CN102005405A - 钨栓塞的制造方法 - Google Patents
钨栓塞的制造方法 Download PDFInfo
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- CN102005405A CN102005405A CN2009101947811A CN200910194781A CN102005405A CN 102005405 A CN102005405 A CN 102005405A CN 2009101947811 A CN2009101947811 A CN 2009101947811A CN 200910194781 A CN200910194781 A CN 200910194781A CN 102005405 A CN102005405 A CN 102005405A
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CN2009101947811A CN102005405A (zh) | 2009-08-28 | 2009-08-28 | 钨栓塞的制造方法 |
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CN2009101947811A CN102005405A (zh) | 2009-08-28 | 2009-08-28 | 钨栓塞的制造方法 |
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CN102005405A true CN102005405A (zh) | 2011-04-06 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104347491A (zh) * | 2013-08-09 | 2015-02-11 | 上海华虹宏力半导体制造有限公司 | 钨沉积的方法 |
CN104752320A (zh) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
CN105097474A (zh) * | 2014-05-09 | 2015-11-25 | 中国科学院微电子研究所 | 一种半导体器件的制造方法 |
CN106033714A (zh) * | 2015-03-10 | 2016-10-19 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
CN109256358A (zh) * | 2017-07-14 | 2019-01-22 | 长鑫存储技术有限公司 | 一种导电栓塞的制备方法及具有导电栓塞的半导体器件 |
CN110265354A (zh) * | 2018-03-12 | 2019-09-20 | 长鑫存储技术有限公司 | 钨塞及其制备方法 |
CN111162039A (zh) * | 2018-11-08 | 2020-05-15 | 长鑫存储技术有限公司 | 金属导电结构及半导体器件的制备方法 |
CN113192881A (zh) * | 2021-04-29 | 2021-07-30 | 广州粤芯半导体技术有限公司 | 一种互连结构的形成方法 |
-
2009
- 2009-08-28 CN CN2009101947811A patent/CN102005405A/zh active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104347491A (zh) * | 2013-08-09 | 2015-02-11 | 上海华虹宏力半导体制造有限公司 | 钨沉积的方法 |
CN104347491B (zh) * | 2013-08-09 | 2017-06-06 | 上海华虹宏力半导体制造有限公司 | 钨沉积的方法 |
CN104752320A (zh) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
CN104752320B (zh) * | 2013-12-27 | 2017-12-29 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
CN105097474A (zh) * | 2014-05-09 | 2015-11-25 | 中国科学院微电子研究所 | 一种半导体器件的制造方法 |
CN105097474B (zh) * | 2014-05-09 | 2018-03-06 | 中国科学院微电子研究所 | 一种半导体器件的制造方法 |
CN106033714A (zh) * | 2015-03-10 | 2016-10-19 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
CN109256358A (zh) * | 2017-07-14 | 2019-01-22 | 长鑫存储技术有限公司 | 一种导电栓塞的制备方法及具有导电栓塞的半导体器件 |
CN110265354A (zh) * | 2018-03-12 | 2019-09-20 | 长鑫存储技术有限公司 | 钨塞及其制备方法 |
CN110265354B (zh) * | 2018-03-12 | 2022-07-05 | 长鑫存储技术有限公司 | 钨塞的制备方法 |
CN111162039A (zh) * | 2018-11-08 | 2020-05-15 | 长鑫存储技术有限公司 | 金属导电结构及半导体器件的制备方法 |
CN113192881A (zh) * | 2021-04-29 | 2021-07-30 | 广州粤芯半导体技术有限公司 | 一种互连结构的形成方法 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121108 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20121108 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Application publication date: 20110406 |