CN102030913B - Method for preparing novel epoxy resin film - Google Patents
Method for preparing novel epoxy resin film Download PDFInfo
- Publication number
- CN102030913B CN102030913B CN200910235525A CN200910235525A CN102030913B CN 102030913 B CN102030913 B CN 102030913B CN 200910235525 A CN200910235525 A CN 200910235525A CN 200910235525 A CN200910235525 A CN 200910235525A CN 102030913 B CN102030913 B CN 102030913B
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- CN
- China
- Prior art keywords
- epoxy resin
- water
- film
- thin film
- resin thin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Abstract
The invention relates to an environmental-friendly method for preparing an epoxy resin film, which comprises the following steps of: coating the epoxy resin film on a low-cost water-soluble polymer film serving as a template; and dissolving the water-soluble polymer film template in water after the epoxy resin film is cured to obtain the epoxy resin film. The method has the advantages that: an organic solvent is not used in the preparation process so as to avoid harming operating personnel and avoid environmental pollution; a water-soluble polymer material dissolved in the water is easy to decompose, so that the template is environmental-friendly and can be recycled; and the cured epoxy resin film is easy to strip and the epoxy resin film cannot be damaged.
Description
Technical field
The invention belongs to the preparation field of macromolecule membrane, specifically relate to a kind of preparation method of epoxy resin thin film.
Technical background
In PC World, touch-screen becomes most popular man-machine interface just gradually, and its range of application includes handheld computer, industrial control unit (ICU) and a series of just at developing other field.Regardless of the principle of touch-control input, all types of touch-screens efforts be made so that all application person's input is simple, accurate and effective.Up to the present, resistive touch screen technology is the most common in all existing touch technologies.It almost can accept the touch-control input of arbitrary form, edge of for example glove or gloveless finger, metal pen, credit card or the like, and also its production cost also is cheapest.In addition, along with the latest developments of Materials science, the range of application of resistive touch screen also further expands.Under rugged environment, like the resistive touch screen that mobile phone, automobile and electronics etc. use, not only to possess excellent optical property, but also need the adaptive capacity to environment of stable and durable.So the high-performance resistive touch screen parameter that industrial environment requires becomes industry standard, wherein comprises cost performance.
Though the application of resistive touch screen is very extensive, it has an intrinsic weakness---the matter of ITO coating is crisp frangible.Tin indium oxide (ITO) is a kind of conducting ceramic material, can on polyethyleneterephthalate (PET) soft plastics film, be deposited as the ultra-thin coating of one deck.Having under the PET film of ITO coating is a hard substrate that is coated with ito thin film equally.The ITO coating that connects on PET and the substrate through contact detects the touch-control input.Yet along with repeating the contact extruding, the performance of ITO/PET layer descends gradually, because user's finger or the situation of more sternness such as the extruding of PDA metal pen or similar device make the deflection of flexible PET material produce arc curve.The deflection of this curve shape causes frangible ITO material production micro-cracks, and this at first makes contact situation variation, perhaps produces not point of contact, and the diffusion of final crack causes more large-area afunction.
The use of ITO coating on resistive touch screen need be through a high vacuum deposition process, and complex process, environmental requirement are harsh, production cost is very high.For many years, people look on the bright side of things and send a kind of softish, transparent touch conductor, and its surface in contact is lasting stability more, and relatively easily is applied to plastic base.These characteristics will prolong the life-span of resistance-type touch panel, compare with current ITO coating resistance-type touch panel, and it can be applied to harsher rugged environment.
Claims (8)
1. the preparation method of an epoxy resin thin film, its step is following:
1) gets the clean slide glass of a slice surfacing, on slide glass, evenly be coated with last layer vacuum silicone grease then; Cut out the water-soluble polymer film of a slice and said slide glass same size again, entirely paste on the vacuum silicone grease layer on the said slide glass; On the water-soluble polymer film, be coated with one deck silane coupling agent again, it is subsequent use to be placed on clean place then;
2) preparation epoxy resin colloid
Get stoichiometric epoxy resin and solidifying agent, add silane coupling agent then, at room temperature magnetic agitation 10-20 minute; Obtain mixture; The bubble in the mixture is extracted with vacuum pump in magnetic agitation limit in limit then, and no bubble only obtains the epoxy resin colloid to the mixture;
The weight part proportioning of said epoxy resin, solidifying agent and silane coupling agent is 100: 22～60: 1～3;
3) slide glass that is covered with the water-soluble polymer film that step 1) is obtained is fixed on the film spin coating appearance, on the silane coupling agent layer on water-soluble polymer film surface, drips step 2 again) epoxy resin colloid 0.5～3g of making; Adjustment film spin coating appearance rotating speed is that PM 200 changes～1500 commentaries on classics, on the silane coupling agent layer on the slide glass, is covering one deck epoxy resin thin film; The thickness of said epoxy resin thin film is 600 μ m～10 μ m;
4) there is covering of preparing of step 3) the slide glass of epoxy resin thin film to put into baking oven,, at 70 ℃～90 ℃ following cured epoxy resin film 2h～8h, cools to room temperature then with the furnace again at 40 ℃～60 ℃ following cured epoxy resin film 2h～4h;
5) take the epoxy resin thin film that is cured come off from slide glass together with the water-soluble polymer film; Remaining vacuum silicone grease on the paper towel wiped clean water-soluble polymer film; Put into the vessel that fill normal-temperature water then; The water-soluble polymer film is dissolved, and the epoxy resin thin film that takes out in the vessel dries, and obtains epoxy resin thin film.
2. by the preparation method of the described epoxy resin thin film of claim 1, it is characterized in that said step 5) also comprises: the vessel that will fill normal-temperature water are inserted in the ultrasonic cleaning machine, carry out supersound process 10-20 minute, to quicken the dissolving of water-soluble polymer film.
3. by the preparation method of the described epoxy resin thin film of claim 1, it is characterized in that said water-soluble polymer film is polyvinyl alcohol film, water soluble starch film or water-soluble carboxymethyl sodium cellulosate film.
4. by the preparation method of the described epoxy resin thin film of claim 1, it is characterized in that said silane coupling agent is KH550 or KH560.
5. by the preparation method of the described epoxy resin thin film of claim 1, it is characterized in that said epoxy resin is bisphenol f type epoxy resin or bisphenol A type epoxy resin.
6. by the preparation method of the described epoxy resin thin film of claim 1, it is characterized in that said solidifying agent is polyether monoamine solidifying agent or alicyclic ring amine curing agent.
7. by the preparation method of the described epoxy resin thin film of claim 6, it is characterized in that said polyether monoamine solidifying agent is D-230 or D-400.
8. by the preparation method of the described epoxy resin thin film of claim 6, it is characterized in that said alicyclic ring amine curing agent is WK6892, WK6822 or EC201.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910235525A CN102030913B (en) | 2009-09-29 | 2009-09-29 | Method for preparing novel epoxy resin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910235525A CN102030913B (en) | 2009-09-29 | 2009-09-29 | Method for preparing novel epoxy resin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102030913A CN102030913A (en) | 2011-04-27 |
| CN102030913B true CN102030913B (en) | 2012-09-05 |
Family
ID=43884409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910235525A Expired - Fee Related CN102030913B (en) | 2009-09-29 | 2009-09-29 | Method for preparing novel epoxy resin film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102030913B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104448365B (en) * | 2014-12-12 | 2017-07-14 | 江南大学 | It is a kind of prepare epoxidized vegetable oil it is epoxy resin toughened/method of cellulose composite membrane |
| CN113815173A (en) * | 2021-09-03 | 2021-12-21 | 南京贝迪新材料科技股份有限公司 | Coating method production process for LCP film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003048960A (en) * | 2001-08-09 | 2003-02-21 | Mitsui Chemicals Inc | Flame-retardant and highly heat-resistant epoxy resin composition and use thereof |
| US7125918B2 (en) * | 2000-11-07 | 2006-10-24 | Konica Corporation | Protective film of a polarizing plate |
| CN1942502A (en) * | 2004-04-14 | 2007-04-04 | 纳美仕有限公司 | Epoxy resin composition |
| CN101300284A (en) * | 2005-11-04 | 2008-11-05 | 富士胶片株式会社 | Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board |
-
2009
- 2009-09-29 CN CN200910235525A patent/CN102030913B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7125918B2 (en) * | 2000-11-07 | 2006-10-24 | Konica Corporation | Protective film of a polarizing plate |
| JP2003048960A (en) * | 2001-08-09 | 2003-02-21 | Mitsui Chemicals Inc | Flame-retardant and highly heat-resistant epoxy resin composition and use thereof |
| CN1942502A (en) * | 2004-04-14 | 2007-04-04 | 纳美仕有限公司 | Epoxy resin composition |
| CN101300284A (en) * | 2005-11-04 | 2008-11-05 | 富士胶片株式会社 | Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102030913A (en) | 2011-04-27 |
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Granted publication date: 20120905 Termination date: 20170929 |