CN101998769A - Rigid-flex board and step board and processing method of rigid-flex board and step board - Google Patents
Rigid-flex board and step board and processing method of rigid-flex board and step board Download PDFInfo
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- CN101998769A CN101998769A CN 201010559049 CN201010559049A CN101998769A CN 101998769 A CN101998769 A CN 101998769A CN 201010559049 CN201010559049 CN 201010559049 CN 201010559049 A CN201010559049 A CN 201010559049A CN 101998769 A CN101998769 A CN 101998769A
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Abstract
The embodiment of the invention discloses a processing method of a rigid-flex board and a step board, which comprises the following steps: step A, calculating the sizes of grooves on a printed circuit board (PCB) in advance; step B, grooving on the PCB according to the sizes and processing a backing plate; and step C, putting the backing plate at the grooving position of the PCB and laminating. In the embodiment of the invention, the backing plate is installed in an emptied region of the rigid-flex board and the step board, thereby basically eliminating the difference of the step board, the rigid-flex board and a common plate, and eliminating contraction deformation caused by the difference. By adopting the method, working personnel does not need to collect a large quantity of deformation data of the rigid-flex board and the step board, the problem of deformation of the rigid-flex board and the step board is basically solved, and the costs of the rigid-flex board and the step board are reduced. The embodiment of the invention also discloses the rigid-flex board and the step board processed by adopting the method.
Description
Technical field
The present invention relates to PCB and make the field, more particularly, relate to PCD rigid-flex board and stepped plate and processing method thereof.
Background technology
PCB (Printed Circuit Board, printed circuit board) is the supporter of electronic devices and components, is the supplier that electronic devices and components are electrically connected.Along with components and parts towards miniaturization development, the method that is adopted in the course of processing has: 1, with the surface element device to bury appearance, bury form such as device such as resistance grade, the mode by flush type is built in the pcb board; 2, by non-functional position in the mill off pcb board to save the space, electronic devices and components are installed in wiring board inside, to reach the purpose of saving the space, i.e. stepped plate; 3, press together by rigid plate and flex plate, form existing rigid element, flex section is arranged again,, reach the purpose of saving the space, i.e. rigid-flex board by bending by the good bending performance of flex section.
In above-mentioned second kind and the third processing method, if it is rigid-flexible very near from the face surface, or step is very shallow, very near apart from the plate face, behind the pre-mill off stepped portions and the rigid-flexible position that need leak outside, when pressing,, finally cause product function to lose efficacy because stepped portions is stressed extremely inhomogeneous, and outer central layer is subjected to the huge stress that is difficult to grasp the norms and is out of shape.
Adopt by a large amount of collection deformation datas at present, put out deflection in order, the change on the passing ratio reduces because the product failure that this kind situation causes.The defective of this method is: cause manufacturing cost too high because failure rate is still very high; Cause consuming lot of manpower and material resources at the product initial stage owing to need lot of data to collect, and because product of every replacing just need be collected data again, the practical operation difficulty is big, the cost height.
Summary of the invention
In view of this, the invention provides a kind of rigid-flex board and stepped plate and processing method thereof, reduce production costs to be implemented on the phenomenon basis of reducing distortion.
For achieving the above object, the invention provides following technical scheme:
The processing method of a kind of rigid-flex board and stepped plate comprises step:
Steps A: precompute the size of slotting on the pcb board;
Step B: slot on pcb board according to described size, and the processing backing plate;
Step C: described backing plate is placed pcb board fluting position, carry out lamination.
Preferably, in the processing method of above-mentioned rigid-flex board and stepped plate, described pcb board comprises central layer and PP plate.
Preferably, in the processing method of above-mentioned rigid-flex board and stepped plate, described step B groove is specially:
Slot on described central layer and PP plate according to described size, and the processing backing plate.
Preferably, in the processing method of above-mentioned rigid-flex board and stepped plate, also comprise between described step C and the step B, stack central layer and PP plate.
Preferably, in the processing method of above-mentioned rigid-flex board and stepped plate, described backing plate is a pcb board.
The embodiment of the invention also discloses the rigid-flex board and the stepped plate that process by said method.
From such scheme as can be seen, in the embodiment of the invention by in the etched-off area of rigid-flex board and stepped plate, backing plate being installed, thereby fundamentally accomplish to eliminate stepped plate, rigid-flex board is different with common plate, eliminates the different thus contraction distortions that cause.Owing to adopt said method, therefore need not the deformation data that the staff collects rigid-flex board and stepped plate in a large number, and fundamentally solved rigid-flex board and stepped plate problem on deformation, therefore reduced the cost of rigid-flex board and stepped plate.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The rigid-flex board that provides in the embodiment of the invention or the structural representation of stepped plate are provided Fig. 1;
The rigid-flex board that provides in the embodiment of the invention or the explosive view of stepped plate are provided Fig. 2;
The rigid-flex board that provides in the embodiment of the invention or a kind of flow process chart of stepped plate are provided Fig. 3;
The rigid-flex board that provides in the embodiment of the invention or another flow process chart of stepped plate are provided Fig. 4.
Embodiment
Stepped plate: to save the space, electronic devices and components are installed in wiring board inside by non-functional position in the mill off pcb board, to reach the purpose of saving the space;
Rigid-flex board: press together by rigid plate and flex plate, form existing rigid element, flex section is arranged again,, reach the purpose of saving the space by bending by the good bending performance of flex section;
PCB:Printed Circuit Board, printed circuit board;
Central layer: English: Cross-band Veneer, wood-based plate technical term, central layer are called middle plate, brachymedial plate again.Be the grain direction internal layer veneer vertical with the dash board texture.
The PP plate: be a kind of high polymer, monomer is propylene CH2=CH-CH3, obtains polypropylene by adding the poly-reaction of polypropylene, and chemical formula can be expressed as (C3H6) n, and skeleton symbol can be expressed as (CH2-CH (CH3)-) n.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
The embodiment of the invention discloses the processing method of a kind of rigid-flex board and stepped plate, comprise step:.
The invention provides a kind of rigid-flex board and stepped plate and processing method thereof, please refer to Fig. 3, reduce production costs to be implemented on the phenomenon basis of reducing distortion.Comprise:
Step S101: precompute the size of slotting on the pcb board;
In order to save the space, rigid-flex board and stepped plate all can be provided with fluting, and installation electronic device in fluting can be so that the integrated function of pcb board be more powerful.When the laying condition of design circuit,, comprise that position, shape and depth calculation come out with the size of fluting.
Step S201: slot on pcb board according to described size, and the processing backing plate;
After the size of fluting calculated, process at pcb board according to this size, usually the technology that adopts is for milling, and the design of individual layer pcb board groove does not have specific (special) requirements, requires in each layer groove correspondence mutually for the pcb board of multilayer.According to above-mentioned size backing plate is processed, the deflection of the deflection of backing plate and pcb board is close usually, and perhaps the deflection than pcb board is little, can stop the groove distortion of pcb board on every side so effectively.
Step S301: described backing plate is placed pcb board fluting position, carry out lamination.
For rigid-flex board and stepped plate, all need lamination, backing plate is placed the back just lamination that just needs in the groove, because backing plate supports effectively, therefore, can prevent the distortion of pcb board effectively during lamination in groove.
Pcb board is for improving the performance of pcb board, pcb board is designed to sandwich construction, pass through lamination then, each layer is closely linked, please refer to as 1 and Fig. 2, this pcb board comprises central layer 1 and PP plate 2, central layer 1 and PP plate 2 are staggeredly placed, the superiors' central layer 1 and PP plate 2 offer groove 11 and 21 respectively, in actual production, the particular characteristic that improves pcb board for example is thicker with the size of certain material design.
Pcb board comprises central layer and PP plate in the way, please refer to flow process chart shown in Figure 4, comprising:
Step S101: precompute the size of slotting on the pcb board;
In order to save the space, rigid-flex board and stepped plate all can be provided with fluting, and installation electronic device in fluting can be so that the integrated function of pcb board be more powerful.When the laying condition of design circuit,, comprise that position, shape and depth calculation come out with the size of fluting.
Step S202: slot on described central layer and PP plate according to described size, and the processing backing plate.
In the present embodiment, at first slot at central layer and the corresponding position of PP plate, after fluting is finished with central layer and PP plate according in advance design needs, stack in order, the groove when stacking on it is wanted correspondence mutually.
Step S202: stack central layer and PP plate.
After the size of fluting calculated, process at pcb board according to this size, usually the technology that adopts is for milling, and the design of individual layer pcb board groove does not have specific (special) requirements, requires in each layer groove correspondence mutually for the pcb board of multilayer.According to above-mentioned size backing plate is processed, the deflection of the deflection of backing plate and pcb board is close usually, and perhaps the deflection than pcb board is little, can stop the groove distortion of pcb board on every side so effectively.
Step S301: described backing plate is placed pcb board fluting position, carry out lamination.Before step S301, also comprise stacking central layer and PP plate, stack in the process according to the design needs and stack according to a definite sequence.
In order to guarantee the consistency of backing plate and pcb board type variable, backing plate 3 is a pcb board, and when pcb board was layer structure, backing plate also can be designed to layer structure.
The embodiment of the invention also discloses the rigid-flex board and the stepped plate that process by said method.
From such scheme as can be seen, in the embodiment of the invention by in the etched-off area of rigid-flex board and stepped plate, backing plate being installed, thereby fundamentally accomplish to eliminate stepped plate, rigid-flex board is different with common plate, eliminates the different thus contraction distortions that cause.Owing to adopt said method, therefore need not the deformation data that the staff collects rigid-flex board and stepped plate in a large number, and fundamentally solved rigid-flex board and stepped plate problem on deformation, therefore reduced the cost of rigid-flex board and stepped plate.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the embodiment disclosed method, so description is fairly simple, relevant part partly illustrates referring to method and gets final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (7)
1. the processing method of rigid-flex board and stepped plate is characterized in that, comprises step:
Steps A: precompute the size of slotting on the pcb board;
Step B: slot on pcb board according to described size, and the processing backing plate;
Step C: described backing plate is placed pcb board fluting position, carry out lamination.
2. the processing method of rigid-flex board according to claim 1 and stepped plate is characterized in that, described pcb board comprises central layer and PP plate.
3. the processing method of rigid-flex board according to claim 2 and stepped plate is characterized in that, described step B groove is specially:
Slot on described central layer and PP plate according to described size, and the processing backing plate.
4. the processing method of rigid-flex board according to claim 3 and stepped plate is characterized in that, also comprises between described step C and the step B, stacks central layer and PP plate.
5. the processing method of rigid-flex board according to claim 1 and stepped plate is characterized in that, described backing plate is a pcb board.
6. rigid-flex board, this rigid-flex board processes according to any one processing method of claim 1-5 again.
7. stepped plate, this stepped plate processes according to any one processing method of claim 1-5 again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010559049 CN101998769A (en) | 2010-11-25 | 2010-11-25 | Rigid-flex board and step board and processing method of rigid-flex board and step board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010559049 CN101998769A (en) | 2010-11-25 | 2010-11-25 | Rigid-flex board and step board and processing method of rigid-flex board and step board |
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| CN101998769A true CN101998769A (en) | 2011-03-30 |
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| CN 201010559049 Pending CN101998769A (en) | 2010-11-25 | 2010-11-25 | Rigid-flex board and step board and processing method of rigid-flex board and step board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523685A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacturing method for printed circuit board (PCB) with stepped grooves |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
| CN105163527A (en) * | 2015-09-10 | 2015-12-16 | 珠海城市职业技术学院 | Manufacturing method of semi-flexible circuit board |
| CN105722342A (en) * | 2014-12-17 | 2016-06-29 | 三星电机株式会社 | Flexible printed circuit board and manufacturing method thereof |
| CN114364138A (en) * | 2022-01-18 | 2022-04-15 | 惠州市华盈电子有限公司 | PCB fixing device and working method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101605430A (en) * | 2009-07-16 | 2009-12-16 | 东莞康源电子有限公司 | The compression method of layer gasket of rigid-flexible product |
-
2010
- 2010-11-25 CN CN 201010559049 patent/CN101998769A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101605430A (en) * | 2009-07-16 | 2009-12-16 | 东莞康源电子有限公司 | The compression method of layer gasket of rigid-flexible product |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523685A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacturing method for printed circuit board (PCB) with stepped grooves |
| CN102523685B (en) * | 2011-12-02 | 2013-12-25 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
| CN105722342A (en) * | 2014-12-17 | 2016-06-29 | 三星电机株式会社 | Flexible printed circuit board and manufacturing method thereof |
| CN105722342B (en) * | 2014-12-17 | 2019-08-09 | 三星电机株式会社 | Flexible printed circuit board and its manufacturing method |
| CN105163527A (en) * | 2015-09-10 | 2015-12-16 | 珠海城市职业技术学院 | Manufacturing method of semi-flexible circuit board |
| CN114364138A (en) * | 2022-01-18 | 2022-04-15 | 惠州市华盈电子有限公司 | PCB fixing device and working method thereof |
| CN114364138B (en) * | 2022-01-18 | 2024-04-12 | 惠州市华盈电子有限公司 | Fixing device for PCB body and working method thereof |
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Application publication date: 20110330 |