CN101990359A - Processing method of antistatic adhesive tape - Google Patents
Processing method of antistatic adhesive tape Download PDFInfo
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- CN101990359A CN101990359A CN2009101840354A CN200910184035A CN101990359A CN 101990359 A CN101990359 A CN 101990359A CN 2009101840354 A CN2009101840354 A CN 2009101840354A CN 200910184035 A CN200910184035 A CN 200910184035A CN 101990359 A CN101990359 A CN 101990359A
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- adhesive tape
- processing method
- antistatic adhesive
- antistatic
- primer
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- Adhesive Tapes (AREA)
Abstract
The invention relates to a processing method of an antistatic adhesive tape. The processing method comprises the following steps of: selecting a substrate; coating a bottom adhesive on the front of the substrate while drying the substrate at a drying temperature of approximate 90-120 DEG C; coating a surface adhesive on the bottom adhesive while drying at a drying temperature of approximate 80-200 DEG C; coating an antistatic adhesive on the back of the substrate while drying at a drying temperature of approximate 130-200 DEG C, wherein the antistatic adhesive is prepared by compounding the following raw materials in percentage by weight: 1 percent of main agent, 0.1-0.5 percent of toluene and 0.005-0.01 percent of curing agent; and winding. The adhesive tape produced by adopting the processing method of the invention has higher antistatic capability in one aspect for the surface resistance of the adhesive tape reaches 1.0*10<5> ohm/cm<2> and is environment-friendly in the other aspect for the adhesive tape does not contain heavy metals, halogens and harmful VOC (Volatile Organic Compound) substances.
Description
Technical field
The present invention relates to a kind of processing method of adhesive tape, particularly a kind of processing method of antistatic adhesive tape.
Background technology
Along with electronic science and technology develops rapidly, adhesive tape applies to electronics industry also the development of advancing by leaps and bounds, but because the limitation of the processing method of traditional adhesive tape, make various adhesive tapes have a certain amount of static in various degree, thereby make substrate surface be adsorbed with dust or other particle, and then influence the useful life of related electronic devices.Be a kind of chemical synthetic material owing to adhesive tape simultaneously, the processing method of prior art mainly is devoted to the raising to the adhesive tape function, and the environmental issue of adhesive tape is often ignored by the people.
Therefore, there is following shortcoming at least in the adhesive tape processing method of prior art: the adhesive tape antistatic effect that (1) processes is poor, and the adhesive tape that (2) process itself contains harmful substance (as heavy metal, halogen and other harmful VOC material), contaminated environment.
Summary of the invention
At the problems referred to above, it is good to the invention provides a kind of antistatic effect, the adhesive tape processing method of environmentally safe.
For realizing above goal of the invention, the invention provides a kind of processing method of antistatic adhesive tape, described processing method may further comprise the steps: choose base material; To the positive coating of described base material primer, and dry processing in the coating primer, bake out temperature is approximately 90 ℃～120 ℃; To applicator surface glue on the described primer, and dry processing in applicator surface glue, bake out temperature is approximately 80 ℃～200 ℃; Described substrate backside is applied antistatic adhesive, and in the antistatic adhesive of coating, dry processing, bake out temperature is approximately 130 ℃～200 ℃, described antistatic adhesive forms host by the raw material of following weight ratio is composite: toluene: curing agent=1: 0.1～0.5: 0.005～0.01; Rolling.
Preferentially, described base material is a polyimide film.
Preferentially, described antistatic adhesive is added alcohol, the weight ratio of described host and alcohol is host: alcohol=1: 0.05～0.1.
Preferentially, described host is polyester emulsion.
Preferentially, described curing agent is a platinum catalyst emulsion.
Preferentially, described glue forms by the raw material of following weight ratio is composite, poly dimethyl oxygen alkane silica gel: resin=1: 0.1～0.2.
Preferentially, described primer forms by the raw material of following weight ratio is composite, PSA409 additive: crosslinking agent: catalyst: retarder thinner=1: 0.05～0.1: 0.1～0.2: 0.01～0.08.
The adhesive tape that adopts processing method of the present invention to produce, tape surface resistance reaches 1.0 * 10 on the one hand
5Ω/cm
2, therefore have higher antistatic effect; On the other hand, described adhesive tape does not contain heavy metal, halogen and harmful VOC material, so environmentally safe.
Description of drawings
Fig. 1 is the process chart of one embodiment of the invention.
Embodiment
In order to make those skilled in the art person understand the present invention program better, and above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with embodiment and embodiment accompanying drawing.
Embodiment 1
S1, choose base material
Specifically, preferentially and without limitation choose the polyimide film high temperature resistant, that transparency is good as base material.
S2, to the positive coating of described base material primer, and in the coating primer, dry processing, bake out temperature is approximately 90 ℃.
Specifically, described primer is an organosilicon polymer; More particularly, described primer forms by the raw material of following weight ratio is composite, PSA409 additive: crosslinking agent: catalyst: retarder thinner=1: 0.05: 0.1: 0.01, described crosslinking agent is BPO, described catalyst is two bay catalyst, and described retarder thinner is an aromatic solvent.The temperature of preparation primer is a normal temperature.
S3, to applicator surface glue on the described primer, and in applicator surface glue, dry processing, bake out temperature is approximately 80 ℃.
Specifically, described glue is organic pressure-sensitive gel, and more particularly, described organic pressure-sensitive gel forms by the raw material of following weight ratio is composite, poly dimethyl oxygen alkane silica gel: resin=1: 0.1.The temperature of preparation face glue is a normal temperature.
S4, described substrate backside is applied antistatic adhesive, and dry processing in the antistatic adhesive of coating, bake out temperature is approximately 130 ℃.
Specifically, host as raw material, is supposed that host is 100 parts, allocate 10 parts of toluene into, both stir and are in harmonious proportion; Allocate 0.5 part of curing agent on one side again,, can obtain described antistatic adhesive tape Yi Bian evenly stir.More particularly, described host is polyester emulsion, and described curing agent is a platinum catalyst emulsion.
In addition, the surface produces the phenomenon of washmarking when being coated with in order to alleviate adhesive tape, can suitably add alcohol during use, is example with above-mentioned 100 parts of hosts still, can add 5 parts of alcohol at last.
S5, rolling
S1, choose base material
Specifically, preferentially and without limitation choose the polyimide film high temperature resistant, that transparency is good as base material.
S2, to the positive coating of described base material primer, and in the coating primer, dry processing, bake out temperature is approximately 105 ℃.
Specifically, described primer is an organosilicon polymer; More particularly, described primer forms by the raw material of following weight ratio is composite, PSA409 additive: crosslinking agent: catalyst: retarder thinner=1: 0.08: 0.15: 0.04, described crosslinking agent is BPO, described catalyst is two bay catalyst, and described retarder thinner is an aromatic solvent.The temperature of preparation primer is a normal temperature.
S3, to applicator surface glue on the described primer, and in applicator surface glue, dry processing, bake out temperature is approximately 140 ℃.
Specifically, described glue is organic pressure-sensitive gel, and more particularly, described organic pressure-sensitive gel forms by the raw material of following weight ratio is composite, poly dimethyl oxygen alkane silica gel: resin=1: 0.15.The temperature of preparation face glue is a normal temperature.
S4, described substrate backside is applied antistatic adhesive, and dry processing in the antistatic adhesive of coating, bake out temperature is approximately 170 ℃.
Specifically, host as raw material, is supposed that host is 100 parts, allocate 30 parts of toluene into, both stir and are in harmonious proportion; Allocate 0.8 part of curing agent on one side again,, can obtain described antistatic adhesive Yi Bian evenly stir.More particularly, described host is polyester emulsion, and described curing agent is a platinum catalyst emulsion.
In addition, the surface produces the phenomenon of washmarking when being coated with in order to alleviate adhesive, can suitably add alcohol during use, is example with above-mentioned 100 parts of hosts still, can add 8 parts of alcohol at last.
S5, rolling
S1, choose base material
Specifically, preferentially and without limitation choose the polyimide film high temperature resistant, that transparency is good as base material.
S2, to the positive coating of described base material primer, and in the coating primer, dry processing, bake out temperature is approximately 120 ℃.
Specifically, described primer is an organosilicon polymer; More particularly, described primer forms by the raw material of following weight ratio is composite, PSA409 additive: crosslinking agent: catalyst: retarder thinner=1: 0.1: 0.2: 0.08, and described crosslinking agent is BPO, described catalyst is two bay catalyst, and described retarder thinner is an aromatic solvent.The temperature of preparation primer is a normal temperature.
S3, to applicator surface glue on the described primer, and in applicator surface glue, dry processing, bake out temperature is approximately 200 ℃.
Specifically, described glue is organic pressure-sensitive gel, and more particularly, described organic pressure-sensitive gel forms by the raw material of following weight ratio is composite, poly dimethyl oxygen alkane silica gel: resin=1: 0.2.The temperature of preparation face glue is a normal temperature.
S4, described substrate backside is applied antistatic adhesive, and dry processing in the antistatic adhesive of coating, bake out temperature is approximately 200 ℃.
Specifically, host as raw material, is supposed that host is 100 parts, allocate 50 parts of toluene into, both stir and are in harmonious proportion; Allocate 1 part of curing agent on one side again,, can obtain described antistatic adhesive Yi Bian evenly stir.More particularly, described host is polyester emulsion, and described curing agent is a platinum catalyst emulsion.
In addition, the surface produces the phenomenon of washmarking when being coated with in order to alleviate adhesive, can suitably add alcohol during use, is example with above-mentioned 100 parts of hosts still, can add 10 parts of alcohol at last.
S5, rolling
Polyester emulsion of the present invention, platinum catalyst emulsion, toluene, alcohol all are the common raw material of chemical field, all can buy on market.
Because the described tape surface resistance of the embodiment of the invention reaches 1.0 * 10
5Ω/cm
2, therefore have higher antistatic effect.Simultaneously, after the chemical composition qualitative analysis, this adhesive tape does not contain heavy metal, halogen and harmful VOC material, so environmentally safe.
The above; it only is the specific embodiment of the present invention; should be noted that protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claim was defined.
Claims (7)
1. the processing method of an antistatic adhesive tape is characterized in that, described processing method may further comprise the steps:
S1, choose base material;
S2, to the positive coating of described base material primer, and in the coating primer, dry processing, bake out temperature is approximately 90 ℃～120 ℃;
S3, to applicator surface glue on the described primer, and in applicator surface glue, dry processing, bake out temperature is approximately 80 ℃～200 ℃;
S4, described substrate backside is applied antistatic adhesive, and in the antistatic adhesive of coating, dry processing, bake out temperature is approximately 130 ℃～200 ℃, described antistatic adhesive forms host by the raw material of following weight ratio is composite: toluene: curing agent=1: 0.1～0.5: 0.005～0.01;
S5, rolling.
2. the processing method of antistatic adhesive tape according to claim 1 is characterized in that, described base material is a polyimide film.
3. the processing method of antistatic adhesive tape according to claim 1 is characterized in that, described antistatic adhesive is added alcohol, and the weight ratio of described host and alcohol is host: alcohol=1: 0.05～0.1.
4. the processing method of antistatic adhesive tape according to claim 1 is characterized in that, described host is polyester emulsion.
5. the processing method of antistatic adhesive tape according to claim 1 is characterized in that, described curing agent is a platinum catalyst emulsion.
6. the processing method of antistatic adhesive tape according to claim 1 is characterized in that, described glue forms by the raw material of following weight ratio is composite, poly dimethyl oxygen alkane silica gel: resin=1: 0.1～0.2.
7. the processing method of antistatic adhesive tape according to claim 1, it is characterized in that, described primer forms by the raw material of following weight ratio is composite, PSA409 additive: crosslinking agent: catalyst: retarder thinner=1: 0.05～0.1: 0.1～0.2: 0.01～0.08.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101840354A CN101990359A (en) | 2009-07-31 | 2009-07-31 | Processing method of antistatic adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101840354A CN101990359A (en) | 2009-07-31 | 2009-07-31 | Processing method of antistatic adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101990359A true CN101990359A (en) | 2011-03-23 |
Family
ID=43746576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101840354A Pending CN101990359A (en) | 2009-07-31 | 2009-07-31 | Processing method of antistatic adhesive tape |
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| CN (1) | CN101990359A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105453710A (en) * | 2013-05-24 | 2016-03-30 | 雅马哈发动机株式会社 | Coating trial device, dispenser and electronic component mounting device |
-
2009
- 2009-07-31 CN CN2009101840354A patent/CN101990359A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105453710A (en) * | 2013-05-24 | 2016-03-30 | 雅马哈发动机株式会社 | Coating trial device, dispenser and electronic component mounting device |
| CN105453710B (en) * | 2013-05-24 | 2019-02-19 | 雅马哈发动机株式会社 | Apply experimental rig, coating machine and electronic element installation device |
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Application publication date: 20110323 |