CN102005445A - Led光源模块封装结构 - Google Patents

Led光源模块封装结构 Download PDF

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Publication number
CN102005445A
CN102005445A CN2010102995730A CN201010299573A CN102005445A CN 102005445 A CN102005445 A CN 102005445A CN 2010102995730 A CN2010102995730 A CN 2010102995730A CN 201010299573 A CN201010299573 A CN 201010299573A CN 102005445 A CN102005445 A CN 102005445A
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Prior art keywords
source module
light source
led
reflector
led chip
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CN2010102995730A
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何文铭
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FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
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FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
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Priority to CN2010102995730A priority Critical patent/CN102005445A/zh
Priority to PCT/CN2010/078620 priority patent/WO2012040956A1/zh
Publication of CN102005445A publication Critical patent/CN102005445A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供了一种LED光源模块封装结构，属于照明设备的加工领域，其包括一具有反光杯的底座，底座的反光杯底部中央设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，其特征在于：所述LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层，所述芯片之间通过导线连接后引出正负极。

Description

LED光源模块封装结构
【技术领域】
本发明涉及一种照明设备，尤其涉及一种LED光源模块。
【背景技术】
LED是一种低电压光源，由于其省电、寿命长，现已被广泛应用于各种低压照明装置，传统的LED光源模块封装结构一般包括一具有反光杯的金属底座，在底座的反光杯底部中央设有若干LED芯片，该LED芯片通过焊接方式或者绝缘胶均匀地粘在反光杯的底部中央，LED芯片之间通过导线相串联或者并联后引出，连接至设置在金属底座上的反光杯外部的线路板，再将LED芯片的上表面涂敷一胶水与荧光粉混合层后使LED芯片被完全覆盖在混合层内部。上述传统的LED光源模块封装结构中，为了节约成本，因此所述胶水与荧光粉混合层采用的大都是软硅胶，但其光效损失较大，若采用硬硅胶则可以提高光效，但同时LED模块的成本会大幅增加，不利于工业上的大规模生产。
【发明内容】
本发明要解决的技术问题，在于提供一种既能够节省生产成本，又可以保持较好的光效的LED光源模块封装结构。
本发明是这样实现的：一种LED光源模块封装结构，包括一具有反光杯的底座，底座的反光杯底部中央设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，所述LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层，所述芯片之间通过导线连接后引出正负极。
所述底座上设有绝缘片，所述LED芯片经串联或并联连接后引出至绝缘片。
所述底座的上表面设有一电镀的反光层。
所述底座和反光杯均为圆形。
所述绝缘片为玻璃纤维片，绝缘片上设有印刷电路。
本发明具有如下优点：采用上述将LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层的双胶层结构，可以大大节省了生产成本，并且其光效损失极少，有利于大批量的工业化生产。
【附图说明】
下面参照附图结合实施例对本发明作进一步的说明。
图1是本发明的实施例一的整体结构示意图。
图2是图1的A-A剖视图。
【具体实施方式】
下面结合具体实施例来对本发明进行详细的说明。
请参阅图1至图2所示，是本发明的所述的LED光源模块封装结构，包括底座11、LED芯片12、绝缘胶13、胶水与荧光粉混合层14、反光杯15、线路板16、硬硅胶层17、导线18。
所述底座11的中央设有一反光杯15，本实施例中的底座11和反光杯15均为圆形，所述底座11为铜制一体成型，其上表面有一电镀的反光层，在本实施例中该反光层为镀银层，反光杯15的底部设有若干LED芯片12，这些LED芯片12通过绝缘胶粘在反光杯15的底部，所述LED芯片12的表面周围涂敷有一硬硅胶层17，在该硬硅胶层17的外部还涂敷有一胶水与荧光粉混合层14，底座11上还预留有容纳线路板16的小槽，将线路板16安装在该小槽内后，所述若干LED芯片12之间用导线18经串联或并联后引出连接至线路板16，形成正负极。
上述实施例中，所述底座也不局限于圆形，可以做成方形或者长条形等形状，仍然可以达到前述的发明目的。

Claims (5)

1.一种LED光源模块封装结构，包括一具有反光杯的底座，底座的反光杯底部中央设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，其特征在于：所述LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层，所述芯片之间通过导线连接后引出正负极。
2.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座上设有绝缘片，所述LED芯片经串联或并联连接后引出至绝缘片。
3.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座的上表面设有一电镀的反光层。
4.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座和反光杯均为圆形。
5.根据权利要求2所述的LED光源模块封装结构，其特征在于：所述绝缘片为玻璃纤维片，绝缘片上设有印刷电路。 
CN2010102995730A 2010-09-30 2010-09-30 Led光源模块封装结构 Pending CN102005445A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290410A (zh) * 2011-08-16 2011-12-21 陈炜旻 Led面光源及其制造方法
CN102299247A (zh) * 2011-05-20 2011-12-28 浙江英特来光电科技有限公司 一种全户外led模组
CN102306695A (zh) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 Led光源单杯模块用镀陶瓷层底座

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287208A1 (en) * 2006-05-17 2007-12-13 3M Innovative Properties Company Method of Making Light Emitting Device With Multilayer Silicon-Containing Encapsulant
CN101399304A (zh) * 2007-09-27 2009-04-01 海立尔股份有限公司 具有多层光学透镜的发光二极管的制造方法及其结构
CN201820757U (zh) * 2010-09-30 2011-05-04 福建省万邦光电科技有限公司 Led光源模块封装结构

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7405433B2 (en) * 2005-02-22 2008-07-29 Avago Technologies Ecbu Ip Pte Ltd Semiconductor light emitting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287208A1 (en) * 2006-05-17 2007-12-13 3M Innovative Properties Company Method of Making Light Emitting Device With Multilayer Silicon-Containing Encapsulant
CN101399304A (zh) * 2007-09-27 2009-04-01 海立尔股份有限公司 具有多层光学透镜的发光二极管的制造方法及其结构
CN201820757U (zh) * 2010-09-30 2011-05-04 福建省万邦光电科技有限公司 Led光源模块封装结构

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299247A (zh) * 2011-05-20 2011-12-28 浙江英特来光电科技有限公司 一种全户外led模组
CN102290410A (zh) * 2011-08-16 2011-12-21 陈炜旻 Led面光源及其制造方法
CN102290410B (zh) * 2011-08-16 2016-09-07 陈炜旻 Led面光源及其制造方法
CN102306695A (zh) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 Led光源单杯模块用镀陶瓷层底座

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Application publication date: 20110406