CN102044595A - LED (Light-Emitting Diode) structure - Google Patents
LED (Light-Emitting Diode) structure Download PDFInfo
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- CN102044595A CN102044595A CN2009101783008A CN200910178300A CN102044595A CN 102044595 A CN102044595 A CN 102044595A CN 2009101783008 A CN2009101783008 A CN 2009101783008A CN 200910178300 A CN200910178300 A CN 200910178300A CN 102044595 A CN102044595 A CN 102044595A
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- emitting diode
- light
- light emitting
- printing opacity
- pedestal
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Abstract
The invention relates to a LED (Light-Emitting Diode) structure comprising a base with a dent part. An LED chip is arranged at the dent part of the base and used for generating rays, a transmitting block is arranged on the base to cover the dent part and the LED chip so that rays are emitted out from the transmitting block, the transmitting block is flat-topping polylateral conical and comprises a bottom, a top and a plurality of sides which are connected between the bottom and the top, and a groove with a bottom is formed on the top of the transmitting block. The LED structure provided by the invention can greatly improve the brightness of emergent light and improve the brightness of lateral light except for positive light.
Description
Technical field
The present invention relates to a kind of light emitting diode construction, the brightness of its emergent light significantly promotes, and except forward light, lateral light is also taken into account in the lump.
Background technology
(its producible brightness is also more and more high for Light-Emitting Diode, LED) development of technology, and has life-span length, power saving, safety and react advantage such as fast, and applicable field is quite extensive along with light-emitting diode.
In known surface adhesion type light-emitting diode structure, light-emitting diode chip for backlight unit is arranged in the pedestal, and pedestal only stays the light ejaculation of a bright dipping opening for light-emitting diode chip for backlight unit.When light-emitting diode chip for backlight unit is luminous, have part light incident pedestal sidewall thereby be absorbed or produce the phenomenon of reflection and scattering, make the brightness of emergent light reduce many.
Summary of the invention
In view of this, the invention provides a kind of light emitting diode construction, the brightness of its emergent light significantly promotes, and except forward light, therefore lateral light is also taken into account in the lump, and no matter light emitting diode construction of the present invention is to be used in to make scape or use as backlight, all is well suited for.
Light emitting diode construction of the present invention comprises a pedestal, a light-emitting diode chip for backlight unit and a printing opacity piece.Pedestal has a depressed part, and light-emitting diode chip for backlight unit is arranged in the depressed part of pedestal and is used to produce a light.The printing opacity piece is arranged on the pedestal and covers depressed part and light-emitting diode chip for backlight unit, and light is penetrated via the printing opacity piece.The printing opacity piece is the polygon pyramid of flat-top, and it comprises a bottom surface, an end face and a plurality of side, and a plurality of sides are connected between bottom surface and the end face.
Wherein, the bottom surface of printing opacity piece and wherein the angle between the side be an acute angle or be an obtuse angle.
Wherein, the printing opacity piece is flat-top quadrangular pyramid body.
Wherein, the section of printing opacity piece is one trapezoidal or one trapezoidal.
Wherein, has a reflection lid in the depressed part of pedestal.
Light emitting diode construction of the present invention also comprises a metal level, is arranged on the inner surface of depressed part and forms the reflection lid.
Wherein, the material of pedestal is the material of tool thermal conductivity.
Wherein, the material of pedestal is for containing silicon substrate or ceramic substrate.
Light emitting diode construction of the present invention comprises a pedestal, a light-emitting diode chip for backlight unit and a printing opacity piece.Pedestal has a depressed part, and light-emitting diode chip for backlight unit is arranged in the depressed part of pedestal, is used to produce a light.The printing opacity piece is arranged on the pedestal and covers depressed part and light-emitting diode chip for backlight unit, and light is penetrated via the printing opacity piece.The printing opacity piece is the polygon pyramid of flat-top, and it comprises a bottom surface, an end face and a plurality of side, and a plurality of sides are connected between bottom surface and the end face, is formed with a groove with a bottom on the end face of printing opacity piece.
Wherein, the bottom surface of printing opacity piece and wherein the angle between the side be an acute angle or be an obtuse angle.
Wherein, the printing opacity piece is flat-top quadrangular pyramid body.
Wherein, the opening of groove is shaped as circle, rectangle, ellipse or polygonal.
Wherein, the shape of the bottom of groove is identical with the shape of the opening of groove.
Wherein, angle is a right angle or an obtuse angle between the bottom of groove and the sidewall.
Wherein, has a reflection lid in the depressed part of pedestal.
Light emitting diode construction of the present invention also comprises a metal level, is arranged on the bottom of depressed part and the sidewall and forms the reflection lid.
Wherein, the material of pedestal is the material of tool thermal conductivity.
Wherein, the material of pedestal is for containing silicon substrate or ceramic substrate.
Light emitting diode construction provided by the invention can significantly promote the brightness of emergent light, and except forward light, also improves the brightness of lateral light in the lump.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly also cooperates appended accompanying drawing to elaborate.
Description of drawings
Fig. 1 is according to the schematic diagram of first embodiment of light emitting diode construction of the present invention.
Fig. 2 is according to the profile of the printing opacity piece of first embodiment of light emitting diode construction of the present invention.
Fig. 3 is according to the stereogram of the printing opacity piece of first embodiment of light emitting diode construction of the present invention.
Fig. 4 is according to the schematic diagram of second embodiment of light emitting diode construction of the present invention.
Fig. 5 is according to the profile of the printing opacity piece of second embodiment of light emitting diode construction of the present invention.
Fig. 6 is according to the stereogram of the printing opacity piece of second embodiment of light emitting diode construction of the present invention.
Fig. 7 to Fig. 9 shows the manufacturing process of light emitting diode construction of the present invention.
Figure 10 shows that the present invention's angle of putting of light emitting diode construction when computer simulation is 0 °.
Figure 11 shows that the present invention's angle of putting of light emitting diode construction when computer simulation is 90 °.
Figure 12 shows that the analog result of the light emitting diode construction that does not have the printing opacity piece.
Figure 13 shows that the analog result of the light emitting diode construction (being provided with the printing opacity piece) of the first embodiment of the present invention.
Figure 14 shows that the analog result of the light emitting diode construction (being provided with the printing opacity piece) of the second embodiment of the present invention.
Wherein, description of reference numerals is as follows:
1～light emitting diode construction
10～conducting bracket
11～printing opacity piece
The bottom surface of 111～printing opacity piece
The end face of 112～printing opacity piece
The side of 113～printing opacity piece
115～groove
The bottom of 115 '～groove
115 "～sidewall of groove
12～pedestal
13～light-emitting diode chip for backlight unit
The sidewall of 14～depressed part
The depressed part of 16～pedestal
Second embodiment
2～light emitting diode construction
20～conducting bracket
21～printing opacity piece
The bottom surface of 211～printing opacity piece
The end face of 212～printing opacity piece
The side of 213～printing opacity piece
22～pedestal
23～light-emitting diode chip for backlight unit
The sidewall of 24～depressed part
26～depressed part
Embodiment
See also Fig. 1, Fig. 1 is according to the schematic diagram of first embodiment of light emitting diode construction of the present invention.As shown in the figure, light emitting diode construction 1 comprises a conducting bracket 10, a printing opacity piece 11, a pedestal 12 and a light-emitting diode chip for backlight unit 13, wherein, conducting bracket 10 is arranged in the pedestal 12, pedestal 12 is provided with the conducting bracket 10 of a depressed part 16 and expose portion, light-emitting diode chip for backlight unit 13 be arranged on the conducting bracket 10 among the depressed part 16 and with its electric connection.Comprise a reflection lid (figure does not show) with metal level of reflective can be set on the inner surface of sidewall 14 in the depressed part 16 of pedestal 12, the reflection lid is to be used for upwards reflecting the light that light-emitting diode chip for backlight unit 13 is produced.In addition, the material of pedestal 12 can be the material of tool thermal conductivity, as contains silicon substrate or ceramic substrate etc.
Suppose that angle is θ between the bottom surface 111 of printing opacity piece 11 and the side 113
1, so in first embodiment, when the section of printing opacity piece 11 is trapezoidal approximately, θ
1Be an acute angle, yet can recognize, when the section of printing opacity piece 11 is down trapezoidal approximately, θ
1It can be an obtuse angle.
In addition, suppose the bottom 115 ' and the sidewall 115 of groove 115 " between angle be θ
2, generally speaking, 90 °≤θ
2＜180 ° all applicable.
See also Fig. 4, Fig. 4 is according to the schematic diagram of second embodiment of light emitting diode construction of the present invention.As shown in the figure, light emitting diode construction 2 comprises a conducting bracket 20, a printing opacity piece 21, a pedestal 22 and a light-emitting diode chip for backlight unit 23, wherein, conducting bracket 20 is arranged in the pedestal 22, pedestal 22 is provided with a depressed part 26, and the conducting bracket 20 of expose portion, light-emitting diode chip for backlight unit 23 be arranged on the conducting bracket 20 among the depressed part 26 and with its electric connection.Similarly, comprise in the depressed part 26 of pedestal 22 a reflection lid (figure does not show) with metal level of reflective can be set on the inner surface of sidewall 24 that the reflection lid is to be used for upwards reflecting the light that light-emitting diode chip for backlight unit 23 is produced.In addition, the material of pedestal 22 can be the material of tool thermal conductivity, as contains silicon substrate or ceramic substrate etc.
First embodiment and the second embodiment main difference be in: the end face 112 of the printing opacity piece 11 of first embodiment is provided with a groove 115, the second embodiment does not then have this groove.
Fig. 7 to Fig. 9 shows the manufacturing process of light emitting diode construction of the present invention, and it is to be that example explains with the light emitting diode construction of first embodiment (fluted on the printing opacity piece).At first as shown in Figure 7, epoxy resin (Epoxy) is injected the mould cup to form the shape of printing opacity piece; Then shown in the 8th figure, the pedestal with baking finishes in the face down mode, combines with the mould cup, pressurizes then to increase both adaptations; At last as shown in Figure 9, after the baking, light emitting diode construction is broken away from from the mould cup, promptly finish entire making process.
Utilize computer simulation, can understand light emitting diode construction and be provided with the printing opacity piece and do not have difference between the printing opacity piece.In computer simulation, the angle of putting of light emitting diode construction has 0 ° (Figure 10) and 90 ° (Figure 11) two kinds of situations.Figure 12 shows that the analog result that does not have the printing opacity piece, and Figure 13 shows that the analog result of the first embodiment of the present invention (being provided with the printing opacity piece) and wherein aforesaid θ
1=68 °, θ
2=120 °, Figure 14 shows that the analog result of the second embodiment of the present invention (being provided with the printing opacity piece) and wherein aforesaid θ
1=68 °.
Relatively Figure 12 and Figure 13 can find, if add the trapezoidal printing opacity piece of first embodiment in light emitting diode construction after, then brightness promotes approximately 45% under same angle, and the light type is comparatively concentrated slyness.
Can find do not have the high-high brightness of groove (second embodiment) slightly better than the high-high brightness of fluted (first embodiment) by Figure 14.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; have in any its affiliated technical field and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can changing arbitrarily and retouching, so protection scope of the present invention is as the criterion when looking appended the determined scope of claim.
Claims (18)
1. light emitting diode construction comprises:
One pedestal has a depressed part;
One light-emitting diode chip for backlight unit is arranged in the depressed part of this pedestal, is used to produce a light; And
One printing opacity piece, be arranged on this pedestal and cover this depressed part and this light-emitting diode chip for backlight unit, this light is penetrated via this printing opacity piece, wherein, this printing opacity piece is the polygon pyramid of flat-top, comprise a bottom surface, an end face and a plurality of side, these sides are connected between this bottom surface and this end face.
2. light emitting diode construction as claimed in claim 1, wherein the bottom surface of this printing opacity piece and wherein the angle between the side be an acute angle or be an obtuse angle.
3. light emitting diode construction as claimed in claim 2, wherein this printing opacity piece is flat-top quadrangular pyramid body.
4. light emitting diode construction as claimed in claim 3, wherein the section of this printing opacity piece is one trapezoidal or one trapezoidal.
5. light emitting diode construction as claimed in claim 1 wherein has a reflection lid in the depressed part of this pedestal.
6. light emitting diode construction as claimed in claim 5, it also comprises a metal level, is arranged on the inner surface of this depressed part and forms this reflection lid.
7. light emitting diode construction as claimed in claim 1, wherein the material of this pedestal is the material of tool thermal conductivity.
8. light emitting diode construction as claimed in claim 7, wherein the material of this pedestal is for containing silicon substrate or ceramic substrate.
9. light emitting diode construction comprises:
One pedestal has a depressed part;
One light-emitting diode chip for backlight unit is arranged in the depressed part of this pedestal, is used to produce a light; And
One printing opacity piece, be arranged on this pedestal and cover this depressed part and this light-emitting diode chip for backlight unit, this light is penetrated via this printing opacity piece, wherein, this printing opacity piece is the polygon pyramid type of flat-top, comprise a bottom surface, an end face and a plurality of side, these sides are connected between this bottom surface and this end face, are formed with a groove with a bottom on the end face of this printing opacity piece.
10. light emitting diode construction as claimed in claim 9, wherein the bottom surface of this printing opacity piece and wherein the angle between the side be an acute angle or be an obtuse angle.
11. light emitting diode construction as claimed in claim 10, wherein this printing opacity piece is flat-top quadrangular pyramid body.
12. light emitting diode construction as claimed in claim 9, wherein the opening of this groove is shaped as circle, rectangle, ellipse or polygonal.
13. light emitting diode construction as claimed in claim 9, wherein the shape of the bottom of this groove is identical with the shape of the opening of this groove.
14. light emitting diode construction as claimed in claim 9, wherein angle is a right angle or an obtuse angle between the bottom of this groove and the sidewall.
15. light emitting diode construction as claimed in claim 9 wherein has a reflection lid in the depressed part of this pedestal.
16. light emitting diode construction as claimed in claim 15, it also comprises a metal level, is arranged on the inner surface of this depressed part and forms this reflection lid.
17. light emitting diode construction as claimed in claim 9, wherein the material of this pedestal is the material of tool thermal conductivity.
18. light emitting diode construction as claimed in claim 17, wherein the material of this pedestal is for containing silicon substrate or ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101783008A CN102044595A (en) | 2009-10-09 | 2009-10-09 | LED (Light-Emitting Diode) structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101783008A CN102044595A (en) | 2009-10-09 | 2009-10-09 | LED (Light-Emitting Diode) structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102044595A true CN102044595A (en) | 2011-05-04 |
Family
ID=43910576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101783008A Pending CN102044595A (en) | 2009-10-09 | 2009-10-09 | LED (Light-Emitting Diode) structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102044595A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1586017A (en) * | 2001-11-16 | 2005-02-23 | 丰田合成株式会社 | Light-emitting diode, led light, and light apparatus |
| CN1925179A (en) * | 2005-08-31 | 2007-03-07 | 斯坦雷电气株式会社 | Semiconductor light-emitting device |
| CN101523625A (en) * | 2006-10-12 | 2009-09-02 | 松下电器产业株式会社 | Light-emitting device and method for manufacturing the same |
-
2009
- 2009-10-09 CN CN2009101783008A patent/CN102044595A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1586017A (en) * | 2001-11-16 | 2005-02-23 | 丰田合成株式会社 | Light-emitting diode, led light, and light apparatus |
| CN1925179A (en) * | 2005-08-31 | 2007-03-07 | 斯坦雷电气株式会社 | Semiconductor light-emitting device |
| CN101523625A (en) * | 2006-10-12 | 2009-09-02 | 松下电器产业株式会社 | Light-emitting device and method for manufacturing the same |
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| PB01 | Publication | ||
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Application publication date: 20110504 |