the mode of face applying.These bubbles produce but have a little bubble in the applying manufacture craft, if can't be got rid of the display effect that will influence display screen.Because the size of display screen and contact panel is big more, the chance that produces bubble during applying is high more, so the size of touch control screen is difficult to promote.
Summary of the invention
Therefore the object of the present invention is to provide a kind of encapsulating structure, produce the situation of bubble during in order to the solution baseplate-laminating.
For reaching above-mentioned purpose, according to one embodiment of the invention, a kind of encapsulating structure is proposed, it comprises first substrate, second substrate, interfacial agents, and adhesive coating.First substrate has first surface, and interfacial agents is arranged at first surface, to promote the smoothness of first surface.Adhesive coating combines first substrate and second substrate, and wherein adhesive coating contacts with interfacial agents.Second substrate has second surface, and second surface is attached at adhesive coating.Some of adhesive coatings infiltrate in interfacial agents, and adhere on the first surface.The light penetration degree of interfacial agents and adhesive coating preferably is greater than 80%.First surface comprises a plurality of micro-pores, and interfacial agents is filled up micro-pore.First substrate can be glass substrate, and second substrate can be contact panel.Perhaps, first substrate can be contact panel, and second substrate can be over cap.Interfacial agents comprises silicone oil.
Another aspect of the present invention is a kind of packaging manufacturing process, and it comprises provides one first substrate, then smears the first surface of interfacial agents in first substrate, to promote the smoothness of first surface.Then, second substrate is provided, and the coating adhesive coating is in the second surface of second substrate.Pressing first substrate and second substrate then, wherein adhesive coating contacts with this interfacial agents, and the adhesive coating of part infiltrates in interfacial agents and is attached to first surface.This packaging manufacturing process can more comprise pressurization to deviate from least one bubble between adhesive coating and interfacial agents.Wherein smear the step of interfacial agents, comprise a plurality of micro-pores that make interfacial agents fill up first surface in the first surface of first substrate.The light penetration degree of adhesive coating and interfacial agents preferably is greater than 80%.
This encapsulating structure promotes the smoothness of substrate surface through interfacial agents; And can reduce the viscosity of the adhesive coating that contacts with interfacial agents; Making that the bubble that in the applying process, produces is more or less freely is removed; To solve display screen and contact panel generation bubble but can't remove the problem that causes size to be difficult to promote when fitting.
Description of drawings
For letting above-mentioned and other purposes of the present invention, characteristic, advantage and the embodiment can be more obviously understandable, the detailed description of appended accompanying drawing be following:
Fig. 1 illustrates the cut-open view of encapsulating structure one embodiment of the present invention;
Fig. 2 A and Fig. 2 B illustrate the partial enlarged drawing before and after the first base plate coating interfacial agents respectively;
Fig. 3 illustrates the process flow diagram of method for packing one embodiment of the present invention;
Fig. 4 illustrates the cut-open view of another embodiment of encapsulating structure of the present invention.
The main element symbol description
100: encapsulating structure 212: first surface
214: the four surfaces of 110: the first substrates
112: 220: the second substrates of first surface
114: micro-pore 222: second surface
230: the three substrates of 120: the second substrates
122: 232: the three surfaces of second surface
130: 240: the first interfacial agents of interfacial agents
140: adhesive coating 250: the second contact surface agent
150: 260: the first adhesive coatings of bubble
160: 270: the second adhesive coatings of pressure defoaming machine
200: encapsulating structure S10～S40: step
210: the first substrates
Embodiment
Below will clearly demonstrate spirit of the present invention with accompanying drawing and detailed description; Has common knowledge the knowledgeable under any in the technical field after understanding preferred embodiment of the present invention; When can be by the technology of teachings of the present invention, change and modification, it does not break away from spirit of the present invention and scope.
With reference to Fig. 1, it illustrates the cut-open view of encapsulating structure one embodiment of the present invention.Encapsulating structure 100 includes first substrate 110, second substrate 120, interfacial agents 130, and adhesive coating 140.First substrate 110 has first surface 112, and interfacial agents 130 is arranged on the first surface 112, to promote the smoothness of first surface 112.Second substrate 120 has second surface 122, and adhesive coating 140 is arranged on the second surface 122, in order to combine first substrate 110 and second substrate 120.
With reference to Fig. 2 A and Fig. 2 B, it illustrates the partial enlarged drawing before and after the first base plate coating interfacial agents respectively.Among Fig. 2 A, be difficult to have a plurality of micro-pores 114 on the first surface 112 of first substrate 110 with avoiding.These micro-pores 114 can influence the smoothness of first surface 112, and become bubble and be difficult to one of main cause that breaks away from the adhesive coating (see figure 1).
Among Fig. 2 B, interfacial agents 130 is coated on the first surface 112, to fill up the micro-pore 114 on the first surface 112 through interfacial agents 130, is used to promote the smoothness of first surface 112.After micro-pore 114 is filled up by interfacial agents 130; First surface 112 can be regarded as smooth surface; And interfacial agents 130 can reduce the viscosity of this part that the adhesive coating (see figure 1) contacts with interfacial agents 130, makes the more or less freely disengaging adhesive coating of bubble (see figure 1).
Wherein the thickness of interfacial agents 130 only need be filled up this and gets final product fine porosity 114 slightly.If the thickness of interfacial agents 130 is blocked up, then might makes the sticker (see figure 1) can't infiltrate interfacial agents 130 and contact, and influence the effect that combines of first substrate 110 and the second substrate (see figure 1) with first surface 112.
With reference to Fig. 3, it illustrates the process flow diagram of method for packing one embodiment of the present invention.Step S10 is for providing first substrate 110 and second substrate 120, and the second surface 122 that wherein scribbles interfacial agents 130, the second substrates 120 on the first surface 112 of first substrate 110 is provided with adhesive coating 140.
Then, step S20 is for first substrate 110 and second substrate 120 of fitting, to obtain encapsulating structure 100.Step S20 comprises the roll extrusion of use roller with pressing first substrate 110 and second substrate 120.Wherein adhesive coating 140 contacts with interfacial agents 130, and the adhesive coating 140 of part can infiltrate in the interfacial agents 130 and be attached to first surface 112, to bind first substrate 110 and second substrate 120.Interfacial agents 130 and adhesive coating 140 are disposed between first substrate 110 and second substrate 120.
Among the step S20,, may on the surface of contact of interfacial agents 130 and adhesive coating 140, form at least one bubble 150 because first substrate 110 and second substrate 120 are modes that employing face is fitted.
Step S30 sends in the pressure defoaming machine 160 for the encapsulating structure 100 that will contain bubble 150, deviates from the bubble 150 in the encapsulating structure 100 with pressurization.Because the smoothness of the first surface 112 that interfacial agents 130 promotes, and can reduce the viscosity of this part sticker 140 that contacts with interfacial agents 130, bubble 150 just can be by deviating from the encapsulating structure 100.
At last, step S40 shifts out encapsulating structure 100, and solidifies adhesive coating 140.
With reference to Fig. 4, it illustrates the cut-open view of another embodiment of encapsulating structure of the present invention.Encapsulating structure 200 includes first substrate 210, second substrate 220, the 3rd substrate 230, first interfacial agents 240, second contact surface agent 250, first adhesive coating 260, and second adhesive coating 270.First substrate 210 has first surface 212, the first interfacial agents 240 and coats on the first surface 212.Second substrate 220 has second surface 222; First adhesive coating 260 is arranged on the second surface 222; First adhesive coating 260 contacts with first interfacial agents 240; And first adhesive coating 260 of part can infiltrate in first interfacial agents 240 and be attached to first surface 212, to bind first substrate 210 and second substrate 220.
The 3rd substrate 230 has the 3rd surface 232, and second contact surface agent 250 is for being coated on the 3rd surface 232.First substrate 210 has the 4th surface 214 with respect to first surface 212; Second adhesive coating 270 is arranged on the 4th surface 214; And second adhesive coating 270 of part can infiltrate in the second contact surface agent 250 and be attached to the 3rd substrate 230, to bind first substrate 210 and the 3rd substrate 230.
The 3rd substrate 230 can be the glass substrate of liquid crystal panel.First substrate 210 can be contact panel.Second substrate 220 can be over cap.The material of first interfacial agents 240 and second contact surface agent 250 can be silicone oil with high light line penetration or cured.The material of first adhesive coating 260 and second adhesive coating 270 can be optical cement.First interfacial agents 240 can promote the smoothness on first surface 212 and the 3rd surface 232 with second contact surface agent 250, and reduces by first adhesive coating 260 of this part and the viscosity of second adhesive coating 270, makes that the bubble when fitting breaks away from easily.
Interfacial agents can be selected from the group that is made up of silicon-containing compound, saturated fatty acid, unsaturated fatty acid, silicon dioxide, alcohols, ketone, alkanes, ester class, alkene class and combination thereof.
The material of interfacial agents can be silicon-containing compound.The material of interfacial agents can be siloxane polymer ((CH
3)
3SiO (SiO (CH
3)
2O)
nSi (CH
3)
3, be commonly called as silicone oil).The part alkyl of this silicone oil (comprising side group and end group) can be by substituted silicone oil such as hydrogen, hydroxyl, oxyalkyl, vinyl, chlorphenyls, like methyl (or dimethyl) silane oil, tolyl silane oil, chlorophenylmethyl silicone oil, ethyl silicon oil etc.
The material of interfacial agents can be saturated fatty acid (saturated fatty acid), like hexadecanoic acid (Hexadecanoic acid) (be called not only palmitic acid, palmitic acid (palmitic acid)) or octadecanoid acid (Octadecanoic acid) (but also claiming stearic acid (stearic acid)).The material of interfacial agents can be unsaturated fatty acid (unsaturated fatty acid), like oleic acid (oleic acid), linolenic acid (linoleic acid) (linoleic acid), linolenic acid (α-Linolenic acid).
Interfacial agents can be silicon dioxide, alcohols, ketone, alkanes, ester class, or the alkene class.
Can know by the invention described above preferred embodiment, use the present invention and have advantage.This encapsulating structure promotes the smoothness of substrate surface through interfacial agents; And can reduce the viscosity of the adhesive coating that contacts with interfacial agents; Making that the bubble that in the applying process, produces is more or less freely is removed; To solve display screen and contact panel generation bubble but can't remove the problem that causes size to be difficult to promote when fitting.
Though disclosed the present invention in conjunction with an above preferred embodiment; Yet it is not in order to limit the present invention; Anyly be familiar with this operator; Do not breaking away from the spirit and scope of the present invention, can do various changes and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (8)
1. encapsulating structure comprises:
First substrate has first surface;
Interfacial agents is arranged at this first surface, to promote the smoothness of this first surface;
Second substrate; And
Adhesive coating, in conjunction with this first substrate and this second substrate, wherein this adhesive coating contacts with this interfacial agents, and this adhesive coating of part infiltrates in this interfacial agents, and adheres on this first surface,
This first substrate is a glass substrate, and this second substrate is a contact panel.
2. encapsulating structure as claimed in claim 1, wherein this second substrate has a second surface, and this second surface is attached at this adhesive coating.
3. encapsulating structure as claimed in claim 1, wherein the light penetration degree of this interfacial agents and this adhesive coating is greater than 80%.
4. encapsulating structure as claimed in claim 1, wherein this first surface comprises a plurality of micro-pores, and this interfacial agents is filled up those micro-pores.
5. encapsulating structure as claimed in claim 1, wherein this interfacial agents is silicon-containing compound or siloxane polymer.
6. packaging manufacturing process comprises:
One first substrate is provided;
Smear the first surface of an interfacial agents, to promote the smoothness of this first surface in this first substrate;
One second substrate is provided;
Be coated with the second surface of an adhesive coating in this second substrate; And
This first substrate of pressing and this second substrate, wherein this adhesive coating contacts with this interfacial agents, and this adhesive coating of part infiltrates in this interfacial agents and is attached to this first surface,
Wherein this packaging manufacturing process also comprises pressurization to deviate from least one bubble between this adhesive coating and this interfacial agents.
7. packaging manufacturing process as claimed in claim 6 is wherein smeared the step of an interfacial agents in a first surface of this first substrate, comprises a plurality of micro-pores that make this interfacial agents fill up this first surface.
8. packaging manufacturing process as claimed in claim 6, wherein the light penetration degree of this adhesive coating and this interfacial agents is greater than 80%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105061910A CN102064140B (en) | 2010-10-12 | 2010-10-12 | Packaging structure and making process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105061910A CN102064140B (en) | 2010-10-12 | 2010-10-12 | Packaging structure and making process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102064140A CN102064140A (en) | 2011-05-18 |
| CN102064140B true CN102064140B (en) | 2012-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105061910A Expired - Fee Related CN102064140B (en) | 2010-10-12 | 2010-10-12 | Packaging structure and making process thereof |
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| CN (1) | CN102064140B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI558570B (en) * | 2013-05-13 | 2016-11-21 | 仁寶電腦工業股份有限公司 | Display apparatus, fabricating method thereof and optical adhesive |
| CN104483769B (en) * | 2015-01-04 | 2017-09-26 | 京东方科技集团股份有限公司 | A kind of full applying method of scraper type fruit juice gel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441345A (en) * | 2007-11-23 | 2009-05-27 | 胜华科技股份有限公司 | Touch control type liquid crystal display panel and method for producing same |
| CN101464743A (en) * | 2007-12-19 | 2009-06-24 | 介面光电股份有限公司 | Hybrid touch control panel and its forming method |
| CN101587402A (en) * | 2009-06-29 | 2009-11-25 | 友达光电股份有限公司 | Flexible touch-control display device |
-
2010
- 2010-10-12 CN CN2010105061910A patent/CN102064140B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441345A (en) * | 2007-11-23 | 2009-05-27 | 胜华科技股份有限公司 | Touch control type liquid crystal display panel and method for producing same |
| CN101464743A (en) * | 2007-12-19 | 2009-06-24 | 介面光电股份有限公司 | Hybrid touch control panel and its forming method |
| CN101587402A (en) * | 2009-06-29 | 2009-11-25 | 友达光电股份有限公司 | Flexible touch-control display device |
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| Publication number | Publication date |
|---|---|
| CN102064140A (en) | 2011-05-18 |
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