CN102006732A - Circuit board assembling method, circuit board assembly and electronic device - Google Patents
Circuit board assembling method, circuit board assembly and electronic device Download PDFInfo
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- CN102006732A CN102006732A CN2010105571434A CN201010557143A CN102006732A CN 102006732 A CN102006732 A CN 102006732A CN 2010105571434 A CN2010105571434 A CN 2010105571434A CN 201010557143 A CN201010557143 A CN 201010557143A CN 102006732 A CN102006732 A CN 102006732A
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- circuit board
- connection gasket
- adhesive layer
- conductive adhesive
- salient points
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Abstract
The invention provides a circuit board assembling method, a circuit board assembly and an electronic device. The circuit board assembling method comprises the following steps: providing a first circuit board, wherein the first circuit board comprises at least one first connecting pad; attaching a first conductive adhesive layer on the first connecting pad; providing a second circuit board, wherein the second circuit board comprises at least one second connecting pad; attaching a second conductive adhesive layer on the second connecting pad; and laminating the first circuit board and the second circuit board, so that the first conductive adhesive layer is stuck to the second conductive adhesive layer, and the first circuit board is electrically connected with the second circuit board. In the circuit board assembling method and the circuit board assembly, use of welding flux which can easily cause environmental pollution is avoided, and machines can be used to carry out automatic operation, thereby reducing the human power and enhancing the production efficiency.
Description
Technical field
The present invention relates to a kind of circuit board combination method, circuit board group component and electronic installation, particularly about a kind of by the bonding circuit board combination method of conductive adhesive layer, circuit board group component and the electronic installation that uses this circuit board group component.
Background technology
At present, progress and social development along with electronics technology have become people's daily necessities as various electronic installations such as display, TV, computer, refrigerators.Circuit board is the requisite element that transmits the signal of telecommunication in various electronic installations, the LED mounting circuit boards that the drive circuit board that drives panel is for example arranged in liquid crystal panel and be used for the LED power supply.In order to connect LED mounting circuit boards and drive circuit board, commonly used is by the form of drawing weldering LED mounting circuit boards and drive circuit board to be combined now, draws weldering need use leaded scolding tin, causes the pollution of environment in a large amount of industrial production easily.In addition, drawing weldering is manual work, and operating efficiency is difficult to significantly promote, and influences the raising of productivity ratio.
Summary of the invention
In view of this, the invention provides a kind of circuit board combination method, it comprises: first circuit board is provided, and this first circuit board comprises at least one first connection gasket; Stick first conductive adhesive layer on this first connection gasket; Second circuit board is provided, and this second circuit board comprises at least one second connection gasket; Stick second conductive adhesive layer on this second connection gasket; This first circuit board of pressing and this second circuit board make this first conductive adhesive layer and this second conductive adhesive layer bonding and this first circuit board and the electric connection of this second circuit board.
According to described circuit board combination method, this first conductive adhesive layer and this second conductive adhesive layer are conducting adhesive cloth, conductive glue or aeolotropic conductive.
According to described circuit board combination method, this first circuit board and this second circuit board are all flexible PCB; Perhaps, one of them of this first circuit board and this second circuit board is flexible PCB.
According to an embodiment, the invention provides a kind of circuit board combination method, it comprises: first circuit board is provided, and this first circuit board comprises at least one first connection gasket, this first connection gasket has a plurality of first salient points, and this first circuit board is opposing to have first surface in this first connection gasket; Second circuit board is provided, and this second circuit board comprises at least one second connection gasket, and this second connection gasket has a plurality of second salient points, and this second circuit board has second surface corresponding to this second connection gasket; Be oppositely arranged this first circuit board and this second circuit board, those first salient points and those second salient points are electrically connected; Stick insulating tape in the first surface of this first circuit board and the second surface of this second circuit board, to fix this first circuit board and this second circuit board.
According to an embodiment, the invention provides a kind of circuit board group component, it comprises first circuit board, second circuit board and conductive adhesive layer.This first circuit board comprises at least one first connection gasket; This second circuit board comprises at least one second connection gasket; This conductive adhesive layer is arranged between this first connection gasket and this second connection gasket with bonding this first circuit board and this second circuit board, and this first circuit board and this second circuit board electrically connect.
According to described circuit board group component, this first conductive adhesive layer and this second conductive adhesive layer are conducting adhesive cloth, conductive glue or aeolotropic conductive.
According to an embodiment, the invention provides a kind of electronic installation, it comprises above-mentioned circuit board group component.
According to described electronic installation, this first circuit board is a drive circuit board, and this second circuit board is the LED mounting circuit boards.
According to an embodiment, the invention provides a kind of electronic installation, it comprises first circuit board, second circuit board and adhesive tape.This first circuit board comprises at least one first connection gasket, and this first connection gasket has a plurality of first salient points, and this first circuit board is opposing to have first surface in this first connection gasket; This second circuit board comprises at least one second connection gasket, and this second connection gasket has a plurality of second salient points, and this second circuit board has second surface corresponding to this second connection gasket, and those second salient points and those first salient points are oppositely arranged and electrically connect; This adhesive tape sticks in the first surface of this first circuit board and the second surface of this second circuit board, to fix this first circuit board and this second circuit board.
According to described electronic installation, this first circuit board is a drive circuit board, and this second circuit board is the LED mounting circuit boards.
Circuit board combination method of the present invention and circuit board group component avoid using the scolder that causes environmental pollution easily, can use the board automated job simultaneously, reduce manpower, enhance productivity.
Can be further understood by following description of drawings and embodiment detailed description in the advantages and spirit of the present invention.
Description of drawings
Fig. 1 is the end view of first circuit board and second circuit board in the embodiment of the invention circuit board combination method.
Fig. 2 is the end view that adopts the circuit board group component of circuit board combination method assembling of the present invention.
Fig. 3 is the vertical view that adopts the circuit board group component of circuit board combination method assembling of the present invention.
Fig. 4 is the end view of first circuit board and second circuit board in another embodiment circuit board combination method of the present invention.
Fig. 5 is the end view after first circuit board and second circuit board are fitted among Fig. 4.
Fig. 6 is the vertical view that adopts the circuit board group component of circuit board combination method assembling of the present invention.
Embodiment
Please be simultaneously referring to figs. 1 through Fig. 3, Fig. 1 is the end view of first circuit board and second circuit board in the embodiment of the invention circuit board combination method, Fig. 2 is the end view that adopts the circuit board group component of circuit board combination method assembling of the present invention, and Fig. 3 is the vertical view that adopts the circuit board group component of circuit board combination method assembling of the present invention.As shown in the figure, provide a kind of circuit board combination method according to this embodiment, it comprises: first circuit board 11 is provided, and this first circuit board 11 comprises at least one first connection gasket 13; Stick first conductive adhesive layer 15 on this first connection gasket 13; Second circuit board 12 is provided, and this second circuit board 12 comprises at least one second connection gasket 14; Stick second conductive adhesive layer 16 on this second connection gasket 14; Pressing this first circuit board 11 and this second circuit board 12 make this first conductive adhesive layer 15 and 16 bonding and this first circuit board 11 and 12 electric connections of this second circuit board of this second conductive adhesive layer, form circuit board group component 100.According to described circuit board combination method, this first conductive adhesive layer 15 and this second conductive adhesive layer 16 are conducting adhesive cloth, conductive glue or aeolotropic conductive.The benefit of this method is, before this first circuit board 11 of combination and this second circuit board 12, produce the semi-finished product that stick conductive adhesive layer earlier, can be when needs are assembled with these first circuit board 11 and these second circuit board 12 quick-bindings, by this conductive adhesive layer 17 bonding these first circuit boards 11 and this second circuit board 12 and make this first circuit board 11 and this second circuit board 12 electrically connects, circuit board combination method of the present invention can be used the board automated job, reduce manpower, significantly enhance productivity.
According to described circuit board combination method, this first circuit board 11 and this second circuit board 12 are all flexible PCB; Perhaps, one of them of this first circuit board 11 and this second circuit board 12 is flexible PCB.This first conductive adhesive layer 15 and this second conductive adhesive layer 16 are conducting adhesive cloth, conductive glue or aeolotropic conductive.
According to an embodiment, the invention provides a kind of circuit board group component 100, it comprises first circuit board 11, second circuit board 12 and conductive adhesive layer 17.This first circuit board 11 comprises at least one first connection gasket 13; This second circuit board 12 comprises at least one second connection gasket 14; This conductive adhesive layer 17 is arranged between this first connection gasket 13 and this second connection gasket 14 with bonding this first circuit board 11 and this second circuit board 12, and this first circuit board 11 and this second circuit board 12 electrically connect.
According to an embodiment, the invention provides a kind of electronic installation, it comprises above-mentioned circuit board group component 100.As an embodiment, described electronic installation can be liquid crystal panel, but not as limit, wherein this first circuit board 11 is a drive circuit board, and this second circuit board 12 is the LED mounting circuit boards.
Please be simultaneously with reference to Fig. 4 to Fig. 6, Fig. 4 is the end view of first circuit board and second circuit board in another embodiment circuit board combination method of the present invention, Fig. 5 is the end view after first circuit board and second circuit board are fitted among Fig. 4, and Fig. 6 is the vertical view that adopts the circuit board group component of circuit board combination method assembling of the present invention.As shown in the figure, provide a kind of circuit board combination method according to this embodiment, it comprises: first circuit board 21 is provided, this first circuit board 21 comprises at least one first connection gasket 23, this first connection gasket 23 has a plurality of first salient points 25, and this first circuit board 21 is opposing to have first surface in this first connection gasket 23; Second circuit board 22 is provided, and this second circuit board 22 comprises at least one second connection gasket 24, and this second connection gasket 24 has a plurality of second salient points 26, and this second circuit board 22 has second surface corresponding to this second connection gasket 24; Be oppositely arranged this first circuit board 21 and this second circuit board 22, those first salient points 25 and those second salient points 26 are electrically connected; Stick insulating tape 27 in the first surface of this first circuit board 21 and the second surface of this second circuit board 22, to fix this first circuit board 21 and this second circuit board 22.This embodiment has two tangible advantages: 1, be that first salient point 25 and second salient point 26 are circle or dentation, increase the contact area of first connection gasket 23 and second connection gasket 24 with this, improve the stability of the electric connection of first circuit board 21 and second circuit board 22; 2, be the use that this embodiment is omitted conducting resinl or scolding tin, more environmental protection and saving cost.
According to an embodiment, the invention provides a kind of electronic installation, it comprises first circuit board 21, second circuit board 22 and insulating tape 27.This first circuit board 21 comprises at least one first connection gasket 23, and this first connection gasket has a plurality of first salient points 25, and this first circuit board 21 is opposing to have first surface in this first connection gasket 23; This second circuit board 22 comprises at least one second connection gasket 24, this second connection gasket has a plurality of second salient points 26, this second circuit board 22 has second surface corresponding to this second connection gasket 24, and those second salient points 26 are oppositely arranged and electrically connect with those first salient points 25; This insulating tape 27 sticks on the second surface of the first surface of this first circuit board 21 and this second circuit board 22, to fix this this first circuit board 21 and this second circuit board 22.Electronic installation of the present invention can be liquid crystal panel, but not as limit, described first circuit board 21 is a drive circuit board, and described second circuit board 22 is the LED mounting circuit boards.
Circuit board combination method of the present invention and circuit board group component avoid using the scolder that causes environmental pollution easily, can use the board automated job simultaneously, reduce manpower, enhance productivity.
According to the detailed description of above embodiment, hope can be known description feature of the present invention and spirit more, and is not to come the present invention is limited with above-mentioned disclosed embodiment.
Claims (10)
1. circuit board combination method is characterized in that comprising:
First circuit board is provided, and this first circuit board comprises at least one first connection gasket;
Stick first conductive adhesive layer on this first connection gasket;
Second circuit board is provided, and this second circuit board comprises at least one second connection gasket;
Stick second conductive adhesive layer on this second connection gasket;
This first circuit board of pressing and this second circuit board make this first conductive adhesive layer and this second conductive adhesive layer bonding and this first circuit board and the electric connection of this second circuit board.
2. circuit board combination method according to claim 1 is characterized in that: this first conductive adhesive layer and this second conductive adhesive layer are conducting adhesive cloth, conductive glue or aeolotropic conductive.
3. circuit board combination method according to claim 1 is characterized in that: this first circuit board and this second circuit board are all flexible PCB; Perhaps, one of them of this first circuit board and this second circuit board is flexible PCB.
4. circuit board combination method is characterized in that comprising:
First circuit board is provided, and this first circuit board comprises at least one first connection gasket, and this first connection gasket has a plurality of first salient points, and this first circuit board is opposing to have first surface in this first connection gasket;
Second circuit board is provided, and this second circuit board comprises at least one second connection gasket, and this second connection gasket has a plurality of second salient points, and this second circuit board has second surface corresponding to this second connection gasket;
Be oppositely arranged this first circuit board and this second circuit board, those first salient points and those second salient points are electrically connected;
Stick insulating tape in the first surface of this first circuit board and the second surface of this second circuit board, to fix this first circuit board and this second circuit board.
5. a circuit board group component is characterized in that, comprises:
First circuit board, this first circuit board comprise at least one first connection gasket;
Second circuit board, this second circuit board comprise at least one second connection gasket;
Conductive adhesive layer is arranged between this first connection gasket and this second connection gasket with bonding this first circuit board and this second circuit board, and this first circuit board and this second circuit board electrically connect.
6. circuit board group component according to claim 5 is characterized in that: this first conductive adhesive layer and this second conductive adhesive layer are conducting adhesive cloth, conductive glue or aeolotropic conductive.
7. an electronic installation is characterized in that: comprise as the described circuit board group component of any claim in the claim 5 to 6.
8. electronic installation according to claim 7 is characterized in that: this first circuit board is a drive circuit board, and this second circuit board is the LED mounting circuit boards.
9. electronic installation is characterized in that comprising:
First circuit board, this first circuit board comprise at least one first connection gasket, and this first connection gasket has a plurality of first salient points, and this first circuit board is opposing to have first surface in this first connection gasket;
Second circuit board, this second circuit board comprises at least one second connection gasket, this second connection gasket has a plurality of second salient points, and this second circuit board has second surface corresponding to this second connection gasket, and those second salient points and those first salient points are oppositely arranged and electrically connect; And
Insulating tape sticks in the first surface of this first circuit board and the second surface of this second circuit board, to fix this first circuit board and this second circuit board.
10. electronic installation according to claim 9 is characterized in that: this first circuit board is a drive circuit board, and this second circuit board is the LED mounting circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105571434A CN102006732A (en) | 2010-11-10 | 2010-11-10 | Circuit board assembling method, circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105571434A CN102006732A (en) | 2010-11-10 | 2010-11-10 | Circuit board assembling method, circuit board assembly and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102006732A true CN102006732A (en) | 2011-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105571434A Pending CN102006732A (en) | 2010-11-10 | 2010-11-10 | Circuit board assembling method, circuit board assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102006732A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300403A (en) * | 2011-07-11 | 2011-12-28 | 深圳市华星光电技术有限公司 | Printed circuit board (PCB) connecting structure and connecting method |
| CN103323916A (en) * | 2012-03-22 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | High frequency transmission module and optical fiber connector |
| CN104901040A (en) * | 2015-04-23 | 2015-09-09 | 合肥京东方光电科技有限公司 | Circuit board connection structure and display device |
| CN105449476A (en) * | 2015-12-29 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board connection assembly and mobile terminal |
-
2010
- 2010-11-10 CN CN2010105571434A patent/CN102006732A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300403A (en) * | 2011-07-11 | 2011-12-28 | 深圳市华星光电技术有限公司 | Printed circuit board (PCB) connecting structure and connecting method |
| CN102300403B (en) * | 2011-07-11 | 2013-04-24 | 深圳市华星光电技术有限公司 | Printed circuit board (PCB) connecting structure and connecting method |
| CN103323916A (en) * | 2012-03-22 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | High frequency transmission module and optical fiber connector |
| CN104901040A (en) * | 2015-04-23 | 2015-09-09 | 合肥京东方光电科技有限公司 | Circuit board connection structure and display device |
| US9583855B2 (en) | 2015-04-23 | 2017-02-28 | Boe Technology Group Co., Ltd. | Circuit board device and display apparatus |
| CN105449476A (en) * | 2015-12-29 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board connection assembly and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110406 |