CN102023410B - 液晶显示装置 - Google Patents
液晶显示装置 Download PDFInfo
- Publication number
- CN102023410B CN102023410B CN201010254480.6A CN201010254480A CN102023410B CN 102023410 B CN102023410 B CN 102023410B CN 201010254480 A CN201010254480 A CN 201010254480A CN 102023410 B CN102023410 B CN 102023410B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- light
- circuit board
- led
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 55
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims description 28
- 230000033228 biological regulation Effects 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000009740 moulding (composite fabrication) Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0075—Arrangements of multiple light guides
- G02B6/0078—Side-by-side arrangements, e.g. for large area displays
- G02B6/008—Side-by-side arrangements, e.g. for large area displays of the partially overlapping type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
- G02B6/0046—Tapered light guide, e.g. wedge-shaped light guide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009209926A JP5286206B2 (ja) | 2009-09-11 | 2009-09-11 | 液晶表示装置 |
JP2009-209926 | 2009-09-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102023410A CN102023410A (zh) | 2011-04-20 |
CN102023410B true CN102023410B (zh) | 2014-04-30 |
Family
ID=43479355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010254480.6A Active CN102023410B (zh) | 2009-09-11 | 2010-08-11 | 液晶显示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8350989B2 (zh) |
EP (1) | EP2296021A1 (zh) |
JP (1) | JP5286206B2 (zh) |
CN (1) | CN102023410B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5286206B2 (ja) * | 2009-09-11 | 2013-09-11 | 日立コンシューマエレクトロニクス株式会社 | 液晶表示装置 |
JP5089788B1 (ja) * | 2011-05-13 | 2012-12-05 | シャープ株式会社 | 液晶表示装置 |
CN102789303A (zh) * | 2011-05-19 | 2012-11-21 | 国际商业机器公司 | 用于移动终端的节电方法和*** |
KR102108214B1 (ko) | 2013-06-12 | 2020-05-07 | 엘지디스플레이 주식회사 | 발광다이오드어셈블리 및 그를 포함한 액정표시장치 |
JP6462337B2 (ja) * | 2014-11-26 | 2019-01-30 | 京セラ株式会社 | 液晶表示装置 |
KR101784406B1 (ko) * | 2015-02-25 | 2017-10-12 | 금호전기주식회사 | 투명 전광 장치 |
JP6696853B2 (ja) * | 2016-07-29 | 2020-05-20 | 株式会社ジャパンディスプレイ | 力検出装置 |
JP2018147879A (ja) * | 2017-03-02 | 2018-09-20 | オムロン株式会社 | 面光源装置、表示装置、及び電子機器 |
WO2018159603A1 (ja) * | 2017-03-02 | 2018-09-07 | オムロン株式会社 | 面光源装置、表示装置、及び電子機器 |
CN107274802B (zh) * | 2017-05-31 | 2023-05-30 | Oppo广东移动通信有限公司 | 灯箱布及灯箱 |
JP7199048B2 (ja) * | 2018-09-19 | 2023-01-05 | パナソニックIpマネジメント株式会社 | 発光装置、及びそれを備える移動体 |
CN109887950A (zh) * | 2019-04-19 | 2019-06-14 | 京东方科技集团股份有限公司 | 显示基板、led器件、显示面板、显示装置及制作方法 |
JP7464491B2 (ja) | 2020-09-30 | 2024-04-09 | 日東精工株式会社 | 照明装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005283852A (ja) * | 2004-03-29 | 2005-10-13 | Kyocera Corp | 液晶表示装置 |
JP2006011239A (ja) * | 2004-06-29 | 2006-01-12 | Kyocera Corp | 液晶表示装置 |
JP2006100483A (ja) * | 2004-09-29 | 2006-04-13 | Matsushita Electric Works Ltd | プリント配線板の放熱構造 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3804861B2 (ja) | 2002-08-29 | 2006-08-02 | 株式会社デンソー | 電気装置および配線基板 |
JP4190268B2 (ja) * | 2002-12-04 | 2008-12-03 | シャープ株式会社 | 照明装置およびそれを備えた液晶表示装置 |
JP2004281682A (ja) * | 2003-03-14 | 2004-10-07 | Sumitomo Electric Ind Ltd | 光送信装置 |
DE10314525A1 (de) * | 2003-03-31 | 2004-11-04 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Beleuchtungsvorrichtung und Beleuchtungsvorrichtung |
CN100454054C (zh) * | 2004-05-24 | 2009-01-21 | 奥斯兰姆奥普托半导体有限责任公司 | 用于装配表面发光***的方法以及表面发光*** |
JP5072186B2 (ja) | 2005-02-25 | 2012-11-14 | 京セラ株式会社 | 液晶表示装置 |
US7311431B2 (en) * | 2005-04-01 | 2007-12-25 | Avago Technologies Ecbu Ip Pte Ltd | Light-emitting apparatus having a plurality of adjacent, overlapping light-guide plates |
JP4903393B2 (ja) | 2005-04-27 | 2012-03-28 | 京セラ株式会社 | 光源装置、および液晶表示装置 |
JP4697533B2 (ja) | 2005-06-08 | 2011-06-08 | ミネベア株式会社 | 面状照明装置 |
KR101241650B1 (ko) * | 2005-10-19 | 2013-03-08 | 엘지이노텍 주식회사 | 엘이디 패키지 |
CN100538473C (zh) * | 2005-12-08 | 2009-09-09 | 统宝光电股份有限公司 | 图像显示***及其液晶显示模块 |
KR100752009B1 (ko) | 2006-03-06 | 2007-08-28 | 삼성전기주식회사 | Led가 구비된 백라이트유닛 |
US7806574B2 (en) | 2006-04-16 | 2010-10-05 | Albeo Technologies, Inc. | Thermal management of LED-based lighting systems |
US20080043194A1 (en) * | 2006-08-15 | 2008-02-21 | Wintek Corporation | Optical display module with heat sink structure |
US7667378B2 (en) * | 2006-11-14 | 2010-02-23 | Epson Imaging Devices Corporation | Illuminating device, electro-optic device, and electronic apparatus |
US7961271B2 (en) * | 2007-02-27 | 2011-06-14 | Seiko Instruments Inc. | Lighting device and display device provided with the same |
WO2009019964A1 (ja) * | 2007-08-07 | 2009-02-12 | Sharp Kabushiki Kaisha | 照明装置および液晶表示装置 |
US20100265432A1 (en) * | 2008-02-05 | 2010-10-21 | Takeshi Masuda | Illumination device and liquid crystal display device |
CN201273549Y (zh) * | 2008-09-19 | 2009-07-15 | 福建省苍乐电子企业有限公司 | 大功率led低热阻传热结构 |
JP5286206B2 (ja) * | 2009-09-11 | 2013-09-11 | 日立コンシューマエレクトロニクス株式会社 | 液晶表示装置 |
-
2009
- 2009-09-11 JP JP2009209926A patent/JP5286206B2/ja active Active
-
2010
- 2010-05-18 US US12/782,183 patent/US8350989B2/en active Active
- 2010-07-26 EP EP10007748A patent/EP2296021A1/en not_active Withdrawn
- 2010-08-11 CN CN201010254480.6A patent/CN102023410B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005283852A (ja) * | 2004-03-29 | 2005-10-13 | Kyocera Corp | 液晶表示装置 |
JP2006011239A (ja) * | 2004-06-29 | 2006-01-12 | Kyocera Corp | 液晶表示装置 |
JP2006100483A (ja) * | 2004-09-29 | 2006-04-13 | Matsushita Electric Works Ltd | プリント配線板の放熱構造 |
Also Published As
Publication number | Publication date |
---|---|
JP2011060619A (ja) | 2011-03-24 |
EP2296021A1 (en) | 2011-03-16 |
CN102023410A (zh) | 2011-04-20 |
US20110063543A1 (en) | 2011-03-17 |
JP5286206B2 (ja) | 2013-09-11 |
US8350989B2 (en) | 2013-01-08 |
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GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150325 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150325 Address after: Osaka, Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171222 Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Osaka, Japan Patentee before: Hitachi Maxell, Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Kyoto Japan Patentee before: MAXELL HOLDINGS, Ltd. |
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Effective date of registration: 20220616 Address after: Kyoto Japan Patentee after: MAXELL HOLDINGS, Ltd. Address before: Kyoto, Japan Patentee before: MAXELL, Ltd. |