CN101980071B - Wire pattern and method for monitoring adhesion deviation of film material - Google Patents
Wire pattern and method for monitoring adhesion deviation of film material Download PDFInfo
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- CN101980071B CN101980071B CN2010102966013A CN201010296601A CN101980071B CN 101980071 B CN101980071 B CN 101980071B CN 2010102966013 A CN2010102966013 A CN 2010102966013A CN 201010296601 A CN201010296601 A CN 201010296601A CN 101980071 B CN101980071 B CN 101980071B
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Abstract
The invention provides a wire pattern in a connecting pad area, which comprises a plurality of terminal parts which are arranged in parallel in the connecting pad area, wherein each terminal part comprises an open part and a lead part; each terminal part has at least one open part side edge; and the lead parts are connected to the open part side edges correspondingly. The positions of the lead parts relative to the corresponding open parts vary with the configuration positions of the terminal parts in the connecting pad area. The invention also discloses a method for monitoring the adhesion deviation of a film material, which comprises: providing a film material with a plurality of conductive patterns on surface; and providing a target area on the surface of which the film material is to be adhered. In the invention, the efficiency and accurate of the measurement of the adhesion deviation of the film material, and the problems of low efficiency and uncontrollable precision of the conventional film material adhesion deviation measuring method adopting a time-consuming process are solved.
Description
Technical field
The present invention relates to the wire pattern in a kind of connection pad district and a kind of method of monitoring membrane material attaching deviation, refer to a kind of connection pad district wire pattern of the reference data that can be used to be used as monitoring membrane material attaching deviation and the method for monitoring attaching deviation thereof especially.
Background technology
General display panels (liquid crystal display; LCD) processing procedure; Be to make earlier a multiple substrate and a colored filter substrate respectively; Wherein the production method of this multiple substrate is to comprise manufacture of semiconductor such as several thin film deposition, little shadow and etching, and to produce the thin film transistor (TFT) array, colored filter substrate then is on substrate, to produce the colored filter that is the array arrangement corresponding to thin film transistor (TFT).After multiple substrate and colored filter substrate complete respectively, fit each other again and cutting splitting.
Please refer to Fig. 1; Fig. 1 is the synoptic diagram of a convention LCD panel 10; It comprises a colored filter substrate 12 and a multiple substrate 14; Wherein colored filter substrate 12 is smaller than multiple substrate 14, so colored filter substrate 12 can expose the multiple substrate 14 of part, and multiple substrate 14 is not commonly referred to non-display area 16 by the part that colored filter substrate 12 covers.Be provided with a plurality of portion of terminal (terminal) in the non-display area 16, be used for LCD panel 10 inner leads like scanning linear or RCA are electrically connected on outside control circuit.Please refer to Fig. 2, Fig. 2 is the part synoptic diagram of a portion of terminal 20 of convention LCD panel 10.Generally speaking, portion of terminal 20 comprises a peristome 22 and a leading part 24, and wherein the major function of peristome 22 is given the inner lead of LCD panel 10 for transmitting the external control signal.Therefore, after the making of accomplishing LCD panel 10, usually can be with (printing wire board, film material PWB) is attached on the non-display area 16, utilizes the wire pattern on the film material to be electrically connected on peristome 22 to transmit outside signal like printed circuit board (PCB).As shown in Figure 3, when film material (figure do not show) when being attached at non-display area 16, the conductive pattern 26 on film material surface should be aimed at the middle body that is covered in portion of terminal 20, makes conductive pattern 26 apart from peristome 22 both sides all equal apart from d1, d2.
Yet; In the process of cling film material; Unavoidably can cause the deviation on the sticking position because of factor such as board contraposition, as shown in Figure 4, because membrane material attaching deviation has taken place; Therefore the conductive pattern 26 on the film material squint to the right, make the left side of conductive pattern 26 and peristome 22 apart from d1 greater than the right side of conductive pattern 26 and peristome 22 apart from d2.By on can know because the technology of existing cling film material can't effectively be avoided the problem of attaching deviation, carry out monitoring measurement so on production line, must be directed against the attaching deviation of film material.The method of existing detection membrane material attaching deviation mainly contains three kinds; The first is used and is comprised charge-coupled device (CCD) (charge coupled device; CCD) measuring instrument of sensor measures; Detection person must utilize ccd sensor to search the problem whether membrane material attaching deviation takes place in the non-display area 16, and then sees through the side-play amount of the rule calculating film material of ccd sensor itself.Yet this kind measures the shortcoming of mode to be comprised must LCD panel 10 being sent on the board with measuring instrument especially and just can measure, and detection person must use ccd sensor to search the position that measures target, might search less than and expend time in.Moreover measuring instrument also must have certain specification requirement, builds measuring program in for example needing and has the measurement scale.In addition, this kind measurement mode also possibly have the doubt of degree of accuracy.
The method that second kind of convention measures membrane material attaching deviation is detection person directly measures conductive pattern 26 behind portion of terminal 20 and the cling film material with measuring tool an attaching deviation value, via the left side that measures conductive pattern 26 and peristome 22 apart from d1 and right side can learn apart from d2 whether membrane material attaching deviation takes place, to the right or left deviation how many distances.Yet the shortcoming that this kind measures mode comprises that the measuring program trouble is time-consuming and degree of accuracy is not enough.
On the other hand, the method for the third convention measurement membrane material attaching deviation is to utilize the side-play amount mark to remember to measure the deviation that how many distances take place the film material.At first form side-play amount mark note 30 with the mode of exposure image at multiple substrate 14; As shown in Figure 5; Side-play amount mark note 30 comprises three inferior mark 30a, 30b, 30c, is respectively drift angle delta pattern up, and on the film material, forms the side-play amount mark note 32 with anti-delta pattern.When the film material is attached to (like the relativeness of Fig. 5 left side portion of terminal 20 and conductive pattern 26) when deviation not taking place on the portion of terminal 20; Then the side-play amount mark on the film material remembers that the drift angle of 32 belows can just be aligned with the center of side-play amount mark note 30, that is in alignment with the drift angle of the inferior mark 30b of centre.Please refer to Fig. 6; Fig. 6 then demonstrates the situation when film material generation attaching deviation; Shown in Fig. 6 left side, the film material that is attached some distances that squinted to the right, the side-play amount mark note 32 on this moment film material just corresponds to the top pin of time mark 30c; Therefore know the film material squinted to the right 3 microns (micrometer, um).Yet; The method of utilizing this kind mode to measure film material side-play amount still has its shortcoming: owing to be subject to the imaging capability of exposure bench; Therefore can't form pattern less than 3 microns; And the wedge angle of delta pattern part also can't form images completely, may have influence on the accuracy that measures side-play amount near the fillet pattern.
Therefore, judging whether to take place membrane material attaching deviation and the attaching deviation value that measures the film material like simple efficient again method how, still is an important topic of LCD panel industry.
Summary of the invention
Fundamental purpose of the present invention; Be to provide special wire pattern and a kind of method of utilizing this wire pattern to carry out monitoring membrane material attaching deviation in a kind of connection pad district; Paste the efficient and the correctness of deviation partially improve to measure the film material, solve convention and measure the membrane material attaching deviation method and cause efficient lower and can't grasp the problem of degree of accuracy because of program is consuming time.
The present invention is achieved in that a kind of wire pattern, and it comprises a plurality of portion of terminal, arranges and each other side by side in a connection pad district, respectively this portion of terminal comprises a peristome and a leading part respectively along a first direction.Each peristome has at least one peristome side, and each leading part is to connect corresponding peristome side.The relative position of each leading part and corresponding peristome is to change with the allocation position of this portion of terminal in the connection pad district.
The present invention discloses a kind of method of monitoring membrane material attaching deviation in addition.One film material at first is provided, and its surface has a plurality of conductive pattern, then provides a surperficial desire to attach the target area of this film material, and it comprises a plurality of reference marks and a plurality of displacement mark.These reference marks are to arrange and each other side by side in this target area along a first direction, and each reference mark corresponds respectively to a conductive pattern.Each displacement mark is to be connected to a reference mark, and wherein the relative position of each displacement mark and corresponding respectively this reference mark is to change with the allocation position of this reference mark in the target area.Then, the film material is attached on this target area, the relative position of observing these conductive pattern and displacement mark again with and the corresponding position of reference mark in this target area, to judge this film material whether attaching deviation is arranged.
Description of drawings
Fig. 1 is the synoptic diagram of a convention LCD panel.
Fig. 2 is the part synoptic diagram of a portion of terminal of LCD panel shown in Figure 1.
Fig. 3 is for being attached at the film material synoptic diagram of portion of terminal shown in Figure 2.
Fig. 4 has the synoptic diagram of attaching deviation for the film material.
Fig. 5 to Fig. 6 uses the synoptic diagram of the monitoring membrane material attaching deviation method that measures offset marker for convention.
Fig. 7 is applied to the synoptic diagram of a LCD panel for the wire pattern in connection pad of the present invention district.
Fig. 8 is the enlarged diagram of the wire pattern in the connection pad district of LCD panel shown in Figure 7.
Fig. 9 is the enlarged diagram in part connection pad district shown in Figure 8.
Figure 10 to Figure 11 is the synoptic diagram of the method for monitoring membrane material attaching deviation of the present invention.
Figure 12 is the schematic flow sheet of the method for monitoring membrane material attaching deviation of the present invention.
Primary clustering symbol description in the accompanying drawing:
10 LCD panels, 12 colored filter substrates
14 multiple substrates, 16 non-display areas
20 portion of terminal, 22 peristomes
24 leading parts, 26 conductive pattern
30,32 side-play amount marks note 30a, 30b, 30c mark
50 LCD panels, 52 multiple substrates
54 colored filter substrates, 56 non-display areas
58 connection pad districts, 60 wire patterns
62 portion of terminal, 64 peristomes
68 contact hole structures, 70 datum line marks
72 film materials, 74 conductive pattern
The flow process of 100～106,202～206 monitoring membrane material attaching deviation methods of the present invention
Embodiment
Please refer to Fig. 7, Fig. 7 is applied to the synoptic diagram of a LCD panel 50 for the wire pattern in connection pad of the present invention district.LCD panel 50 comprises a multiple substrate 52 and a colored filter substrate 54; Multiple substrate 52 is not to be defined as non-display area 56 by colored filter substrate 54 region covered; Non-display area 56 is provided with a plurality of connection pads district 58 (the connection pad district of the RCA side of only drawing among Fig. 7); Be used for being provided with portion of terminal, drive LCD panel 50 to be electrically connected with external circuit.
Please refer to Fig. 8, Fig. 8 is the enlarged diagram of the wire pattern 60 in the present invention one connection pad district 58.It is parallel in the Y direction shown in the figure that wire pattern 60 comprises a plurality of portion of terminal 62, and be arranged side by side along directions X shown in the figure.Each portion of terminal 62 comprises a peristome 64 and a leading part 66 respectively.Peristome 64 is to can be used to transmitting signals, is electrically connected on the follow-up conductive pattern that is pasted to the film material on multiple substrate 52 surfaces.66 of leading parts are when LCD panel 50 carries out edging lead angle processing procedure, the function of position identification are provided, in addition; Before edging lead angle processing procedure; Leading part 66 also can be electrically connected a static eraser, and a ring-type short-circuit structure (short ring) for example is to prevent electrostatic breakdown.Therefore, comprise the portion of terminal 62 preferable conductive materials that comprise like metal material of peristome 64 and leading part 66, and within peristome 64, comprise a plurality of contacts hole structure 68, be used for being electrically connected different conductive material layers on the multiple substrate 52.In addition; Each peristome 64 has identical width S 1; Each leading part 66 also has identical width S 2, and each peristome 64 all comprises a peristome side 64a, and each leading part 66 is to be connected in its peristome side 64a with pairing peristome 64 respectively; Yet each leading part 66 of the present invention is to change with the allocation position of its portion of terminal 62 in connection pad district 58 with the relative position of corresponding peristome 64.
For further specifying the variation of portion of terminal 62 and the relative position of peristome 64, below be the leading part 66 of representing diverse locations in the connection pad district 58 with different code names.Be parallel to the Y direction if define a datum line C in connection pad district 58; Wherein datum line C is preferably the center line in connection pad district 58; The leading part 66 that then is positioned at the portion of terminal 62 in datum line C left side represented with code name L1, L2, L3, L4, L5, L6 to the outside by datum line C in regular turn, and the leading part 66 that is positioned at the portion of terminal 62 on datum line C right side is represented with code name R1, R2, R3, R4, R5, R6 to the outside by datum line C in regular turn.Can know by the 8th figure, with respect to each peristome 64, then by datum line C to leading part R1, R2, R3, R4, R5, the R6 in 58 outsides, connection pad district be in regular turn by many to the right skew one unit lengths of datum line C.Likewise, by datum line C to leading part L1, L2, L3, L4, L5, the L6 in 58 outsides, connection pad district be than many to the left in regular turn skew one unit lengths of corresponding opening portion 64, until the left side edge of peristome 64.
Please refer to Fig. 9, Fig. 9 is the enlarged diagram in part connection pad district 58, and wherein the 9th figure only draws the portion of terminal 62 on datum line C right side, and omits the contact hole structure 68 among Fig. 8.In each peristome 64, define a peristome center line C respectively
oBe parallel to Y direction shown in Figure 8 and (only draw the center line C of leading part R2, the pairing peristome 64 of R4 among Fig. 9
o), and peristome center line C
oBe the mid point O of each peristome side 64a with the intersection point of peristome side 64a, in each leading part 66, define a leading part center line C in addition
LThe Y direction that is parallel to Fig. 8, then each leading part center line C
LAll has a relative position difference D with the mid point O of the side 64a of its corresponding opening portion; And the relative position difference Dn at each leading part 66 on datum line C right side is neither identical; Be to begin to increase progressively to the outside in connection pad district 58 (being the right side) in regular turn by datum line C; Wherein " n " representes the n bar leading part 66 on datum line C right side; That is the relative position difference of leading part R1, R2, R3, R4, R5, R6 is D1, D2, D3, D4, D5, D6, and it has following relationship: D1＜D2＜D3＜D4＜D5＜D6.In other words; If present embodiment is used as a unit length with 1 micron; Then leading part R1 is that mid point O than peristome side 64a squints 1 micron to the right; Leading part R2 is that the mid point O than peristome side 64a squints 2 microns to the right, and leading part R3 is that the mid point O than peristome side 64a squints 3 microns to the right, and side arrives the right side edge of peristome 64 up to the right side of leading part R6.Likewise, also have a relative position difference between each leading part 66 on the left of datum line C and the peristome 64, begin to increase progressively to the left, repeat no more by datum line C.Therefore, the leading part in connection pad district 58 66 is to be that symmetrical center line and left-right symmetric are arranged with datum line C.Yet in other embodiments, the relative position difference between each leading part 66 and the peristome 64 also can be designed to begun to successively decrease laterally by datum line C.Therefore, within connection pad district 58, the sub-portion 62 of wantonly two abutting ends of datum line C either side all has the different relative positions difference.
Please refer to Figure 10, Figure 10 demonstrates the film material with conductive pattern is attached to the synoptic diagram when attaching deviation not taking place in the connection pad district 58.As shown in the figure; Provide one comprise a plurality of conductive pattern 74 film material 72; It is attached in the connection pad district 58 shown in Figure 8, and wherein film material 72 can be a printed circuit board (PCB), and it is provided with and utilizes coil type to carry encapsulation (tape carrier package; TCP) chip for driving (figure does not show) can make chip for driving be electrically connected with portion of terminal 62 by conductive pattern 74.After having attached film material 72; Its lip-deep conductive pattern 74 is a corresponding portion of terminal 62 respectively; Under the situation that attaching deviation does not take place; Each leading part 66 can't drop on corresponding conductive pattern 74 central authorities and about divide conductive pattern 74 equally, can be partial to a side of conductive pattern 74 on the contrary, the leading part R1 that for example is arranged on datum line C right side can be partial to the right side of conductive pattern 74.In addition, being positioned at more, the leading part 66 in the outside is the more distances of central authorities that depart from conductive pattern 74.
On the other hand, if film material 72 is when having attaching deviation, then must have in the connection pad district 58 leading part 66 near or just drop on the central authorities of conductive pattern 74.Please refer to Figure 11, Figure 11 shows that the situation of attaching deviation takes place membrane material 72.As shown in the figure, after having attached film material 72, leading part R2 just drops on the central authorities of its corresponding conductive pattern 74 and divides conductive pattern 74 equally, is different from position shown in Figure 10, therefore can judge that film material 72 has an attaching deviation.Moreover owing to be the central authorities that leading part R2 drops on corresponding conductive pattern 74, and leading part R2 is compared to peristome 64 squinted to the right 2 microns or 2 unit lengths, therefore can know the film material 72 that attached to the right deviation 2 microns.That is, when detection person finds that a leading part Rn or Ln just drop on conductive pattern 74 central, then can judge film material 72 n micron or the n unit length that squinted easily to the right or left.Moreover; In order detection person can be calculated rapidly to drop on conductive pattern 74 central leading parts 66 are which the root leading parts 66 on the left side or the right side in connection pad district 58; That is find out the n value; Therefore the wire pattern 60 in the connection pad district 58 can comprise a datum line mark 70 in addition, indicate the position of datum line C, so detection person can judge the n value from datum line mark 70; And this leading part 66 is right side or left side at datum line C, and then to calculate membrane material 72 easily be to have moved how many unit lengths to where to lateral deviation.
From the above; The present invention is except the particular design of wire pattern that a kind of connection pad district is provided; But also provide a kind of and utilized this kind wire pattern and method that whether effective monitoring film material squints and judge side-play amount; The spirit of its judgement be respectively with peristome and leading part as reference mark and displacement mark; And the relative position of displacement mark and reference mark be along with this reference mark in the connection pad district diverse location and change, again by the relative position relation of the conductive pattern of displacement mark and attaching and judge whether the membrane material has the problem of attaching deviation.The method step of monitoring membrane material attaching deviation of the present invention is to be summarized as follows:
Step 100: the film material that provides a surface to have a plurality of conductive pattern;
Step 102: provide a surperficial desire to attach the target area of this film material; That is aforesaid connection pad district; It is side by side parallel to each other wherein to comprise a plurality of portion of terminal in the connection pad district; Each portion of terminal comprises a peristome of being used as reference mark and a leading part of being used as the displacement mark respectively, and each reference mark is corresponding to a displacement mark, and the relative position of each displacement mark and corresponding reference mark is to change with the allocation position of reference mark in the connection pad district;
Step 104: the film material is attached on the target area; And
Step 106: the relative position of observing conductive pattern and displacement mark on the film material with and the corresponding position of reference mark in the target area, to judge the membrane material whether attaching deviation is arranged.
In addition, judge described in the step 106 that the method whether the film material attaching deviation takes place then comprises:
Step 202: observe the relative position of conductive pattern and displacement mark,, judge that then this film material has an attaching deviation if arbitrary displacement mark (leading part R2 as shown in Figure 11) just is positioned at the central authorities of corresponding conductive pattern and divides this conductive pattern equally;
Step 204: observing described this displacement mark of step 202 (leading part R2 shown in figure 11) is center line or the right side of a datum line or n the displacement mark in left side that is positioned at the target area; And
Step 206: judge that this film material is n the unit length that squinted to the right or to the left.
From the above; Whether monitoring membrane material the method for attaching deviation takes place according to the present invention; Detection person if need monitoring membrane material whether attaching deviation takes place only needs from optical microscope (optical microscope, OM) the middle connection pad district of observing; Carry out the method step of the invention described above monitoring membrane material attaching deviation, just can judge easily the membrane material whether take place attaching deviation and film material be to the left or the right side deviation how many distances.Compared to known techniques; The CCD etc. that has measuring program and scale in the present invention does not need must use as known techniques measures instrument; And can not be subject to the size of exposure size; The measurement target that does not also need the spended time search to squint also can avoid measuring the not enough problem of degree of accuracy.According to spirit of the present invention, detection person only need utilize the relative position of conductive pattern on observation by light microscope portion of terminal and the film material, just can make things convenient for and judge apace attaching film material deviation how many distances.In addition; Utilize the wire pattern in the connection pad district that spirit of the present invention produces need not increase extra cost; Only need revise the design of original wire pattern split shed portion and leading part relative position a little, the reference mark and the displacement mark that promptly can be used as in the method for supervising of the present invention use.It should be noted that; The wire pattern that the method for wire pattern design of connection pad of the present invention district and monitoring membrane material attaching deviation is not limited on the LCD panel designs the monitoring that attaches error with the film material, also can be applicable to other and need monitor whether overlapping pattern is subjected to displacement or the situation of deviation.
The above is merely preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (6)
1. the method for a monitoring membrane material attaching deviation is characterized in that, comprises:
One film material is provided, and its surface has a plurality of conductive pattern;
Provide a surperficial desire to attach the target area of this film material, it comprises:
A plurality of reference marks correspond respectively to this conductive pattern, and these reference marks are along first direction arrangement and each other side by side in this target area; And
A plurality of displacement marks are connected to this reference mark, and wherein respectively the relative position of this displacement mark and corresponding this reference mark is to change with the allocation position of this reference mark in this target area;
This film material is attached on this target area; And
The relative position of observing these conductive pattern and these displacement marks with and the corresponding position of these reference marks in this target area, to judge this film material whether attaching deviation is arranged; Described target area comprises a datum line, and these displacement marks in the target area of this datum line either side are neither identical with the relative position of corresponding this reference mark; Wherein respectively this displacement mark is this reference mark relatively respectively, is center and many laterally in regular turn skew one unit lengths by this datum line; Wherein this judges whether this film material the method for attaching deviation takes place; Comprise the relative position of observing these conductive pattern and these displacement marks; If arbitrary this displacement mark just is positioned at the central authorities of corresponding this conductive pattern and divides this conductive pattern equally, judge that then this film material has an attaching deviation.
2. the method for monitoring membrane material attaching deviation according to claim 1, it is characterized in that: wherein this judges whether this film material the method for attaching deviation takes place, and other comprises:
When observing that this displacement mark just is positioned at the central authorities of corresponding this conductive pattern and after dividing this conductive pattern equally, observing and obtaining this displacement mark is right side or the left side that is positioned at this datum line;
It is by this datum line n displacement mark laterally that observation obtains this displacement mark; And
The attaching deviation of judging this film material be for deviation to the right or left n unit length.
3. the method for monitoring membrane material attaching deviation according to claim 1, it is characterized in that: described datum line is the center line for this target area;
Described displacement mark and these reference marks are to be symmetrical center line with this center line, and left-right symmetric is arranged.
4. the method for monitoring membrane material attaching deviation according to claim 1 is characterized in that: comprise a datum line mark in the described target area in addition, indicate the position of this datum line.
5. the method for monitoring membrane material attaching deviation according to claim 1; It is characterized in that: wherein respectively this displacement mark has a center line respectively with this reference mark respectively and is parallel to this first direction; And respectively the center line of this center line of this displacement mark and corresponding this reference mark has a relative position difference; In this target area, respectively this relative position difference of wantonly two adjacent these displacement marks of this datum line one side is inequality; Described relative position difference is an increasing or decreasing along a center line of this target area and laterally.
6. the method for monitoring membrane material attaching deviation according to claim 1; It is characterized in that: described target area is to be a connection pad district of a display panel; And this target area comprises a plurality of portion of terminal and is used for transmitting signal, and respectively this portion of terminal comprises this reference mark and this displacement mark;
This reference mark in this portion of terminal and this displacement mark peristome and the leading part that are respectively this portion of terminal respectively wherein;
Wherein these reference marks and these displacement marks packets metal-containing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2010102966013A CN101980071B (en) | 2009-03-10 | 2009-03-10 | Wire pattern and method for monitoring adhesion deviation of film material |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102966013A CN101980071B (en) | 2009-03-10 | 2009-03-10 | Wire pattern and method for monitoring adhesion deviation of film material |
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| CN2009101111867A Division CN101498873B (en) | 2009-03-10 | 2009-03-10 | Wire pattern and method for monitoring membrane material attaching deviation |
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| CN101980071A CN101980071A (en) | 2011-02-23 |
| CN101980071B true CN101980071B (en) | 2012-07-04 |
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| CN107195639B (en) | 2017-06-27 | 2020-04-03 | 京东方科技集团股份有限公司 | Preparation method of array substrate mother board, array substrate mother board and detection method |
| CN114255683B (en) * | 2021-12-21 | 2024-03-22 | 武汉华星光电技术有限公司 | Display panel |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1319825A (en) * | 2000-02-02 | 2001-10-31 | 卡西欧计算机株式会社 | Indicator |
| CN1350422A (en) * | 2000-10-25 | 2002-05-22 | 松下电器产业株式会社 | Element mounting method |
| CN1677660A (en) * | 2004-03-30 | 2005-10-05 | 夏普株式会社 | Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus |
| CN1885106A (en) * | 2005-06-20 | 2006-12-27 | 三菱电机株式会社 | Display panel, display device equipped with the same, and display device manufacturing method |
| WO2007100142A1 (en) * | 2006-03-02 | 2007-09-07 | Matsushita Electric Industrial Co., Ltd. | Component bonding method and component bonding device |
| CN101355087A (en) * | 2007-07-25 | 2009-01-28 | 中华映管股份有限公司 | Active element array substrate |
-
2009
- 2009-03-10 CN CN2010102966013A patent/CN101980071B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1319825A (en) * | 2000-02-02 | 2001-10-31 | 卡西欧计算机株式会社 | Indicator |
| CN1350422A (en) * | 2000-10-25 | 2002-05-22 | 松下电器产业株式会社 | Element mounting method |
| CN1677660A (en) * | 2004-03-30 | 2005-10-05 | 夏普株式会社 | Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus |
| CN1885106A (en) * | 2005-06-20 | 2006-12-27 | 三菱电机株式会社 | Display panel, display device equipped with the same, and display device manufacturing method |
| WO2007100142A1 (en) * | 2006-03-02 | 2007-09-07 | Matsushita Electric Industrial Co., Ltd. | Component bonding method and component bonding device |
| CN101355087A (en) * | 2007-07-25 | 2009-01-28 | 中华映管股份有限公司 | Active element array substrate |
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