CN102012005B - Completely-metal integrated illuminating and backlight LED heat radiating structural body - Google Patents
Completely-metal integrated illuminating and backlight LED heat radiating structural body Download PDFInfo
- Publication number
- CN102012005B CN102012005B CN2010102614527A CN201010261452A CN102012005B CN 102012005 B CN102012005 B CN 102012005B CN 2010102614527 A CN2010102614527 A CN 2010102614527A CN 201010261452 A CN201010261452 A CN 201010261452A CN 102012005 B CN102012005 B CN 102012005B
- Authority
- CN
- China
- Prior art keywords
- cup body
- metal
- lamp cup
- circuit board
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses a completely-metal integrated illuminating and backlight LED heat radiating structural body which comprises a lamp holder, a lamp cup body, a circuit board provided with an LED, and a lamp shade, wherein the lamp holder is fixedly connected with one end of the lamp cup body through an insulation plastic shell, the lamp shade is fixedly connected with the other end of the lamp cup body, the circuit board is connected to the lamp cup body, the lamp cup body is an integrated structure made of an aluminum material; an aluminum foil or aluminum plate layer is arranged on one surface in the circuit board, which is connected with the lamp cup body, the outer side surface of the aluminum foil or aluminum plate layer is plated with a first metal coating; one surface in the lamp cup body, which is connected with the circuit board is provided with an aluminum installing surface, the outer side surface of the aluminum installing surface is plated with a second metal coating; and the first metal plating layer of the aluminum foil or aluminum plate layer of the circuit board is welded and fixed with the second metal coating of the lamp cup body. The invention realizes a completely-metal integrated structure, greatly improves the heat radiation of the LED lamp and ensures that the heating temperature of the LED lamp is effectively controlled.
Description
Technical field
The present invention relates to a kind of LED heat-radiating structure, particularly relate to and a kind ofly can realize the integrated illumination of complete metal and the LED of using heat-radiating structure backlight.
Background technology
At present, along with long-pending day by day the dwindling of LED lamp body, and the day by day increase of LED lamp power, the heat that the LED lamp produces is more and more, and the heat that the LED lamp produces can exert an influence to its light and service life.As when LED is overheated, its light can be dimmed, and color can shoal, and simultaneously, also can correspondingly shorten its service life.Therefore, the design of the integral heat sink structure of LED illumination is most important.
In the prior art, between the Lamp cup body and its circuit board of LED lamp, the general heat-conducting cream that adopts is realized mutually affixed, but the thermal conductivity factor too low (being only 0.01-0.1w/m.k) due to the macromolecular material of heat-conducting cream, though add the Heat Conduction Material of recipe ingredient in its system, still make the heat-conducting effect of this heat-conducting cream relatively poor.Opposite, generally between 60-700w/m.k, therefore, the heat-conducting effect of heat-conducting cream can not show a candle to the good heat conduction effect of metal to the thermal conductivity factor of metal.For this reason, the present invention is devoted to study between a kind of Lamp cup body that can make the LED lamp and circuit board and realizes the integrated draw bail of complete metal, thereby greatly improves the radiating effect of LED.
In addition, because the solderability of aluminium is very poor, even to its surface process oxidation processes, its solderability does not reach technological requirement yet.A kind of common way was with the aluminium foil in the LED modulated structure in the past, adopted Copper Foil or copper coin to replace, and improved its solderability with this.Yet because the cost of Copper Foil is higher, and matter is soft, difference of hardness, and therefore, this way of prior art is unfavorable for applying.
Summary of the invention
The object of the invention is to overcome the deficiency of prior art, the integrated illumination of a kind of complete metal and the LED of using heat-radiating structure backlight are provided, adopt tin cream to being welded and fixed between Lamp cup body and circuit board, thereby realized the integrated draw bail of complete metal, the weak points such as the LED radiating effect that has overcome prior art is not good, and service life is shorter.
The technical solution adopted for the present invention to solve the technical problems is: the integrated illumination of a kind of complete metal and the LED heat-radiating structure of using backlight comprise lamp holder, Lamp cup body, the circuit board that LED is housed and lampshade; Lamp holder is by an end Joint of insulated plastic shell and Lamp cup body; The other end Joint of lampshade and Lamp cup body; Circuit board be connected on the Lamp cup body and be contained in the Lamp cup body and chamber that lampshade surrounds in; This Lamp cup body is the integral structure that aluminum is made; Be made as an aluminium foil or aluminum layer with the joining one side of Lamp cup body in circuit board, the outer surface of this aluminium foil or aluminum layer is coated with one first coat of metal; Be provided with aluminium matter installed surface with the joining one side of circuit board in this Lamp cup body, the outer surface of this aluminium matter installed surface is coated with one second coat of metal; First coat of metal of the aluminium foil of this circuit board or aluminum layer is welded and fixed mutually by second coat of metal of tin cream with the Lamp cup body.
Described circuit board is provided with copper foil layer, also is provided with a high heat conduction or super-high heat-conductive dielectric layer between the copper foil layer of circuit board and aluminium foil or aluminum layer.
The thickness of described aluminium foil is C6 micron U-200U; The thickness of described aluminum layer is the 0.2-6.4 micron.
Described copper foil layer is to be that the electrolytic copper foil of 1/4-9.5 ounce or rolled copper foil that thickness is the 1/4-9.5 ounce are made by thickness.
Described high heat conduction or super-high heat-conductive dielectric layer are to be prepared into sizing material by insulating polymeric material with solvent, add non-metal solid class heat-conducting medium and are made.
The outer surface of described aluminium foil or aluminum layer is by chemical plating plating or evaporation or sputter acquisition first coat of metal.
The outer surface of described aluminium matter installed surface is by chemical plating plating or evaporation or sputter acquisition second coat of metal.
the integrated illumination of a kind of complete metal of the present invention and the LED heat-radiating structure of using backlight, with copper foil layer by high heat conduction or super-high heat-conductive dielectric layer and aluminium foil or the aluminum layer forming circuit plate that combines, and at the outer surface of aluminium foil or aluminum layer through chemical plating plating or the methods such as evaporation or sputter, form the first superior coat of metal of solderability, make this circuit board can be integrally welded by tin cream (adding scolder and scaling powder) and Lamp cup body by its first coat of metal, thereby realized the complete metal integral structure, greatly improved the thermal diffusivity of LED lamp, the heating temp of LED lamp is effectively controlled.In addition, because Lamp cup body and installed surface thereof are the Lam-cup structure of aluminium matter, thereby, plate second coat of metal at the outer surface of its installed surface, will be conducive to being welded and fixed mutually of Lamp cup body and circuit board.
The invention has the beneficial effects as follows, because circuit board and the joining one side of Lamp cup body are made as aluminium foil or aluminum layer, and the outer surface of this aluminium foil or aluminum layer is coated with first coat of metal; The integral structure of Lamp cup body for being made by aluminum, and the joining one side of Lamp cup body and circuit board is provided with aluminium matter installed surface, the outer surface of this aluminium matter installed surface is coated with second coat of metal, make the present invention adopt tin cream with the Lamp cup body with after circuit board is welded and fixed mutually, the complete metal of having realized the LED lamp is integrated, thereby greatly improved the thermal diffusivity of LED lamp, the heating temp of LED lamp is effectively controlled; Owing to adopting copper foil layer, high heat conduction or super-high heat-conductive dielectric layer and aluminium foil or aluminum layer forming circuit plate, and aluminium foil or aluminum layer are located at circuit board and the joining one side of Lamp cup body, the outer surface of this aluminium foil or aluminum layer is coated with first coat of metal, make this circuit board not only have superior solderability, thermal conductivity, and its cost also reduce greatly.
In sum, LED heat-radiating structure of the present invention has the characteristics such as cost is low, good heat dissipation effect, long service life.
Below in conjunction with drawings and Examples, the present invention is described in further detail; But the integrated illumination of a kind of complete metal of the present invention and backlightly be not limited to embodiment with the LED heat-radiating structure.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the partial sectional view of the connection place of Lamp cup body of the present invention and circuit board.
The specific embodiment
Embodiment sees also shown in accompanying drawing, and the integrated illumination of a kind of complete metal of the present invention and the LED heat-radiating structure of using backlight comprise lamp holder 1, Lamp cup body 2, circuit board 3 and the lampshade 4 of LED are housed; Lamp holder 1 is by an end Joint of insulated plastic shell and Lamp cup body 2; The other end Joint of lampshade 4 and Lamp cup body 2; Circuit board 3 be connected on Lamp cup body 2 and be contained in Lamp cup body 2 and chamber that lampshade 4 surrounds in; The integral structure that this Lamp cup body 2 is made for aluminum; Be made as an aluminium foil or aluminum layer 33 with the joining one side of Lamp cup body 2 in circuit board 3, the outer surface of this aluminium foil or aluminum layer 33 is coated with one first coat of metal 331; Be provided with aluminium matter installed surface 21 with the joining one side of circuit board 3 in this Lamp cup body 2, the outer surface of this aluminium matter installed surface 21 is coated with one second coat of metal 211; First coat of metal 331 of the aluminium foil of this circuit board 3 or aluminum layer 33 is welded and fixed mutually by second coat of metal 211 of tin cream 6 with the Lamp cup body.
Wherein,
Described circuit board 3 also comprises copper foil layer 31; Also be provided with a high heat conduction or super-high heat-conductive dielectric layer 32 between the copper foil layer 31 of circuit board and aluminium foil or aluminum layer 33;
Circuit board 3 can be aluminium foil layer or aluminum layer with the joining one side of Lamp cup body 2, and when being aluminium foil layer, its thickness is C6 micron U-200U; When being aluminum layer, its thickness is the 0.2-6.4 micron;
The electrolytic copper foil (ED copper, thickness are 1/4 ounce-9.5 ounces) of described copper foil layer 31 employing THE types or calendering copper (RA copper, knuckle 90 are spent above and once fixed or often do not roll over 1/4 ounce-9.5 ounces of thickness) are made;
Described high heat conduction or super-high heat-conductive dielectric layer 32 are to be prepared into sizing material by insulating polymeric material with solvent, add non-metal solid class heat-conducting medium and are made; Here, insulating polymeric material comprises the macromolecular materials such as epoxy type polyimide type, organic fluorine type, organic siliconresin type, polyether-type, polyethers copper type, (PEEK) organic polymer liquid crystal, powder or the nano materials such as non-metal solid class heat-conducting medium such as alundum (Al2O3), beryllium oxide, graphite, carborundum, agraphitic carbon, aluminium nitride, boron nitride are through coating, oven dry, film forming and make; This high heat conduction or super-high heat-conductive dielectric material can be made pure film-type and be attached on metallic matrix, or make the semi-solid preparation sheet material use of carrier;
The outer surface of described aluminium foil or aluminum layer 33 is method acquisition first coats of metal 331 by chemical plating plating or evaporation or sputter;
The outer surface of described aluminium matter installed surface 21 is method acquisition second coats of metal 211 by chemical plating plating or evaporation or sputter.
Preparation technology's main points of above-mentioned first coat of metal 331 and second coat of metal 211 are as follows:
1), alkaline tin plating: adopt NaOH and potassium hydroxide bond to electroplate take sodium stannate as main alkaline tin plating solution.
2), acid zinc-plated: as to add antioxidant and other additives in sulfuric acid and stannous sulfate solution, can obtain the second best in quality unglazed or bright coating.
3), aluminium foil or aluminium sheet be through oxidation processes, obtains the alumina surface layer, carry out carrying out electroless copper as activator after surface treatment with silane (epoxy radicals silicone hydride or amino silane).
4), electroplate: do electrolyte with copper sulphate, copper is done anode, and aluminium is done catholyte; Copper plate is stablized, corrosion-resistant, anti-tarnishing ability is strong, and coating is nontoxic, soft, and good solderability and ductility are arranged, and therefore is widely used industrial.
The present invention also need use scolder and scaling powder in the process that adopts tin cream to weld.Wherein, tin cream, the temperature range of its temperature RTS curve and RSS curve is the 40-320 degree; Scolder has the soft or hard work post, for the scolder of soft work post, has the characteristics such as fusing point is low, matter is soft, for the scolder of hard work post, has the fusing point high, and here, the present invention adopts soft solder; For scaling powder, the present invention selects soft welding procedure, and utilizes and help the weldering activating agent to come the auxiliary heat conduction to remove oxide, and the surface that reduces soldered material is powerful, increases its bonding area, prevents from reoxidizing.
The integrated illumination of a kind of complete metal of the present invention and the LED heat-radiating structure of using backlight combine Copper Foil with aluminium foil or aluminium sheet, its heat conductivility and Copper Foil are close, but cost greatly reduces.in order to realize the solderability of aluminum, the present invention also adopts the methods such as chemical plating plating or evaporation or sputter to obtain first coat of metal at the aluminium foil of circuit board or the outer surface of aluminum layer, outer surface at the aluminium matter installed surface of Lamp cup body adopts the methods such as chemical plating plating or evaporation or sputter to obtain second coats of metal, by this first coat of metal, second coat of metal hot melt of this circuit board by the aluminium matter installed surface of tin cream and Lamp cup body linked into an integrated entity, thereby realized the integrated structure of complete metal, and then greatly improved the thermal diffusivity of LED lamp, the heating temp of LED lamp is effectively controlled.
Above-described embodiment only is used for further illustrating the integrated illumination of a kind of complete metal of the present invention and the LED of using heat-radiating structure backlight; but the present invention is not limited to embodiment; every foundation technical spirit of the present invention all falls in the protection domain of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment does.
Claims (5)
1. the integrated illumination of complete metal and the LED heat-radiating structure of using backlight, comprise lamp holder, Lamp cup body, the circuit board that LED is housed and lampshade; Lamp holder is by an end Joint of insulated plastic shell and Lamp cup body; The other end Joint of lampshade and Lamp cup body; Circuit board be connected on the Lamp cup body and be contained in the Lamp cup body and chamber that lampshade surrounds in; It is characterized in that: this Lamp cup body is the integral structure that aluminum is made; Be made as an aluminium foil or aluminum layer with the joining one side of Lamp cup body in circuit board, the outer surface of this aluminium foil or aluminum layer is coated with one first coat of metal; Be provided with aluminium matter installed surface with the joining one side of circuit board in this Lamp cup body, the outer surface of this aluminium matter installed surface is coated with one second coat of metal; First coat of metal of the aluminium foil of this circuit board or aluminum layer is welded and fixed mutually by second coat of metal of tin cream with the Lamp cup body.
2. the integrated illumination of complete metal according to claim 1 and the LED heat-radiating structure of using backlight, it is characterized in that: described circuit board is provided with copper foil layer, also be provided with a high heat conduction or super-high heat-conductive dielectric layer between the copper foil layer of circuit board and aluminium foil or aluminum layer, described high heat conduction or super-high heat-conductive dielectric layer are to be prepared into sizing material by insulating polymeric material with solvent, add non-metal solid class heat-conducting medium, through coating, oven dry, film forming is made, and insulating polymeric material comprises the epoxy type polyimide type, the organic fluorine type, the organic siliconresin type, polyether-type, polyethers copper type, wherein one or several combination in PEEK organic polymer liquid crystal material, non-metal solid class heat-conducting medium comprises alundum (Al2O3), beryllium oxide, graphite, carborundum, agraphitic carbon, aluminium nitride, wherein a kind of powder or nano material in boron nitride.
3. the integrated illumination of complete metal according to claim 2 and the LED heat-radiating structure of using backlight is characterized in that: described copper foil layer is to be that the electrolytic copper foil of 1/4-9.5 ounce or rolled copper foil that thickness is the 1/4-9.5 ounce are made by thickness.
4. the integrated illumination of complete metal according to claim 1 and the LED heat-radiating structure of using backlight is characterized in that: the outer surface of described aluminium foil or aluminum layer is to obtain first coat of metal by chemical plating, plating or evaporation or sputter.
5. the integrated illumination of complete metal according to claim 1 and the LED heat-radiating structure of using backlight is characterized in that: the outer surface of described aluminium matter installed surface is to obtain second coat of metal by chemical plating, plating or evaporation or sputter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102614527A CN102012005B (en) | 2010-08-24 | 2010-08-24 | Completely-metal integrated illuminating and backlight LED heat radiating structural body |
| PCT/CN2010/079056 WO2012024867A1 (en) | 2010-08-24 | 2010-11-24 | Metal integral led heat dissipation structure for illumination and backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102614527A CN102012005B (en) | 2010-08-24 | 2010-08-24 | Completely-metal integrated illuminating and backlight LED heat radiating structural body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102012005A CN102012005A (en) | 2011-04-13 |
| CN102012005B true CN102012005B (en) | 2013-05-22 |
Family
ID=43842276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102614527A Expired - Fee Related CN102012005B (en) | 2010-08-24 | 2010-08-24 | Completely-metal integrated illuminating and backlight LED heat radiating structural body |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102012005B (en) |
| WO (1) | WO2012024867A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102287788B (en) * | 2011-06-03 | 2014-08-27 | 厦门汇耕电子工业有限公司 | Manufacture method of fully integrated radiating structure with circuit function |
| CN203010404U (en) * | 2012-12-13 | 2013-06-19 | 林培林 | Straight-welding type light-emitting diode (LED) spotlight |
| CN104728673A (en) * | 2015-03-03 | 2015-06-24 | 善研光电科技（上海）有限公司 | Tube lamp with cooler |
| CN104861939B (en) * | 2015-06-12 | 2018-02-13 | 矽照光电（厦门）有限公司 | A kind of heat sink material and the soft bar lamp FPCs of LED based on the material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2723812Y (en) * | 2004-09-04 | 2005-09-07 | 樊邦弘 | Heat radiating lighting decoration lamp |
| CN101005733A (en) * | 2006-12-29 | 2007-07-25 | 上海芯光科技有限公司 | Method for producing thin semiconductor lighting plane integrated optic source module |
| CN101182909A (en) * | 2007-02-06 | 2008-05-21 | 胡民海 | Intelligent LED lighting bulb |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070230182A1 (en) * | 2006-03-28 | 2007-10-04 | Yun Tai | Led module |
| CN100496188C (en) * | 2006-05-16 | 2009-06-03 | 南京汉德森科技股份有限公司 | Aluminum-base printing circuit board and its production |
| CN201100532Y (en) * | 2007-08-20 | 2008-08-13 | 郑锦荣 | High power LED bulb |
| CN201507806U (en) * | 2009-07-14 | 2010-06-16 | 上海彩煌光电科技有限公司 | LED luminaire with high heat radiation performance |
-
2010
- 2010-08-24 CN CN2010102614527A patent/CN102012005B/en not_active Expired - Fee Related
- 2010-11-24 WO PCT/CN2010/079056 patent/WO2012024867A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2723812Y (en) * | 2004-09-04 | 2005-09-07 | 樊邦弘 | Heat radiating lighting decoration lamp |
| CN101005733A (en) * | 2006-12-29 | 2007-07-25 | 上海芯光科技有限公司 | Method for producing thin semiconductor lighting plane integrated optic source module |
| CN101182909A (en) * | 2007-02-06 | 2008-05-21 | 胡民海 | Intelligent LED lighting bulb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102012005A (en) | 2011-04-13 |
| WO2012024867A1 (en) | 2012-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2699495T3 (en) | Substrate metal isolated | |
| CN102012005B (en) | Completely-metal integrated illuminating and backlight LED heat radiating structural body | |
| CN101293294B (en) | Sealing-in method for packaging outer shell with aluminum silicon carbide | |
| CN103327732A (en) | High heat conduction substrate and manufacturing method thereof | |
| CN101710493B (en) | Graphite radiating module and manufacturing process thereof | |
| CN102297352B (en) | LED (light-emitting diode) lamp based on composite heat-radiating technique | |
| CN208538833U (en) | A kind of heat transfer element of resistance to liquid metal corrosion | |
| CN102208377B (en) | Radiating unit with antioxidant nano-film and deposition method of antioxidant nano-film | |
| CN207678068U (en) | A kind of ultra-high conducting heat type ceramic substrate | |
| JP2012199332A (en) | Heat radiation component and semiconductor package having the same | |
| CN105387439A (en) | Manufacturing method of LED light source module radiator and manufacturing method of LED lighting equipment | |
| CN202176948U (en) | Light-emitting diode (LED) lamp based on composite heat dissipating technique | |
| CN101508889A (en) | Aluminium plating plumbago heat-conducting fin and method of preparing the same | |
| CN101298674A (en) | Manufacturing method of insulation heat-conducting metal substrate | |
| CN204047004U (en) | Compound fin | |
| JP2008098511A (en) | Ceramic circuit board and semiconductor module using the same | |
| CN110340174A (en) | A kind of production method of capacitor tantalum aluminum composite panel belt | |
| RU2003114308A (en) | COOLING ELEMENT | |
| TWI443229B (en) | Method for directly forming aluminum nitride layer on aluminum substrate | |
| CN101445385A (en) | Method for combing graphite plate with metal | |
| CN210771489U (en) | Ultrahigh heat conduction LED circuit substrate | |
| CN102384385B (en) | LED (light emitting diode) lamp with high heat dissipation performance | |
| CN110831269A (en) | Method for forming heating element and heating element | |
| TWI362774B (en) | Lighting device and method for forming the same | |
| CN205137106U (en) | High -power LED lighting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20180824 |