CN101996907A - 一种晶圆级弹性体压入微球植球装置 - Google Patents
一种晶圆级弹性体压入微球植球装置 Download PDFInfo
- Publication number
- CN101996907A CN101996907A CN 201010276711 CN201010276711A CN101996907A CN 101996907 A CN101996907 A CN 101996907A CN 201010276711 CN201010276711 CN 201010276711 CN 201010276711 A CN201010276711 A CN 201010276711A CN 101996907 A CN101996907 A CN 101996907A
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- CN
- China
- Prior art keywords
- motion
- ball
- microballoon
- elastomer
- pressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001971 elastomer Polymers 0.000 title claims abstract description 45
- 239000000806 elastomer Substances 0.000 title claims abstract description 42
- 239000004005 microsphere Substances 0.000 title abstract 7
- 230000033001 locomotion Effects 0.000 claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 239000004744 fabric Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 208000027418 Wounds and injury Diseases 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102767113A CN101996907B (zh) | 2010-09-09 | 2010-09-09 | 一种晶圆级弹性体压入微球植球装置 |
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CN2010102767113A CN101996907B (zh) | 2010-09-09 | 2010-09-09 | 一种晶圆级弹性体压入微球植球装置 |
Publications (2)
Publication Number | Publication Date |
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CN101996907A true CN101996907A (zh) | 2011-03-30 |
CN101996907B CN101996907B (zh) | 2012-04-18 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103794541A (zh) * | 2014-01-15 | 2014-05-14 | 上海微松工业自动化有限公司 | 用于晶圆级植球机的搭载平台 |
CN103871915A (zh) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | 手动bga植球机 |
CN103904833A (zh) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | 平面电机磁阵列工装装置及其安装方法 |
CN104576415A (zh) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | 一种球栅阵列结构的植球设备 |
CN105789095A (zh) * | 2016-04-12 | 2016-07-20 | 上海微松工业自动化有限公司 | 一种全自动植球机及其植球方法 |
CN106112182A (zh) * | 2016-07-12 | 2016-11-16 | 上海微松工业自动化有限公司 | 一种全自动植球装置及其应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050205995A1 (en) * | 2004-03-18 | 2005-09-22 | Denso Corporation | Wire bonding method and semiconductor device |
CN101106098B (zh) * | 2006-07-12 | 2010-08-25 | 爱立发股份有限公司 | 球填充装置及方法 |
-
2010
- 2010-09-09 CN CN2010102767113A patent/CN101996907B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050205995A1 (en) * | 2004-03-18 | 2005-09-22 | Denso Corporation | Wire bonding method and semiconductor device |
CN101106098B (zh) * | 2006-07-12 | 2010-08-25 | 爱立发股份有限公司 | 球填充装置及方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103904833A (zh) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | 平面电机磁阵列工装装置及其安装方法 |
CN103904833B (zh) * | 2012-12-28 | 2016-08-03 | 上海微电子装备有限公司 | 平面电机磁阵列工装装置及其安装方法 |
CN104576415A (zh) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | 一种球栅阵列结构的植球设备 |
CN103794541A (zh) * | 2014-01-15 | 2014-05-14 | 上海微松工业自动化有限公司 | 用于晶圆级植球机的搭载平台 |
CN103871915A (zh) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | 手动bga植球机 |
CN103871915B (zh) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | 手动bga植球机 |
CN105789095A (zh) * | 2016-04-12 | 2016-07-20 | 上海微松工业自动化有限公司 | 一种全自动植球机及其植球方法 |
CN105789095B (zh) * | 2016-04-12 | 2018-06-29 | 上海微松工业自动化有限公司 | 一种全自动植球机及其植球方法 |
CN106112182A (zh) * | 2016-07-12 | 2016-11-16 | 上海微松工业自动化有限公司 | 一种全自动植球装置及其应用 |
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Publication number | Publication date |
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CN101996907B (zh) | 2012-04-18 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C35 | Partial or whole invalidation of patent or utility model | ||
IP01 | Partial invalidation of patent right |
Commission number: 4W101813 Conclusion of examination: The claim No. 201010276711.3 of the patent for invention No. 1-5 is invalid, and the patent right shall remain valid on the basis of claim 6 and 7 of the authorization notice. Decision date of declaring invalidation: 20130531 Decision number of declaring invalidation: 20719 Denomination of invention: Bumping device for pressing wafer-level elastomer into microsphere Granted publication date: 20120418 Patentee: SHANGHAI WEISONG INDUSTRY AUTOMATION Co.,Ltd.|SHANGHAI MICRO ELECTRONICS EQUIPMENT Co.,Ltd. |