CN101984012B - 一种有蜡加工晶片用粘结剂及其制备方法 - Google Patents
一种有蜡加工晶片用粘结剂及其制备方法 Download PDFInfo
- Publication number
- CN101984012B CN101984012B CN2009102367349A CN200910236734A CN101984012B CN 101984012 B CN101984012 B CN 101984012B CN 2009102367349 A CN2009102367349 A CN 2009102367349A CN 200910236734 A CN200910236734 A CN 200910236734A CN 101984012 B CN101984012 B CN 101984012B
- Authority
- CN
- China
- Prior art keywords
- sticker
- shellac
- rosin
- paraffin
- bonding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Jigs For Machine Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009102367349A CN101984012B (zh) | 2009-11-05 | 2009-11-05 | 一种有蜡加工晶片用粘结剂及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009102367349A CN101984012B (zh) | 2009-11-05 | 2009-11-05 | 一种有蜡加工晶片用粘结剂及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101984012A CN101984012A (zh) | 2011-03-09 |
CN101984012B true CN101984012B (zh) | 2012-07-25 |
Family
ID=43641181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009102367349A Expired - Fee Related CN101984012B (zh) | 2009-11-05 | 2009-11-05 | 一种有蜡加工晶片用粘结剂及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101984012B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102960913B (zh) * | 2012-12-18 | 2014-11-19 | 金华冠华水晶有限公司 | 人造水晶钻石胶粘粉制造工艺 |
CN104004494A (zh) * | 2014-06-09 | 2014-08-27 | 成都泰美克晶体技术有限公司 | 一种smd石英晶片晶坨粘接剂及其制备工艺 |
CN105038696A (zh) * | 2015-06-29 | 2015-11-11 | 开平市盈光机电科技有限公司 | 一种用于粘结光学镜片的粘合剂及其制作方法 |
CN106833512B (zh) * | 2015-12-04 | 2019-01-25 | 中国石油化工股份有限公司 | 一种用于硅钢片加工中粘结的含蜡组合物 |
CN109404696B (zh) * | 2018-10-22 | 2020-12-08 | 武汉船用机械有限责任公司 | 一种三脚平台 |
CN110452663B (zh) * | 2019-09-11 | 2021-01-08 | 久智光电子材料科技有限公司 | 石英制品粘结剂及其制备方法、在石英制品加工中的应用 |
-
2009
- 2009-11-05 CN CN2009102367349A patent/CN101984012B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101984012A (zh) | 2011-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101984012B (zh) | 一种有蜡加工晶片用粘结剂及其制备方法 | |
CN102642240B (zh) | 铁氧体磁芯坯体的制造方法以及铁氧体磁芯的制造方法 | |
CN104893316B (zh) | 一种填充型精密铸造中温调制蜡及其制备方法 | |
CN102093731B (zh) | 彩色沥青温拌剂的制备工艺 | |
CN106696252B (zh) | 一种高分子材料三维制品的制造方法 | |
CN105907107A (zh) | 一种精密铸造调制蜡及其处理工艺 | |
CN102672109A (zh) | 一种易脱模覆膜砂及其生产工艺 | |
CN105062009A (zh) | 一种轻质高强度鱼竿的制备方法 | |
CN105753394A (zh) | 一种掺加石蜡微胶囊的高贝利特水泥混凝土 | |
CN105081198A (zh) | 一种铸钢件用含钠基膨润土的改性呋喃树脂砂及其制备方法 | |
CN101643627A (zh) | 黄色抛光膏 | |
CN105802257A (zh) | 一种用于熔模铸造的3d打印成型树脂 | |
CN110449546A (zh) | 一种冒口覆膜砂的制备工艺 | |
CN105081202A (zh) | 一种铸钢件用含纳米硅藻土的改性呋喃树脂砂及其制备方法 | |
CN106221215A (zh) | 氰酸酯树脂复合材料制备方法 | |
CN106892558B (zh) | 一种新型高强度玻璃制备方法 | |
CN101979439B (zh) | 一种抛光沥青的预处理方法 | |
CN110479953A (zh) | 一种冒口覆膜砂 | |
CN102153972B (zh) | 用于复杂型芯组合安装的常温快干型粘合剂及制备方法 | |
CN106077433A (zh) | 一种汽车铸造用耐高温低发气覆膜芯砂及其制备方法 | |
CN102438965A (zh) | 用于耐火材料和陶瓷的胶和涂料 | |
CN101768520A (zh) | 一种蜡烛制备方法 | |
CN103111600B (zh) | 复合耐磨管道制造工艺方法 | |
CN105778826A (zh) | 一种低温高相容性包装用热熔胶的制备方法 | |
CN102127293A (zh) | 一种热塑性聚氨酯液压密封圈材料配方及其生产工艺 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215129 Suzhou high tech Zone, Jiangsu, No. 189 Kunlun Road Patentee after: Suzhou TanKeBlue Semiconductor Co., Ltd. Patentee after: BEIJING TIANKE HEDA SEMICONDUCTOR CO., LTD. Patentee after: Research Institute of Physics, Chinese Academy of Sciences Address before: 215129 Suzhou high tech Zone, Jiangsu, No. 189 Kunlun Road Patentee before: Suzhou TanKeBlue Semiconductor Co., Ltd. Patentee before: Beijing Tankeblue Semiconductor Co., Ltd. Patentee before: Research Institute of Physics, Chinese Academy of Sciences |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20171105 |
|
CF01 | Termination of patent right due to non-payment of annual fee |