CN101990355B - Soft-hard circuit board and process thereof - Google Patents
Soft-hard circuit board and process thereof Download PDFInfo
- Publication number
- CN101990355B CN101990355B CN 200910160888 CN200910160888A CN101990355B CN 101990355 B CN101990355 B CN 101990355B CN 200910160888 CN200910160888 CN 200910160888 CN 200910160888 A CN200910160888 A CN 200910160888A CN 101990355 B CN101990355 B CN 101990355B
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- base plate
- soft
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a soft-hard circuit board and a process thereof. The soft-hard circuit board comprises a hard circuit board, a first soft circuit board, a first outer composite layer and a plurality of first conductive connecting structures. The hard circuit board is provided with an upper surface, a lower surface opposite to the upper surface and a groove. The first outer composite layer is provided with a first opening communicated with the groove, and comprises a first outer circuit layer and a first insulating layer. The first insulating layer is arranged between the first outer circuit layer and the upper surface. The first soft circuit board is arranged on the first insulating layer and covers the groove. The first insulating layer is locally covered on the first soft circuit board. The first conductive connecting structures are arranged in the first insulating layer and electrically connected between the hard circuit board and the first soft circuit board. The soft-hard circuit board can reduce the demand of flexible substrates and greatly reduce the manufacturing cost, and also has the advantages of saving the assembly space and reducing the soft board length and the soft board pressing times.
Description
Technical field
The present invention relates to a kind of wiring board and technique thereof, particularly relate to a kind of soft hard circuit board (flex-rigid circuit board) and technique thereof.
Background technology
Wiring board technology has now developed the soft hard circuit board of numerous species, and these soft hard circuit boards are mostly open, and for example the soft or hard composite wiring plate that discloses of Japanese Laid-Open Patent document 2006-140213 has: the core substrate of huttriall, in abutting connection with the flexible base plate that is configured in the horizontal direction of core substrate, lamination in the flexibility adhesive layer on core substrate and the flexible base plate, be formed at the wiring pattern on the flexibility adhesive layer that is positioned at the huttriall and be connected to form blind hole and/or through hole between the wiring pattern of each layer.In this structure, lamination has the flexibility adhesive layer on flexible base plate.Therefore, bending during flexible base plate stress large, so it is large to put on the power of connecting portion of conductor of the conductor of flexible base plate and rigid substrate, cause easily broken string etc.For example TaiWan, China patent documentation I304318 discloses the non-flexible substrate that alignment arrangements in the horizontal direction possesses the flexible base plate of conductive pattern and has rigidity again, so that the mode that at least one part of flexible base plate is exposed, cover flexible base plate and non-flexible substrate by insulating barrier, its shortcoming is that soft board needs through repeatedly pressing, easily oxidation and layering.See also Fig. 1, it is the generalized section of existing known common soft hard circuit board.Existing known soft hard circuit board 100 comprises a soft circuit base plate 110,120 and two layers of copper wire layer of two layers of rigid resin bed (rigidresin layer) (coppe rcircuit layer) 130.These rigid resin beds 120 are bonding on respectively relative two sides of soft circuit base plate 110, and the soft circuit base plate 110 of local exposure, and these copper wire layer 130 then are disposed at respectively on these rigid resin beds 120.
Hold above-mentionedly, soft circuit base plate 110 comprises a soft substrate plate 112, and soft substrate plate 112 has flexibility, and then allows the soft hard circuit board 100 can be crooked.Soft substrate plate 112 extends between these rigid resin beds 120 comprehensively, to such an extent as to the surface 122 of these rigid resin beds 120 contacts soft substrate plate 112 all fully.Therefore, from Fig. 1, soft substrate plate 112 is the centres that are clamped in soft hard circuit board 100.
Yet, because soft substrate plate 112 extends between these rigid resin beds 120 comprehensively, so soft substrate plate 112 only has the sub-fraction can be crooked, other parts then can't be crooked because of being binded by rigid resin bed 120, to such an extent as to soft hard circuit board 100 needs quite large-area soft substrate plate 112 in manufacturing, cause the demand of soft substrate plate 112 too high, and then significantly increase the manufacturing cost of soft hard circuit board 100.
Therefore, how reducing the demand of soft substrate plate 112, with the manufacturing cost that reduces soft hard circuit board 100 and avoid repeatedly pressing to cause the easy oxidation of soft board and layering, is the problem that present urgent need will solve.
This shows that above-mentioned existing known wiring board and technique thereof obviously still have inconvenience and defective, and demand urgently further being improved in manufacture method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but have no for a long time applicable design is finished by development always, and common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious wish of relevant dealer solves.Therefore how to found a kind of new soft hard circuit board and technique thereof, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing wiring board and technique thereof exist, the inventor is based on being engaged in for many years abundant practical experience and professional knowledge of this type of product design manufacturing, and the utilization of cooperation scientific principle, positive research and innovation in addition, in the hope of founding a kind of new soft hard circuit board and technique thereof, can improve general existing wiring board and technique thereof, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the present invention who has practical value.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing wiring board exists, and provide a kind of new soft hard circuit board, technical problem to be solved is to make it reduce the demand of flexible base plate, and then the manufacturing cost of reduction soft hard circuit board, improve simultaneously the problem that repeatedly pressing causes the easy oxidation of soft board and layering, be very suitable for practicality.
Another object of the present invention is to, overcome the defective that existing wiring board and technique thereof exist, and a kind of technique of new soft hard circuit board is provided, technical problem to be solved is to make its manufacturing cost that reduces soft hard circuit board, thereby more is suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of soft hard circuit board that the present invention proposes, it comprises: a rigid wiring board, and the lower surface and with a upper surface, relative this upper surface extends to the groove of this lower surface from this upper surface; One first outer composite bed has one and is communicated with the first opening of this groove, and comprises one first outer-layer circuit layer and one first insulating barrier, and wherein this first insulating barrier is disposed between this first outer-layer circuit layer and this upper surface; One first flexible circuit board is disposed at this first insulating barrier, wherein local this first insulating barrier that covers of this first flexible circuit board; And a plurality of the first conduction connecting structures, be disposed in this first insulating barrier, and be electrically connected this rigid wiring board and this first flexible circuit board.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid soft hard circuit board, wherein said the first flexible circuit board comprises: one first flexible base plate; Line layer on one first; One first time line layer, this on first first time line layer of line layer and this be disposed at respectively relative two surfaces of this first flexible base plate; And a plurality of the first conductive poles, be disposed in this first flexible base plate, and be electrically connected this line layer and this first time line layer on first, wherein those first conductive poles see through this on first line layer be electrically connected those the first conduction connecting structures.
Aforesaid soft hard circuit board, wherein said the first flexible circuit board comprise that more one is disposed at the first cover layer of this first flexible base plate, and this first cover layer covers this first time line layer.
Aforesaid soft hard circuit board, wherein more comprise: one second outer composite bed, have one and be communicated with the second opening of this groove, and comprise one second outer-layer circuit layer and one second insulating barrier, wherein this second insulating barrier is disposed between this second outer-layer circuit layer and this lower surface; One second flexible circuit board is disposed at this second insulating barrier, wherein local this second insulating barrier that covers of this second flexible circuit board; And a plurality of the second conduction connecting structures, be disposed in this second insulating barrier, and be electrically connected this rigid wiring board and this second flexible circuit board.
Aforesaid soft hard circuit board, the second wherein said flexible circuit board comprises: one second flexible base plate; Line layer on one second; One second time line layer, this on second second time line layer of line layer and this be disposed at respectively relative two surfaces of this second flexible base plate; And a plurality of the second conductive poles, be disposed in this second flexible base plate, and be electrically connected this line layer and this second time line layer on second, wherein those second conductive poles see through this second time line layer and are electrically connected those the second conduction connecting structures.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The technique of a kind of soft hard circuit board that proposes according to the present invention, it may further comprise the steps: a rigid wiring board is provided, and wherein the lower surface and of this rigid wiring board with a upper surface, relative this upper surface extends to the groove of this lower surface from this upper surface; Form one first insulating barrier in this upper surface; One first soft circuit base plate is pressed on this first insulating barrier, wherein local this first insulating barrier that covers of this first soft circuit base plate; Form one first conductive layer on this first insulating barrier, wherein this first conductive layer exposes this first soft circuit base plate; Form a plurality of the first conduction connecting structures in this first insulating barrier, wherein those first conduction connecting structures are electrically connected this rigid wiring board and this first soft circuit base plate; And this first conductive layer of patterning, to form one first line layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The technique of aforesaid soft hard circuit board, the wherein said first soft circuit base plate comprises: one first flexible base plate; One first upper conductor layer; And one first time line layer, first time line layer of this first upper conductor layer and this is disposed at respectively relative two surfaces of this first flexible base plate.
The technique of aforesaid soft hard circuit board, wherein after forming this first conductive layer, more may further comprise the steps: form a plurality of the first conductive poles in this first flexible base plate, wherein those first conductive poles are electrically connected this first upper conductor layer and this first time line layer, and those first conductive poles are electrically connected those the first conduction connecting structures through this first upper conductor layer.
The technique of aforesaid soft hard circuit board wherein more may further comprise the steps: form one second insulating barrier on this lower surface; One second soft circuit base plate is pressed on this second insulating barrier, wherein local this second insulating barrier that covers of this second soft circuit base plate; Form one second conductive layer on this second insulating barrier, wherein this second conductive layer exposes this second soft circuit base plate; Form a plurality of the second conduction connecting structures in this second insulating barrier, wherein those second conduction connecting structures are electrically connected this rigid wiring board and this second soft circuit base plate; And this second conductive layer of patterning, to form one second line layer.
The technique of aforesaid soft hard circuit board, the wherein said second soft circuit base plate comprises: one second flexible base plate; Line layer on one second; And one second lower conductor layer, this on second line layer and this second lower conductor layer be disposed at respectively relative two surfaces of this second flexible base plate.
The present invention compared with prior art has obvious advantage and beneficial effect.As known from the above, for achieving the above object, the invention provides a kind of soft hard circuit board, comprise a rigid wiring board (rigidcircuit board), one first outer composite bed, one first flexible circuit board and a plurality of the first conduction connecting structure.The lower surface and one that rigid wiring board has a upper surface, a relative upper surface extends to the groove of lower surface from upper surface.The first outer composite bed has one and is communicated with the first opening of groove, and comprises one first outer-layer circuit layer and one first insulating barrier, and wherein the first insulating barrier is disposed between the first outer-layer circuit layer and the upper surface.The first flexible circuit board is disposed at the first insulating barrier, and hides groove, wherein local first insulating barrier that covers of the first flexible circuit board.A plurality of the first conduction connecting structures are disposed in the first insulating barrier, and are electrically connected between rigid wiring board and the first flexible circuit board.
The present invention provides a kind of technique of soft hard circuit board in addition, may further comprise the steps, and a rigid wiring board is provided, and wherein the lower surface and of rigid wiring board with a upper surface, a relative upper surface extends to the groove of lower surface from upper surface.Then, form one first insulating barrier on upper surface.Afterwards, one first soft circuit base plate is pressed on the first insulating barrier, wherein local first insulating barrier that covers of the first soft circuit base plate, and covering groove.Then, form one first conductive layer on the first insulating barrier, wherein the first conductive layer exposes the first soft circuit base plate.Then, form a plurality of the first conduction connecting structures in the first insulating barrier, wherein these first conduction connecting structures are electrically connected between rigid wiring board and the first soft circuit base plate.At last, patterning the first conductive layer is to form one first line layer.
By technique scheme, soft hard circuit board of the present invention and technique thereof have following advantages and beneficial effect at least: soft hard circuit board of the present invention only needs the flexible circuit board of small size on making, so the present invention can reduce the demand of flexible base plate, and then significantly reducing the manufacturing cost of soft hard circuit board, the present invention also has and saves assembling space, reduces the advantage that soft board length and soft board pressing number of times reduce.
In sum, the invention relates to a kind of soft hard circuit board and technique thereof, a kind of soft hard circuit board comprises a rigid wiring board, one first flexible circuit board, one first outer composite bed and a plurality of the first conduction connecting structure.Rigid wiring board has lower surface and a groove of a upper surface, a relative upper surface.The first outer composite bed has one and is communicated with the first opening of groove, and comprises one first outer-layer circuit layer and one first insulating barrier.The first insulating barrier is configured between the first outer-layer circuit layer and the upper surface.The first flexible circuit board is configured in the first insulating barrier, and hides groove.Local first insulating barrier that covers of the first flexible circuit board.These first conduction connecting structures are configured in the first insulating barrier, and are electrically connected between rigid wiring board and the first flexible circuit board.The present invention has significant progress technically, and has obvious good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is the generalized section that has known soft hard circuit board now.
Fig. 2 A to Fig. 2 F is the generalized section of technique of the soft hard circuit board of first embodiment of the invention.
Fig. 3 A to Fig. 3 C is the generalized section of technique of the soft hard circuit board of second embodiment of the invention.
100,200,300: soft hard circuit board
110: soft circuit base plate 112: matter substrate
120: rigid resin bed 122: surface
130: copper wire layer 210: rigid wiring board
10a: upper surface 10b: lower surface
12a: upper line layer 12b: lower line layer
214: dielectric layer
20a: the first outer composite bed 20b: the second outer composite bed
22a: the first outer-layer circuit layer 22b: the second outer-layer circuit layer
23a: the first conductive layer 23b: the second conductive layer
24a: the first insulating barrier 24b: the second insulating barrier
30a: the first flexible circuit board 30b: the second flexible circuit board
31a: the first soft circuit base plate 31b: the second soft circuit base plate
32a: the first flexible base plate 32b: the second flexible base plate
34a: line layer 34b on first: second time line layer
35a: the first upper conductor layer 35b: the second lower conductor layer
36a: first time line layer 36b: line layer on second
38a: the first conductive pole 38b: the second conductive pole
39a: the first cover layer 39b: the second cover layer
40a: the first conduction connecting structure 40b: the second conduction connecting structure
250: welding resisting layer B1, B2: blind hole
H1: the first opening H2: the second opening
O1-O4, O4 ': through hole T: groove
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, soft hard circuit board and its embodiment of technique, structure, method, step, feature and effect thereof to foundation the present invention proposes are described in detail as follows.
Relevant aforementioned and other technology contents of the present invention, Characteristic can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.For convenience of description, in following embodiment, identical element represents with identical numbering.
See also shown in Fig. 2 A to Fig. 2 F, Fig. 2 A to Fig. 2 F is the generalized section of technique of the soft hard circuit board of first embodiment of the invention, and wherein Fig. 2 F illustrates the structure of the soft hard circuit board of present embodiment.Please consult first Fig. 2 F, soft hard circuit board 200 comprises a rigid wiring board 210, one first outer composite bed 20a, one second outer composite bed 20b, one first flexible circuit board 30a, a plurality of the first conduction connecting structure 40a and a plurality of the second conduction connecting structure 40b.The first flexible circuit board 30a is positioned at the outermost layer of soft hard circuit board 200.
The lower surface 10b and one that rigid wiring board 210 has a upper surface 10a, a relative upper surface 10a extends to the groove T of lower surface 10b from upper surface 10a.Rigid wiring board 210 shown in Fig. 2 F is a kind of double-sided wiring board (double-side circuit board), but in the embodiment that other do not illustrate, rigid wiring board 210 can also be one-sided circuit board (single-side circuit board) or multilayer circuit board (multilayer circuit board).
The two structure and material of the first outer composite bed 20a and the second outer composite bed 20b is all identical.Specifically, the first outer composite bed 20a comprises one first outer-layer circuit layer 22a and one first insulating barrier 24a, and has one first an opening H1, and the second outer composite bed 20b comprises one second outer-layer circuit layer 22b and one second insulating barrier 24b, and having one second opening H2, it extends to the second insulating barrier 24b from the second outer-layer circuit layer 22b.The first opening H1 all is communicated with groove T with the second opening H2, and the first opening H1 and the second opening H2 respective grooves T all.
The first insulating barrier 24a is disposed on the upper surface 10a of rigid wiring board 210, and the first outer-layer circuit layer 22a is disposed on the first insulating barrier 24a.Therefore, the first insulating barrier 24a is disposed between the first outer-layer circuit layer 22a and the upper surface 10a.The second insulating barrier 24b is disposed on the lower surface 10b of rigid wiring board 210, and the second outer-layer circuit layer 22b is disposed on the second insulating barrier 24b, so the second insulating barrier 24b is disposed between the second outer-layer circuit layer 22b and the lower surface 10b.
The first flexible circuit board 30a is disposed at the first insulating barrier 24a, and is positioned at the first opening H1 place, and wherein the first flexible circuit board 30a is local covers the first insulating barrier 24a, and incomprehensive covering the first insulating barrier 24a.The first flexible circuit board 30a comprises line layer 34a on the one first flexible base plate 32a, one first, one first time line layer 36a and a plurality of the first conductive pole 38a.
Hold above-mentionedly, line layer 34a and first time line layer 36a are disposed at respectively relative two surfaces of the first flexible base plate 32a on first.Line layer 34a and first time line layer 36a for example are copper wire layer on first, have the material of flexibility and the first flexible base plate 32a for example is polyimides (Polyimide, PI) diaphragm or other.In addition, can protrude from the first insulating barrier 24a or coplanar after the first flexible base plate 32a pressing.
These first conductive poles 38a is electrically connected line layer 34a and first time line layer 36a on first, and is disposed among the first flexible base plate 32a.In addition, the first conductive pole 38a can see through that line layer 34a is electrically connected the first conduction connecting structure 40a on first.
Particularly, the first conduction connecting structure 40a for example is conductive blind hole structures (conductiveblind via structure), and the first conduction connecting structure 40a connects the circuit of line layer 34a and rigid wiring board 210 on first.
These second conduction connecting structures 40b is disposed among the second insulating barrier 24b, and be electrically connected rigid wiring board 210 and the second outer-layer circuit layer 22b, wherein the two structure of the second conduction connecting structure 40b and the first conduction connecting structure 40a is identical, and namely the second conduction connecting structure 40b is conductive blind hole structures.
In addition, the first flexible circuit board 30a comprises that more one is disposed at the first cover layer 39a of the first flexible base plate 32a, and wherein the first cover layer 39a covers first time line layer 36a, and more local covering the first flexible base plate 32a.In addition, the first cover layer 39a partly extends into the first insulating barrier 24a, and the first cover layer 39a can dispose (shown in Fig. 2 F) inwardly or be configured to protect the line layer on the first flexible base plate 32a surface outwardly.
The technique of relevant soft hard circuit board 200, please consult first Fig. 2 A, at first, rigid wiring board 210 is provided, wherein rigid wiring board 210 can be by copper clad laminate (Copper Clad Laminate, CCL) made, and the manufacture method of rigid wiring board 210 is known by having in the technical field of the invention common thing person, so further do not introduce the manufacture method of rigid wiring board 210 at this.
Hold above-mentioned, rigid wiring board 210 comprises line layer 12a on, the dielectric layer 214 of line layer 12b and between upper line layer 12a and lower line layer 12b once, wherein go up line layer 12a and lower line layer 12b all can be copper wire layer, and dielectric layer 214 can be resin bed, and it for example is core layer (core layer).
See also Fig. 2 B and Fig. 2 C, then, form the first insulating barrier 24a on upper surface 10a, and form the second insulating barrier 24b on lower surface 10b, wherein the first insulating barrier 24a and the second insulating barrier 24b cover respectively upper line layer 12a and the lower line layer 12b of rigid wiring board 210.Specifically, the first insulating barrier 24a and the second insulating barrier 24b all can be film, and the step that forms the first insulating barrier 24a and the second insulating barrier 24b is respectively that the pressing film is in upper surface 10a and lower surface 10b.
In addition, the first insulating barrier 24a and the second insulating barrier 24b have respectively through hole O1, O2, and wherein through hole O1, O2 be all corresponding to groove T, so through hole O1, O2 all communicate with groove T.In addition, through hole O1, O2 utilize punching or external form cutting mechanical processing methods such as (routing) to form.
Then, one first soft circuit base plate 31a is pressed on the first insulating barrier 24a, wherein the first soft circuit base plate 31a part covers the first insulating barrier 24a, and hides groove T and through hole O1.Particularly, because the first insulating barrier 24a can be film, therefore the first insulating barrier 24a has stickiness, and can stick together the first soft circuit base plate 31a.So, the first soft circuit base plate 31a is pressed on the first insulating barrier 24a.
The first soft circuit base plate 31a comprises the first flexible base plate 32a, one first upper conductor layer 35a, first time line layer 36a and the first cover layer 39a.The first upper conductor layer 35a and first time line layer 36a are disposed at respectively relative two surfaces of the first flexible base plate 32a, and the first cover layer 39a covers first time line layer 36a.The first soft circuit base plate 31a carries out little shadow and etching and forms the soft board base material, and its formation method is identical with the technique of existing known flexible circuit board, so do not elaborate at this.
Afterwards, form one first conductive layer 23a on the first insulating barrier 24a, and form one second conductive layer 23b on the second insulating barrier 24b, wherein the first conductive layer 23a exposes the first soft circuit base plate 31a.Specifically, the first conductive layer 23a has a through hole O3, and through hole O3 can expose the first soft circuit base plate 31a fully, so that the whole first soft circuit base plate 31a is exposed out.
Hold above-mentionedly, the second conductive layer 23b has a through hole O4, and through hole O4 can corresponding through hole O1, O2 and groove T, so through hole O1, O2 and O4 and groove T all communicate with each other.In addition, the formation method of through hole O3, O4 is identical with through hole O1, O2, and namely through hole O3, O4 can utilize the mechanical processing methods such as punching or external form cutting to form.
The step that forms the first conductive layer 23a and the second conductive layer 23b can be pressing one Copper Foil in the first insulating barrier 24a, another Copper Foil of pressing is in the second insulating barrier 24b.Specifically, because the first insulating barrier 24a and the second insulating barrier 24b are film, to such an extent as to the first insulating barrier 24a and the second insulating barrier 24b all have stickiness, and then can stick together above-mentioned two Copper Foils.So, the first conductive layer 23a and the second conductive layer 23b all can form through the method for pressing Copper Foil.
See also Fig. 2 D, after forming the first conductive layer 23a and the second conductive layer 23b, form a plurality of the first conduction connecting structure 40a in the first insulating barrier 24a, and form a plurality of the second conduction connecting structure 40b in the second insulating barrier 24b, wherein the first conduction connecting structure 40a is electrically connected rigid wiring board 210 and the first soft circuit base plate 31a, and the second conduction connecting structure 40b is electrically connected rigid wiring board 210 and the second conductive layer 23b.
In the present embodiment, the method that forms the first conduction connecting structure 40a and the second conduction connecting structure 40b can be to carry out bore process, to form a plurality of blind hole B1 in the first insulating barrier 24a, forms a plurality of blind hole B2 in the second insulating barrier 24b.Afterwards, these blind holes B1, B2 are carried out electroplating technology.So, the first conduction connecting structure 40a and the second conduction connecting structure 40b are respectively formed among these blind holes B1, the B2.
In the process that forms the first conduction connecting structure 40a and the second conduction connecting structure 40b, can also form simultaneously a plurality of the first conductive pole 38a in the first flexible base plate 32a.Specifically, these first conductive poles 38a is electrically connected the first upper conductor layer 35a and first time line layer 36a, and is electrically connected the first conduction connecting structure 40a through the first upper conductor layer 35a.In addition, the two formation method of the formation method of the first conductive pole 38a and the first conduction connecting structure 40a and the second conduction connecting structure 40b is identical.
See also Fig. 2 D and Fig. 2 E, then, patterning the first conductive layer 23a, the second conductive layer 23b and the first upper conductor layer 35a, to form respectively line layer 34a on the first outer-layer circuit layer 22a, the second outer-layer circuit layer 22b and first, wherein the method for patterning can adopt little shadow and etch process.So, the first flexible circuit board 30a, the first outer composite bed 20a and the second outer composite bed 20b are formed.So far, a kind of soft hard circuit board 200 has basically been made and has been finished.
See also Fig. 2 F; then; in the present embodiment; can also form respectively two layers of welding resisting layer 250 in the first insulating barrier 24a and the second insulating barrier 24b surface; wherein these welding resisting layers 250 cover respectively the first outer-layer circuit layer 22a and the second outer-layer circuit layer 22b, to protect the first outer-layer circuit layer 22a and the second outer-layer circuit layer 22b.
See also shown in Fig. 3 A to Fig. 3 C, Fig. 3 A to Fig. 3 C is the generalized section of technique of the soft hard circuit board of second embodiment of the invention, and wherein Fig. 3 C illustrates the structure of the soft hard circuit board of present embodiment.Please consult first Fig. 3 C, the soft hard circuit board 300 of present embodiment is similar to the soft hard circuit board 200 of the first embodiment, and only the difference part is: soft hard circuit board 300 comprises a plurality of flexible circuit boards.
Specifically, soft hard circuit board 300 not only comprises the element of soft hard circuit board 200, more comprises one second flexible circuit board 30b.The second flexible circuit board 30b is disposed at the second insulating barrier 24b, and hides groove T, wherein the local second insulating barrier 24b that covers of the second flexible circuit board 30b.
The second flexible circuit board 30b is identical with first the two structure of flexible circuit board 30a.Specifically, the second flexible circuit board 30b comprises line layer 36b, a plurality of the second conductive pole 38b and one second cover layer 39b on one second flexible base plate 32b, the one second time line layer 34b, one second, and wherein line layer 36b and second time line layer 34b are disposed at respectively relative two surfaces of the second flexible base plate 32b on second.
The second conductive pole 38b is disposed among the second flexible base plate 32b, and for example these second conductive poles 38b is embedded in the second flexible base plate 32b.The second conductive pole 38b is electrically connected line layer 36b and second time line layer 34b on second, and is electrically connected the second conduction connecting structure 40b through second time line layer 34b.
In addition, the second conduction connecting structure 40b that is disposed among the second insulating barrier 24b can be electrically connected rigid wiring board 210 and the second flexible circuit board 30b.So, rigid wiring board 210 and the second flexible circuit board 30b are electrically conducted each other.
The technique of relevant soft hard circuit board 300, its soft hard circuit board 200 techniques with the first embodiment are identical, so be not repeated herein the same steps as in soft hard circuit board 200,300 the two technique, only cooperate Fig. 3 A to Fig. 3 C to describe with regard to its difference.
See also Fig. 3 A and Fig. 3 B, after rigid wiring board 210 is provided, form the first insulating barrier 24a on the upper surface 10a of rigid wiring board 210, and form the second insulating barrier 24b on the lower surface 10b of rigid wiring board 210, wherein the formation first insulating barrier 24a of present embodiment is identical with the first embodiment with the method for the second insulating barrier 24b.
Then, one first soft circuit base plate 31a is pressed on the first insulating barrier 24a, and one second soft circuit base plate 31b is pressed on the second insulating barrier 24b.The local first insulating barrier 24a that covers of the first soft circuit base plate 31a, and hide groove T.The second soft circuit base plate 31b is local to cover the second insulating barrier 24b, and also hides groove T, and corresponding the first soft circuit base plate 31a.
The second soft circuit base plate 31b comprises line layer 36b and the second cover layer 39b on one second flexible base plate 32b, the one second lower conductor layer 35b, second.Line layer 36b and the second lower conductor layer 35b are disposed at respectively relative two surfaces of the second flexible base plate 32b on second, and the second cover layer 39b covers line layer 36b on second.In addition, the method that forms the second soft circuit base plate 31b is identical with the method that forms the first soft circuit base plate 31a.
Afterwards, form one first conductive layer 23a on the first insulating barrier 24a, and form one second conductive layer 23b on the second insulating barrier 24b, wherein the first conductive layer 23a exposes the first soft circuit base plate 31a, and the second conductive layer 23b exposes the second soft circuit base plate 31b.
Specifically, the second conductive layer 23b has a through hole O4 ', and through hole O4 ' can expose the second soft circuit base plate 31b fully, so that the whole second soft circuit base plate 31b is exposed out, wherein through hole O4 ' utilizes the mechanical processing methods such as punching or external form cutting to form.In addition, the first conductive layer 23a and the second conductive layer 23b all can form through the method for pressing Copper Foil.
See also Fig. 3 B and Fig. 3 C, after forming the first conductive layer 23a and the second conductive layer 23b, utilize little shadow and etch process patterning to form a plurality of the first conduction connecting structure 40a in the first insulating barrier 24a, and form a plurality of the second conduction connecting structure 40b in the second insulating barrier 24b, wherein the first conduction connecting structure 40a is electrically connected rigid wiring board 210 and the first soft circuit base plate 230a, and the second conduction connecting structure 40b is electrically connected rigid wiring board 210 and the second soft circuit base plate 30b.
In addition, in the process that forms the first conduction connecting structure 40a and the second conduction connecting structure 40b, also can form simultaneously a plurality of the first conductive pole 38a in the first flexible base plate 32a, and form a plurality of the second conductive pole 38b in the second flexible base plate 32b.
These first conductive poles 38a is electrically connected line layer 34a and first time line layer 36a on first, and these second conductive poles 38b is electrically connected line layer 36b and second time line layer 34b on second.In addition, the formation method of these second conductive poles 38b is identical with the first conductive pole 38a.So far, a kind of soft hard circuit board 300 has basically been made and has been finished.
See also Fig. 3 C; then; can form respectively two layers of welding resisting layer 250 in the first insulating barrier 24a and the second insulating barrier 24b surface; wherein these welding resisting layers 250 cover respectively the first outer-layer circuit layer 22a and the second outer-layer circuit layer 22b, to protect the first outer-layer circuit layer 22a and the second outer-layer circuit layer 22b.
In sum, because the local insulating barrier (such as the first insulating barrier or the second insulating barrier) that covers of flexible circuit board (such as the first flexible circuit board or the second flexible circuit board), therefore compared to existing known techniques, soft hard circuit board of the present invention only needs the flexible circuit board of small size, so the present invention can reduce the demand of flexible base plate, and then significantly reduce the manufacturing cost of soft hard circuit board.
In addition, flexible circuit board of the present invention is made in the soft hard circuit board outermost layer, can reduce the pressing number of times, avoids soft board oxidation and layering.And can reduce soft board length and save assembling space, so having more, the present invention improves the advantage that repeatedly pressing causes the problem of the easy oxidation of soft board and layering.
Secondly, in the technique of soft hard circuit board of the present invention, because soft circuit base plate (such as the first soft circuit base plate or the second soft circuit base plate) has comprised cover layer (such as the first cover layer or the second cover layer), therefore in manufacture process, flexible base plate (such as the first flexible base plate or the second flexible base plate) can be subject to tectal support, with the situation of minimizing flexible circuit board fracture, and then improve product yield (yield).
Although the present invention discloses as above with most preferred embodiment, so it is not to limit the present invention, anyly has the knack of alike skill person, and without departing from the spirit and scope of the present invention, institute does to change and the equivalence replacement of retouching, and still is in the scope of patent protection of the present invention.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1. soft hard circuit board is characterized in that it comprises:
One rigid wiring board, the lower surface and with a upper surface, relative this upper surface extends to the groove of this lower surface from this upper surface, and wherein this rigid wiring board comprises line layer and a dielectric layer on one, and line layer is disposed at the surface of dielectric layer on this;
One first outer composite bed has one and is communicated with the first opening of this groove, and comprises one first outer-layer circuit layer and one first insulating barrier, and wherein this first insulating barrier is disposed between this first outer-layer circuit layer and this upper surface;
One first flexible circuit board, be disposed at this first insulating barrier, wherein part, the two ends of this first flexible circuit board covers this first insulating barrier, and this first flexible circuit board is between this rigid wiring board and this first outer composite bed, wherein this first flexible circuit board comprises line layer on one first flexible base plate and one first, this on first line layer be disposed at the surface of this first flexible base plate; And
A plurality of the first conduction connecting structures are disposed in this first insulating barrier, and be electrically connected this rigid wiring board one on line layer and this first flexible circuit board one first on line layer.
2. soft hard circuit board according to claim 1 is characterized in that wherein said the first flexible circuit board comprises:
One first flexible base plate;
Line layer on one first;
One first time line layer, this on first first time line layer of line layer and this be disposed at respectively relative two surfaces of this first flexible base plate; And
A plurality of the first conductive poles are disposed in this first flexible base plate, and are electrically connected this line layer and this first time line layer on first, wherein those first conductive poles see through this on first line layer be electrically connected those the first conduction connecting structures.
3. soft hard circuit board according to claim 2 it is characterized in that wherein said the first flexible circuit board comprises that more one is disposed at the first cover layer of this first flexible base plate, and this first cover layer covers this first time line layer.
4. soft hard circuit board according to claim 1 is characterized in that it more comprises:
One second outer composite bed has one and is communicated with the second opening of this groove, and comprises one second outer-layer circuit layer and one second insulating barrier, and wherein this second insulating barrier is disposed between this second outer-layer circuit layer and this lower surface;
One second flexible circuit board is disposed at this second insulating barrier, wherein local this second insulating barrier that covers of this second flexible circuit board; And
A plurality of the second conduction connecting structures are disposed in this second insulating barrier, and are electrically connected this rigid wiring board and this second flexible circuit board.
5. soft hard circuit board according to claim 4 is characterized in that wherein said the second flexible circuit board comprises:
One second flexible base plate;
Line layer on one second;
One second time line layer, this on second second time line layer of line layer and this be disposed at respectively relative two surfaces of this second flexible base plate; And
A plurality of the second conductive poles are disposed in this second flexible base plate, and are electrically connected this line layer and this second time line layer on second, and wherein those second conductive poles see through this second time line layer and are electrically connected those the second conduction connecting structures.
6. the technique of a soft hard circuit board is characterized in that it may further comprise the steps:
One rigid wiring board is provided, and wherein the lower surface and of this rigid wiring board with a upper surface, relative this upper surface extends to the groove of this lower surface from this upper surface;
Form one first insulating barrier in this upper surface;
One first soft circuit base plate is pressed on this first insulating barrier, wherein local this first insulating barrier that covers of this first soft circuit base plate;
Form one first conductive layer on this first insulating barrier, wherein this first conductive layer exposes this first soft circuit base plate;
Form a plurality of the first conduction connecting structures in this first insulating barrier, wherein those first conduction connecting structures are electrically connected this rigid wiring board and this first soft circuit base plate; And
This first conductive layer of patterning is to form one first line layer.
7. the technique of soft hard circuit board according to claim 6 is characterized in that the wherein said first soft circuit base plate comprises:
One first flexible base plate;
One first upper conductor layer; And
One first time line layer, first time line layer of this first upper conductor layer and this is disposed at respectively relative two surfaces of this first flexible base plate.
8. the technique of soft hard circuit board according to claim 7 is characterized in that wherein saidly after forming this first conductive layer, more may further comprise the steps:
Form a plurality of the first conductive poles in this first flexible base plate, wherein those first conductive poles are electrically connected this first upper conductor layer and this first time line layer, and those first conductive poles are electrically connected those the first conduction connecting structures through this first upper conductor layer.
9. the technique of soft hard circuit board according to claim 6 is characterized in that wherein more may further comprise the steps:
Form one second insulating barrier on this lower surface;
One second soft circuit base plate is pressed on this second insulating barrier, wherein local this second insulating barrier that covers of this second soft circuit base plate;
Form one second conductive layer on this second insulating barrier, wherein this second conductive layer exposes this second soft circuit base plate;
Form a plurality of the second conduction connecting structures in this second insulating barrier, wherein those second conduction connecting structures are electrically connected this rigid wiring board and this second soft circuit base plate; And
This second conductive layer of patterning is to form one second line layer.
10. the technique of soft hard circuit board according to claim 9 is characterized in that the wherein said second soft circuit base plate comprises:
One second flexible base plate;
Line layer on one second; And
One second lower conductor layer, this on second line layer and this second lower conductor layer be disposed at respectively relative two surfaces of this second flexible base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910160888 CN101990355B (en) | 2009-07-30 | 2009-07-30 | Soft-hard circuit board and process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910160888 CN101990355B (en) | 2009-07-30 | 2009-07-30 | Soft-hard circuit board and process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101990355A CN101990355A (en) | 2011-03-23 |
| CN101990355B true CN101990355B (en) | 2013-02-20 |
Family
ID=43746573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910160888 Active CN101990355B (en) | 2009-07-30 | 2009-07-30 | Soft-hard circuit board and process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101990355B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102740612B (en) * | 2011-04-13 | 2014-11-05 | 富葵精密组件(深圳)有限公司 | Method for manufacturing rigid-flexible printed circuit board |
| CN103052281A (en) * | 2011-10-14 | 2013-04-17 | 富葵精密组件(深圳)有限公司 | Embedded multilayer circuit board and manufacturing method thereof |
| CN103124472B (en) * | 2011-11-18 | 2015-12-16 | 北大方正集团有限公司 | A kind of rigid/flexible combined printed circuit board manufacture method and rigid/flexible combined printed circuit board |
| CN103313530B (en) * | 2012-03-08 | 2016-03-30 | 宏恒胜电子科技（淮安）有限公司 | The manufacture method of rigid-flexible circuit board |
| US9257310B2 (en) * | 2012-10-19 | 2016-02-09 | Haesung Ds Co., Ltd. | Method of manufacturing circuit board and chip package and circuit board manufactured by using the method |
| CN104093263B (en) * | 2014-05-19 | 2018-08-14 | 北京国联万众半导体科技有限公司 | Bridge module and board unit for flexible base board |
| CN105451442B (en) * | 2014-08-28 | 2018-06-05 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flexible circuit board and production method |
| CN105221984B (en) * | 2015-11-10 | 2017-09-22 | 台龙电子（昆山）有限公司 | A kind of two-sided rigid-flex luminous lamp strip |
| CN114375615A (en) * | 2020-04-24 | 2022-04-19 | 庆鼎精密电子（淮安）有限公司 | Rigid-flexible circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325262A (en) * | 2000-03-06 | 2001-12-05 | 索尼公司 | Printed circuit board and its mfg. method |
| JP2006140213A (en) * | 2004-11-10 | 2006-06-01 | Cmk Corp | Rigid flexible multilayer printed wiring board |
| CN1806474A (en) * | 2004-06-11 | 2006-07-19 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
-
2009
- 2009-07-30 CN CN 200910160888 patent/CN101990355B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325262A (en) * | 2000-03-06 | 2001-12-05 | 索尼公司 | Printed circuit board and its mfg. method |
| CN1806474A (en) * | 2004-06-11 | 2006-07-19 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
| JP2006140213A (en) * | 2004-11-10 | 2006-06-01 | Cmk Corp | Rigid flexible multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101990355A (en) | 2011-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101990355B (en) | Soft-hard circuit board and process thereof | |
| CN107343361A (en) | Multi-layer flexible circuit board and preparation method thereof | |
| TW200740334A (en) | Multilayer printed wiring board and its manufacturing method | |
| CN103906371B (en) | Circuit board with embedded element and preparation method thereof | |
| TW201427510A (en) | Printed circuit board having buried component and method for manufacturing same | |
| TW200701853A (en) | Structure of circuit board and method for fabricating the same | |
| KR100903373B1 (en) | Loop Antenna And Manufacturing Method Of The Same | |
| CN109429441A (en) | Rigid Flex and preparation method thereof | |
| US9961784B2 (en) | Manufacturing method of circuit substrate | |
| TWI712346B (en) | Multilayer circuit board and method of manufacturing the same | |
| CN102905460A (en) | Wiring board and method for manufacturing the same | |
| US9362248B2 (en) | Coreless package structure and method for manufacturing same | |
| TWI615076B (en) | Rigid-flex circuit board and method for manufacturing same | |
| TW201637522A (en) | Printed circuit boards having profiled conductive layer and methods of manufacturing same | |
| JP2014022715A (en) | Coreless substrate and method of manufacturing the same | |
| KR20130117667A (en) | Structure of via hole of electrical circuit board | |
| JP4482613B2 (en) | Manufacturing method of multilayer wiring board | |
| KR101360814B1 (en) | Device structure and method for fabricating a high-density package board | |
| CN102404946A (en) | Low-density multilayer circuit board capable of integrating high-density multilayer board as well as manufacturing method thereof | |
| CN108260304B (en) | Composite circuit board and method for manufacturing the same | |
| CN107949187A (en) | A kind of production method of Rigid Flex, Rigid Flex and mobile terminal | |
| TWI384913B (en) | Flex-rigid circuit board and process the same | |
| CN102427679A (en) | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board | |
| JP2008135550A (en) | Key contact built-in type multilayer circuit board and its manufacturing method | |
| KR20160139829A (en) | Multilayer fpcb and fabricating method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |