CN102034681A - 一种修复晶圆表面划伤的方法 - Google Patents
一种修复晶圆表面划伤的方法 Download PDFInfo
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102610497A (zh) * | 2012-04-09 | 2012-07-25 | 上海先进半导体制造股份有限公司 | 晶圆表面修复方法 |
CN103128650A (zh) * | 2011-12-05 | 2013-06-05 | 无锡华润上华科技有限公司 | 一种化学机械研磨方法 |
CN103165412A (zh) * | 2013-03-15 | 2013-06-19 | 上海华力微电子有限公司 | 晶圆表面凹陷缺陷的处理方法 |
CN110484386A (zh) * | 2019-09-12 | 2019-11-22 | 河北工业大学 | 一种集成电路低k介质抛光后清洗剂及其清洗方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1538505A (zh) * | 2003-04-18 | 2004-10-20 | 矽统科技股份有限公司 | 改善晶圆表面平坦度的方法 |
US20070212986A1 (en) * | 2006-03-13 | 2007-09-13 | Karl Heinz Priewasser | Method for concave grinding of wafer and unevenness-absorbing pad |
CN101140878A (zh) * | 2007-06-15 | 2008-03-12 | 中国电子科技集团公司第二十四研究所 | 多晶硅介质平坦化的方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1538505A (zh) * | 2003-04-18 | 2004-10-20 | 矽统科技股份有限公司 | 改善晶圆表面平坦度的方法 |
US20070212986A1 (en) * | 2006-03-13 | 2007-09-13 | Karl Heinz Priewasser | Method for concave grinding of wafer and unevenness-absorbing pad |
CN101140878A (zh) * | 2007-06-15 | 2008-03-12 | 中国电子科技集团公司第二十四研究所 | 多晶硅介质平坦化的方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103128650A (zh) * | 2011-12-05 | 2013-06-05 | 无锡华润上华科技有限公司 | 一种化学机械研磨方法 |
CN102610497A (zh) * | 2012-04-09 | 2012-07-25 | 上海先进半导体制造股份有限公司 | 晶圆表面修复方法 |
CN103165412A (zh) * | 2013-03-15 | 2013-06-19 | 上海华力微电子有限公司 | 晶圆表面凹陷缺陷的处理方法 |
CN110484386A (zh) * | 2019-09-12 | 2019-11-22 | 河北工业大学 | 一种集成电路低k介质抛光后清洗剂及其清洗方法 |
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Effective date of registration: 20120312 Address after: 214028 Wuxi provincial high tech Industrial Development Zone, Hanjiang Road, No. 5, Jiangsu, China Applicant after: Wuxi CSMC Semiconductor Co., Ltd. Address before: 214061 No. 5 Hanjiang Road, national hi tech Industrial Development Zone, Wuxi, Jiangsu, China Applicant before: Wuxi CSMC Semiconductor Co., Ltd. Co-applicant before: Wuxi Huarun Shanghua Technology Co., Ltd. |
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Application publication date: 20110427 |