CN102010600B - Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof - Google Patents
Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof Download PDFInfo
- Publication number
- CN102010600B CN102010600B CN 201010560820 CN201010560820A CN102010600B CN 102010600 B CN102010600 B CN 102010600B CN 201010560820 CN201010560820 CN 201010560820 CN 201010560820 A CN201010560820 A CN 201010560820A CN 102010600 B CN102010600 B CN 102010600B
- Authority
- CN
- China
- Prior art keywords
- mass parts
- silicon rubber
- liquid silicon
- component
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a conductive liquid silicon rubber-based adhesive (A), which comprises 100 to 200 mass parts of aliphatic unsaturated hydrocarbon-terminated organic polybisiloxane (a), 10 to 60 mass parts of silica reinforcing filler (b), 10 to 60 mass parts of conductive filler (c) and 5 to 25 mass parts of structural controller (d). In addition, the invention also discloses a conductive liquid silicon rubber composition, which consists of the component (A) and a component (B) according to a mass ratio of 1:1. The component (A) comprises 100 mass parts of the conductive liquid silicon rubber-based adhesive and 0.05 to 0.5 mass part of addition reaction catalyst; and the component (B) comprises 100 mass parts of the conductive liquid silicon rubber-based adhesive, 2 to 10 mass parts of crosslinking agent (h), 0.04 to 0.5 mass part of addition reaction inhibitor (i) and 0.03 to 2.0 mass parts of pigment (j). The invention also discloses preparation methods and use of the adhesive and the composition.
Description
Technical field
The invention belongs to conducting liquid silastic material technical field, but be specifically related to the preparation method of the add-on type conducting liquid silicon rubber of a kind of high temperature rapid curing moulding, high mechanical strength, low volume specific resistance, low permanent compression set.
Background technology
In recent years, along with scientific and technical high speed development, the electronics of various high frequencies, electrical equipment, high-voltage power equipment etc. when work to space radiation the hertzian wave of a large amount of different wave lengths and frequency, thereby caused new environmental pollution and Electromagnetic Interference.The interference and the leakage that cause for solving electromagenetic wave radiation often adopt electro-conductive material to shield, such as metal or conductive plastics housing.But unconnected positions such as the seam crossing of housing, adhesive spots, duck eye are reduced shield effectiveness, therefore must use at these positions to have certain elastic conductive rubber product, the conductive silicon rubber material of mechanical property and weather resistance just becomes ideal selection and have preferably.
Silastic material itself has good insulativity, must add the electroconductive stuffings such as the metal powder such as a certain proportion of carbon black, Graphite Powder 99, silver, copper, nickel or steel fiber, just can obtain electroconductibility, makes the volume specific resistance of material reach 1 * (10
10～10
-4) Ω cm.Patent CN03809897.0 discloses a kind of conductive silicon rubber composition, and said composition is take the alkenyl organopolysiloxane as the basis, and hydrogeneous organopolysiloxane is linking agent, and take metal-powder as conductive filler material, its conductivity is excellent, and volume specific resistance can reach 10
-2Ω cm, but the cost of material is higher, and the performance of material be subject to the metal-powder fineness and with the restriction of silicon rubber consistency.It is conducting medium that patent CN200810060489.6 adopts Shawinigan black, utilize first treatment agent that Shawinigan black is carried out pre-treatment, make the conductive silicon rubber material at cooperation reinforcement silicon rubber, carbon black can have been improved floating, be of value to the healthy of operator, but increased manufacturing procedure, and existed equally pollution carbon black the treatment stage.Patent CN201010011842.9 discloses a kind of low modulus, high-intensity room temperature vulcanized conductive silicon rubber, its physicals is excellent, hardness is moderate, good mechanical property, can be used for producing the conductive rubber products of various electrical connectors, electric seal shock-proof spare, but this conductive silicon rubber adopts the condensed type curing system, can discharge poisonous or corrosive gases in solidification process, and contraction is larger in the solidification process of material, so the use field has been subject to great limitation.
Summary of the invention
Technical problem to be solved by this invention is: a kind of conducting liquid silastic material and preparation method thereof is provided.This liquid silicon rubber material preparation technology is simple, cost is relatively cheap; Curing molding speed is fast under the sizing material high temperature, the solidification process no coupling product, and material loss is few, the post cure stable performance, and be convenient to realize the production of serialization injecting glue, the production process cycle is short, efficient is high; Moulded products has the characteristics such as mechanical property excellence, permanent compression set is little, conductivity is outstanding.
The technical solution adopted for the present invention to solve the technical problems:
A kind of conductive liquid silicon rubber-based adhesive is characterized in that: it comprises poly-diorganosiloxane (a), 10-60 mass parts reinforced silicon dioxide filler (b), 10-60 mass parts conductive filler material (c), the 5-25 mass parts antistructurizing agent (d) of the unsaturated aliphatic hydrocarbon base end-blocking of 100-200 mass parts.
In the above-mentioned liquid conductive silastic sizing, can also add 0 ~ 80 mass parts silicone resin (e);
The poly-diorganosiloxane (a) of above-mentioned unsaturated aliphatic hydrocarbon base end-blocking is to contain 2 or 2 above unsaturated aliphatic hydrocarbon bases in each molecular chain, and its molecular structural formula is as follows:
In the formula, m=400 ~ 1500, n=0 ~ 40;
R
1Can be C1-C6 alkyl (for example methyl, ethyl, propyl group, butyl or amyl group), C6-C8 aromatic group (for example phenyl or tolyl), C2-C6 alkenyl (for example vinyl, allyl group, 1-butylene base or 1-vinyl) any;
R
2Be C2-C6 unsaturated aliphatic hydrocarbon base.For example be any in vinyl, allyl group, 1-butylene base, the 1-vinyl, preferred vinyl.
Preferred m=500 ~ 1300, n=0 ~ 30; More preferably m=600 ~ 1200, n=1 ~ 20; Preferred m=600 ~ 1200 further, n=1 ~ 10, m=600 ~ 1200 most preferably, n=2 ~ 5.
Above-mentioned reinforced filling (b) is that specific surface area is 150 ~ 400m
2The aerosil of/g, precipitated silica, the aerosil through surface hydrophobicity is processed, any one or more in the precipitated silica that surface hydrophobicity is processed;
Above-mentioned conductive filler material (c) can be that resistivity is less than 1.0 * 10
-5The silver powder of Ω cm, copper powder, and resistivity is between 1.0 * 10
-2Any in the Graphite Powder 99 of ~ 50 Ω cm, Shawinigan black, the carbon fiber or their mixture; Here the mean particle size for conductive filler material is not particularly limited, generally be 0.01 micron to 500 micrometer ranges, preferably at 0.01 micron to 10 micrometer ranges.
Above-mentioned antistructurizing agent (d) is that (for example weight-average molecular weight is in the 300-2000 scope for the small molecular weight hydroxy silicon oil, preferred 500-1500 scope, more preferably 500-1000 scope), any in the hexamethyldisilazane, dimethyldimethoxysil,ne or their mixture;
The molecular formula of above-mentioned silicone resin (e) is as follows:
In the formula: p=0.6 ~ 0.9, q=0 ~ 0.1, z=1
The preparation method of above-mentioned conductive liquid silicon rubber-based adhesive is characterized in that comprising the steps:
(1) poly-diorganosiloxane (a), 10-60 mass parts reinforced filling (b), 10-60 mass parts conductive filler material (c), the 5-25 mass parts antistructurizing agent (d) with the unsaturated aliphatic hydrocarbon base end-blocking of 100 mass parts mixed 1-6 hour in vacuum kneader;
(2) be warming up to 140-180 ℃ and add hot milling 2-6 hour;
(3) through 1 hour-4 hours the low molecule of time vacuum removal, dilution was cooled off;
(4) cooled material is made liquid silicon rubber sizing through grinding, filtering.
After wherein step (3) was finished, cooling stages added poly-diorganosiloxane (a) and optional 0 ~ 80 mass parts silicone resin (e) that adds of 0-100 mass parts.Here " choosing " expression wantonly " adds or does not add ".
A kind of conducting liquid rubber composition, it is comprised of component (A) and the quality proportioning of component (B) according to 1:1:
Above-mentioned component (A) comprising: the described liquid silicon rubber sizing of 100 mass parts, the addition reaction catalyst of 0.05-0.5 mass parts (f);
Above-mentioned component (B) comprising: the described liquid silicon rubber sizing of 100 mass parts, the addition reaction inhibitor (i) of the linking agent of 2-10 mass parts (h), 0.04-0.5 mass parts and the pigment (j) of 0.03-2.0 mass parts.；
Above-mentioned addition reaction catalyst (f) is any in platinum class catalyzer, palladium class catalyzer or the rhodium class catalyzer; Any in the complex compound that described platinum class catalyzer is platinum, Tetrachloroplatinum or Platinic chloride and vinyl compound and the diacetyl platinum acetate;
Above-mentioned linking agent (h) is organic hydrogen based polysiloxane, and its general molecular formula is:
In the formula: x=0 ~ 100, y=2 ~ 30;
R3, R4 can be methyl or hydrogen base independently, but contain at least two hydrogen bases in each molecule, preferably contain three or three above hydrogen bases.
Above-mentioned addition reaction inhibitor (i) is for containing the compound of ethynyl; The described compound that contains ethynyl preferably is selected from: 3,5-dimethyl-1-hexin base-3-is pure, methylacetylene is pure, 1-ethynyl-1-hexalin or methylbutynol;
Above-mentioned pigment (j) can be ferric oxide, chromic oxide, titanium oxide and pigment carbon black.
The preparation method of above-mentioned conducting liquid rubber composition is characterized in that comprising the steps:
⑴ the liquid silicon rubber sizing that 100 mass parts are above-mentioned adds the addition reaction catalyst (f) of 0.05-0.5 mass parts, and after stirring, de-bubbled is filtered, and namely gets component (A);
⑵ the liquid silicon rubber sizing that 100 mass parts are above-mentioned adds linking agent (h), the addition reaction inhibitor (i) of 0.04-0.5 mass parts and the pigment (j) of 0.03-2.0 mass parts of 2-10 mass parts, after stirring, de-bubbled is filtered, and namely gets component (B);
⑶ component (A) mixes with the quality proportioning of component (B) according to 1:1, obtains the conducting liquid rubber composition.Said composition is injected in the mould, is heating and curing to be made to the conductive silicon rubber goods, is also referred to as " conductive elastomer ".
Beneficial effect of the present invention:
The present invention makes conductive liquid silicon rubber-based adhesive take poly-diorganosiloxane (a), reinforced filling (b), conductive filler material (c), as main component, the modest viscosity of this sizing, and not thickening, storage ability is good; Take this conductive liquid silicon rubber-based adhesive as the basis, cooperate other component to make the conducting liquid rubber composition, it is under room temperature or heating condition, and the mode by addition reaction is sulfided into conductive elastomer.Curing molding speed is fast under the conducting liquid rubber composition high temperature of the present invention, the solidification process no coupling product, and material loss is few, the post cure stable performance, and be convenient to realize the production of serialization injecting glue, the production process cycle is short, efficient is high; Elastomer material after the curing has the characteristics such as high mechanical strength, low permanent compression set, conductivity be outstanding." conductive silicon rubber goods " are used interchangeably with " conductive elastomer ".
Prepare from composition of the present invention
Conductive elastomerGenerally has 10-80, the hardness (Shao A) of preferred 20-60.It generally has the tensile strength of 2-15 MPa, preferred 5～10 MPa.It generally has the elongation of 100-1000%, preferred 200-600%.It generally has the tear strength of 10-50 kN/m, preferred 20-40kN/m.In addition, also generally have 5-800 Ω cm, preferred 10-600 Ω cm, the more preferably volume specific resistance of 10-400 Ω cm.
Describe the present invention in detail below in conjunction with specific embodiment.
Embodiment
Embodiment 1
In vacuum kneader, add 100 mass parts α, ω-divinyl polydimethylsiloxane (viscosity under 25 ℃ is 3000mPas), (specific surface area is 150m to add 60 mass parts aerosils
2/ g), 20 mass parts silver powder (20 microns of mean particle sizes), 25 mass parts hexamethyldisilazanes, material was at room temperature stirred 2.0 hours, be warming up to 140 ℃ of temperature of charge, added hot milling 2.0 hours, took off low 4 hours through vacuum, the above-mentioned α that adds again 80 mass parts, ω-divinyl polydimethylsiloxane, 20 mass parts silicone resin (e), mix, grind, filter through three-roller.Obtain at last liquid silicon rubber sizing.
In 100 mass parts liquid silicon rubber sizings, add 1% isopropyl alcohol solution of chloroplatinic acid 0.05 mass parts, stir, de-bubbled is filtered; Make component (A).
In 100 mass parts liquid silicon rubber sizings, add polymethyl hydrogen siloxane (h) 2.0 mass parts, 3.5 the red iron oxide of-dimethyl-1-cyclohexyl-3-alcohol reaction suppressor 0.04 mass parts and 0.03 mass parts, at room temperature mix, de-bubbled, filter, make component (B).
Component (A) and component (B) mix according to the quality proportioning of 1:1, are expelled in the mould, and being heating and curing forms liquid silicon rubber material.At 150 ℃ of lower mold pressing 10min, make the thick film of 2mm.
The molecular formula of above-mentioned polymethyl hydrogen siloxane (h) is:
R
3＝H
The molecular formula of above-mentioned silicone resin (e) is as follows:
In the formula: p=0.6, q=0.1, z=1
Embodiment 2
In vacuum kneader, add 100 mass parts α, ω-allyl dimethyl base polydimethylsiloxane (viscosity under 25 ℃ is 10000mPas), (specific surface area is 200m to add 50 mass parts aerosils
2/ g), 50 mass parts Shawinigan blacks (0.01 micron of mean particle size), 20 mass parts hexamethyldisilazanes, material was at room temperature stirred 3.0 hours, be warming up to 160 ℃ of temperature of charge, added hot milling 6.0 hours, took off low 2.0 hours through vacuum, add again 40 mass parts α, ω-allyl dimethyl base polydimethylsiloxane, 30 mass parts silicone resin (e), mix, grind, filter through three-roller.Obtain at last liquid silicon rubber sizing.
In 100 mass parts liquid silicon rubber sizings, add 1% isopropyl alcohol solution of chloroplatinic acid 0.2 mass parts, stir, de-bubbled is filtered; Make component (A).
In 100 mass parts liquid silicon rubber sizings, add polymethyl hydrogen siloxane (h) 4.0 mass parts, methylacetylene alcohol reaction suppressor 0.2 mass parts at room temperature mixes, and de-bubbled is filtered, and makes component (B).
Component (A) and component (B) mix according to the quality proportioning of 1:1, are expelled in the mould, and being heating and curing forms liquid silicon rubber material.At 150 ℃ of lower mold pressing 10min, make the thick film of 2mm.
The molecular formula of above-mentioned polymethyl hydrogen siloxane (h) is:
R
3＝CH
3
The molecular formula of above-mentioned silicone resin (e) is as follows:
In the formula: p=0.9, q=0, z=1
Embodiment 3
In vacuum kneader, add 100 mass parts α, ω-butenyl dimethyl polydimethylsiloxane (viscosity under 25 ℃ is 15000mPas), (specific surface area is 150m to add 30 mass parts precipitated silicas
2/ g), 40 mass parts Shawinigan blacks (0.1 micron of mean particle size), 15 mass parts dimethyldimethoxysil,ne, material was at room temperature stirred 5.0 hours, be warming up to 180 ℃ of temperature of charge, added hot milling 4.0 hours, add again 100 mass parts α, ω-butenyl dimethyl polydimethylsiloxane, 60 mass parts silicone resin (e) mix, and grind, filter through three-roller.Obtain at last liquid silicon rubber sizing.
In 100 mass parts liquid silicon rubber sizings, add 1% diacetyl platinum acetate solution 0.5 mass parts, stir, de-bubbled is filtered; Make component (A).
In 100 mass parts liquid silicon rubber sizings, add polymethyl hydrogen siloxane (h) 6.0 mass parts, 1-ethynyl-1-hexalin reaction suppressor 0.5 mass parts at room temperature mixes, and de-bubbled is filtered, and makes component (B).
Component (A) and component (B) mix according to the quality proportioning of 1:1, are expelled in the mould, and being heating and curing forms liquid silicon rubber material.At 150 ℃ of lower mold pressing 10min, make the thick film of 2mm.
The molecular formula of above-mentioned polymethyl hydrogen siloxane (h) is:
R
3＝H
The molecular formula of above-mentioned silicone resin (e) is as follows:
In the formula: p=0.7, q=0.05, z=1
Embodiment 4
In vacuum kneader, add 100 mass parts α, ω-divinyl polydimethylsiloxane (viscosity under 25 ℃ is 20000mPas), (specific surface area is 200m to add 40 mass parts precipitated silicas
2/ g), 60 mass parts Shawinigan blacks (50 microns of mean particle sizes), 10 mass parts small molecular weight hydroxy silicon oils (weight-average molecular weight 2000), material was at room temperature stirred 6.0 hours, be warming up to 140 ℃ of temperature of charge, added hot milling 2.0 hours, took off low 1.0 hours through vacuum, add again 20 mass parts α, ω-divinyl polydimethylsiloxane, 40 mass parts silicone resin (e), mix, grind, filter through three-roller.Obtain at last liquid silicon rubber sizing.
In 100 mass parts liquid silicon rubber sizings, add 1% diacetyl platinum acetate solution 0.1 mass parts, stir, de-bubbled is filtered; Make component (A).
In 100 mass parts liquid silicon rubber sizings, add polymethyl hydrogen siloxane (h) 8.0 mass parts, methylbutynol reaction suppressor 0.1 mass parts at room temperature mixes, and de-bubbled is filtered, and makes component (B).
Component (A) and component (B) mix according to the quality proportioning of 1:1, are expelled in the mould, and being heating and curing forms liquid silicon rubber material.At 150 ℃ of lower mold pressing 10min, make the thick film of 2mm.
The molecular formula of above-mentioned polymethyl hydrogen siloxane (h) is:
R
3＝CH
3
The molecular formula of above-mentioned silicone resin (e) is as follows:
In the formula: p=0.6, q=0, z=1
Embodiment 5
In vacuum kneader, add 100 mass parts α, ω-allyl dimethyl base polydimethylsiloxane (viscosity under 25 ℃ is 40000mPas), (specific surface area is 300m to add 20 mass parts aerosils
2/ g), 30 mass parts copper powders (500 microns of mean particle sizes), 5 mass parts dimethyldimethoxysil,ne, material was at room temperature stirred 4.0 hours, be warming up to 160 ℃ of temperature of charge, added hot milling 6.0 hours, took off low 2.0 hours through vacuum, add again 60 mass parts α, ω-allyl dimethyl base polydimethylsiloxane mixes, and grinds, filters through three-roller.Obtain at last liquid silicon rubber sizing.
In 100 mass parts liquid silicon rubber sizings, add Platinic chloride organic silicon solution 0.3 mass parts of vinyl coordination, stir, de-bubbled is filtered; Make component (A).
In 100 mass parts liquid silicon rubber sizings, add polymethyl hydrogen siloxane (h) 10 mass parts, the red iron oxide of methylbutynol reaction suppressor 0.3 mass parts and 1.0 mass parts, at room temperature mix, de-bubbled is filtered, and makes component (B).
Component (A) and component (B) mix according to the quality proportioning of 1:1, are expelled in the mould, and being heating and curing forms liquid silicon rubber material.At 150 ℃ of lower mold pressing 10min, make the thick film of 2mm.
The molecular formula of polymethyl hydrogen siloxane (h) is:
R
3＝H
Embodiment 6
In vacuum kneader, add 100 mass parts α, ω-butenyl dimethyl polydimethylsiloxane (viscosity under 25 ℃ is 80000mPas), (specific surface area is 400m to add 10 mass parts aerosils
2/ g), 10 mass parts silver powder (100 microns of mean particle sizes), 5 mass parts small molecular weight hydroxy silicon oils (weight-average molecular weight 300), material was at room temperature stirred 1.0 hours, be warming up to 180 ℃ of temperature of charge, add hot milling 4.0 hours, and took off low 3.0 hours through vacuum, add again 80 mass parts silicone resin (e), mix, grind, filter through three-roller.Obtain at last liquid silicon rubber sizing.
In 100 mass parts liquid silicon rubber sizings, add Platinic chloride organic silicon solution 0.4 mass parts of vinyl coordination, stir, de-bubbled is filtered; Make component (A).
In 100 mass parts liquid silicon rubber sizings, add polymethyl hydrogen siloxane (h) 4.0 mass parts, 3.5 the charcoal blacks of-dimethyl-1-cyclohexyl-3-alcohol reaction suppressor 0.35 mass parts and 2.0 mass parts, at room temperature mix, de-bubbled, filter, make component (B).
Component (A) and component (B) mix according to the quality proportioning of 1:1, are expelled in the mould, and being heating and curing forms liquid silicon rubber material.At 150 ℃ of lower mold pressing 10min, make the thick film of 2mm.
The molecular formula of polymethyl hydrogen siloxane (h) is:
R
3＝CH
3
The molecular formula of above-mentioned silicone resin (e) is as follows:
In the formula: p=0.9, q=0.02, z=1
6mm heavy-gage rubber sheet in the various embodiments described above is used for testing leak(age) test, and the film that 2mm is thick is used for measuring physicals.And carry out leak(age) test by standard GB6553-86 " estimating the test method that the insulating material anti creepage trace performance use and anti-galvanic corrosion are decreased under the harsh and unforgiving environments condition ", experimental result sees Table 1.
The physical and mechanical properties of table 1 film and conductivity test-results
Wherein:
Hardness (Shao A) is to test according to standard GB/T 531-1999;
Tensile strength, elongation at break are to test according to standard GB/T 528-1998;
Tear strength is to test according to standard GB/T 529-1999;
Volume specific resistance is to test according to standard GB/T 1410-2006.
Claims (9)
1. conductive liquid silicon rubber-based adhesive, it is characterized in that: it comprises poly-diorganosiloxane (a), 10-60 mass parts reinforced silicon dioxide filler (b), 10-60 mass parts conductive filler material (c), the 5-25 mass parts antistructurizing agent (d) of the unsaturated aliphatic hydrocarbon base end-blocking of 100-200 mass parts
Wherein for the poly-diorganosiloxane (a) of unsaturated aliphatic hydrocarbon base end-blocking, contain 2 or 2 above unsaturated aliphatic hydrocarbon bases in its each molecular chain, its molecular structural formula is as follows:
In the formula, m=400 ~ 1500, n=0 ~ 40;
R
1The C1-C6 alkyl, C6-C8 aromatic group, C2-C6 alkenyl any;
R
2Be C2-C6 unsaturated aliphatic hydrocarbon base;
Described reinforced filling (b) is that specific surface area is 150 ~ 400m
2The aerosil of/g, precipitated silica, through aerosil that surface hydrophobicity is processed or any in the middle of the precipitated silica that surface hydrophobicity is processed or two or more combination;
Described conductive filler material (c) is that resistivity is less than 1.0 * 10
-5The silver powder of Ω cm, copper powder, and resistivity is between 1.0 * 10
-2Any in the Graphite Powder 99 of ~ 50 Ω cm, Shawinigan black, the carbon fiber or two or more mixture in the middle of them; Wherein conductive filler material (c) is to 500 micrometer ranges at 0.01 micron;
Described antistructurizing agent (d) is any in small molecular weight hydroxy silicon oil, hexamethyldisilazane, the dimethyldimethoxysil,ne or two or more mixture in the middle of them, and wherein the weight-average molecular weight of small molecular weight hydroxy silicon oil is in the 300-2000 scope.
2. according to claim 1 conductive liquid silicon rubber-based adhesive is characterized in that it can also comprise 0 ~ 80 mass parts silicone resin (e), and the molecular formula of silicone resin (e) is as follows:
In the formula: p=0.6 ~ 0.9, q=0 ~ 0.1, z=1.
3. the method for the conductive liquid silicon rubber-based adhesive of preparation claim 1 is characterized in that comprising the steps:
(1) poly-diorganosiloxane (a), 10-60 mass parts reinforced filling (b), 10-60 mass parts conductive filler material (c), the 5-25 mass parts antistructurizing agent (d) with the unsaturated aliphatic hydrocarbon base end-blocking of 100 mass parts mixed 1-6 hour in vacuum kneader;
(2) be warming up to 140-180 ℃ and add hot milling 2-6 hour;
(3) through 1 minute-4 hours the low molecule of time vacuum removal, dilution was cooled off;
(4) cooled material is made liquid silicon rubber sizing through grinding, filtering.
4. the method for the conductive liquid silicon rubber-based adhesive of preparation claim 2 is characterized in that comprising the steps:
(1) poly-diorganosiloxane (a), 10-60 mass parts reinforced filling (b), 10-60 mass parts conductive filler material (c), the 5-25 mass parts antistructurizing agent (d) with the unsaturated aliphatic hydrocarbon base end-blocking of 100 mass parts mixed 1-6 hour in vacuum kneader;
(2) be warming up to 140-180 ℃ and add hot milling 2-6 hour;
(3) through 1 minute-4 hours the low molecule of time vacuum removal, dilution was cooled off;
(4) cooled material is made liquid silicon rubber sizing through grinding, filtering,
After wherein removing in step (3) hanged down molecule, add poly-diorganosiloxane (a) and optional 0 ~ 80 mass parts silicone resin (e) that adds of 0-100 mass parts at the dilution cooling stages.
5. conducting liquid rubber composition is characterized in that it is comprised of component (A) and the quality proportioning of component (B) according to 1:1:
Above-mentioned component (A) comprising: 100 mass parts liquid silicon rubber sizing according to claim 1, the addition reaction catalyst of 0.05-0.5 mass parts (f);
Above-mentioned component (B) comprising: 100 mass parts liquid silicon rubber sizing according to claim 1, the pigment (j) of the addition reaction inhibitor (i) of the linking agent of 2-10 mass parts (h), 0.04-0.5 mass parts and optional 0.03-2.0 mass parts.
6. according to claim 5 conducting liquid rubber composition is characterized in that any in platinum class catalyzer, palladium class catalyzer or the rhodium class catalyzer of described addition reaction catalyst (f);
Described linking agent (h) is organic hydrogen based polysiloxane, and its general molecular formula is:
In the formula: x=0 ~ 100, y=2 ~ 30;
R3, R4 can be methyl or hydrogen base independently, but contain at least two hydrogen bases in each molecule.
7. according to claim 5 conducting liquid rubber composition is characterized in that described addition reaction inhibitor (i) is the compound that contains ethynyl.
8. the preparation method of the conducting liquid rubber composition of claim 5 is characterized in that comprising the steps:
⑴ add 100 mass parts liquid silicon rubber sizing according to claim 1 the addition reaction catalyst (f) of 0.05-0.5 mass parts, and after stirring, de-bubbled is filtered, and namely gets component (A);
⑵ add 100 mass parts liquid silicon rubber sizing according to claim 1 linking agent (h), the addition reaction inhibitor (i) of 0.04-0.5 mass parts and the pigment (j) of 0.03-2.0 mass parts of 2-10 mass parts, after stirring, de-bubbled, filter, namely get component (B);
⑶ component (A) mixes with the quality proportioning of component (B) according to 1:1, forms the conducting liquid rubber composition.
9. the conducting liquid rubber composition of claim 5 is characterized in that for the preparation of the purposes of conductive silicon rubber goods described conducting liquid rubber composition is expelled in the mould, is heating and curing to make conductive silicon rubber goods or conductive elastomer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010560820 CN102010600B (en) | 2010-11-26 | 2010-11-26 | Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010560820 CN102010600B (en) | 2010-11-26 | 2010-11-26 | Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102010600A CN102010600A (en) | 2011-04-13 |
| CN102010600B true CN102010600B (en) | 2013-01-16 |
Family
ID=43840938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010560820 Active CN102010600B (en) | 2010-11-26 | 2010-11-26 | Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102010600B (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102276988B (en) * | 2011-06-08 | 2012-10-31 | 北京工业大学 | Mono-component Ni-C filled-type FIP (Form In Place) heat-curing highly-conductive silicone rubber and preparation method thereof |
| CN102277128A (en) * | 2011-06-15 | 2011-12-14 | 浙江科创新材料科技有限公司 | Conductive silicone rubber adhesive moulded on-site at room temperature and application method |
| CN102570376A (en) * | 2012-01-18 | 2012-07-11 | 中科英华高技术股份有限公司 | Production method of insulation intermediate connector |
| CN102942896B (en) * | 2012-11-21 | 2013-09-25 | 江苏创景科技有限公司 | Single-component addition type high adhesion organic silicon rubber |
| CN103031058B (en) * | 2012-12-31 | 2015-06-03 | 武汉今福科技有限公司 | Room temperature vulcanized silicone rubber electromagnetic shielding paint and preparation method thereof |
| EP2966765A1 (en) * | 2014-07-11 | 2016-01-13 | ABB Technology Oy | Converter system with DC conductors comprising carbon fibres |
| CN104177833A (en) * | 2014-08-12 | 2014-12-03 | 上海柯金电子科技有限公司 | Conductive heat-conducting composite material and application thereof |
| WO2016208059A1 (en) * | 2015-06-26 | 2016-12-29 | ポリマテック・ジャパン株式会社 | Conductive member |
| CN106928725A (en) * | 2015-12-31 | 2017-07-07 | 蓝星有机硅（上海）有限公司 | conductive curable organic silicon rubber |
| CN106085340B (en) * | 2016-06-12 | 2019-01-11 | 江苏明昊新材料科技股份有限公司 | High heat-conductivity conducting elargol with thixotropic behavior and preparation method thereof |
| CN106085341B (en) * | 2016-06-12 | 2019-01-11 | 江苏明昊新材料科技股份有限公司 | Single-component silicone conductive silver glue and preparation method thereof |
| CN106590520B (en) * | 2016-11-14 | 2019-11-01 | 广州市白云化工实业有限公司 | The liquid silastic and preparation method thereof of selective self-adhesion |
| CN106617344B (en) * | 2017-02-15 | 2018-08-21 | 明新弹性织物（中国）有限公司 | A kind of the steel ring band and its manufacturing method of built-in silica gel |
| CN106914613A (en) * | 2017-03-31 | 2017-07-04 | 合肥悦兰信息技术有限公司 | The method for producing conductive particle as matrix modification with nano silicon |
| CN107880557B (en) * | 2017-12-25 | 2021-02-23 | 广东标美硅氟新材料有限公司 | High-expansion-ratio silicone rubber cold-shrink tube and preparation method and application thereof |
| WO2020025025A1 (en) | 2018-08-01 | 2020-02-06 | 江西蓝星星火有机硅有限公司 | Conductive liquid silicone rubber and preparation method and use thereof |
| CN110791103B (en) * | 2018-08-01 | 2022-09-06 | 江西蓝星星火有机硅有限公司 | Novel conductive liquid silicone rubber and preparation method and application thereof |
| CN109266017B (en) * | 2018-09-29 | 2021-12-24 | 上海道氟实业有限公司 | Preparation method of high-strength and high-performance rubber material |
| CN110396296A (en) * | 2019-07-29 | 2019-11-01 | 河南三创硅业有限公司 | A kind of hardness is 80A silica gel roll material and method |
| CN113652090A (en) * | 2021-04-27 | 2021-11-16 | 江门市胜鹏化工实业有限公司 | Liquid silicone rubber composition and method for preparing silicone rubber |
| CN114479467A (en) * | 2021-12-18 | 2022-05-13 | 航天长屏科技有限公司 | Ultra-soft high-resilience electromagnetic shielding rubber and preparation method thereof |
| CN114479757A (en) * | 2022-03-02 | 2022-05-13 | 深圳市美宝昕新材料有限公司 | Environment-friendly vulcanized silicone rubber for fixing electronic element and preparation method thereof |
| CN116102890A (en) * | 2023-02-09 | 2023-05-12 | 广州回天新材料有限公司 | Organic silicon rubber composition and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1730561A (en) * | 2005-08-08 | 2006-02-08 | 广州天赐有机硅科技有限公司 | Liquid silicon rubber sizing, liquid silicon rubber material and their preparation method |
| CN101575454A (en) * | 2008-11-12 | 2009-11-11 | 广东标美硅氟精细化工研究所有限公司 | Liquid conductive silastic used for electric stress control and preparation method thereof |
-
2010
- 2010-11-26 CN CN 201010560820 patent/CN102010600B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1730561A (en) * | 2005-08-08 | 2006-02-08 | 广州天赐有机硅科技有限公司 | Liquid silicon rubber sizing, liquid silicon rubber material and their preparation method |
| CN101575454A (en) * | 2008-11-12 | 2009-11-11 | 广东标美硅氟精细化工研究所有限公司 | Liquid conductive silastic used for electric stress control and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102010600A (en) | 2011-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102010600B (en) | Conductive liquid silicon rubber-based adhesive and preparation method for composition thereof | |
| CN100368479C (en) | Liquid silicon rubber sizing, liquid silicon rubber material and their preparation method | |
| CN111057379B (en) | High-thermal-conductivity insulating silicone rubber composite material containing carbon fibers and preparation method thereof | |
| CN104072998A (en) | Base rubber material of high dielectric constant liquid silicone rubber and application thereof in composition | |
| CN113429930B (en) | Addition type bi-component organic silicon pouring sealant and preparation method thereof | |
| CN102977613B (en) | Method for preparing halogen-free and flame-retardant silicon rubber | |
| CN106701012B (en) | Light-weight heat-conducting organic silicon pouring sealant base rubber material, composition and preparation method of light-weight heat-conducting organic silicon pouring sealant base rubber material | |
| CN110564107B (en) | Efficient electromagnetic shielding composite material and preparation method thereof | |
| CN107189445A (en) | One kind is used for highly conductive liquid silicon rubber composition of injection moulding and preparation method thereof | |
| JPH03146557A (en) | Electrically conductive silicone rubber composition and cured product thereof | |
| CN104449239A (en) | Nitrogen-doped graphene composited electromagnetic shielding type electricity conductive primer and preparation method thereof | |
| EP3835362A1 (en) | Conductive liquid silicone rubber and preparation method and use thereof | |
| CN104530873A (en) | Copper-based electromagnetic shielding coating and preparation method thereof | |
| CN101891936B (en) | Preparation method of composite material based on epoxy resin and phosphazene nanotubes | |
| CN109320968B (en) | Composite permanent antistatic agent and application thereof | |
| CN105838077A (en) | Surface treatment method of graphene used for producing heat conducting silicon sheets | |
| CN105461963A (en) | Surface-organically-modified boron nitride powder, preparation method and applications thereof | |
| CN110922762A (en) | High-conductivity silica gel composition based on conductive powder wet modification technology | |
| CN106916451A (en) | A kind of conductive rubber composition and preparation method thereof | |
| CN104356737B (en) | A kind of special high conductive material of conductive powder paint and preparation method | |
| Zhou et al. | Preparation of SiO2 particles with silicone-methoxy groups on surface and its co-curing hydroxyl silicone oil | |
| CN104530775A (en) | Preparation method of graphene nanofiller for epoxy molding compound modification | |
| CN103509253B (en) | A kind of rubber combination of electric cable of submersible pump rubber sheath | |
| CN110845851B (en) | Liquid conductive adhesive for power cable accessories and preparation method thereof | |
| CN106221223A (en) | High-tensile rubber composition and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220119 Address after: 510760, Guangzhou, Guangdong province Whampoa District Po Po Industrial Zone, East Road, Tat Tat Road, No. 8 Patentee after: GUANGZHOU TINCI MATERIALS TECHNOLOGY Co.,Ltd. Address before: 510760, Guangdong, Guangzhou province Whampoa District Po Po Industrial Zone East Cheng Cheng Patentee before: GUANGZHOU TIANCI ORGANIC SILICON TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |