CN101989543B - 一种用于减少基片背面聚合物的装置 - Google Patents
一种用于减少基片背面聚合物的装置 Download PDFInfo
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- CN101989543B CN101989543B CN200910056086A CN200910056086A CN101989543B CN 101989543 B CN101989543 B CN 101989543B CN 200910056086 A CN200910056086 A CN 200910056086A CN 200910056086 A CN200910056086 A CN 200910056086A CN 101989543 B CN101989543 B CN 101989543B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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CN200910056086A CN101989543B (zh) | 2009-08-07 | 2009-08-07 | 一种用于减少基片背面聚合物的装置 |
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CN200910056086A CN101989543B (zh) | 2009-08-07 | 2009-08-07 | 一种用于减少基片背面聚合物的装置 |
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CN101989543A CN101989543A (zh) | 2011-03-23 |
CN101989543B true CN101989543B (zh) | 2012-09-05 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160289827A1 (en) * | 2015-03-31 | 2016-10-06 | Lam Research Corporation | Plasma processing systems and structures having sloped confinement rings |
CN109423606A (zh) * | 2017-08-24 | 2019-03-05 | 中微半导体设备(上海)有限公司 | 聚焦环及其耐腐蚀防护方法 |
CN112992631B (zh) * | 2019-12-16 | 2023-09-29 | 中微半导体设备(上海)股份有限公司 | 一种下电极组件,其安装方法及等离子体处理装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10143718A1 (de) * | 2001-08-31 | 2003-03-27 | Infineon Technologies Ag | Lagerungsvorrichtung für einen Wafer in einer Plasmaätzanlage |
CN1518073A (zh) * | 2003-01-07 | 2004-08-04 | 东京毅力科创株式会社 | 等离子体处理装置及聚焦环 |
CN1540738A (zh) * | 2003-04-24 | 2004-10-27 | ���������ƴ���ʽ���� | 等离子体处理装置、聚焦环和基座 |
KR20070081038A (ko) * | 2006-02-09 | 2007-08-14 | 삼성전자주식회사 | 플라즈마 장치의 정전척 어셈블리 |
JP2007258500A (ja) * | 2006-03-24 | 2007-10-04 | Hitachi High-Technologies Corp | 基板支持装置 |
CN101150044A (zh) * | 2006-09-19 | 2008-03-26 | 东京毅力科创株式会社 | 聚焦环和等离子体处理装置 |
CN101165855A (zh) * | 2006-10-17 | 2008-04-23 | 东京毅力科创株式会社 | 基板平台和等离子处理装置 |
JP2008171899A (ja) * | 2007-01-09 | 2008-07-24 | Tokyo Electron Ltd | 被処理基板の載置装置におけるフォーカスリングの熱伝導改善方法 |
CN101236915A (zh) * | 2007-01-22 | 2008-08-06 | 东京毅力科创株式会社 | 基板处理装置以及聚焦环 |
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- 2009-08-07 CN CN200910056086A patent/CN101989543B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10143718A1 (de) * | 2001-08-31 | 2003-03-27 | Infineon Technologies Ag | Lagerungsvorrichtung für einen Wafer in einer Plasmaätzanlage |
CN1518073A (zh) * | 2003-01-07 | 2004-08-04 | 东京毅力科创株式会社 | 等离子体处理装置及聚焦环 |
CN1540738A (zh) * | 2003-04-24 | 2004-10-27 | ���������ƴ���ʽ���� | 等离子体处理装置、聚焦环和基座 |
KR20070081038A (ko) * | 2006-02-09 | 2007-08-14 | 삼성전자주식회사 | 플라즈마 장치의 정전척 어셈블리 |
JP2007258500A (ja) * | 2006-03-24 | 2007-10-04 | Hitachi High-Technologies Corp | 基板支持装置 |
CN101150044A (zh) * | 2006-09-19 | 2008-03-26 | 东京毅力科创株式会社 | 聚焦环和等离子体处理装置 |
CN101165855A (zh) * | 2006-10-17 | 2008-04-23 | 东京毅力科创株式会社 | 基板平台和等离子处理装置 |
JP2008171899A (ja) * | 2007-01-09 | 2008-07-24 | Tokyo Electron Ltd | 被処理基板の載置装置におけるフォーカスリングの熱伝導改善方法 |
CN101236915A (zh) * | 2007-01-22 | 2008-08-06 | 东京毅力科创株式会社 | 基板处理装置以及聚焦环 |
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CN101989543A (zh) | 2011-03-23 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Device for reducing polymers at back side of substrate Effective date of registration: 20150202 Granted publication date: 20120905 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
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Date of cancellation: 20170809 Granted publication date: 20120905 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
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Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |
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