CN101990417B - Photoacoustic imaging devices and methods of imaging - Google Patents
Photoacoustic imaging devices and methods of imaging Download PDFInfo
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Abstract
A photoacoustic medical imaging device may include a substrate, an array of ultrasonic transducers on the substrate, at least one groove etched on the substrate, at least one optical fiber, and at least one facet. Each optical fiber is disposed in one of the grooves. Each facet is etched in one of the grooves and coated with a layer of metal having high infrared reflectivity. Each optical fiber is configured to guide infrared light from a light source through the fiber and toward the respective facet. The facet is configured to reflect the infrared light toward a target.
Description
Coherent reference:
It is 61/007 that the application requires the application number of December in 2007 application on the 10th, the application number of 023 U.S. Provisional Patent Application and application on February 29th, 2008 is 61/032, the priority of 947 U.S. Provisional Patent Application, the application's technology contents disclosed herein will be included above-mentioned patent in term of reference fully.
Technical field
Technology contents disclosed by the invention relates to a kind of imaging device and method, particularly for photoacoustic imaging module and the method for medical imaging and/or diagnosis.
Background technology
Photoacoustic imaging (PAI) be a kind of can tissues observed internal anatomy without the wound medical imaging technology.In the medical imaging application, photoacoustic imaging can provide the image of high spatial resolution and high-contrast.On the contrary, traditional pulse-echo ultrasound medical imaging can't provide the image of high spatial resolution and high-contrast because of having close acoustic characteristic for the different human body tissue.Compare with X ray, photoacoustic imaging is a kind of safe technology, because it does not produce ionization and molecule in body is not affected.
Photoacoustic imaging is a kind of relatively novel technology and also is far from bringing into play its effect at mankind's clinical field, and ultra sonic imaging is used in 50 years in the past always.One of them main cause is also fall flat of hardware.Photoacoustic imaging adopts infrared ray to induce the image of (infrared-induced) ultrasonic establishing target object.In this imaging process, the target that is imaged is with the pulse of near-infrared shortwave (short near-infrared pulse) flash (flashed), such as the pulse of nanosecond.Near infrared long wave makes light penetrate organization internal.When light was organized chromophore (chromophores) for example the haemachrome (hemoglobin) in blood absorbs, tissue heated up also by being called as the process expansion of quick thermoelastic expansion (rapid thermoelastic expansion).The tissue expander of this moment produces the ultrasound wave that can be placed in external supersonic sounding array received.The acoustical signal that receives adopts beamforming algorithm (beamforming algorithms) resolved to generate 2D or the 3D rendering of destination organization.PAI has utilized the advantage of the high spatial resolution of the advantage of height contrast of optical imagery and pure ultra sonic imaging.
Photoacoustic imaging utilizes the different ir-absorbances of different classes of tissue to generate high contrast images.Therefore, different tissue absorbs the infra-red radiation of varying number and sends the ultrasonic signal of different magnitudes, phase place and/or frequency.Thereby these ultrasonic signals are received, gather and analyze the image that produces destination organization by sensor.
Have in the photoacoustic imaging of animal of erythrocyte at the mankind and other, haemachrome is played an important role aspect picture contrast strengthening, because haemachrome has very high optical contrast when being subject to near-infrared radiation.Therefore, for containing for example high-contrast imagery of tumor or blood vessel of blood agglomeration structure in tissue, be one of feature of photoacoustic imaging uniqueness.Utilize this blood concentration/content relevant to optical absorption, photoacoustic imaging comprises hemorrhage and (early stage) cancer for distinguishing that the disease relevant to blood and/or the improper phenomenon of being correlated with blood are of great advantage.Like this, the doctor can use photoacoustic imaging to know many other technology problem as impalpable in ultra sonic imaging.Except can observe anatomical structure, photoacoustic imaging can also for detection of the structure of tissue and relevant from different ir-absorbances, based on the functional activity situation of blood organ.
Put it briefly, the conventional ultrasound imaging is lower for the contrast of image that soft tissue becomes, and reason is that the acoustic characteristic of different soft tissues is closely similar.Yet photoacoustic imaging can provide than the ultra sonic imaging image of high-contrast more.Photoacoustic imaging is based on the optical absorption that is used for contrast, and the main tissue that relies on is for the absorption spectrum of near infrared light.The entrained Information Availability of ultrasound wave is in the 3D imaging.Ultrasonic one-way only propagation is used to carry information and is back to ultrasonic receiver.For living person or animal with for the photoacoustic imaging of the tissue of erythrocyte, haemachrome is providing important help aspect contrast ratio promoting.Because the image ratio conventional ultrasound imaging that the difference of image-forming principle, photoacoustic imaging provide has higher contrast.Difference is that mainly blood comprises for example imaging of cancer of organ.
The ultrasonic internal imaging instrument of some traditional tubuloses (tubular ultrasonic internal imagers) uses piezoelectric transducer (piezoelectric transducers) to transmit and receive ultrasonic.The common voltage that adopts higher than 100V of piezoelectric transducer that is used for medical imaging.This high working voltage requires to make the piezoelectricity imager in its micro radio unit that is difficult to be applicable to capsule endoscope (capsule endoscope) equipment to use; Adopt battery powered Wireless capsule endoscope that high-tension ability like this is not provided, even there be auxiliary also being difficult to of advanced voltage delivery circuit to realize.
Recently, the appearance of capacitance type micromachined ultrasonic transducer (CMUT) becomes a kind of improvement with development prospect for the piezoelectric transducer of medical imaging.In ultrasonic process of transmitting, the thin film of CMUT (membrane) is Dc bias normally.After AC signal is superimposed on this Dc bias, the deformation of thin membrane that becomes when causing.Medium around this deformation of thin membrane has encouraged also sends ultrasonic.In receiving course, thin film is also Dc bias, and its numerical value is usually less than numerical value required in process of transmitting.Impact the ultrasonic change that makes deformation of thin membrane and cause electric capacity, this change can be read by controlling electronic component.Usually, ultrasonic process of transmitting is than the more electric energy of receiving course consumption.For the wireless endoscopic mirror device, reduce power consumption and make the ultrasonic imaging device can be in the situation that use battery to work the longer time, the feasibility of this technology is brought and is wished the effect that obtains.
At present, a kind of existing mode for photoacoustic imaging is to adopt near-infrared laser irradiation target organism.This laser can comprise, for example, Q-switch Nd (Q-switched Nd): yag laser (YAG laser) or with the laser diode of optical fiber or optical lens coupling.A kind of external ultrasonic sensor (ultrasonic transducer) array is used for the ultrasound wave that tissue receiving sends.This setup is very convenient for experimentation, but is not suitable for clinical use, because the relative position between infrared light beam, destination organization and ultrasonic sensor array can only pass through manual adjustments.Manual alignment/adjustment is consuming time and can't satisfy the required precision of clinical use.Therefore, this system is friendly not for the end user as the doctor.
Except being used for surveying without wound, photoacoustic imaging has been used to the wound diagnosis, and its method is that part or whole imaging system are inserted in checked tissue or organ.Visited target because this method can approach, picked up ultrasonic signal so traumatic photoacoustic imaging instrument can pass tissue at it before causing decay.Therefore, it signal to noise ratio preferably can be provided and the picture quality that provides without the wound mode can't be obtained.
An example of traumatic photoacoustic imaging instrument is a kind of imager for diagnosing in blood vessel.Several different modes have been used to the intravascular photoacoustic imaging.For example, a kind of commercial side-looking intravascular ultrasound (IVUS) head for the blood vessel photoacoustic imaging is tested, this mode is to adopt iraser to carry out imaging from patient's extracorporeal irradiation blood vessel.When adopting this mode to obtain preliminary illusory (phantom) image, there are two shortcomings at least in this imaging.The first, because enter in-house ultrared decay and dispersion, the laser irradiation outside the patient body generally can't be carried out photoacoustic imaging to the blood vessel of depths in body because of insufficient strength.Irradiation obstruction/the shade that the second, IVUS head itself and/or the organ as bone produce may cause visual dead angle and hinder observation.
The a kind of of the problems referred to above may solution be that light source and sonac are formed a whole, and so just can provide infrared radiation from imager.This conception of species is adopted in the design of multiple light acoustic imaging.For example, a kind of forward sight (front-looking) photoacoustic imaging probe that is used for the intra-arterial imaging polymer sonac and optical fiber integration has been produced model machine.The optical fiber that imaging probe is 600 μ m by inner core diameter is made, and is equipped with to concentrate the polymer sensor element around the end of fibre core.This device can receive the ultrasonic signal that mankind's finger tissue and fingernail send in demonstration.Yet, because only equip a discrete component but not ultrasonic sensor array, so can't realize actual imaging.
Possible settling mode comprises a kind of optical fiber head that is specifically designed to infrared excitation and ultrasonic reception in addition.Learn on optical sound head at this full gloss, a kind of Fabry-Perot (Fabry-Perot) polymer thin film induction apparatus of temperature sense is installed at the end of optical fiber, be used for the ultrasound wave that produces at optoacoustic processing procedure receiving target object.Optical fiber is used for that the infra-red radiation that outside lasing light emitter produces is directed to target object and is used for excitation, as infra-red radiation (carrying ultrasound information) to the external signal of guiding reflection is processed photovoltaic element.This equipment is used to check the sensing of optical fiber connector direction of advance, but can not be used for lateral observation.
Opto-acoustic imaging devices disclosed by the invention solves above-mentioned one or more problems.
Summary of the invention
Technology contents disclosed by the invention relates to the photoacoustic imaging module for medical diagnosis.When tissue was stimulated by infrared ray, image-forming module produced ultrasound wave by the process of Rapid Thermal elastic dilatation.Ultrasonic sensor array can be capacitance type micromachined ultrasonic transducer (CMUT) or piezoelectric transducer, can be used for the ultrasound wave that tissue receiving sends.The infrared ray that is used for photoacoustic imaging is provided by the array of source that arranges around this module, and wherein array of source can be that near-infrared laser diode array, light emitting diode matrix or the inclined groove that distributes around the skeleton are arranged on its inner optical fiber (being connected with external light source).This module can be arranged in wireless endoscope and to consist of with it whole and become a kind of internal imaging device, can transmit the image of higher contrast and work under low-voltage and power supply.Therefore, this device can use the battery operated long time.
From many aspects, technology disclosed by the invention is a kind of optoacoustic medical imaging apparatus, comprises at least one groove, at least one optical fiber and at least one facet that on substrate, on-chip ultrasonic sensor array, substrate, etching forms.Every optical fiber is arranged on wherein in a groove.Each facet interior etching of groove therein forms and is covered with the metal level with high infrared reflection characteristic.The purposes of every optical fiber is that the infrared ray that the guiding light source sends passes optical fiber facet extremely separately.The purposes of facet is that reflected infrared ray is to target.
According to content disclosed by the invention, a kind of optoacoustic medical imaging apparatus comprises single substrate, single on-chip a plurality of ultrasonic sensor arrays and many grooves that etching forms on single substrate.At least one groove is connected with each array.This device also comprises many optical fiber, and wherein every optical fiber is arranged on wherein in a groove.This device also comprises a plurality of facets, wherein each facet therein in groove etching form and be covered with the metal level with high infrared reflection characteristic.The effect of every optical fiber is that the infrared ray that the guiding light source produces passes optical fiber to one of them facet, and the effect of described facet is that reflected infrared ray is to target.
According to many-sided technology contents disclosed by the invention, a kind of method of making the optoacoustic medical imaging apparatus is included in that on single substrate, on integrated a plurality of ultrasonic sensor arrays, substrate, etching has many grooves, wherein at least one groove is connected with each array, and etching has facet in every described groove.Described method also is included as each facet and coats the metal level with high IR emission characteristics and carry out photoetching (photolithography) program and delimit out the photoacoustic imaging instrument, and wherein the photoacoustic imaging instrument comprises a plurality of arrays.This method comprises that also etch substrate discharges (release) photoacoustic imaging instrument and places at least one optical fiber every groove with the remainder from substrate.
Description of drawings
Figure 1A is the front perspective view of a kind of photoacoustic imaging instrument example disclosed in this invention;
Figure 1B is the amplification sectional view of Figure 1A circle part;
Fig. 2 A is the side isometric view of a kind of three-dimensional photoacoustic imaging instrument example disclosed by the invention;
Fig. 2 B is the amplification sectional view with same section shown in Figure 1B;
Fig. 3 A is the top view of the three-dimensional photoacoustic imaging instrument decomposing state of Fig. 2 A;
Fig. 3 B is the sectional view along the line IIIB-IIIB of Fig. 3 A;
Fig. 3 C is the amplification sectional view of circle part in Fig. 3 B;
Fig. 4 is the front perspective view of a kind of photoacoustic imaging module instance disclosed by the invention;
Fig. 5 A be Fig. 4 the photoacoustic imaging module instance face three-dimensional exploded view;
Fig. 5 B is the sectional view of the line VB-VB in Fig. 5 A, is used for a kind of light source example of photoacoustic imaging module shown in Figure 4 disclosed by the invention;
Fig. 5 C is the sectional view of the line VB-VB in Fig. 5 A, is used for illustrating a kind of light source example of photoacoustic imaging module shown in Figure 4 disclosed by the invention;
Fig. 6 is the top view of a kind of CMUT element design example disclosed by the invention;
The frequency response schematic diagram of the ultrasonic component that Fig. 7 is comprised of the sensor array of different geometrical size;
Fig. 8 is the front perspective view of a kind of Wireless capsule endoscope module instance disclosed by the invention;
Fig. 9 A is the three-dimensional exploded view of facing of Wireless capsule endoscope example shown in Figure 8;
Fig. 9 B is the amplification sectional view of circle part in Fig. 9 A.
The specific embodiment
Shown in Figure 1A and 1B is the example of photoacoustic imaging instrument 100.Technology contents disclosed according to the present invention, photoacoustic imaging instrument 100 comprise one single chip photoacoustic imaging instrument.Described photoacoustic imaging instrument comprises the array 102 of the sonac 104 that is connected with substrate 112, and such as capacitance type micromachined ultrasonic transducer (CMUT) or piezoelectric supersonic sensor, as an example, substrate 112 is silicon chip.Imager 100 comprises an optical fiber 106 or fiber array, is used for providing infrared radiation.For photoacoustic imaging, the required power density of infrared ray is every square centimeter of millijoule level.Multimode or single-mode fiber all can transmit this power density.
As shown in Figure 1B, facet 114 can be made with the horizontal-extending spare 116 of groove 108 bottoms 118 and roughly be become the angle of 54.7 °.Facet 114 is covered with thin metal layer 120, and for example the metal of silver or other high infrared reflection characteristic, be used for strengthening 114 pairs of ultrared reflections of facet.The diameter of optical fiber 106 is approximately 125 μ m and the diameter of inner core 122 is approximately 5 μ m.
Described photoacoustic imaging instrument 100 does not need strict dimension control for vee-cut 108, does not need high precision to aim between optical fiber 106 and vee-cut 108 yet.Different from the high precision alignment that optical fiber in Fiber Optical Communication System and other optical element are required, for this photoacoustic imaging instrument platform, the aligning of optical fiber is so not strict.Between optical fiber 106 and reflection facet 114, small displacement can not affect irradiation function or the imaging capability of described photoacoustic imaging instrument 100.When the inner core 122 of optical fiber 106 than relative hour of the size of the diameter of optical fiber 106 or facet 114, as long as the end 107 of optical fiber 106 has ultrared existence, infrared ray just can throw in (111) facet 114 in vee-cut 108 so, and less displacement can not make described integrated optical acoustic imaging unit 100 functions cause significant reduction.
Shown in Fig. 2 A and 2B is the example of three-dimensional photoacoustic imaging instrument 200.Described three-dimensional imaging instrument 200 can hold a plurality of photoacoustic imaging unit 250 for full views watching.According to technology contents disclosed by the invention, photoacoustic imaging instrument 200 comprises 7 photoacoustic imaging unit 250.Same design has been adopted in traditional pulse-echo ultra sonic imaging.6 in 7 image-generating units 250 can form 360 ° of views with respect to axle 252.As an example, these 6 image-generating units 250 comprise 6 previously described photoacoustic imaging instrument 100.
As an example, on three-dimensional photoacoustic imaging instrument 200, the array 102 of a plurality of sonacs 104 is such as capacitance type micromachined ultrasonic transducer (CMUT) or piezoelectric supersonic sensor can be integrated on single silicon chip 112.In example, described three-dimensional photoacoustic imaging instrument 200 comprises 7 CMUT arrays 102,202, is used for observing 7 different directions.
As an example, groove 108 arrays are 6 about 250 dark vee-cuts of μ m, and anisotropic etching forms on substrate surface 110, can hold many optical fiber 106,6 optical fiber for example, and purpose is for infrared couplings.Each groove 108 is included in the facet 114 that on silicon chip 112, etching forms.Optical fiber 106 is positioned in groove 108, makes the end 107 of optical fiber 106 to guide infrared ray into facet 114, and facet 114 transfers infrared ray is sent to destination organization 190.
According to technology contents disclosed by the invention, as an example, silicon chip 112 comprises (100) silicon chip, and facet 114 comprises (111) facet.Infrared ray produces and is guided through optical fiber 106 by the external light source (not shown).As an example, light source can comprise Q-switch Nd: yag laser, with laser diode of optical fiber or Lens Coupling etc.
Shown in Fig. 2 B, the horizontal-extending spare 116 that facet 114 can be made relative groove 108 bottoms 118 has the angle of 54.7 °.Facet 114 is covered with thin metal layer 120, and as an example, its material is the metal of silver or other high infrared reflection characteristic, and purpose is in order to strengthen facet 114 for ultrared reflexive.The diameter that the diameter of every optical fiber 106 is approximately 125 μ m and inner core 122 is approximately 5 μ m.The effect of described 6 arrays 102 is to provide imager 200 panoramic view of target on every side.
As shown in Fig. 2 A, one in optical fiber 206 is used for the 7th direction of observation (seventh viewing direction), i.e. forward sight.The infrared ray of front apparent direction is guided through optical fiber 206 and extends through hole 240 on forward sight sensor array 202, and as an example, described array 202 is ring-type CMUT array.
With reference to Fig. 3 A-3C, a kind of method of making three-dimensional photoacoustic imaging instrument example has been described.The method is from the little course of processing of a kind of polysilicon surface that is used for formation CMUT array.Some details of this case method can be referring to " a kind of monolithic ultrasonic sensor array for medical imaging " (AMonolithic Ultrasonic Transducer Array for Medical Imaging) of the microelectronics system of processing magazine of IEEE, in October, 2007 number, pp.1015-1024, Vol.16, the present inventor will all include term of reference at the technology contents of this piece article or the announcement of other data.
After adopting bio-compatible polymeric layer (a layer of bio-compatible polymer) to carry out passivation (passivating) processing to the CMUT array, employing is wet or dried anisotropic etch method forms the vee-cut 108 with suitable width and degree of depth on substrate, as an example, the width of vee-cut 108 and the degree of depth are to be determined by the fibre diameter that uses.Silicon chip can be made the thin layer of inclination, for example about 3000-5000
Silver or other metal with high infrared reflection characteristic are formed coating by sputter (sputter) method in the inclination silicon facet 114 of vee-cut 108 inside, wherein the end 107 of optical fiber 106 points to inclination silicon facet 114.The effect of described metal coating facet is equivalent to mirror and is used for reflected infrared ray, from the infrared reflection of optical fiber 106 original path directions to destination organization, as shown in Fig. 2 B.
According to technology contents disclosed by the invention, when facet 114 when delimiting the end of (delimit) vee-cut 108, each facet 114 is the triangle minute surface, as an example, it highly is approximately 250 μ m, base widths is approximately 350 μ m, height wherein and base widths are in fact all greater than the diameter of optical fiber inner core, and inner core diameter generally is approximately 5 μ m.Therefore, the displacement spacing of maximum tens microns is little for the reflectance impact of the infrared reflection from optical fiber 106 being arrived tissue between optical fiber and vee-cut 108 facets.
Silicon chip is reversed and glues note to load wafer (carry wafer).Described load wafer and silicon chip comprise a plurality of CMUT arrays 102,202, so each load wafer and silicon chip can form a plurality of photoacoustic imaging instrument 200, and each imager comprises 7 arrays 102,202.
As an example, a kind of back side water etching method can make wafer be thinned to about 250 μ m.The photoetching of carrying out overleaf (photolithography) is processed and can be formed a kind of pipe trench (trenches) array at each CMUT array 102,202 periphery, and for example each about 40 μ m is wide.A kind of back side degree of depth silicon etching method is used to open described pipe trench, until these pipe trench penetrate silicon chip.A kind of acetone wet etching can discharge each photoacoustic imaging instrument 200 (each comprises 7 CMUT arrays 102,202) from the load wafer.Then, planar array 102,202 folded and/or be combined to form a kind of hexagon prism imager, as shown in Figure 3; Optical fiber 106,206 is arranged in vee-cut 108, and on front array 202, perforate 240 is arranged.Front array 202 has the perforate 360 of the effect of holding, and holds for guiding imager 200 to enter the guide wire of assigned address at interventional therapy.Optical fiber 106 available epoxies or other suitable medium stick on the position.
The related imager of technical scheme that the present invention announces comprises a kind of surface platform, this platform has single CMUT/ piezoelectric-array or a plurality of CMUT/ piezoelectric supersonic sensing-fiber array that is integrated on flexible substrates of observing in one direction, and is assembled into a kind of hexagon prism internal imaging instrument for multi-direction observation.One single chip photoacoustic imaging instrument disclosed herein can be used to the hand-held platform of work outside the patient body and/or be used in blood vessel and other wound diagnosis as little imaging head.
According to technology contents disclosed by the invention, Fig. 4 has shown a kind of example of the module 400 for photoacoustic imaging.Described module 400 comprises as the skeleton 470 of settling opto-acoustic imaging devices.Skeleton 470 can be made with plastics or other material that is fit to.Ultrasonic sensor array 472 is arranged on the mid portion of module 400.The effect of sonac 472 is ultrasound wave that receiving target tissue 190 sends.As shown in Fig. 5 A, skeleton 470 comprises for the opening 574 of placing ultrasonic sensor array 472.According to technology contents disclosed by the invention, ultrasonic sensor array 472 comprises the micromachined ultrasonic transducer (CMUT) that is connected with substrate 512, and as an example, substrate is silicon chip.In technical scheme disclosed by the invention, ultrasonic sensor array 472 comprises piezoelectric transducer.
As shown in Fig. 5 B and 5C, groove 578 has certain angle with the surface 480 of the skeleton 470 of emission of light.As an example, as shown in the figure, the groove of supporting light sources is centroclinal to platform, so the geometric center of destination organization can obtain the major part irradiation from light source 476.In content disclosed by the invention, sonac 472 and infrared light sources 476 can be integrated on platform, therefore the same with the degree of depth of destination organization 190, the relative position between ultrasonic sensor array 472 and infrared light sources 476 be fix and do not need the manual alignment opto-acoustic imaging devices.
Fig. 5 B has shown the example of laser diode or LED source, and Fig. 5 C has shown a kind of example of optical fiber source.The end on groove 578 surfaces 480 comprises optical lens 482, makes the light from light source 476 pass through it to destination organization 190.
Although the example design in Figure 4 and 5 A only is provided with 4 light sources around skeleton, imager disclosed by the invention is not limited to 4 light sources.Image-forming module 400 can comprise any amount of light source, and is unnecessary or be less than 4, as long as can provide suitable infrared radiation density and these light sources can be distributed in any suitable position on module 400.What be worth happiness is that image-forming module 400 also can be used for the Co-registration (co-registration) of photoacoustic imaging and these two kinds of combinations of ultra sonic imaging.For example, because the ultrasonic absorption frequency spectrum between the interior different tissues of body and/or material (for example speckle or clot in blood vessel) is different, so the reflecting spectrum of ultrasound wave (ultrasonic sensor array sends) can be used for identifying the structure by the diagnosis target.This is useful replenishing for photoacoustic imaging.These two kinds of imaging modes can provide comprehensive diagnos information, and the information that only provides with a kind of imaging mode wherein can't reach this effect.
In the photoacoustic imaging process, the ultrasound wave bandwidth that tissue produces generally is approximately 30MHz.Although capacitance micro-machining ultrasonic sensor (CMUT) can transmit wider bandwidth relatively than conventional piezoelectric sensor, its bandwidth is inadequate for the whole frequency spectrum that covers photoacoustic imaging.For annular CMUT device, its thin film is fixed along whole periphery, and the resonant frequency of thin film (mainly the mid frequency by CMUT determines) can determine with following analysis equation:
T wherein
mBe the thickness of thin film, α is the radius of thin film, and T is internal pressure, and E is young's modulus, and ρ is density, and ν is the Poisson's ratio of thin-film material.Can find out from this equation, the less or thicker thin film of thin film radius (thickness of thin film is fixed), mid frequency is higher.If the different radii of membrane array (or thickness) in element as shown in Figure 6 for mixing, so the frequency spectrum of this element will with all stacks of the frequency of each single thin film, as shown in Figure 7.
Fig. 6 has shown an example that can transmit the CMUT element design of the wide spectrum that is fit to the photoacoustic imaging requirement.Except the physical dimension of sensor was identical, sensor array 672 comprised and is integrated in a plurality of CMUT that receive the different size in ultrasonic element, is used for receiving ultrasound wave in the photoacoustic imaging process.As shown in Figure 7, the frequency spectrum of this hybrid element will be realized wider frequency spectrum with the spectral overlay of different size CMUT.Although Fig. 6 has shown a kind of annular CMUT array apparatus of different radii, within the mixture of the CMUT of other geometries (for example square, rectangle or approximate shape) or the different geometries of different size and/or different film thicknesses also can transmit the effect of same widened spectrum and be included in technology contents disclosed by the invention.CMUT device in this hybrid element adopts parallel electric connecting mode.
The example that shown in Figure 8 is for reducing the Wireless capsule endoscope supply voltage.In Fig. 8, Wireless capsule endoscope 880 comprises photoacoustic imaging module and ultra sonic imaging module 800.Module 800 comprises as the skeleton 870 of settling opto-acoustic imaging devices.As an example, skeleton 870 can be made with plastics or other suitable material.In this optoacoustic system, in order to reduce power consumption, 872 of CMUT arrays are used for ultrasound wave and receive.One or more light sources 876, for example infra-red laser diode, light emitting diode and/or optical fiber, be used for incentives target tissue 190, makes it produce ultrasound wave in thermoelastic process of expansion fast, as previously mentioned.Described capsule endoscope 880 comprises battery 886 and the light source diode 876 to 872 power supplies of CMUT array.
Laser diode and light emitting diode are generally operational in the voltage lower than 10V, and this voltage is significantly less than CMUT transmission required voltage.Usually, the quantum efficiency of semiconductor diode is higher than 95%, therefore is applied to electric energy on optoacoustic equipment (laser diode and light emitting diode) and is effectively transformed and is infrared ray, is used for the excitation tissue and produces ultrasound wave thereupon.Because in fact, this mixed light acoustic imaging system in receiving course than usually consuming less energy and lower bias voltage in CMUT device transmission process, so this mixed light acoustic imaging system can be operated in electric energy and the voltage lower than conventional ultrasound imaging system.Therefore this system can work the long time with battery 886.
Fig. 9 A has shown each constituent components of Wireless capsule endoscope 880 examples that can be used for gastrointestinal diagnosis.In optoacoustic capsule endoscope 880, a plurality of infrared light sources 876, for example laser diode or light emitting diode, be integrated in ultrasonic sensor array 872 around.Capsule endoscope 880 comprises that the CMOS/DMOS wave beam forms electronic component 889, and it is by flip-chip bonded (flip-chip) or wire-bonded (wire bonding) mode and ultrasonic sensor array 872 couplings.
As shown in Fig. 9 B, ultrasonic sensor array 872 is connected with substrate 912, and as an example, substrate is silicon chip.The plane of light source 876 relative skeletons 870 tilts to the geometric center of destination organization 190, and purpose is in order to realize the maximum illumination efficient to destination organization 190.With reference to Fig. 8, the end of the capsule endoscope 880 relative with ultrasonic sensor array 872 positions, comprise 884 of secondary light source 882 and cmos imaging instrument, secondary light source 882 is used for visible spectrum irradiation destination organization surface, 884 of cmos imaging instrument can produce optical imagery to the destination organization that is shone by secondary light source 882, thus the medical diagnosis of realize target tissue.Cmos imaging instrument 884 and/or secondary light source 882 are arranged in shell 885, and as an example, shell 885 can be made with plastics or other suitable material.Capsule endoscope 880 also comprises spiral inductance antenna 888, and its effect is the view data receptor (not shown) to the patient body that sends from CMUT array 872 and/or cmos imaging instrument.
Compare with the conventional ultrasound imaging device, the part advantage of the Wireless capsule endoscope platform of this employing photoacoustic imaging mode comprises and transmits the better image of contrast and/or be operated in lower voltage and electric energy, so the permission system can use the battery operated long time.
It should be noted that " one " of the singulative that this description and claims use, " a kind of " and " this " have comprised the reference of plural form, unless represent and clearly be restricted to one.For example " a kind of sensor " comprises two or more different sensors.Vocabulary " comprises " and its grammatical variants does not refer to not restriction as used herein, so quoting of list-item do not repelled other similar items that substitute or other can be added into the project of list.
Various changes of doing according to photoacoustic imaging instrument provided by the invention and method for those skilled in the art and improve and to fall within the scope of protection of the present invention.Those skilled in the art are by at the technology contents of this announcement and the consideration and practice of description, and other example of the present invention will be apparent for them.It should be noted that the only use of reference as an example of this description and example.
Claims (19)
1. optoacoustic medical imaging apparatus comprises:
Substrate;
On-chip ultrasonic sensor array;
At least one groove that etching forms on substrate;
At least one optical fiber, every optical fiber are arranged in described at least one groove in a groove; And
At least one facet, in the groove of each facet in described at least one groove, etching forms and is covered with the metal level with high infrared reflection characteristic, the effect of every described optical fiber is that guiding is from the extremely described facet of the described optical fiber of infrared ray process of light source, the effect of described at least one facet is that reflected infrared ray is to target, described like this ultrasonic sensor array is set to receive ultrasound wave from target and is mapped in contrast ultrared response on described target, and it is outside that described target is positioned at described optoacoustic medical imaging apparatus.
2. device according to claim 1, wherein said substrate comprises silicon chip.
3. device according to claim 1, wherein said metal level comprise silver layer.
4. device according to claim 1, wherein said sensor array comprises the capacitance micro-machining ultrasonic sensor array.
5. device according to claim 1, wherein said sensor array comprises the piezoelectric supersonic sensor array.
6. device according to claim 1, wherein said at least one groove Bian on substrate forms with anisotropic etching.
7. device according to claim 1, wherein said at least one groove comprises a kind of V-shaped groove.
8. device according to claim 1, wherein facet is a kind of (111) facet.
9. optoacoustic medical imaging apparatus comprises:
Single substrate;
At described single on-chip a plurality of ultrasonic sensor arrays;
On described substrate, etching has many grooves, and at least one groove is connected with each described array;
Many optical fiber, every described optical fiber are arranged in a groove in described groove; And
A plurality of facets, in the groove of each facet in described groove, etching forms and is covered with the metal level with high infrared reflection characteristic, the effect of every described optical fiber is to guide the infrared ray from light source to pass described optical fiber to described facet, the purposes of described facet is that reflected infrared ray is to target, described like this ultrasonic sensor array is set to receive ultrasound wave from target and is mapped in contrast ultrared response on described target, and it is outside that described target is positioned at described optoacoustic medical imaging apparatus.
10. device according to claim 9, wherein said substrate comprises silicon chip.
11. device according to claim 10, wherein said substrate comprises the flexible silicon substrate.
12. device according to claim 9, wherein said metal level comprise silver layer.
13. device according to claim 9, wherein each described sensor array comprises the capacitance micro-machining ultrasonic sensor array.
14. device according to claim 9, wherein each described sensor array comprises the piezoelectric supersonic sensor array.
15. device according to claim 9, every groove Bian on substrate in wherein said many grooves forms with anisotropic etching.
16. device according to claim 9, every groove in wherein said many grooves comprises vee-cut.
17. device according to claim 9, facet wherein comprise a kind of (111) facet.
18. a method of making optoacoustic medical sensor device comprises:
Be integrated with a plurality of ultrasonic sensor arrays on single substrate;
Many grooves of etching on substrate, at least one groove is connected with each described array;
Be etched into facet in each described groove;
Each facet is covered with the metal level with high infrared reflection characteristic;
Carry out photoetching process and mark off the photoacoustic imaging instrument, described photoacoustic imaging instrument comprises a plurality of described arrays;
Etch substrate discharges described photoacoustic imaging instrument from the substrate remainder; With
Place at least one optical fiber in every described groove, wherein said ultrasonic sensor array, facet, be set to described ultrasonic sensor array with optical fiber and be set to receive from the ultrasound wave of target as to the ultrared response on described target of shining from least one optical fiber to its corresponding facet, it is outside that described target is positioned at described optoacoustic medical imaging apparatus.
19. method according to claim 18, wherein the step of etching face comprises etching a kind of (111) facet.
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| US61/032,947 | 2008-02-29 | ||
| PCT/US2008/086206 WO2009076427A1 (en) | 2007-12-10 | 2008-12-10 | Photoacoustic imaging devices and methods of imaging |
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| CN200880123985XA Expired - Fee Related CN101990417B (en) | 2007-12-10 | 2008-12-10 | Photoacoustic imaging devices and methods of imaging |
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2008
- 2008-12-10 AU AU2008335144A patent/AU2008335144A1/en not_active Abandoned
- 2008-12-10 WO PCT/US2008/086206 patent/WO2009076427A1/en active Application Filing
- 2008-12-10 CA CA2708743A patent/CA2708743C/en not_active Expired - Fee Related
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- 2008-12-10 US US12/747,428 patent/US8529454B2/en active Active
- 2008-12-10 CN CN200880123985XA patent/CN101990417B/en not_active Expired - Fee Related
- 2008-12-10 EP EP08860441.8A patent/EP2231019B1/en not_active Not-in-force
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2013
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| CN1191023A (en) * | 1995-08-03 | 1998-08-19 | 松下电器产业株式会社 | Optical device and method of manufacturing it |
| CN1575770A (en) * | 2003-07-02 | 2005-02-09 | 株式会社东芝 | Method and apparatus for forming an image that shows information about a subject |
Also Published As
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|---|---|
| CA2708743C (en) | 2016-08-30 |
| AU2008335144A1 (en) | 2009-06-18 |
| BRPI0822064A2 (en) | 2015-06-23 |
| US20140012125A1 (en) | 2014-01-09 |
| EP2231019B1 (en) | 2014-10-22 |
| US20100268058A1 (en) | 2010-10-21 |
| EP2231019A1 (en) | 2010-09-29 |
| CN101990417A (en) | 2011-03-23 |
| US8529454B2 (en) | 2013-09-10 |
| US9192306B2 (en) | 2015-11-24 |
| EP2231019A4 (en) | 2011-08-10 |
| CA2708743A1 (en) | 2009-06-18 |
| WO2009076427A1 (en) | 2009-06-18 |
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