CN102023365B - Camera module, method of focusing the same, and device for focusing the same - Google Patents

Camera module, method of focusing the same, and device for focusing the same Download PDF

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Publication number
CN102023365B
CN102023365B CN201010003400XA CN201010003400A CN102023365B CN 102023365 B CN102023365 B CN 102023365B CN 201010003400X A CN201010003400X A CN 201010003400XA CN 201010003400 A CN201010003400 A CN 201010003400A CN 102023365 B CN102023365 B CN 102023365B
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CN
China
Prior art keywords
housing
base unit
camera model
lens
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010003400XA
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Chinese (zh)
Other versions
CN102023365A (en
Inventor
李相彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN102023365A publication Critical patent/CN102023365A/en
Application granted granted Critical
Publication of CN102023365B publication Critical patent/CN102023365B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

An a camera module includes: a lens barrel housing lenses; a housing formed integrally with the lens barrel; and a substrate unit having a top surface bonded to the housing with an adhesive and including pass portions through which an ascending and descending unit passes, the ascending and descending unit vertically moving the housing to perform focusing when the housing is bonded to the substrate unit.

Description

Camera model, make camera mould method of focusing and device
The application requires the right of priority at the 10-2009-0086587 korean patent application of Korea S Department of Intellectual Property submission on September 14th, 2009, and the content of this application is incorporated into this by reference.
Technical field
The present invention relates to a kind of camera model, more particularly, relate to a kind of camera model, a kind of method and a kind of device that this camera model is focused on that this camera model is assembled, this camera model is installed in individual mobile terminal etc. and goes up to carry out imaging function.
Background technology
Along with recent portable terminal (for example, portable phone and PDA(Personal Digital Assistant)) development, now, portable terminal not only provides phone call functions, and is used as the many aggregate devices (multi-convergence divice) for music, film and recreation etc.The most representative in these many aggregate devices is camera model.
In addition, because portable terminal size and thickness reduces, so the size and the thickness that are installed in the camera model in the terminal are reduced.
Under the situation of high pixel camera module, when being mounted to housing for the lens drum that holds lens, the height of housing is conditioned, and can be reduced.Therefore, need to carry out focusing.
In the process of mounted lens tube and housing, lens drum is attached to housing by screw, so that camera model focuses on.Therefore, when by screw lens drum being attached to housing, the position that camera model focuses on can be regulated by the operator and change.
Yet in this camera model, when lens drum is rotated to carry out when focusing on, impurity can be from contact portion drops into space between lens drum and the housing, thus the infringement screen.In addition, when lens drum and housing are assembled, need to regulate rotary torque.Therefore, current, needs solve the technology of such problem.
Summary of the invention
One aspect of the present invention provides a kind of camera model that makes assembling process simplify, a kind of camera mould method of focusing and a kind of device that camera model is focused on of making.
According to an aspect of the present invention, provide a kind of camera model, this camera model comprises: lens drum, hold lens; Housing forms with lens drum; Base unit has the top surface that is attached to housing by cementing agent, and comprises and rising and the decline unit passes pass through part, when housing is bonded to base unit, rises and the decline unit moves housing vertically, to carry out focusing.
Each can be the hole that is formed at the office, joint portion between housing and base unit by part.
Can be formed in each angle of base unit by part, from but open wide.
Lens drum and housing can be the products of one injection molding.
But housing comprises the escape part, and this escape part is formed on the outer surface that is bonded to base unit of housing, and the part of should escaping so that the escape space to be provided, makes cementing agent escape in the escape space according to wedge shape formation.
According to a further aspect in the invention, provide a kind of camera model method of focusing that makes, this method comprises:
Housing is arranged on the base unit, makes housing be arranged in the bonding position that bonds with base unit, the housing that forms with lens drum comprises lens; Cementing agent is applied to the bonding position of base unit and temporary bonding housing; Pass the rising of passing through part that is formed in the base unit and the decline unit position vertical motion that makes housing so that camera model focuses on by use.
After lens are arranged in the mould, can carry out injection molding to form housing, make lens be contained in the housing.
By being the hole that is formed at the binding part office between housing and base unit partly, to pass base unit.
Can become by each dihedral of cutting base unit by part.
According to a further aspect in the invention, provide a kind of be used to the device that camera model is focused on, this device comprises: rise and the decline unit, form and pass the part of passing through that is formed in the base unit; Driver element makes and rises and the decline unit motion so that with the housing vertical motion of lens drum one, thereby camera model is focused on.
Driver element can comprise the electric motor units of the end that is formed on rising and decline unit.
Description of drawings
By the detailed description of carrying out below in conjunction with accompanying drawing, above-mentioned and other side of the present invention, characteristics and other advantage will more be expressly understood, wherein:
Fig. 1 is the skeleton view of camera model according to an embodiment of the invention;
Fig. 2 is the sectional view of base unit of the camera model of key drawing 1;
Fig. 3 is the skeleton view of the base unit of camera model according to an embodiment of the invention;
Fig. 4 to Fig. 6 is the sectional view of explaining according to another embodiment of the present invention that makes the camera model method of focusing;
Fig. 7 is the skeleton view of explaining the base unit of camera model according to another embodiment of the present invention.
Embodiment
Now, describe exemplary embodiment of the present invention with reference to the accompanying drawings in detail.But the present invention can realize in many different forms, and should not be construed as limited to embodiment set forth herein.On the contrary, provide these embodiment to make that the disclosure will be completely with complete, and will fully scope of the present invention be conveyed to those skilled in the art.In the accompanying drawings, for the sake of clarity, the thickness in layer and zone has been exaggerated.In the accompanying drawings, therefore identical label indication components identical, will omit description of them.
Fig. 1 is the skeleton view of camera model according to an embodiment of the invention.Fig. 2 is the sectional view of base unit of the camera model of key drawing 1.
See figures.1.and.2, camera model 100 can comprise lens drum 110, housing 120 and base unit 130.
Lens drum 110 is the injection-molded products with housing 120 one.A plurality of lens are contained in the lens drum 110, so that it is arranged along optical axis.Therefore, can be by injection molded material being expelled in the mould (in this mould, lens are disposed in the position of design) with the housing 120 of lens drum 110 one and manufactured.
In this case, though not shown, the lens that are arranged in the lens drum 110 can comprise at least one space, make adjacent lens to be spaced apart at a predetermined distance from each other.Though at least one lens is arranged in the lens drum 110, the quantity that is arranged on the lens in the lens drum 110 is unrestricted.
As mentioned above, housing 120 forms by a molding process and lens drum 110.Do not limit the border between lens drum 110 and the housing 120 in fact.
Housing 120 can comprise and be bonded to its inner infrared ray (IR) filtrator 112 that IR filtrator 112 can filter infrared ray from the light of scioptics.The basal surface of housing 120 can be bonded to the top surface of base unit 130 by cementing agent 134.
Escape part 122 can be formed on the outside of the bonding surface of the housing 120 that is bonded to base unit 130.Escape part 122 can form according to wedge shape, so that the escape space to be provided, makes cementing agent 134 enter in the escape space.When base unit 130 and housing 120 were oppressed and bonded to one another, compressing power made cementing agent 134 flow into the escape part 122 of housing 120.Therefore, can prevent that cementing agent 134 from moving to the outside of base unit 130.
In this embodiment of the present invention, escape part 122 prevents that cementing agent 134 from moving to the lateral electrode unit 136 on each side surface that is formed on base unit 130, thereby lateral electrode unit 136 pollutes for not bonded dose 134.
IR filtrator 112 is arranged between lens drum 110 and the imageing sensor 140, and can be bonded to the stayed surface that is formed in the housing 120 by cementing agent.
Can from the light of propagating, filter ultrared IR filtrator and can be used as IR filtrator 112.Yet, being not limited thereto, IR filtrator 112 can replace with any filtrator that can filter unnecessary light from see through the light of lens.
Imageing sensor 140 is arranged under the lens drum 110, and the image transitions that is formed by lens drum 110 can be become electric signal.In order to change, imageing sensor 140 can comprise pel array and photoelectric conversion unit.
Pel array stores electric charge in response to the light that sees through lens, and the charge conversion that will be stored in the pel array as the photoelectric conversion unit of light receiving element becomes available electric signal.For example, charge-coupled device (CCD) imageing sensor or complementary metal oxide semiconductor (CMOS) (CMOS) imageing sensor can be used as imageing sensor 140.
Imageing sensor 140 can be installed on the top surface of base unit 130 by wire bonding method (wire-bonding method).Electrical connection between base unit 130 and the imageing sensor 140 is not limited to wire bonding method.
Fig. 3 explains the skeleton view of the base unit of camera model according to an embodiment of the invention.
With reference to Fig. 3, base unit 130 is bonded to the basal surface of housing 120, makes that the imageing sensor 140 on the top surface that is installed in base unit 130 is arranged in the inner space of housing 120.
Base unit 130 can comprise and be formed on its lip-deep pad cell that pad cell is arranged in around the imageing sensor 140.Therefore, can carry out the lead-in wire bonding according to the mode that imageing sensor 140 can be electrically connected to pad cell.
In addition, what base unit 130 can comprise the place, each angle that is formed in its four angles pass through part 132, rises and decline unit 10 passes this and passes through part 132.Rising and decline unit 10 move housing 120 vertically, so that camera model focuses on.
Be formed at binding part office between housing 120 and base unit 130 by part 132, and can be the hole of passing base unit 130.Yet, be not limited thereto by part 132.According to deviser's intention, the shape by part 132 can be designed according to multiple mode.
Fig. 4 to Fig. 6 is the sectional view of explaining according to another embodiment of the present invention that makes the camera model method of focusing.
With reference to Fig. 4, the camera model method of focusing can be comprised the housing 120 with lens drum 110 one is arranged on the base unit 130, make housing 120 be arranged in the bonding position that bonds with base unit 130.
At this moment, cementing agent 134 is applied on the top surface of base unit 130, with corresponding to the bonding position of housing 120 bonding.What form base unit 130 in the position of coated with adhesive 134 passes through part 132.
Rise and decline unit 10 is arranged under the base unit 130, and be inserted into and be formed on passing through in the part 132 in the base unit 130.
With reference to Fig. 5, described method can be included in and cementing agent 134 is applied to after the bonding position of base unit 130 temporary bonding housing 120.
Rising and decline unit 10 pass by the height of part 132 with adjustment housings 120.When cementing agent 134 sclerosis, height that can adjustment housings 120.
With reference to Fig. 6, when the height of housing 120 is conditioned, carry out the focusing of camera model.Use rising and decline unit 10 to regulate the position of camera models.After the position was conditioned, cementing agent 140 sclerosis made housing 120 fix in position.
The device that is used for camera model is focused on according to another embodiment of the present invention can comprise rising and decline unit 10 and driver element.
Rise and decline unit 10 can form to pass to be formed on and passes through part 132 in the base unit 130.The shape of rising and decline unit 10 is unrestricted, as long as the diameter of rising and decline unit 10 is less than the diameter by part 132.For example, rising and decline unit 10 can form according to bar shaped.
The driver element that is used for rising and decline unit 10 are moved vertically can comprise electric motor units 20.Rising and decline unit 10 can be by the driving force fine motions that provides from electric motor units 20.Driver element is not limited to electric motor units 20.
Usually, lens drum and housing form respectively and are bonded to each other by screw, to form camera model.In this case, when carry out focusing on by rotating lens drum, impurity can be from contact portion drops into space between lens drum and the housing, thus the infringement screen.When lens drum and housing are assembled together, be difficult to regulate rotary torque.
Yet, at camera model according to an embodiment of the invention, be used for making the camera model method of focusing and be used for device that camera model is focused on, because lens drum 110 and housing 120 form, so can omit above-mentioned assembling process.Therefore, can prevent impurity, and save the trouble of regulating rotary torque.
In addition, owing to carried out simply by the focusing of carrying out camera model for the device that camera model is focused on, embodiments of the invention can easily be applied to carry out the high pixel camera module of focusing.
Fig. 7 is the skeleton view of explaining the base unit of camera model according to another embodiment of the present invention.Housing 120, imageing sensor 140 and rising and decline unit 10 be identical with above-described embodiment basically.Therefore, with the special description of omitting other.
With reference to Fig. 7, base unit 230 is bonded to the basal surface of housing 120, makes that the imageing sensor 140 on the top surface that is installed in base unit 230 is arranged in the inner space of housing 120.
Base unit 230 can be included in its lip-deep pad cell of arranging around imageing sensor 140.Imageing sensor 140 can be electrically connected to pad cell by the lead-in wire bonding.
Base unit 230 can comprise the part of passing through at the place, each angle that is formed on its four angles.Should can be formed in the open section 232 at each place, angle of base unit 230 by part.
The rising and the decline unit 10 that are used for housing 120 is moved vertically move vertically by open section 232, so that camera model focuses on.Compare with the part 132 of passing through of according to the abovementioned embodiments of the present invention base unit 130, the open section 232 of base unit 230 can more easily form.
Though show in conjunction with exemplary embodiment and described the present invention, it will be apparent to those skilled in the art that and under the situation that does not break away from the spirit and scope of the present invention that are defined by the claims, can make amendment and change.

Claims (11)

1. camera model comprises:
Lens drum holds lens;
Housing forms with lens drum;
Base unit, has the top surface that is attached to housing by cementing agent, and comprise and rising and the decline unit passes passes through part, when housing was bonded to base unit, rising and decline unit moved housing vertically, focused on to carry out, then, after camera model focused on, the cementing agent sclerosis made housing be fixed and puts in place.
2. camera model as claimed in claim 1, wherein, each is the hole that is formed at the office, joint portion between housing and base unit by part.
3. camera model as claimed in claim 1 wherein, is formed in each angle of base unit by part, from but open wide.
4. camera model as claimed in claim 1, wherein, lens drum and housing are the products of one injection molding.
5. camera model as claimed in claim 1, wherein, housing comprises the escape part, this escape part is formed on the outer surface that is bonded to base unit of housing, and the part of should escaping forms according to wedge shape, so that the escape space to be provided, makes cementing agent escape in the escape space.
6. one kind makes the camera model method of focusing, and this method comprises:
Housing is arranged on the base unit, makes housing be arranged in the bonding position that bonds with base unit, the housing that forms with lens drum comprises lens;
Cementing agent is applied to the bonding position of base unit and temporary bonding housing;
Pass the rising of passing through part that is formed in the base unit and the decline unit position vertical motion that makes housing so that camera model focuses on by use, then, after camera model focused on, the cementing agent sclerosis made housing be fixed and puts in place.
7. method as claimed in claim 6 wherein, after lens are arranged in the mould, is carried out injection molding to form housing, makes lens be contained in the housing.
8. method as claimed in claim 6 wherein, is the hole that is formed at the binding part office between housing and base unit by part, to pass base unit.
9. method as claimed in claim 6 wherein, becomes by part each dihedral by the cutting base unit.
10. one kind is used for device that camera model is focused on, and described camera model has: lens drum, hold lens; Housing forms with lens drum; Base unit, has the top surface that is attached to housing by cementing agent, and comprise and rising and the decline unit passes pass through part that when housing was bonded to base unit, rising and decline unit moved housing vertically, focus on to carry out, then, after camera model focuses on, the cementing agent sclerosis, make housing be fixed and put in place that the device that should be used for camera model is focused on comprises:
Described rising and decline unit form and pass the part of passing through that is formed in the described base unit;
Driver element makes described rising and decline unit motion so that with the described housing vertical motion of lens drum one, thereby camera model is focused on.
11. device as claimed in claim 10, wherein, driver element comprises the electric motor units of the end that is formed on rising and decline unit.
CN201010003400XA 2009-09-14 2010-01-19 Camera module, method of focusing the same, and device for focusing the same Expired - Fee Related CN102023365B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0086587 2009-09-14
KR1020090086587A KR101032212B1 (en) 2009-09-14 2009-09-14 Camera Module, focusing method of thereof and focusing device of thereof

Publications (2)

Publication Number Publication Date
CN102023365A CN102023365A (en) 2011-04-20
CN102023365B true CN102023365B (en) 2013-07-03

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US (1) US8139146B2 (en)
KR (1) KR101032212B1 (en)
CN (1) CN102023365B (en)

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