CN102060437A - Brittle material thermal stress cutting method based on large-area uneven temperature distribution and thermal stress cutting device - Google Patents
Brittle material thermal stress cutting method based on large-area uneven temperature distribution and thermal stress cutting device Download PDFInfo
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Abstract
A brittle material thermal stress cutting method based on large-area uneven temperature distribution and a thermal stress cutting device which are provided in the invention can achieve no thermal damage resulted from material heating on a workpiece, realize a high cutting speed and high cutting position precision and be suitably applied for cutting solar battery glass slabs with a more or less 5-millimeter thickness. Static or moving low-temperature uneven heating temperature distribution is smoothly arranged as large as possible on the workpiece so as to lower the heating temperature for stress generation and prevent the workpiece from being thermally damaged. On the other hand, the heating temperature distribution is overlapped with concentrating static or moving heating energy in a relatively small area of a cutting position determination factor. Moreover, the position is set in a deviating way or the position is made under negative feedback control. The cutting position precision is improved by performing positive feedback control as required.
Description
Technical field
The present invention relates to a kind of hard brittle material particularly the thermal stresses cutting method and the device of flat panel display glass and solar cell substrate glass.
Background technology
In glass cutting, used thermal stresses patterning method recently, with the mechanical means that replaces using in number century in the past always based on diamond head based on laser radiation.
Can eliminate mechanical means inherent shortcoming according to this method, the pollution that the generation of the cullet the when reduction, the cutting that promptly produce the strength of glass that tiny crack causes causes, be suitable for thickness of slab and have lower value etc.
Its result, according to the thermal stresses patterning method not needs carry out promptly grinding, cleaning as the postorder operation of cut mechanically, can obtain the minute surface of surfaceness below 1 μ m, the product design dimensional precision is more than ± 25 μ m.Have, can also be used for the thickness that sheet thickness is thinned to 0.1mm, flat panel display glass, the solar cell substrate that can be used for from now on are on glass.
The principle of this method is as described below.To glass irradiating laser locally, carry out can not cracking, the heating of degree such as fusion, gasification.Though this moment, glass heats portion will expand, because of the retroaction from peripheral glass can not be expanded fully, and with point of irradiation center generation stress under compression.At the non-heating region of periphery, also pushed and produced distortion with respect to periphery from the expansion of heating part, its result produces stress under compression.Such stress under compression is the stress along radial direction.Under the situation that has stress under compression on the object, on its orthogonal directions, produce by the relevant tensile stress of Poisson's ratio.Here this direction is a tangential direction.This information slip is shown among Fig. 2.
This Fig. 2 is used to represent with the initial point to be the radial direction stress components σ of Gaussian distribution when temperature rises at center
xWith tangential direction stress components σ
ySituation according to the place variation.The former is always stress under compression (in this Fig. 2 for negative value), and the latter is a stress under compression at the heating central part, and is changed to tensile stress (this Fig. 2 on the occasion of) away from this center the time.Based on this stress distribution shown in Figure 2, also can be processed into the linear combination of this stress distribution at general temperature distribution.Under this situation, one fixes on orthogonal directions generation stress under compression and tensile stress on the each point on the sheet glass.
Relevant with direct cutting in these stress is tensile stress.When this stress surpasses destruction toughness value as the material proper value, produce everywhere and destroy and can not control.Under situation,, thereby can not produce destruction because tensile stress is chosen to be this below value as thermal stresses cutting of the present invention.
But, having on the tensile stress location under the situation of be full of cracks, enlarge at its front end stress, if this power exceeds the destruction toughness value of material, then be full of cracks can enlarge.That is the cutting that has produced as the Be Controlled of processing.By the scan laser point of irradiation, be full of cracks is prolonged.In this thermal stresses cutting, because cut surface and crystalline cleavage plane are similar, thereby can not produce tiny crack, cullet, can eliminate the shortcoming of above-mentioned mechanical means, as the working method of glass, have very excellent characteristic.
This thermal stresses is cut with two kinds of situations shown in Figure 14.Shown in Figure 14 (a) is to heat 2 and cooling 3 result, only produces the situation of be full of cracks 4 at the upper layer (for example degree of depth 100 μ m) of workpiece 1, is commonly referred to as surface scratch.5 expression cut directions.
On the other hand, shown in Figure 14 (b) is the situation that produces be full of cracks on the whole thickness of workpiece, is commonly referred to as full cutting.5 expression cut direction, 6 expression cutting preset lines.Do not cool off under the situation of the full cutting shown in this figure.Obviously cool off the formation of tensile stress favourablely, but this is owing to can not find the method for cooling that involves workpiece inside in large quantities.Both respectively have relative merits.The former needs to cut off operation behind cut, this is maximum shortcoming.This operation is unwanted in the latter, reduces but exist in this latter's technology at the large-scale workpiece cutting speed in feet per minute, or reduce the shortcoming of so-called size effect such as cutting position precision near workpiece end.
This surface scratch technology to the glass irradiating laser is poured into energy by Kondratenko Vladimir S. and is developed, and has applied for the Japanese Patent of patent documentation 1.This patent has also been applied for the Europe patent and the United States Patent (USP) of patent documentation 2 and patent documentation 3.This contriver has selected CO
2Laser is as laser.
Equally, utilize CO
2Laser carries out the technology of surface scratch, and application has based on beam splitter will justify symmetrical laser beam is converted to the technology of a plurality of beam point ranges of arranging on straight line the Japanese Patent of patent documentation 4.
At above surface scratch patent, wish to carry out the exploitation of the full cutting mode technology shown in Figure 14 (b) in order to remove above-mentioned shortcoming, and apply for the Japanese Patent of patent documentation 5 of technology of the irradiation semiconductor laser on glass of oriented rare earth doped dvielement.
Thermal stresses is cut into full cutting mode or terminates in surface scratch, be to terminate in the poor of surface phenomena or scale of construction phenomenon (based on the laser of non-patent literature 1), only produce or spread all over the difference that the full depth of workpiece produces by thermal stresses and decide at upper layer according to workpiece heating.As mentioned above, both respectively have relative merits, get final product thereby use respectively according to purpose.This patent can be applicable to two technology simultaneously, and is the improvement patent that can further improve the performance of hard brittle material thermal stresses cutting.Particularly in surface scratch, it has done technique improvement can being that used for solar batteries glass about 5mm is as its object with the glass thickness of slab.
Patent documentation 1: コ Application De ラ テ Application コ V.S. (Kondratenko Vladimir S.), the method for dividing of brittle non-metallic material, No. the 3027768th, Japan's patent
Patent documentation 2:Kondratenko Vladimir S., Method of splitting non-metallic materials, EP0633867B1
Patent documentation 3:Kondratenko Vladimir S., Method of splitting non-metallic materials, USP5609284
Patent documentation 4: originally exert oneself at the temple, shut-off device, No. the 3792639th, Japan's patent
5: three Pus of patent documentation are grand, the light rule husband of portion, the cut-off method of hard brittle material and device, No. the 4179314th, Japan's patent
Non-patent literature 1:Vladimir V.Fedorov et al.3.77-5.05 μ m Tunable Solid-State Lasers Based on Fe
2+-Doped ZnSe Crystals Operating at Low and Room Temperatures, IEEE Journal of Quantum Electronics, Vol.42, No.9, pp 906-917, September (2006).
Thermal stresses cutting based on laser radiation etc. is characterised in that comparing mechanical means is a kind of high-quality processing method.But this processing method also has shortcoming.It is high temperature that its first shortcoming is compared normal temperature for the processing stand temperature.Mechanical means carries out at normal temperatures, and the thermal stresses cutting must be heated to more than the normal temperature correspondingly.Particularly when large-scale workpiece is cut entirely, need increase thermal stresses in order to increase cutting speed in feet per minute.Need further to improve Heating temperature for this reason.On the other hand, because glass has sex change point temperature, melting point, in order to prevent that the workpiece damage from needing to reduce Heating temperature, this is a maximum problem in the thermal stresses cutting when particularly on glass surface film being arranged.
Especially, the shortcoming as surface scratch can not be applicable in the plate glass.Now, this technology is applied in the flat panel display glass cutting, and glass thickness of slab at this moment is generally 0.7mm.CO
2When glass surface is arrived in laser radiation, be the projectile energy of the upper layer absorption 99% of 3.7 μ m by the degree of depth.Therefore, scratch depth is defined as about 200 μ m usually.When thickness of slab is 0.7mm, if there is the scratch depth of 200 μ m can carry out follow-up mechanical cutting.When but thickness of slab is the 5mm left and right sides, under this scratch depth, can not carry out mechanical cutting.Can not carry out the laser cutting of solar battery glass with present cut technology.
Summary of the invention
In order to address these problems, workpiece not to be heated a bit that is defined on the workpiece in the present invention, but be distributed in the big zone.So, can be by the thermal stresses of area branch in the heating all zones, with the thermal stresses of remarkable increase generation in the each point generation of heating region.But, do not produce thermal stresses during workpiece all zones even heating.In order to remove the residual stress in the workpiece, usually workpiece is put into that process furnace heats gradually or cooling processing gradually.Need uneven temperature to distribute in order to produce thermal stresses.This distributes to form on the principle and both can also can realize by cooling by the heating realization, but it is easier in fact to carry out the method that heats.And both and time spent also produce effect.By the heating of this profile, we can accomplish with the Heating temperature of full cutting mode cutting speed in feet per minute 300mm/ second when to cut thickness of slab be the large-scale non-alkali glass of 0.7mm to be 50 ℃ lesser temps.
This method produces effect to the Heating temperature that reduces processing stand.But, and do not have cutting position determining cause really, so produce the shortcoming that precision reduces because temperature distribution enlarges gently.For preventing this shortcoming, overlapping sharp-pointed peak and determine as cutting position that the factor is used and get final product in mild temperature distribution.But usually, temperature distribution is inconsistent with the stress distribution of using during interatomic bond separates.That in fact work piece cut is exerted an influence is the latter, and this not only depends on the one-piece construction that temperature distribution also depends on workpiece.Therefore, only make temperature distribution consistent, can not realize higher cutting position precision with the cutting preset lines.Can improve this precision by the following method: can accurately predict by theoretical or experiment under the situation of deviation between the two and use migration technology; This is predicted comparatively and controls by reverse feedback under the situation of difficult, or carries out positive regeeration control as required.
And, utilized the stress of be full of cracks front end to amplify phenomenon in the present invention in order to solve the problem of slab.Have thickness of slab 5mm on glass under the situation of surface scratch of the degree of depth 200 μ m, be full of cracks can not be quickly up and down direction advance.But, only near the zone of the qualification the end of glass after the thickness of slab direction is carried out mechanical cutting, mechanical cutting is advanced along score line, carry out mechanical cutting on the total length of glass and get final product.In case forming, mechanical cutting just continues to cut off the still initial comparison difficulty that begins after this than being easier to.So in the zone of above-mentioned glass end, need to make the degree of depth of cut to be set at the almost numerical value of approaching whole thickness of slab, rather than 200 μ m.
According to the present invention, can realize the high quality that thermal stresses cutting is had, Heating temperature fully is reduced to do not damage glass self and lip-deep film than low value, and can also fully improve positional precision.And, can make the object thickness of slab increase to the 5mm of solar battery glass or this is more than thickness.Based on the glass cutting of laser, though have a lot of technical advantages on processing quality, the several centuries of replacing over of also failing is used the mechanical system based on diamond head so far always.The present invention is used to change this situation.
The thermal stresses cutting of the glass of realizing by the present invention has following advantage.
1) method of comparing in the past can significantly improve the speed of cutting.
2) postorder operation such as the grinding after not needing to cut, cleaning.
3) do not produce tiny crack near cut surface, the value of workpiece material intensity is higher.
4) do not have adhering to of cullet on cut surface, cleaning becomes.
5) can cut plate glass.
6) cutting position precision height.
7) cut surface is fully vertical with respect to glass surface.
8) cut surface is a minute surface, and surfaceness is good.
9) can use the selectivity cutting that realizes overlapping glass from the laser beam irradiation of a direction, and not need the operations such as counter-rotating of sheet glass.
10) can realize the automatization of cutting.
Description of drawings
Fig. 1 is the synoptic diagram of expression based on the thermal stresses incision principle of big regional uneven temperature distribution.
Fig. 2 be based on the Gaussian temperature distribution and thermal stress distribution figure.
Fig. 3 represents to be used to produce the inhomogeneous example that adds heat distribution in big zone under the lesser temps of thermal stresses.
Fig. 4 is illustrated in the inhomogeneous stress intensity factor distribution plan that produces in the example of heat distribution that adds in big zone.
Fig. 5 represents that the stress intensity factor of laser facula scanning distributes.
Stress intensity factor when Fig. 6 is illustrated in overlapping scan laser facula in the inhomogeneous heating in big zone distributes.
Fig. 7 represents that Gaussian laser beam is converted to line beam by DOE.
Fig. 8 represents to carry out along profile the rotation control of the line beam direction in thermal stresses when cutting.
Fig. 9 represents to carry out the line beam length in thermal stresses when cutting and the control of direction along profile.
The cutting position of reality and the deviation between the target location when Figure 10 represents near the thermal stresses cut workpiece side.
Figure 11 represents that thickness is the infrared rays light transmission rate of the non-alkali glass plate of 0.7mm.
Figure 12 is illustrated in full cut direction and the very dark orthogonal example of cut direction of the degree of depth in a large amount of cuttings of workpiece.
Figure 13 represents to carry out easily the synoptic diagram that the desirable scratch depth of the mechanical cutting of plate glass distributes.
Figure 14 be expression on glass when carrying out laser radiation surface scratch (a) and cut the synoptic diagram of (b) entirely.
Embodiment
Fig. 1 illustrates the synoptic diagram of embodiments of the present invention.Basic structure as embodiments of the present invention, static or the mobile uneven temperature that temperature in the big zone on the workpiece is lower than the thermal damage temperature of workpiece distributes and determines that as cutting position the static or mobile temperature distribution of being concentrated in the tiny area of the factor is overlapping, only makes the opening mode stress strength factor K near this tiny area
1Value greater than the destruction toughness value K of material
1cValue, and determine at this cutting position to set side-play amount as required on the temperature distribution of the factor, perhaps carry out reverse feedback control or according to circumstances carry out positive regeeration control, so that cutting position is consistent with the target location, the thermal stresses cutting method of this hard brittle material is characterised in that, determine the factor for forming cutting position, use the line beam that laser conversion is obtained by the diffraction grating type optical element.
The thermal stresses cutting unit of a kind of hard brittle material that embodiments of the present invention relate to, be used to realize the thermal stresses cutting method of above-mentioned hard brittle material, static or the mobile uneven temperature that temperature in the big zone on the workpiece is lower than the thermal damage temperature of workpiece distributes and determines that as cutting position the static or mobile temperature distribution of being concentrated in the tiny area of the factor is overlapping, only makes the opening mode stress strength factor K near this tiny area
1Value greater than the destruction toughness value K of material
1cValue, and determine at this cutting position to set side-play amount as required on the temperature distribution of the factor, perhaps carry out reverse feedback control or according to circumstances carry out positive regeeration control, so that cutting position is consistent with the target location, the thermal stresses cutting unit of above-mentioned hard brittle material is characterised in that, determine the factor for forming cutting position, have light beam and produce mechanism, the line beam that output obtains laser conversion by the diffraction grating type optical element.
If the brief description present embodiment, the inhomogeneous Heating temperature of the static or mobile lower temperature by mild distribution is set in the zone big as far as possible on workpiece distributes, and realizes being used to producing the reduction of the Heating temperature of stress, and prevents the thermal damage of workpiece.On the other hand, overlapping heat energy on this Heating temperature distributes, this energy is concentrated in the more small zone of determining the factor as cutting position and is static or mobile, and this position of offset setting, perhaps carry out reverse feedback control or carry out positive regeeration control as required, to improve the cutting position precision.When distributing, can use linear elasticity to destroy the method for mechanics for the uneven temperature of realizing required thermal stress distribution design.Use laser as heating, can use the CO that section shape is converted to line beam by diffraction grating optics element
2Laser, can realize the Er:YAG laser of full cutting, can select to realize the wavelength variable Fe of full cutting or dark cut at the glass of various thicknesss of slab
+ 2: ZnSe laser.The cut-out of plate glass is provided with to such an extent that realize fully deeply by the scratch depth that makes the glass end.
Present embodiment more specifically is described below, and as mentioned above, though have the also low more advantage of big more its Heating temperature in zone that heating region relates to, the cutting position precision also reduces but then.For preventing the problems referred to above, utilized as Fig. 1 11 shown in temperature distribution, this temperature distribution is the sharp-pointed waveform 7 of overlapping crest on the crest line of the wide waveform of temperature distribution.In this case, sharp-pointed crest line position 7 becomes cutting position and determines the factor.As the integrated value that spreads all over large-scale heating region, promptly heat stress value becomes greatly, and is low irrelevant with the height of crest, not reach cutting threshold also preferably only to set above the mode of this threshold value at sharp-pointed crest location.In the figure, to such an extent as to represented that with 10 thermal stresses causes the interatomic bond separate areas fully greatly.In this zone, use * represented wherein to represent interatomic bond with line segment by the isolating state of interatomic bond between the adjacent atom of zero expression.The cutting of the full cutting mode of 8 expressions, 9 expression be full of cracks front ends.5 is cut direction.In this case, crest is sharp-pointed more can improve the cutting position precision more.
Destroy mechanics according to linear elasticity, according near the characteristic generation cutting of the stress field the be full of cracks front end on the workpiece.Set the heat stress value except that this characteristic, make it littler than adjacent interatomic bond power.Even the thermal stresses that produces under near the characteristic condition the be full of cracks also can allow the value of value of workpiece deformation be used for the combination of initial separation atom with exceeding.The former mainly depends on Workpiece structure, and its value of large-scale workpiece is high more.The latter depends on the workpiece material constant, and is irrelevant with the workpiece shape.Destroy theory of mechanics according to linear elasticity, as the physical quantity K that represents the latter
1(opening mode stress intensity factor) satisfies K
1＞K
1c(K here
1cBeing the destruction toughness value of material, is 0.73MPa/m in common glass
2) time, cutting is carried out with the development of be full of cracks front end.Select in the present invention only in required cutting position, to satisfy K
1＞K
1cTemperature distribution get final product.In this case, design should make this condition realize at low temperatures as far as possible.Linear elasticity is destroyed theory of mechanics calculating K is provided
1Method, it is a known method, omits explanation here.
According to this embodiment, can obtain big regional inhomogeneous heats, promptly reduce Heating temperature, and can avoid the thermal damage of workpiece.And, determine the factor by overlapping cutting position in the heating of big zone, can realize high cutting position precision.Its result can obtain the inherent high quality cutting characteristic that the thermal stresses cutting is had.
As first embodiment, introduce first concrete Heating temperature distribution design example.This example to as if on the central part of the non-alkali glass plate of width 580mm, thickness of slab 0.7mm with the situation of the full cutting mode cutting of linearity.This situation is as full cutting mode, in large-scale workpiece inevitably owing to there is sizable difficulty in dimensional effect.As the mild waveform of Fig. 1, setting has the Gaussian temperature distribution of about 50 ℃ thermal spike at glass width central part as shown in Figure 3.For specific implementation, be to have used the electric power that be arranged in parallel with glass length to be input as the column infrared lamp of 1kW on the position of 200mm at the height on the sheet glass.Figure 3 illustrates the glass surface temperature of electric power input after 3 minutes of measuring when carrying out cutting.Here, the back that lights a lamp waits for that the reason that began to cut again in 3 minutes is that the part of light energy is absorbed by glass surface, and reaching inner by thermal conduction needs the regular hour to reach the required condition of full cutting mode.If make infrared light via the irradiation of the bandpass filter of 3-4 μ m, then irradiates light directly is absorbed after arriving glass inside, reaches this condition and do not need the waiting time when lighting a lamp.
Fig. 4 illustrates at the K of this temperature distribution with the glass width central authorities of finite element method calculating
1The glass length direction of value distributes.Also show K in the figure at non-alkali glass
1cValue.K
1Compare K
1cBig zone then stops full cutting for the zone till from the top portion that cuts open of glass to 310mm if surpass this point.Under the heating of this condition, cut entirely automatically and stop cutting at the 310mm place from the end to 310mm.
If improve Heating temperature, then the forward travel distance of full cutting increases, if reduce Heating temperature, then distance reduces.No matter be what situation, add at as shown in Figure 3 big width and to pine for to obtain high cutting position precision.Advantage under this condition is to make maximum heating temperature be reduced to 50 ℃.
Determine the factor (overlapping heating) for the cutting position that forms among the present invention, used the light beam of the line beam that output obtains laser conversion by the diffraction grating type optical element to produce mechanism.Use above-mentioned light beam to produce mechanism, produced following single laser facula: the absorption laser of glass is output as 100W, and spot diameter is 3mm, and sweep velocity is 300mm/s.At first only pass through the finite element method calculating K at this LASER HEATING
1In the experiment of reality, used the LD laser beam of wavelength as 976nm.Fig. 5 shows the K on the laser beam flying line
1The distribution of value calculation result on the glass length direction.Scanning laser beam position shown in this figure from the glass end begin to arrive respectively 30,100,200,250,300,400, K during the position of 510mm
1Distribute and temperature distribution.Only pining near the local K beyond the glass end by this laser adding of carrying out
1Be lower than K
1c, do not produce cutting.
Purport of the present invention is to make the heating of infrared lamp and laser beam overlapping, and realizes that Heating temperature shown in Figure 1 distributes.Fig. 6 shows K when overlapping
1The distribution of value calculation result on the glass length direction.K under the position same case among laser beam position shown in this figure and Fig. 5
1Distribute and temperature distribution.Here, the K of each point
1Value and temperature become Fig. 4 and value sum shown in Figure 5.For these physical quantitys, superposition theorem is set up.Its result only needs K on the cutting preset lines
1Surpass K
1cGet final product.K shown in Figure 6
1Value compares K near laser beam
1cGreatly, thereby cutting only proceeds to this position, and stops in this position.Stopping cutting is to suppress stress under compression because exist in laser beam position.
Shown in Figure 3 passing through under the situation that infrared lamp heats, at K
1＞K
1cScope in cut with very high speed.This be because the velocity of propagation of thermal stress distribution in the workpiece basically near the velocity of sound.Under this situation, crack on the cut surface.In contrast, shown in Figure 6 makes under infrared lamp and the laser beam heats eclipsed situation, as mentioned above because the cutting be full of cracks can not be crossed laser beam, so cutting speed in feet per minute is identical with laser beam flying speed.This method can be kept high cutting quality, therefore easily.
Shown here is following embodiment: based on 50 ℃ the thermal stresses cutting heating of being up to of column infrared lamp, is that 0.7mm, width are to carry out the cutting of high quality thermal stresses with the speed of 300mm/s on the central part of non-alkali glass plate of 580mm in overlapping scan type laser facula irradiation back in the low-down low-temperature heat at thickness of slab, can obtain all inaccessible effect of any technology in the past, prove high-performance of the present invention.
In second structure example that Heating temperature shown in Figure 7 distributes, the light beam of determining the factor as cutting position produces mechanism, utilization makes the Gaussian laser beam 13 that penetrates from laser oscillator 12 be converted to line beam 15 as the diffraction grating type optical element (DOE) 14 of line beam homogenizer.Fig. 7 illustrates the synoptic diagram that produces the situation of mechanism's output line beam by above-mentioned light beam.15 expressions realize that by the laser beam behind the DOE design feature is a line beam 16 in the predetermined position among the figure.Identical among other structures and first embodiment.As this line beam 16, it is 0.1～1mm, the length line beam about as 25mm that study plot uses width.The uniform strength that is distributed as of length direction distributes in this case, also can be Gaussian distribution but the distribution of width both can be a uniform distribution.And, can carry out adjustment such as incident laser beam diameter, position to intensity distribution and make its variation.
Compare first embodiment, the cutting positional precision further increases under the situation of second embodiment, and required Heating temperature further reduces, and scratch depth further deepens under the situation of surface scratch.These are effects of this structure example.
Fig. 8 illustrates the 3rd structure example of the present invention.Shown in Figure 8 determines that as cutting position the light beam of the factor produces mechanism, utilizes the diffraction grating type optical element (DOE) 14 as the line beam homogenizer, makes the Gaussian laser beam 13 that penetrates from laser oscillator 12 be converted to line beam 15.Under the situation of carrying out, need make as cutting position and determine that the line beam 16 of the factor is consistent with the tangent line of profile as the profile cut of free curve.Therefore needs are rotated control to the direction of line beam 16 all the time.This control can be carried out with the rotation control 17 of DOE14.
In Fig. 8,1 is workpiece, and 6 are the cutting preset lines, and 21 is the point-like laser hot spot, and 22 is the short lines bundle, and 23 are long line beam, and 8 is full cutting mode cutting.19 expression wedge type masks, the travel direction of 20 expression wedge type masks 19.
As the effect of this structure, because the long axis direction of line beam is always consistent with skeletal lines,, increase the thermal stresses that produces so can improve the cutting position precision, its result can improve cutting speed in feet per minute etc.
Fig. 9 illustrates the 4th structure example of the present invention.Under the situation of cutting curve random bend, the direction of only controlling line beam is inadequate, needs to shorten its length or according to circumstances be made as point-like.Such control can be by control DOE rotation the time use wedge type mask 19 to carry out, this wedge type mask 19 rotates simultaneously with DOE and moves forward and backward.Represent that with 20 this seesaws in the drawings, the length that can control line beam 16 by this control becomes required values such as point-like laser hot spot 21, short lines bundle 22, long line beam 23.Especially, shown in the laser facula 21 is a some shaped laser spot, is the crooked corresponding of acute angle with cutting curve.
As the effect of this structure, profilograph also can prevent the reduction of cutting position precision and the reduction of cutting speed in feet per minute with under less curvature bending or the situation with the acute angle bending.
The thermal stresses cutting occurs in and is used for bonded maximum thermal stress position between separated atom, rather than is created on the top temperature position.We can be used as initial conditions and provide temperature distribution, rather than this thermal stress distribution.The latter is the distribution that as a result of occurs according to conditions such as Workpiece structures.Cause-effect relationship is obviously arranged between the two, but in the production of reality, be difficult to hold all the time this relation usually.According to the principle of the invention shown in Figure 1, the actual thermal stresses cutting position that produces is not to be limited to this to determine near the some positions of the factor, because this position not necessarily is exactly to cut the target location, need a kind of position control technology so control for high precision.
Under the situation that the deviation between temperature distribution and this cutting generation position does not have to determine in theory, can be in order to compensate this deviation by originally side-play amount just is set on temperature distribution to realize high off-position precision.Figure 10 illustrates an example calculating this deviation that also proved by experiment based on finite element method.The width of the workpiece shown here is that 500mm, length are that 1000mm, thickness are that 0.7mm and width are that 2000mm, length are that 2000mm, thickness are from the laser beam cutting position of the reality under the scan condition in the longitudinal direction that on the side 20mm position is 1.5mm in 2 kinds of non-alkali glass plates of 0.7mm with diameter.Near cutting beginning and terminal, produced the position deviation that is 0.7mm to the maximum, and it has the repeatability of height.Under the situation of the position deviation that allows 0.7mm, can carry out, but need position control under the unallowed situation according to original method.As long as calculate with finite element method under various conditions and write down this departure, just can set the side-play amount of thermal stress distribution, can realize high cutting position precision.This is the 5th structure example of the present invention.
According to this structure, can realize that heat answers the further high precision int of cutting position.Constant promptly repeatedly in the operation repeatedly under the condition in conditions such as workpiece shape, cutting positions, be about 50 μ m as long as allow positionerror, just can use this method.This device does not need the reverse feedback control part, but the simplification device structure.
Embodiment 6
The reverse feedback control of laser beam position is the 6th structure example of the present invention.Sometimes be difficult to set above-mentioned side-play amount at production plant, so detect actual cutting position with the cut watch-dog, determining to carry out on the corresponding illuminating laser beam of the factor position reverse feedback control with cutting position, or carry out positive regeeration control as required, with the cutting position precision that realizes being scheduled to.This control can be realized by known control techniques.
Embodiment 7
With respect to above cutting position high precision int based on laser beam position control, can also control by the rectilinear beam rotation angle and realize the cutting position high precision int, this is the 7th structure example of the present invention.The principle of this method is as follows: the rotation angle control by rectilinear beam can make K
11(inplane shear type stress intensity factor) becomes zero or very little value, at this moment can utilize the corresponding to fact in maximum temperature position and maximum thermal stress position.Calculate by finite element method that confirmed should the fact.At this moment also control similarly has side-play amount setting and reverse feedback or 2 kinds of methods of positive regeeration control with laser beam position.But because it is very complicated to calculate the method for migration amount, uses in the production plant of reality and have any problem, so the method for reverse feedback or positive regeeration control is more real.This method also can utilize known control techniques to realize.
According to above-mentioned 2 kinds of reverse feedbacks or positive regeeration control, do not need to estimate in advance the departure between temperature distribution and cutting position, can realize the high precision int of cutting position by automated operation, in the production of reality, have immeasurable advantage.
Embodiment 8
As the laser of heating usefulness, can use the laser beam that to be inhaled by glass.Representational laser is that wavelength is the CO of 10.6 μ m
2Laser.This laser obtains high output laser easily as commercial lasers, therefore easily.This laser to be characterized as the uptake factor that is absorbed by glass very big, to such an extent as in the upper layer of the degree of depth 3.7 μ m, be absorbed 99% projectile energy, can not carry out the scale of construction (Bulk) heating to glass.Therefore be applicable to surface scratch, but can not in full cutting mode, use.
It is that the infrared light of the non-alkali glass plate of 0.7mm sees through characteristic (%) that Figure 11 illustrates thickness.As the laser beam that full cutting mode is used, ideal situation is absorbed about 50% by sheet glass, therefore can use the laser beam of wavelength region in 2.75～4.5 mu m ranges of oscillation wavelength.Using minimal wave length under the bigger situation of thickness of slab is that to use long wavelength under the less situation of 2.5 μ m, thickness of slab be that oscillation wavelength in 5 mu m ranges gets final product.Therefore, the laser of using as full cutting mode can use Er:YAG laser (2.94 μ m).
By using wavelength region, can obtain the ideal effect at 3.77～5.05 μ m and wavelength variable mid-infrared laser.This laser is the ZnSe crystal laser of the doping divalent iron ion that excites with disc type laser device, optical fiber laser.Nearly 50% oscillation efficiency nearly can also high outputization.Report has this laser technology in non-patent literature 1.
Now, the thickness of slab of flat panel display glass has the trend that reduces gradually to 0.1mm from current value 0.7mm.The condition that can absorb 99% incident light energy in described thickness of slab is, according to relational expression I/I
0=e
-α x, the value of absorption coefficient is at 65～230cm
-1Scope in.Corresponding with it and by the wavelength region that absorption characteristic determined of non-alkali glass fully in above-mentioned this Wavelength of Laser resonance range.Thereby, even the glass thickness of slab changes, also can make most luminous energy arrive the back side of sheet glass, and can not connect sheet glass by this wavelength resonances, can make scratch depth become value near the glass thickness of slab.Proved the following fact: the intersection processing at the crossing place that forms between full cutting mode is difficult, but residually overleaf can intersect processing when some non-incised layer is arranged.Figure 12 illustrates this situation.Carry out initial laser infiltration based on wavelength resonances on sheet glass 1, generation does not arrive the very dark cut 24,241,242,243 at the back side etc.Then on shorter wavelength direction, carry out wavelength resonances, make laser see through sheet glass fully, with the orthogonal direction of above-mentioned cut on realize full cutting 25,251,252.Because does not also separate at the back side, therefore can proceed full cutting in the point of crossing of two lines.Wherein, in this explanation, omitted the first be full of cracks that is located on the glass plate ends.
After this operation, carry out mechanical cutting along dark score line.Because scratch depth is fully dark, this cut-out is easy to carry out.In this operation, disorderly spatter everywhere in order not make each sheet that is cut entirely, in the operation of necessity, to be fixed on workpiece on the electrostatic attraction board 26.The structure of this adsorption plate is the voltage that applies that can independently control in each position, and removes absorption in the desired position and the required moment.
According to this structure, can realize full cutting at the glass of various thicknesss of slab, can also realize not arriving the very dark cut of full cutting degree.This technology can realize cross cut when reporting to the leadship after accomplishing a task cutting by the thermal stresses cutting, exceedingly useful on practical use.
Embodiment 9
In technology of the present invention, can use the full cutting mode cutting solar battery glass shown in Figure 14 (b), but also can cut, be described below with the surface scratch shown in Figure 14 (a).There is shown in the signal of Figure 13 and to make it become the variation of the possible surface scratch degree of depth in the score line direction.This figure is that thickness of slab is the situation of the alkali glass of 5mm, and this is the thickness of common solar battery glass., laterally be the cut direction vertically corresponding to the glass thickness of slab and the surface scratch degree of depth.As shown in the figure from the cut starting point of glass end in length (the proof experiment the contriver is about 10mm～20mm) scope, scratch depth is about 3～4mm, slowly is reduced to normal scratch depth 200 μ m thereafter as shown in figure 13.Be output as at irradiating laser that laser scanning speed is 30～53mm/s under the situation of 70W, but, produce effect just will drop to the low speed of 20mm/s in order to obtain dark cut in the glass end.
Scratch depth is under the situation of this distribution, is just carrying out mechanical cutting easily on whole thickness of slab behind the localized area on this deep.Even surpassed should the zone scratch depth shallowly,, mechanical cutting be slowly advanced along the cut direction as long as carry out the cut-out of whole thickness to 200 μ m.So, can make along the scratch depth of score line to become thickness shown in Figure 13, and make the slab about 5mm on total length, carry out mechanical cutting.
As the generation method of cut distribution shown in Figure 13, in order to increase the method explanation in front that scratch depth reduces laser beam flying speed.It is darker than the position beyond the end in glass end scratch depth to utilize Fig. 6 to illustrate that thermal stresses produces in the mechanism here.Fig. 6 is illustrated in the stress strength factor K that produces on the sheet glass
1Changing conditions, the direction of this variation is the laser beam flying direction of the glass heats that causes at the laser beam irradiation under certain condition.Laser beam flying is carried out continuously, but the stress intensity factor when showing this light beam simultaneously arriving at 7 in Fig. 6 distributes and the Heating temperature distribution.Only be concerned about the variation that the stress intensity factor of direct relation is arranged with scratch depth here.Stress intensity factor when observing the distance of laser beam position from the end and be 3 positions of 10mm, 30mm, 100mm from Fig. 6 distributes, and can know no matter be the sort of situation, this coefficient is got higher value near the glass end.The increase of this stress distribution has directly related with the increase of scratch depth.Fig. 6 is the data under certain heating condition, and trend shown here is general situation.
Embodiment is described so from now on.The invention belongs to the surface scratch shown in Figure 14 (a).Thereby spotting scaming has based on CO on glass surface
2The heating of laser radiation and after it spotting scaming cooling body based on the cooling fluid spraying is arranged.And, be provided be full of cracks just on the glass end of cut beginning to form.Such know-why and method are known now.
In that the laser section shape is arranged shown in Figure 14 (a) is the situation of roundlet, is under the linearity or the situation that will deepen this degree of depth at cut, with the heat-up time that prolongs glass be that purpose uses section shape to get final product as the laser of line beam.Because the laser that penetrates from laser oscillator normally section shape be the Gaussian beam of circle, so in Fig. 7, Fig. 8, method shown in Figure 9, the conversion section shape has been described.
After such operation, carry out mechanical cutting along score line according to above-mentioned explanation.
More than that explanation is several embodiment that are used to realize function of the present invention, and obvious purport of the present invention can realize with other a variety of methods.
So, if the thermal stresses of glass cutting is imported to the manufacturing processed of flat-panel monitor, solar cell, then its effect is very significant in raising process velocity, processing quality, economic benefits and when overcoming the weakness of prior art.These processing are to carry out with diamond custting machine now, to such an extent as to but presented such as needing to carry out cleaning process or because degradation problem under the existence strength of materials of tiny crack after cullet cuts because of producing.Can solve such problem based on thermal stresses cutting of the present invention.And,, can on the film forming that is provided with on glass substrate, its surface, not cause thermal damage because Heating temperature is fully low.Also because the precision of thermal stresses cutting position is fully high, and the heat-affected zone fully is confined in the cut width range, therefore the technology of the present invention processing that not only can be used for base plate glass can also be used for the processing of battery.
Claims (10)
1. the thermal stresses cutting method of a hard brittle material, static or the mobile uneven temperature that temperature in the big zone on the workpiece is lower than the thermal damage temperature of workpiece distributes and determines that as cutting position the static or mobile temperature distribution of being concentrated in the tiny area of the factor is overlapping, only makes the opening mode stress strength factor K near this tiny area
1Value greater than the destruction toughness value K of material
1cValue, and determine at this cutting position to set side-play amount as required on the temperature distribution of the factor, perhaps carry out reverse feedback control or according to circumstances carry out positive regeeration control, so that cutting position is consistent with the target location, the thermal stresses cutting method of above-mentioned hard brittle material is characterised in that
Determine the factor for forming cutting position, use the line beam that laser conversion is obtained by the diffraction grating type optical element.
2. the thermal stresses cutting method of hard brittle material according to claim 1 is characterized in that,
Direction or length according to the shape control line beam of the cutting profile of cutting position.
3. the thermal stresses cutting method of hard brittle material according to claim 1 is characterized in that,
According to the kind of required cutting such as surface scratch, dark cut, full cutting, use CO
2Laser, Fe
2+: any in ZnSe laser, the Er:YAG laser is as laser.
4. the thermal stresses cutting method of hard brittle material according to claim 1 is characterized in that,
For fixation workpiece, use can be switched the electrostatic attraction board that applies voltage respectively by opsition dependent.
5. the thermal stresses cutting method of hard brittle material according to claim 1 is characterized in that,
Cooling unit is moved with speed after mobile laser beam, near and the translational speed the cut starting point of reduction glass end, thereby the increase scratch depth becomes easily the mechanical cutting of this regional postorder operation, and this cut-out of beginning is advanced to other shallow zones of scratch depth.
6. the thermal stresses cutting unit of a hard brittle material, static or the mobile uneven temperature that temperature in the big zone on the workpiece is lower than the thermal damage temperature of workpiece distributes and determines that as cutting position the static or mobile temperature distribution of being concentrated in the tiny area of the factor is overlapping, only makes the opening mode stress strength factor K near this tiny area
1Value greater than the destruction toughness value K of material
1cValue, and determine at this cutting position to set side-play amount as required on the temperature distribution of the factor, perhaps carry out reverse feedback control or according to circumstances carry out positive regeeration control, so that cutting position is consistent with the target location, the thermal stresses cutting unit of above-mentioned hard brittle material is characterised in that
Determine the factor for forming cutting position, have light beam and produce mechanism, the line beam that output obtains laser conversion by the diffraction grating type optical element.
7. the thermal stresses cutting unit of hard brittle material according to claim 6 is characterized in that,
Above-mentioned light beam produces direction or the length of mechanism according to the shape control line beam of the cutting profile of cutting position.
8. the thermal stresses cutting unit of hard brittle material according to claim 6 is characterized in that,
Above-mentioned light beam produces the kind of mechanism according to required cutting such as surface scratch, dark cut, full cutting, uses CO
2Laser, Fe
2+: any in ZnSe laser, the Er:YAG laser is as laser.
9. the thermal stresses cutting unit of hard brittle material according to claim 6 is characterized in that,
For fixation workpiece, above-mentioned light beam produces mechanism and uses and can switch the electrostatic attraction board that applies voltage respectively by opsition dependent.
10. the thermal stresses cutting unit of hard brittle material according to claim 6 is characterized in that,
Above-mentioned light beam produces mechanism moves cooling unit with speed after mobile laser beam, near and the translational speed the cut starting point of reduction glass end, thereby increase scratch depth, the mechanical cutting of this regional postorder operation is become easily, and this cut-out of beginning is advanced to other shallow zones of scratch depth.
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|---|---|---|---|
| JP2009-232125 | 2009-10-06 | ||
| JP2009232125A JP2011079690A (en) | 2009-10-06 | 2009-10-06 | Laser thermal stress dividing of thick plate glass using diffraction grating |
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| CN102060437A true CN102060437A (en) | 2011-05-18 |
| CN102060437B CN102060437B (en) | 2013-12-25 |
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