CN102043074A - High-frequency probe card - Google Patents
High-frequency probe card Download PDFInfo
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- CN102043074A CN102043074A CN2009102042173A CN200910204217A CN102043074A CN 102043074 A CN102043074 A CN 102043074A CN 2009102042173 A CN2009102042173 A CN 2009102042173A CN 200910204217 A CN200910204217 A CN 200910204217A CN 102043074 A CN102043074 A CN 102043074A
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- flexible printed
- printed wiring
- wiring board
- high frequency
- probe card
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- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a high-frequency probe card, comprising a flexible printed circuit board, a metal frame, a plurality of metal pads and a plurality of probes, wherein the metal frame is used for fixing, supporting and maintaining the expanded shape of the flexible printed circuit board; the metal pad is electrically connected with the flexible printed circuit board and is contacted with a detecting machine in a conducting manner; and the probes are used as electrical connection structures between the flexible printed circuit board and an electronic object to be detected. By utilizing the high-frequency probe card, the transmission of testing signals is achieved.
Description
Technical field
The present invention relates to the probe device that electrical detection is used, more detailed be meant a kind of high frequency probe card.
Background technology
Electronic product must be through the multiple tracks trace routine by guaranteeing to begin after the quality to such an extent that circulate in the market.The energising test of one of test item promptly is for whether the electric connection between each precision electronic element of verifying electronic product is certain, whether function meets the examination specification.When switching on test, be as the test signal transmission interface between machines and the electronics object to be measured with probe.
The base this, known probe, PCB circuit board (claiming " printed circuit board (PCB) " again) is electrically connected the probe of a flexible printed wiring board and a plurality of probes as Japanese publication JP2006-111812, promptly be as shown in Figure 1, this probe 1 comprises a PCB circuit board 2, a flexible printed wiring board 3 and a plurality of probes 4, flexible printed wiring board 3 is locked in PCB circuit board 2 belows by a plurality of bolts 5, and by a plurality of metal pads 6 and conductive hole 2a and electrically conduct with the distribution 2b of PCB circuit board 2.Though aforementioned probe 1 can reach default effect and purpose, only, it possesses the PCB circuit board of expensive and hard attribute, to cause the probe cost to increase, under the situation that the PCB circuit board of especially a plurality of at high level, high-frequency and many transmission paths is widely applied gradually, more will cause the multiplication of whole probe card cost; Secondly, electric connection structure between flexible printed wiring board 3 and the PCB circuit board 2 comprises metal pad 6 and conductive hole 2a, the node a plurality of too much (the upper and lower surface of PCB circuit board 2 all possesses) that this collocation mode is not only constituted because of metal pad 6, more worsen the quality of test signal transmission path, then reduced the ability of transmitted test signal, especially during the test signal of carry high frequency rate, more than 3GHz, the transmission path quality of this probe is strict with especially; Person very, the problem of another deterioration transmission path that use PCB circuit board will cause, be exactly conductive hole 2a be the transmission path of electric property impedance matching not, seriously decay in the time of will making the high-frequency test signal by conductive hole 2a, announcing I248330 number as the TaiWan, China patent of invention is the technology that proposes for head it off.
Moreover the PCB circuit board generally uses macromolecular material to make, and when probe is used in the wafer sort environment of high temperature, will influence the stability of probe because expansivity is big.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of high frequency probe card, can promote electrical transmittability, and the expenditure that can reduce cost.
Secondary objective of the present invention is to provide a kind of high frequency probe card, has the physical strength of a metal framework with the strengthening probe card.
Another object of the present invention is to provide a kind of high frequency probe card, its flexible printed wiring board obtains the excellent support effect, strengthens the stability of probe.
Edge is to reach above-mentioned purpose, high frequency probe card provided by the present invention comprises a flexible printed wiring board, a metal framework, a plurality of metal gasket and many probes, wherein, metal framework is in order to this flexible printed wiring board of fixed support, metal gasket is as the electrically direct syndeton between a flexible printed wiring board and the machines, probe and this flexible printed wiring board electrically connect, and have a needle point touches an electronics object to be measured in order to point tested position.By this, reach the transmission of test signal.
In addition, for keeping the expansion shape of flexible printed wiring board, high frequency probe card provided by the present invention can comprise one with the affixed bracing or strutting arrangement of this metal framework.
High frequency probe card provided by the present invention can be provided with an elasticity adjuster again, puts the tested position of touching electronics object to be measured really in order to the needle point of guaranteeing probe.
High frequency probe card provided by the present invention can be provided with a snubber assembly again, the acting force when absorbing from machines contacting metal pad.
High frequency probe card provided by the present invention can be set up a space convertor between flexible printed wiring board and probe, in order to the dirigibility of probe layout to be provided.
Description of drawings
Fig. 1 is existing probe cut-open view in conjunction with flexible printed wiring board and PCB circuit board;
Fig. 2 is the cut-open view of high frequency probe card first preferred embodiment of the present invention;
Fig. 3 is the flexible printed wiring board synoptic diagram of above-mentioned first preferred embodiment;
Fig. 4 is the cut-open view of high frequency probe card second preferred embodiment of the present invention;
Fig. 5 is the cut-open view of high frequency probe card the 3rd preferred embodiment of the present invention;
Fig. 6 is the cut-open view of high frequency probe card the 4th preferred embodiment of the present invention;
Fig. 7 is the cut-open view of high frequency probe card the 5th preferred embodiment of the present invention;
Fig. 8 is the cut-open view of high frequency probe card the 6th preferred embodiment of the present invention;
Fig. 9 is the cut-open view of high frequency probe card the 7th preferred embodiment of the present invention;
Figure 10 is the cut-open view of high frequency probe card the 8th preferred embodiment of the present invention;
Figure 11 is the cut-open view of high frequency probe card the 9th preferred embodiment of the present invention;
Figure 12 is the cut-open view of high frequency probe card the tenth preferred embodiment of the present invention;
Figure 13 is the cut-open view of high frequency probe card the 11 preferred embodiment of the present invention;
Figure 14 is the cut-open view of high frequency probe card the 12 preferred embodiment of the present invention;
Figure 15 is the cut-open view of high frequency probe card the 13 preferred embodiment of the present invention;
Figure 16 is a cut-open view, illustrates that flexible printed wiring board is suppressed by a force fit plate;
Figure 17 is the synoptic diagram of another flexible printed wiring board;
Figure 18 is a local amplification view, illustrates that it is affixed that flexible printed wiring board passes substrate by bolt;
Figure 19 is a local amplification view, illustrates that the steady stake of flexible printed wiring board utilization plugs and is affixed;
Figure 20 is a local amplification view, the built-in magnetic part of flexible printed wiring board is described and reaches in the magnetic mode to set firmly.
[main element symbol description]
10,20 high frequency probe cards
12 flexible printed wiring boards
12a upper surface 12b lower surface 12c probe region
123 perforation
14 metal gaskets, 16 probes, 161 needle points
18 metal frameworks
183 perforations, 184 screws, 19 bolts
22 space convertor 22a bottom surfaces
24,36,38,42,44,48 high frequency probe cards
26 flexible printed wiring boards
26a upper surface 26b lower surface 26c probe region
28 metal gaskets, 30 probes, 301 needle points
32 metal frameworks
32a bottom surface 32b supporting surface 321 hollow-out parts
321a annular conical surface 321b opening 322 reference columns
34 back-up block 34a overlay face
40 bracing or strutting arrangements
401 rigid body 401a overlay face 402 cushions
41 bolts
46 bracing or strutting arrangements
461 connecting supports, 462 ring frames, 463 elasticity adjusters
464 rigid bodies, 465 cushions, 466 screws
467 screws
50,54,58,60,64 high frequency probe cards
52 snubber assemblys
521 cushion pads, 522 backboards
56 snubber assemblys
62 cushion pads
66 back-up blocks
661 open-works, 662 recesses
68 electronic components, 70 modular electronic elements
72 high frequency probe cards
74 force fit plates, 741 open-works
76 flexible printed wiring boards
762a exposed area 762b screw
77 bolts, 78 metal frameworks
80 flexible printed wiring boards
The 803 steady stakes of 801 fan-shaped conducting strip 802 substrates
81 metal frameworks
82 flexible printed wiring boards
83 magnetic parts
84 metal frameworks
100 machines, 101 power spring pins
200 electronics objects to be measured, 201 tested positions
Embodiment
For being illustrated more clearly in the present invention, lift a plurality of preferred embodiments now and cooperate diagram to describe in detail as after.
Fig. 2, Figure 3 shows that first preferred embodiment of high frequency probe card of the present invention, this high frequency probe card 10 comprise a flexible printed wiring board 12, a plurality of metal gasket 14, many probes 16, a metal framework 18 and a plurality of bolts 19, wherein:
Flexible printed wiring board 12 is to be spaced rounded by a plurality of fan-shaped conducting strips 121 in the present embodiment, and constitute an interstitial area 12e between the adjacent fan-shaped conducting strip 121, aforementioned a plurality of fan-shaped conducting strip 121 can be one of the forming or for combining individually, these flexible printed wiring board 12 definition have relative a upper surface 12a and a lower surface 12b, and from interior, external zones is told a probe region 12c and a contact region 12d, other has a bar lead 122 to be laid in each fan-shaped conducting strip 121, and lead 122 two ends lay respectively in probe region 12c and the contact region 12d scope, and 123 of a plurality of perforation are divided into each fan-shaped conducting strip 121.
Those metal gaskets 14 are arranged at the upper surface 12a of flexible printed wiring board 12, and are positioned at this contact region 12d scope, and each metal gasket 14 electrically connects with the lead 122 of flexible printed wiring board 12 respectively.
Those probes 16 directly are arranged at the lower surface 12b of flexible printed wiring board 12 in the present embodiment, and are positioned at this probe region 12c scope, and the lead 122 of each probe 16 1 end and flexible printed wiring board 12 electrically connects, and the other end then forms a needle point 161.
This metal framework 18 is that a body 181 and with tapering follows the disc that ring frame 182 that radial outward extends constitutes from body 181 apical margins, other has a plurality of perforations 183 to penetrate top, the bottom surface of ring frame 182, and a plurality of screws 184 be located at the ring frame 182 on, the bottom surface of metal framework 18 then constitutes a supporting surface 18a.
The screw 184 of metal framework 18 is locked in the perforation 123 that those bolts 19 pass flexible printed wiring board 12 again, after screwing bolt 19, to make flexible printed wiring board 12 be fixedly arranged on metal framework 18, and the upper surface 12a of flexible printed wiring board 12 and the supporting surface 18a of metal framework 18 are closely connected and keep the expansion shape of flexible printed wiring board 12, at this moment, each metal gasket 14 correspondence on the flexible printed wiring board 12 are placed in the perforation 183 of metal framework 18.
The above is the structure explanation of the present invention's first preferred embodiment high frequency probe card 10, when it is applied to the electronic product detection, those metal gaskets 14 of being located at flexible printed wiring board 12 upper surface 12a just by a plurality of power spring pins (pogo pin) 101 of a machines 100 the correspondence contact, be located at the tested position 201 that 161 points of needle point of those probes 16 of flexible printed wiring board 12 lower surface 12b touch an electronics object 200 to be measured, by this, be convenient to machines 100, form a conductive path between high frequency probe card 10 and the electronics object 200 to be measured, this high frequency probe card 10 and effectively the test signal of machines 100 is transferred to electronics object 200 to be measured to carry out electrical detection.
Concluding the benefit that above-mentioned high frequency probe card 10 structures bring has:
1. the test signal transmission path between machines 100 and the electronics object 200 to be measured, be to electrically connect and constitute by the lead 122 of metal gasket 14, flexible printed wiring board 12 and probe 16, aforementioned collocation mode makes the electrical transmittability of high frequency probe card 10 obtain to promote because of reducing the quantity that is provided with of conductive bond pads.
2. the high frequency probe card 10 main modes that combine with flexible printed wiring board 12 with lower-cost metal framework 18 replace the higher PCB circuit board of cost, so the expenditure that can reduce cost.
3. high frequency probe card 10 is to use as strengthening integrally-built physical strength with the metal framework 18 that possesses good rigidity, makes high frequency probe card 10 not damage because of testing repeatedly to use.
4. hold, (Coefficient of Thermal Expansion CTE) makes the probe of circuit board far below existing skill with organic material to the thermal expansivity of metal framework 18, and therefore, high frequency probe card of the present invention more helps hot environment to be used.
5. flexible printed wiring board 12 obtains the excellent support effect of metal frameworks 18 supporting surface 18a, not cracky and be convenient to assembling.
Put off until some time later other embodiment of bright high frequency probe card of the present invention in the back, wherein:
Figure 4 shows that the high frequency probe card 20 of the present invention's second preferred embodiment, it has high frequency probe card 10 same structures with above-mentioned first preferred embodiment, difference is in: high frequency probe card 20 and more comprises a space convertor (space transformer) 22 that electrically connects with flexible printed wiring board 12, this space convertor 22 is positioned at the outside of probe region 12c, probe 16 then is to change the bottom surface 22a that is located at space convertor 22, because of space convertor 22 has the function of the electrical transmission path of conversion, make the layout type of probe 16 have more dirigibility.
Figure 5 shows that the high frequency probe card 24 of the present invention's the 3rd preferred embodiment, it includes flexible printed wiring board 26, metal gasket 28, probe 30 and metal framework 32, and one by back-up block 34 and and bracing or strutting arrangement that constitute affixed with metal framework 32, wherein:
Flexible printed wiring board 26 has relative a upper surface 26a and a lower surface 26b, and definition has a probe region 26c, an extension area 26d and a contact region 26e; Metal gasket 28 is electrically connected at this upper surface 26a and is positioned at contact region 26e scope; Probe 30 is electrically connected at this lower surface 26b and is positioned at probe region 26c scope; And this metal framework 32 has a hollow-out parts 321, and hollow-out parts 321 has an annular conical surface 321a and forms an opening 321b in the bottom surface of metal framework 32 32a, and the end face of metal framework 32 (comprising this annular conical surface 321a) then constitutes a supporting surface 32b.
Affixed at flexible printed wiring board 26 and metal framework 32, and the face that the overlays 34a of back-up block 34 compresses under the situation of upper surface 26a of probe region 26c of flexible printed wiring board 26, as shown in Figure 5, the lower surface 26b of flexible printed wiring board 26 pastes the supporting surface 32b that supports metal framework 32, the opening 321b of the corresponding hollow-out parts 321 of the probe region 26c of flexible printed wiring board 26, and the needle point 301 of probe 30 is exposed to this opening 321b outside.Aforementioned high frequency probe card 24 possesses the effect identical with previous embodiment, repeats no more in this.
Shown in Figure 6 then for the high frequency probe card 36 of the present invention's the 4th preferred embodiment, it has all members of the high frequency probe card 24 of identical the 3rd preferred embodiment, different is, the high frequency probe card 36 of present embodiment has more this space convertor 22, and probe 30 is to change the bottom surface 22a that is located at space convertor 22.
Figure 7 shows that the high frequency probe card 38 of the present invention's the 5th preferred embodiment, it has the member and the configurations such as flexible printed wiring board 26, metal gasket 28, probe 30 and metal framework 32 of identical above-mentioned the 3rd preferred embodiment, and different is:
The bracing or strutting arrangement 40 of high frequency probe card 38 is to lock metal framework 32 again by the interstitial area 12e that bolt 41 passes flexible printed wiring board 26 to obtain fixing, this bracing or strutting arrangement 40 comprises a rigid body 401 and a cushion 402, wherein, the external form of rigid body 401 cooperates and tapered body with the hollow-out parts 321 of metal framework 32, rigid body 401 bottom surfaces constitute one and overlay the upper surface 26a that face 401a can press flexible printed wiring board 26 probe region 26c, and this cushion 402 is arranged between the extension area 26d of rigid body 401 and flexible printed wiring board 26, avoids the flexible printed wiring board 26 at this place frayed.
Figure 8 shows that the high frequency probe card 42 of the present invention's the 6th preferred embodiment, it comprises all members of the high frequency probe card 38 of above-mentioned the 5th preferred embodiment, different is that this high frequency probe card 42 has more this space convertor 22, and probe 30 changes the bottom surface 22a that is located at space convertor 22.
Figure 9 shows that the high frequency probe card 44 of the present invention's the 7th preferred embodiment, it has the member and the configurations such as flexible printed wiring board 26, metal gasket 28, probe 30 and metal framework 32 of identical above-mentioned the 3rd preferred embodiment, and different is:
The same interstitial area 12e that passes flexible printed wiring board 26 by bolt (scheming not show) of the bracing or strutting arrangement 46 of high frequency probe card 44 locks metal framework 32 and affixed with metal framework 32 again, this bracing or strutting arrangement 46 comprises a connecting support 461, one ring frame 462, one elasticity adjuster 463, one rigid body 464 and a cushion 465, wherein, connecting support 461 belows are connected with this ring frame 462, elasticity adjuster 463 and rigid body 464, this elasticity adjuster 463 has sufficient elasticity and can provide on rigid body 464 appropriateness, following mobile nargin, this function can satisfy the demand of different test environments to probe, the tested position 201 of touching electronics object 200 to be measured by needle point 301 certain places of guaranteeing those probes 30, reach good electrically contact effect, aforementioned elasticity adjuster 463 can be selected the spring of a suitable elasticity coefficient, or a plurality of small springs side by side, or in modes such as elastic caoutchoucs and constitute, certainly, more can further carry out precession or revolve the position of moving back with fine setting rigid body 464 to screw 466 or screw 467; Between ring frame 462 and flexible printed wiring board 26, then be provided with this cushion 465.
Figure 10 shows that the high frequency probe card 48 of the present invention's the 8th preferred embodiment, it comprises all members of the high frequency probe card 44 of above-mentioned the 7th preferred embodiment, different is that this high frequency probe card 48 has more this space convertor 22, and probe 30 changes the bottom surface 22a that is located at space convertor 22.
The various embodiments described above are illustrating of high frequency probe card of the present invention only, but not as limit.But it is as follows for the derived structure variation of architecture to state each embodiment now again more than the explanation:
Figure 11 shows that the high frequency probe card 50 of the present invention's the 9th preferred embodiment, its high frequency probe card 10 with above-mentioned first preferred embodiment is that foundation structure has additional a snubber assembly 52, this snubber assembly 52 comprises a cushion pad 521 and a hard backboard 522, cushion pad 521 is located between the contact region 12d and backboard 522 of flexible printed wiring board 12, when the power spring pin 101 contacting metal pads 14 of machines 100, cushion pad 521 absorbs the acting force that presses from power spring pin 101, in view of the above to guarantee that power spring pin 101 and metal gasket 14 keep good the contact and conductive effect.Similarly, snubber assembly 52 also is applicable to high frequency probe card shown in Figure 4 20.
Figure 12 shows that the high frequency probe card 54 of the present invention's the tenth preferred embodiment, its high frequency probe card 24 with above-mentioned the 3rd preferred embodiment is that foundation structure has additional a snubber assembly 56 again, this snubber assembly 56 is that a whole face is arranged at the contact region 26e of this flexible printed wiring board 26 and the cushion pad between the metal framework 32 supporting surface 32b, in order to absorb the acting force that presses, guarantee that according to this power spring pin 101 and metal gasket 28 keep good the contact and conductive effect from the power spring pin 101 of machines 100; For strengthening the slip of prevention flexible printed wiring board 26, the present embodiment structure more can be set up many reference columns 322, those reference columns 322 can be laid in the face that the overlays 34a of the supporting surface 32b of metal framework 32 or back-up block 34 or in this two place laying be arranged all, be provided with pilot hole 26f in flexible printed wiring board 26 again and wear, suppress the purpose that flexible printed wiring board 26 slides to reach for reference column 322 correspondences.Similarly, snubber assembly 56 also is applicable to Fig. 6 to high frequency probe card 36,38,42,44 and 48 shown in Figure 10, and reference column 322 and cooperating of pilot hole 26f be employed for selection.
Figure 13 shows that the high frequency probe card 58 of the present invention's the 11 preferred embodiment, be that high frequency probe card 24 with the 3rd preferred embodiment is a foundation structure equally, different is: the metal framework 32 of present embodiment high frequency probe card 58 has a plurality of grooves 322, those grooves 322 are from this supporting surface 32b depression and correspondence this metal gasket 28 and being provided with respectively, groove 322 provides flexible printed wiring board 26 suitable deformation space, micro-deformation when pressing metal gasket 28 by the power spring pin 101 in response to machines 100 guarantees that according to this power spring pin 101 and metal gasket 28 keep good the contact and conductive effect.Similarly, aforementioned grooves 322 structures must be extremely high frequency probe card 36,38,42,44 and 48 application shown in Figure 10 of Fig. 6.
Figure 14 shows that the high frequency probe card 60 of the present invention's the 12 preferred embodiment, in each groove 322 structure of the high frequency probe card 58 of the 11 preferred embodiment shown in Figure 13, distinctly insert a cushion pad 62, pressed the effect of acting force in order to the power spring pin 101 that improves absorption detecting machine 100.Similarly, the technical characterictic that cooperates with cushion pad 62 of aforementioned grooves 322 also must be that Fig. 6 is to high frequency probe card 36,38,42,44 and 48 application shown in Figure 10.
Figure 15 shows that the high frequency probe card 64 of the present invention's the 13 preferred embodiment, its high frequency probe card 24 with the 3rd preferred embodiment is a foundation structure, difference be in: the back-up block 66 of present embodiment high frequency probe card 64 has at least one space, and the upper surface 26a of this flexible printed wiring board 26 also is electrically connected with one or more electronic component that can carry out difference in functionality 68 or modular electronic element 70 or is provided with simultaneously, aforesaid space comprises the open-work 661 and recess 662 that runs through in present embodiment, corresponding electronic component 68 such as its grade and modular electronic element 70, purpose is to avoid damaging electronic component.Similarly, aforementioned feature of setting up the space also must be applied to the rigid body 464 of rigid body 401, Fig. 9 and Figure 10 of back-up block 34, Fig. 7 and Fig. 8 of Fig. 6.
The reinforcement of below putting off until some time later the flexible printed wiring board of bright high frequency probe card of the present invention sets firmly mode, wherein:
High frequency probe card 72 shown in Figure 16 is a basic framework with the high frequency probe card 24 of the 3rd preferred embodiment, the high frequency probe card 72 of present embodiment includes a force fit plate 74, the contact region 26e of these force fit plate 74 these flexible printed wiring boards 26 of close pressure, and force fit plate 74 has a plurality of open-works 741 for respectively this metal gasket 28 is wherein ccontaining so that the contact conduction.
Figure 17, flexible printed wiring board 76 shown in Figure 180 are composite structure, it comprises a plurality of fan-shaped conducting strips 761 and a hard substrate 762 for those fan-shaped conducting strips 761 coatings, this substrate 762 is distributed in the contact region 76a of this flexible printed wiring board 76 in the form of a ring and mainly, substrate 762 has a plurality of local exposed area 762a, and each exposed area 762a is provided with screw 762b and wears and lock metal framework 78 and be affixed for bolt 77.
Flexible printed wiring board 80 shown in Figure 19 has similar above-mentioned fan-shaped conducting strip 801 and hard substrate 802 structures, different is also to include many steady stakes 803, those steady stakes 803 intert these hard substrates 802 and metal framework 81 with fixing flexible printed wiring board 80, or, steady stake 803 directly is arranged on the hard substrate 802, steady stake 803 1 ends also insert metal framework 81 with fixing flexible printed wiring board 80, can prevent that so flexible printed wiring board 80 from being torn by side direction.
Flexible printed wiring board 82 shown in Figure 20 also is a composite structure, it is under the situation of (figure does not show) of interfere with guidewire not, built-in at least one magnetic part 83, this magnetic part 82 is in order to be adsorbed in metal framework 84, reach the fixedly purpose of flexible printed wiring board 82 of cramping, and replace the common mechanical consolidation style.
The above only is a plurality of preferable possible embodiments of the present invention, uses equivalent structure and method for making variation that instructions of the present invention and claim are done such as, ought to be included in the claim of the present invention.
Claims (23)
1. a high frequency probe card gives an electronics object to be measured to carry out electrical detection in order to the test signal of a machines is transmitted, and it is characterized in that including:
One flexible printed wiring board;
One framework in order to this flexible printed wiring board of fixed support, and is kept the expansion shape of flexible printed wiring board;
A plurality of metal gaskets are as the electric connection structure between this flexible printed wiring board and this machines; And
Many probes electrically connect with this flexible printed wiring board, and have a needle point touches this electronics object to be measured in order to point tested position.
2. high frequency probe card as claimed in claim 1, it is characterized in that, this flexible printed wiring board definition has relative a upper surface and a lower surface, and differentiation has a contact region and a probe region, described metal gasket is arranged at the upper surface of this flexible printed wiring board, and is positioned at this contact region scope.
3. high frequency probe card as claimed in claim 2 is characterized in that this framework has a supporting surface, and the lower surface of this flexible printed wiring board and this supporting surface paste and support.
4. high frequency probe card as claimed in claim 3, it is characterized in that, this framework has a hollow-out parts, this hollow-out parts forms an opening in the bottom surface of framework, the probe region of this flexible printed wiring board is to opening that should hollow-out parts, described probe is arranged at the lower surface of this flexible printed wiring board, and is positioned at this probe region scope, and its needle point such as grade also is exposed to this hollow-out parts open outer side.
5. high frequency probe card as claimed in claim 4 is characterized in that, comprise one with the affixed bracing or strutting arrangement of this framework, this bracing or strutting arrangement is positioned at the hollow-out parts opening of this framework in order to the probe region of keeping this flexible printed wiring board.
6. high frequency probe card as claimed in claim 5, it is characterized in that, this bracing or strutting arrangement comprises a rigid body and a cushion, and this rigid body has one and overlays face and contact with the upper surface of the probe region of this flexible printed wiring board, and this cushion is between this rigid body and this flexible printed wiring board.
7. high frequency probe card as claimed in claim 6 is characterized in that, this bracing or strutting arrangement also comprises an elasticity adjuster, in order to the removable adjustment nargin of this rigid body to be provided, puts the tested position of touching this electronics object to be measured really with the needle point of guaranteeing those probes.
8. high frequency probe card as claimed in claim 2 is characterized in that this framework also comprises a snubber assembly, the acting force when absorbing from machines contacting metal pad.
9. high frequency probe card as claimed in claim 8 is characterized in that, this framework has the upper surface subsides of a supporting surface and this flexible printed wiring board to be supported, and this snubber assembly comprises a cushion pad and a backboard, and this cushion pad is located between flexible printed wiring board and the backboard.
10. high frequency probe card as claimed in claim 8, it is characterized in that, this framework has the lower surface subsides of a supporting surface and this flexible printed wiring board to be supported, and this snubber assembly is between the supporting surface of at least one cushion pad and the contact region that is arranged at this flexible printed wiring board and this framework.
11. high frequency probe card as claimed in claim 3 is characterized in that, this framework has a plurality of grooves from this supporting surface depression, and described groove top is corresponding, and respectively this is positioned at the metal gasket of the contact region of flexible printed wiring board.
12. high frequency probe card as claimed in claim 11 is characterized in that, is respectively equipped with a cushion pad in each groove.
13. high frequency probe card as claimed in claim 5 is characterized in that, this bracing or strutting arrangement has at least one space, and the electronic component that is connected in this flexible printed wiring board upper surface in order to power supply property is wherein ccontaining.
14. high frequency probe card as claimed in claim 2 is characterized in that, the upper surface that this metal framework has a supporting surface and this flexible printed wiring board pastes and to support, and metal framework has a plurality of perforations that penetrate, and described perforation is for respectively this metal gasket is wherein ccontaining.
15. high frequency probe card as claimed in claim 2 is characterized in that, also comprises a space convertor, electrically connects with this flexible printed wiring board and is positioned at this probe region outside, described probe is arranged at the bottom surface of this space convertor.
16. high frequency probe card as claimed in claim 1 is characterized in that, also comprises a force fit plate, in order to this flexible printed wiring board is fixed in this framework.
17. high frequency probe card as claimed in claim 1, it is characterized in that, this flexible printed wiring board comprises a substrate and a plurality of fan-shaped conducting strip, and described fan-shaped conducting strip compartment of terrain coats this substrate, and this substrate is not coated the position and is fixed in this metal framework by a plurality of fixtures.
18. high frequency probe card as claimed in claim 1 is characterized in that, also comprises many steady stakes, interts this framework to fix this flexible printed wiring board.
19. high frequency probe card as claimed in claim 1 is characterized in that, this framework is that an annular metal material is made.
20. high frequency probe card as claimed in claim 19 is characterized in that, also comprises at least one magnetic part, this magnetic part is in order to be adsorbed in this metal framework.
21. high frequency probe card as claimed in claim 5 is characterized in that, comprises that also many reference columns wear this flexible printed wiring board, breaks away in order to the prevention flexible printed wiring board.
22. high frequency probe card as claimed in claim 21 is characterized in that, described reference column is laid in the supporting surface of metal framework, and this flexible printed wiring board is provided with a plurality of pilot holes and wears for described reference column.
23. high frequency probe card as claimed in claim 21, it is characterized in that this bracing or strutting arrangement is a back-up block, this back-up block has one and overlays face, described reference column is laid in the face that overlays of this back-up block, and this flexible printed wiring board is provided with a plurality of pilot holes and wears for described reference column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102042173A CN102043074A (en) | 2009-10-14 | 2009-10-14 | High-frequency probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102042173A CN102043074A (en) | 2009-10-14 | 2009-10-14 | High-frequency probe card |
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| Publication Number | Publication Date |
|---|---|
| CN102043074A true CN102043074A (en) | 2011-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102042173A Pending CN102043074A (en) | 2009-10-14 | 2009-10-14 | High-frequency probe card |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104714057A (en) * | 2013-12-13 | 2015-06-17 | 旺矽科技股份有限公司 | Test fixture |
| CN105424989A (en) * | 2015-12-10 | 2016-03-23 | 苏州世纪福智能装备股份有限公司 | Overturn pressing detection apparatus |
| CN107314885A (en) * | 2017-06-27 | 2017-11-03 | 太平洋（聊城）光电科技有限公司 | A kind of array type is multiple to receive that light engine is optical coupled and measurement jig |
| WO2018171054A1 (en) * | 2017-03-24 | 2018-09-27 | 华为技术有限公司 | Printed circuit board structure and electronic device |
| CN110716122A (en) * | 2018-07-13 | 2020-01-21 | 中华精测科技股份有限公司 | High-frequency probe card device and signal transmission module thereof |
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| CN114839410A (en) * | 2022-04-06 | 2022-08-02 | 强一半导体（苏州）有限公司 | Film probe card device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104714057A (en) * | 2013-12-13 | 2015-06-17 | 旺矽科技股份有限公司 | Test fixture |
| CN105424989A (en) * | 2015-12-10 | 2016-03-23 | 苏州世纪福智能装备股份有限公司 | Overturn pressing detection apparatus |
| WO2018171054A1 (en) * | 2017-03-24 | 2018-09-27 | 华为技术有限公司 | Printed circuit board structure and electronic device |
| CN107314885A (en) * | 2017-06-27 | 2017-11-03 | 太平洋（聊城）光电科技有限公司 | A kind of array type is multiple to receive that light engine is optical coupled and measurement jig |
| CN112119315A (en) * | 2018-05-16 | 2020-12-22 | 泰克诺探头公司 | High-frequency high-performance probe card |
| CN112119315B (en) * | 2018-05-16 | 2024-04-02 | 泰克诺探头公司 | High-frequency high-performance probe card |
| CN110716122A (en) * | 2018-07-13 | 2020-01-21 | 中华精测科技股份有限公司 | High-frequency probe card device and signal transmission module thereof |
| CN114839410A (en) * | 2022-04-06 | 2022-08-02 | 强一半导体（苏州）有限公司 | Film probe card device |
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Application publication date: 20110504 |