CN101978081A - Copper alloy material for electric/electronic parts - Google Patents
Copper alloy material for electric/electronic parts Download PDFInfo
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- CN101978081A CN101978081A CN2009801100593A CN200980110059A CN101978081A CN 101978081 A CN101978081 A CN 101978081A CN 2009801100593 A CN2009801100593 A CN 2009801100593A CN 200980110059 A CN200980110059 A CN 200980110059A CN 101978081 A CN101978081 A CN 101978081A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
Disclosed is a copper alloy material for electric and electronic components, which is a copper alloy material comprising 0.5-2.5 mass% Co and 0.1-1.0 mass% Si, wherein Co/Si = 3-5 (mass ratio), and the remainder of which is Cu and unavoidable impurities, and which is solution heat-treated at 800-960 C, and at a temperature ( C) lower than -122.77X2 + 409.99X + 615.74 when the Co content (mass%) is X.
Description
Technical field
The present invention relates to be applicable to the Cu alloy material of electrical/electronic part.
Background technology
At present, the junctor used of electronic electric equipment, terminal, rly., switch etc. have used brass (C2600) and phosphor bronze (C5191, C5212, C5210) and beryllium copper (C17200, C17530) and Corson alloy (C7025) etc.
In recent years, use the frequency gets higher of employed electric current in the electronic electric equipment of these materials, because of the electric conductivity of skin effect essence is low, therefore, becoming also requires high conductivity to material.Therefore, the original electroconductibility of brass and phosphor bronze is low, electroconductibility during the gloomy copper alloy of section shows as connector material (
), but seek more high conductivity.In addition, beryllium copper has middle electroconductibility but price is high, and because beryllium is the carrying capacity of environment material, so it also is well-known inquiring into it is replaced into other copper alloy etc.On the other hand, the fine copper of high conductivity (C1100) and contain Sn copper (C14410) etc. and have the low shortcoming of intensity.Therefore, expectation possesses the electroconductibility that surpasses the gloomy copper of existing section, equal tensile strength, the copper alloy of bendability.
Above-mentioned Cxxxx is that %IACS is the abbreviation of international annealed copper standard with the kind of the copper alloy of JIS regulation, is the unit of the electroconductibility of expression material.
Known, usually, electroconductibility and intensity have opposite characteristic, as the method that improves intensity, various enhancement methods such as solution strengthening, work strengthening, precipitation strength are arranged, but wherein the copper alloy precipitation strength can not make the electroconductibility deterioration, be expected to as the method that improves intensity.This precipitation strength is to carry out high-temperature heat treatment with being added with the alloy that causes the element of separating out, and makes these elements after the solid solution of copper parent phase, heat-treats with the temperature lower than its temperature, the method that the element of solid solution is separated out.For example, beryllium copper, Corson alloy etc. adopt this enhancement method.
But, except that above-mentioned beryllium copper, Corson alloy etc., also know the alloy of the intermetallic compound that contains cobalt (Co) and silicon (Si) in the copper.In addition, have with up to now high density CoSi copper alloy (the Co amount be 2～4 quality %, Si amount for Co measure 1/4) compare that Co and Si concentration have reduced, as to contain the Co that can make the high-strength high conductivity material at an easy rate and Si and Mg, Sn, Zn copper alloy (for example with reference to patent documentation 1).
In the manufacturing of the copper alloy that this patent documentation 1 is put down in writing, adopt and get high solutionizing temperature (for example being 950 ℃ in the embodiment of patent documentation 1), separate out the solidified method in the thermal treatment after abundant solid solution.
But crystal grain can thickization in this method.As everyone knows, in alloy structure, bendability is poor when crystal grain diameter is thick, in the existing copper alloy that carries out the solutionizing processing, can not obtain excellent in vending workability.
Patent documentation 1:(Japan) spy opens clear 63-307232 communique
Summary of the invention
Problem of the present invention is, provide a kind of be suitable for junctor etc. follow harsh bending machining goods, intensity, electric conductivity, and the electrical/electronic part Cu alloy material of excellent in bending workability.
According to the present invention, provide following invention:
(1) a kind of electrical/electronic part Cu alloy material, contain the Co of 0.5～2.5 quality %, the Si of 0.1～1.0 quality %, and Co/Si=3～5 (mass ratio), remainder is made of Cu and unavoidable impurities, it is characterized in that, setting more than 800 ℃ below 960 ℃ and Co content (quality %) is under the situation of X, with than-122.77X
2The temperature T s that+409.99X+615.74 is low (℃) carry out solutionizing and handle.
(2) a kind of electrical/electronic part Cu alloy material, contain the Co of 0.5～2.5 quality %, the Si of 0.1～1.0 quality %, and Co/Si=3～5 (mass ratio), also contain 0.01～1.0 quality % be selected from Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti, and the group that constitutes of Zr in one or more, remainder is made of Cu and unavoidable impurities, it is characterized in that, setting more than 800 ℃ below 960 ℃ and Co content (quality %) is under the situation of X, with than-94.643X
2The temperature T s that+329.99X+677.09 is low (℃) carry out solutionizing and handle.
As (1) or (2) described electrical/electronic part Cu alloy material, it is characterized in that (3) yielding stress is the above and not enough 650MPa of 500MPa, electric conductivity is more than the 60%IACS, and value (R/t) less than 0.5 of expression bendability.
As (1) or (2) described electrical/electronic part Cu alloy material, it is characterized in that (4) yielding stress is more than the 650MPa, electric conductivity is more than the 50%IACS, and value (R/t) less than 1.5 of expression bendability.
(5) as (1) or (2) described electrical/electronic part Cu alloy material, it is characterized in that, yielding stress is the above and not enough 650MPa of 500MPa, electric conductivity is more than the 60%IACS, and the value (R/t) of expression bendability is below 1.2 at the sample parallel with rolling direction and with vertical sample two sides of rolling direction.
(6) as (1) or (2) described electrical/electronic part Cu alloy material, it is characterized in that, yielding stress is more than the 650MPa, electric conductivity is more than the 50%IACS, and the value (R/t) of expression bendability is below 1.5 at the sample parallel with rolling direction and with vertical sample two sides of rolling direction.
At this, the value (R/t) of expression bendability is meant the following value R/t that obtains: from take out the sample of the wide w=10 of plate (mm) of each thickness of slab for the examination material, with the friction gently from the teeth outwards of medal polish powder, remove oxide film, afterwards, the angle of carrying out crooked inboard in this two kind of bending (BW) of the bending (GW) of [1] sample parallel with rolling direction and [2] and the vertical sample of rolling direction is 90 ° W bending, and the radius of curvature R (mm) that does not have a minimum of microcrack is divided by sample thickness of slab t (mm).Among the present invention, R/t estimates bendability by this value.
Electrical/electronic part Cu alloy material of the present invention is all excellent Cu alloy material of intensity, electric conductivity, bendability.Electrical/electronic part of the present invention also can be suitable for the goods that junctor etc. is followed harsh bending machining with Cu alloy material.
To understand more above-mentioned and other feature of the present invention and advantage from following record.
Embodiment
Below, the alloy composition of Cu alloy material of the present invention is described in detail preferred embodiment.In addition, Cu alloy material of the present invention is the Cu alloy material with specified shape, for example sheet material, web, wire rod, bar, paper tinsel etc., also can be used for any electrical/electronic part, its part is not particularly limited, for example be suitable for junctor, terminal material etc., particularly expect the high frequency relay of high conductivity and switch or automobile mounted junctor or terminal material and the lead frame of using etc. etc.
During copper alloy of the present invention was formed, Co and Si were must composition.Co in the copper alloy and Si mainly form Co
2The precipitate of Si intermetallic compound improves intensity and electric conductivity.
Co is 0.2～2.5 quality %, is preferably 0.3～2.0 quality %, 0.5～1.6 quality % more preferably, and Si is 0.1～1.0 quality %, is preferably 0.1～0.7 quality %, more preferably 0.1～0.5 quality %.Gui Ding reason is like this, and as mentioned above, they mainly form Co
2The precipitate of Si intermetallic compound helps precipitation strength.The precipitation strength amount reduces during Co quantity not sufficient 0.5 quality %, and its effect is saturated when surpassing 2.5 quality %.In addition, according to the stoichiometric ratio of this compound, best interpolation ratio is
Determine the addition of Si in the mode that reaches this scope, but be that the center is regulated preferably, so that Co/Si is in 3.0～5.0 scope, more preferably in 3.2～4.5 scope with this value.Below, sometimes Si and Co are called " adding element I ".
Under the situation of the copper alloy of above-mentioned composition, carry out the temperature T s that solutionizing handles (℃) be more than 800 ℃ below 960 ℃, Co content (quality %) is made as under the situation of X, with than-122.77X
2The temperature that+409.99X+615.74 is low (℃) carry out solutionizing and handle.
In the copper alloy of the present invention, preferably add Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti, and Zr in any one or two kinds of more than, its amount is 0.01～1.0 quality %.Below, sometimes with this Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti, and Zr be called " adding element II ".
This be because the addition that adds element II when less than 0.01 quality %, the effect of interpolation is few, when surpassing 1.0 quality %,＜1〉Mg, electric conductivity significantly reduces in the element of the such solid solution of Mn, Sn; The rising of the solutionizing temperature that the reduction of separating out the intensity of bringing beyond when＜2〉causing timeliness in the element that Cr, V, Al, Fe, Ni, Ti, the such promotion of Zr are separated out or the rising of solid solubility temperature bring;＜3〉Cr, Mg, Al, Ti, Zr are difficult to cast because of significant oxidation.
These add Cr, Ni, Fe among element II has with the part of the Co of main precipitated phase and replaces, and forms Co-χ-Si compound (χ=Cr, Ni, Fe) and effect that intensity is improved.
Mg, Mn, and Sn have solid solution in the copper parent phase and the effect of strengthened copper alloy.Mg, Mn also have the effect of improving hot workability.
V, Al, Ni, Ti, and Zr have with Co, Si and together form the effect that thickization of crystal grain strengthened and suppressed to compound.
The preferred manufacture method of Cu alloy material of the present invention is made up of following operation.That is fusion casting → thermal treatment → hot rolling again → cold rolling → solutionizing processing → timeliness thermal treatment → finally cold rolling → stress relieving.Timeliness thermal treatment can be opposite order with finally cold rolling.In addition, (low temperature) annealing that finally eliminates stress can be omitted.
Among the present invention, final above-mentioned solutionizing before rolling handled being made as more than 800 ℃ below 960 ℃.
In addition, for solutionizing treatment temp Ts (℃) for, under the situation that does not contain above-mentioned interpolation element II, be under the situation of X setting Co content (quality %), be made as ratio-122.77X
2The temperature that+409.99X+615.74 is low (℃).
On the other hand, for solutionizing treatment temp Ts (℃) for, under the situation that contains above-mentioned interpolation element II with above-mentioned content, be under the situation of X setting Co content (quality %), be made as ratio-94.643X
2The temperature that+329.99X+677.09 is low (℃).
By the crystal grain diameter in the thermal treatment decision Cu alloy material of this temperature.
In addition, among the present invention, preferably carrying out from the speed of cooling of this solutionizing thermal treatment temp Ts is quick cooling (quenching) more than 50 ℃/second.Speed of cooling when this cooling is crossed when hanging down, and is separated out sometimes by the element of solutionizing with above-mentioned high temperature.
The particle (compound) that has taken place to separate out with so low excessively speed of cooling (for example being lower than 50 ℃/second speed of cooling) in cooling is the non-coherence precipitate (Noncoherent Precipitate) that intensity is not had help.In addition, when this non-coherence precipitate forms coherence precipitate (Coherent Precipitate) in next timeliness heat treatment step, work, promote separating out of this part, on characteristic, bring detrimentally affect sometimes as nucleation site.
Therefore, above-mentioned speed of cooling is preferably more than 50 ℃/second, more preferably more than 80 ℃/second, is preferably especially more than 100 ℃/second, and speed of cooling fast as far as possible in the scope of the upper limit in practicality is more satisfactory.
In addition, this speed of cooling is meant the average cooling rate from pyritous solutionizing thermal treatment temp to 300 ℃.Can not cause that when the temperature that is lower than 300 ℃ big tissue changes, therefore, as long as suitably control this temperature speed of cooling before.
Among the present invention, be the characteristic of the Cu alloy material of realizing above-mentioned composition rightly, regulation solutionizing temperature.
Among the present invention, crystal grain diameter is preferably below the 20 μ m, more preferably below the 10 μ m.Its reason be because, guess is owing to be thick particle diameter when crystal grain diameter surpasses 20 μ m, so the reduction of crystal boundary density can not fully absorb stress in bending, therefore, the processibility deterioration.The lower limit of crystal grain diameter is not particularly limited, but is generally more than the 3 μ m.In addition, " crystal grain diameter " value for recording based on JIS-H0501 described later (process of chopping).
In this said " size of precipitate " mean sizes for the precipitate obtained with method described later.
Electrical/electronic part of the present invention with one of Cu alloy material preferred embodiment in, have yielding stress and be the above and not enough 650MPa of 500MPa, electric conductivity and be the characteristic of above and bendability (R/t) less than 0.5 of 60%IACS.At this, bendability (R/t) less than 0.5 is meant R/t value less than 0.5 in the bending of parallel with rolling direction at least sample, preferably the bending of the sample parallel with rolling direction and with bending two sides of the vertical sample of rolling direction in R/t value less than 0.5.
In addition, electrical/electronic part of the present invention with Cu alloy material another preferred embodiment in, have yielding stress and be that 650MPa is above, electric conductivity is the characteristic of above and bendability (R/t) less than 1.5 of 50%IACS.At this, bendability (R/t) less than 1.5 is meant R/t value less than 1.5 in the bending of parallel with rolling direction at least sample, preferably the bending of the sample parallel with rolling direction and with bending two sides of the vertical sample of rolling direction in R/t value less than 1.5.
In addition, electrical/electronic part of the present invention with Cu alloy material again one preferred embodiment in, the value (R/t) that has yielding stress and be the above and not enough 650MPa of 500MPa, electric conductivity and be an above and expression bendability of 60%IACS the bending of the sample parallel with rolling direction and with bending two sides of the vertical sample of rolling direction be the characteristic that (more preferably below 1.0, is preferably especially below 0.6) below 1.2.
In addition, electrical/electronic part of the present invention with Cu alloy material again another preferred embodiment in, the value (R/t) that have yielding stress and be that 650MPa is above, electric conductivity is the above and expression bendability of 50%IACS the bending of the sample parallel with rolling direction and with bending two sides of the vertical sample of rolling direction be the characteristic of (more preferably below 1.2) below 1.5.
Like this, the Cu alloy material of the present invention of high conductivity and intensity height and then excellent in bending workability can properly use in the electrical/electronic part of the junctor of following strict bending machining etc.
Embodiment
Secondly, illustrate in greater detail the present invention based on embodiment, but the invention is not restricted to this.
(reference example 1)
To contain alloy (No.1～9) the high-frequency melting stove fusion that composition shown in the table 1 and remainder are made of Cu and unavoidable impurities, and its speed of cooling with 10～30 ℃/second is cast, obtain the ingot bar of length 180mm, width 30mm, height 110mm.
The ingot bar that obtains is processed into thickness 12mm by hot rolling in maintenance under 1000 ℃ after 30 minutes.After hot rolling, implement rapidly to quench by water cooling, for after removing lip-deep oxide scale film building up by welding and becoming about thickness 10mm, process by cold rolling.Afterwards,,, heat-treat simultaneously, quench rapidly by water cooling 950 ℃ of following holding temperatures 30 seconds for solutionizing, recrystallize.
The heat-up rate that arrives top temperature from the room temperature of this moment is in 10～50 ℃/second scope, and speed of cooling is carried out in 30～200 ℃/second scope.
Afterwards, surface film oxide is removed, implemented cold rolling as required.The solidified of operating like this in the thermal treatment of having both processing curing, subsequent processing of separating out promotes.
Secondly, separate out, implement 120 minutes thermal treatment down at 525 ℃ for carrying out timeliness.From this moment room temperature to the heat-up rate that reaches top temperature in 3～25 ℃/minute scope, when lowering the temperature, in stove and in 1 ℃/minute～2 ℃/minute scope, cool off, until comparing promptly 300 ℃ of enough low temperature to separating out the temperature band that impacts with thinking.
After the timeliness thermal treatment, implement cold rolling so that thickness of slab reduces 20%.For each alloy, the making thickness of slab is the material of 0.10mm, 0.15mm, 0.20mm, 0.25mm.
Secondly, implement 30 minutes thermal treatment down at 350 ℃.Arrive the heat-up rate of top temperature in 3～25 ℃/minute scope from the room temperature of this moment, when lowering the temperature, in stove and in 1 ℃/minute～2 ℃/minute scope, cool off, until comparing promptly 300 ℃ of enough low temperature to separating out the temperature band that impacts with thinking.
About the material of the thickness of slab 0.20mm of the alloy material of alloy No.1～8 of such making, measure yielding stress (YS), tensile strength (TS), and electric conductivity (EC) by following method.Table 3 ecbatic.In addition,, crystallization, separate out and too much make the hot rolling difficulty, fail to produce end article, therefore, do not carry out following mensuration about the alloy material of alloy No.9.
Yielding stress and stretching strength determination method: will be that benchmark is respectively measured two with JIS Z2241 along the parallel JIS Z2201-5 test film that cuts out of rolling direction, and obtain its mean value (MPa).
In addition, about yielding stress, according to micro residue elongation method.That is, use formula σ
0.2=F
0.2/ A
0Yield strength when calculating tensile-permanent set 0.2%.At this, σ is the yield strength (N/mm that calculates by micro residue elongation method
2), F is used to obtain following described power, promptly use extensometer to ask the relation line figure of power and elongation, and the point from the axis of elongation of the tensile-permanent set (ε %) that is equivalent to stipulate draws parallel lines to the initial straight line portion of test, obtain itself and the power shown in the crossing point of line chart.
Electric conductivity measuring method: use four-terminal method in the thermostatic bath that remains 20 ℃ (± 0.5 ℃), to measure resistivity, calculate electric conductivity (%IACS).Terminal pitch is from being set at 100mm.
Table 1
Table 2
| Operation | Solutionizing/℃ | Aging anneal/℃ | Rolling (red%) | Stress relieving/℃ |
| A | 825 | 525 | 20 | 350 |
| B | 850 | 525 | 20 | 350 |
| C | 875 | 525 | 20 | 350 |
| D | 900 | 525 | 20 | 350 |
| E | 925 | 525 | 20 | 350 |
| F | 950 | 525 | 20 | 350 |
| G | 750 | 525 | 20 | 350 |
| H | 1000 | 525 | 20 | 350 |
Table 3
In this test, owing to only carry out the evaluation of intensity and electric conductivity, treatment temp adopts 950 ℃ (operation F of above-mentioned table 2) that can obtain sufficient intensity.
Satisfy in alloy No.1～5 of scope of the composition of stipulating among the present invention, obtain the balanced and excellent alloy material of intensity and electric conductivity.
On the other hand, Co and Si measure among the very few alloy No.6, separate out to solidify to reduce undercapacity.
In addition, among the too much alloy No.9 of Co amount, the oxide compound during fusion forms too much and causes the goods deterioration, separate out too much and cause ingot bar thermal rupture again, be difficult to hot rolling, therefore, is difficult to make.In addition, because a large amount of Co that uses costliness, so become the alloy material of cost aspect competitive power difference.
Among the alloy example No.7,8 of the scope beyond Co/Si=3～5, undecomposed Co, Si solid solution element increase, and cause the remarkable reduction of electric conductivity.
Embodiment 1
Use contains the alloy that the composition shown in the table 4 and remainder are made of Cu and unavoidable impurities, the temperature of solutionizing processing is changed to the temperature of the operation A shown in the table 2～H, in addition, identical with reference example 1, obtain the alloy material of example 1～3,10～16 of the present invention and comparative example 1～3,18～22.In addition, alloy No.1～3 of the example shown in the table 4 are and the identical composition in alloy No.1～3 shown in the table 1.In addition, alloy No.10～12 of the example shown in the table 4 are respectively the alloys that has added Cr in alloy No.1～3 shown in table 1 and the table 4 within the limits prescribed, and alloy No.13～the 16th of the example shown in the table 4 added the alloy of Mg (No.13), Sn (No.14), Cr and Mg (No.15), Cr and Ti (No.16) within the limits prescribed respectively in the alloy No.3 shown in table 1 and the table 4.Alloy No.18～the 22nd of the comparative example shown in the table 4, the scope that surpasses regulation in the alloy No.3 shown in table 1 and the table 4 have been added the alloy of Cr (No.18), Ti (No.19), Mg (No.20), Sn (No.21), Zr (No.22) respectively.
About the alloy material of resulting example 1～3,10～16 of the present invention and comparative example 1～3,18～22, identical with reference example 1, measure yielding stress (YS), tensile strength (TS), reached electric conductivity (EC).In addition, crystal grain diameter (GS) and bendability (R/t) have been measured based on following note method.Table 5 ecbatic.
Crystal grain diameter assay method: after the cross section perpendicular to rolling direction of test film being finish-machined to minute surface by wet type polishing, polishing, use chromic acid: the solution of water=1: 1 corrodes the several seconds with polished surface, afterwards, use the secondary electron image of SEM to take pictures, measure the average crystal grain diameter (μ m) in cross section based on the process of chopping of JIS-H-0501 with 400～1000 times multiplying power.The cross section is measured at the rolling direction cross section.
Bendability is estimated: from take out the sample of the wide w=10 of plate (mm) each thickness of slab for the examination material, with the friction gently from the teeth outwards of medal polish powder, remove oxide film, afterwards, the bending of the sample parallel (GOOD WAY: below be called GW) with rolling direction, with this two kind of the bending of the vertical sample of rolling direction (BAD WAY: below be called BW) in carry out crooked inboard angle be 90 ° W bending.About the evaluation of bending, the radius of curvature R of the minimum by there not being microcrack is that R/t estimates divided by the value of sample thickness of slab t.
Table 4
Table 5
In the example of the present invention 1～3 of table 5, with solutionizing treatment temp Ts (℃) be made as more than 800 ℃ and be made as under the situation of X below 960 ℃ and with Co content (quality %), become ratio-122.77X
2The temperature that+409.99X+615.74 is low (℃).Therefore, the particle diameter of less than 20 μ m can be kept, the copper alloy of the balance excellence of intensity, electric conductivity, bendability can be accessed.
Particularly, yielding stress is that the above and not enough 650MPa of 500MPa, electric conductivity are that 60%IACS value (R/t) above and the expression bendability is below 1.0 at GW and BW two sides.And learn that it is below 0.6 even the example of less than 0.5 at GW and BW two sides that the value (R/t) of expression bendability is also arranged, and has obtained the Cu alloy material of the balance excellence of intensity, electric conductivity, bendability.
On the other hand, even same composition is comparing under the heat treated situation of the temperature shown in the example 1～3, intensity is also identical with example of the present invention 1～3 or uprise, and the particle diameter chap is big, compares with example 1～3 of the present invention, and bendability is poor.The value (R/t) of finding the expression bendability in addition is in the tendency of BW ratio in the GW difference.
As shown in table 5, in comparative example 3, in the processing that is lower than regulation employing solutionizing temperature, the tissue residue of non-recrystallization (value (-) as no crystal grain diameter in the table 5 is represented), in addition, in the processing that is higher than regulation employing solutionizing temperature, thickization of crystal grain all can not be kept the excellent in vending workability that becomes problem.
In the example of the present invention 10～16 of table 5, add more than one Cr, Mg, Mn, Sn, V, Zn, Al, Fe, Nb, Ni, Ti, Zr (promptly adding the above-mentioned interpolation element II that amounts to 0.01～1 quality %), with solutionizing treatment temp Ts (℃) be made as more than 800 ℃ below 960 ℃ and Co content (quality %) is made as under the situation of X, become ratio-94.643X
2The temperature that+329.99X+677.09 is low (℃).Therefore, with reference example 1 with the thermal treatment under the high temperature of degree in, particle diameter can be made as below the 20 μ m, can be made as have with reference example 1 with the intensity of degree and the material of excellent in bending workability.
Particularly, be more than the 500MPa and not enough 650MPa, electric conductivity are the sample more than the 60%IACS about yielding stress, the value (R/t) of expression bendability is below 1.2 at GW and BW two sides.In addition, it is below 1.0 at GW and BW two sides that the value (R/t) of expression bendability is also arranged, even is below 0.6, again even be the example of less than 0.5.In addition, about yielding stress be more than the 650MPa, electric conductivity is the sample more than the 50%IACS, the value (R/t) of expression bendability is below 1.5 even is below 1.2 at GW and BW two sides.Like this, learn the Cu alloy material of the balance excellence that can obtain intensity, electric conductivity, bendability.
In addition, even the means by reference example 1 can be controlled at particle diameter situation below the 20 μ m when only adding Co, Si under, can further promote the crystal grain miniaturization, can obtain excellent bending machining performance by adding above-mentioned metal.
On the other hand, surpass in 1% the comparative example 18～22 at the addition that adds element II, separating out in the formation of the oxide compound during because of casting and the high-temperature heat treatment too much is difficult to make.In addition, surpass in 1% the comparative example 21 at the addition that adds element II, when adding solid solution type element, electric conductivity descends significantly, the not enough 650MPa of yielding stress, but the value of R/t surpasses 1.2 at BW, and bendability is poor.Find that in addition the value (R/t) of expression bendability is in the tendency of BW ratio in the GW difference.
Utilizability on the industry
Electrical/electronic part of the present invention with Cu alloy material can properly use the junctor used in electric/electronic device, terminal material etc., particularly expect the high frequency relay of high conductivity and switch or automobile mounted junctor or the electrical/electronic parts of using etc. such as terminal material and lead frame.
The present invention and its embodiment together are illustrated, but as long as we do not specify, then any details in explanation does not all limit our invention, thinks not violate the spirit and scope of the invention shown in the incidental claim and should explain in a wide range.
The application based on March 21st, 2008 spy in Japan's patent application be willing to that 2008-074650 advocates right of priority, it carries out reference at this, takes passages the part of its content as the record of this specification sheets.
Claims (6)
1. electrical/electronic part Cu alloy material, contain the Co of 0.5～2.5 quality %, the Si of 0.1～1.0 quality %, and Co/Si=3～5 (mass ratio), remainder is made of Cu and unavoidable impurities, it is characterized in that, setting more than 800 ℃ below 960 ℃ and Co content (quality %) is under the situation of X, with than-122.77X
2The temperature T s that+409.99X+615.74 is low (℃) carry out solutionizing and handle.
2. electrical/electronic part Cu alloy material, contain the Co of 0.5～2.5 quality %, the Si of 0.1～1.0 quality %, and Co/Si=3～5 (mass ratio), also contain 0.01～1.0 quality % be selected from Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti, and the group that constitutes of Zr in one or more, remainder is made of Cu and unavoidable impurities, it is characterized in that, setting more than 800 ℃ below 960 ℃ and Co content (quality %) is under the situation of X, with than-94.643X
2The temperature T s that+329.99X+677.09 is low (℃) carry out solutionizing and handle.
3. electrical/electronic part Cu alloy material as claimed in claim 1 or 2 is characterized in that, yielding stress is the above and not enough 650MPa of 500MPa, and electric conductivity is more than the 60%IACS, and value (R/t) less than 0.5 of expression bendability.
4. electrical/electronic part Cu alloy material as claimed in claim 1 or 2 is characterized in that, yielding stress is more than the 650MPa, and electric conductivity is more than the 50%IACS, and value (R/t) less than 1.5 of expression bendability.
5. electrical/electronic part Cu alloy material as claimed in claim 1 or 2, it is characterized in that, yielding stress is the above and not enough 650MPa of 500MPa, electric conductivity is more than the 60%IACS, and the value (R/t) of expression bendability is below 1.2 at the sample parallel with rolling direction and with vertical sample two sides of rolling direction.
6. electrical/electronic part Cu alloy material as claimed in claim 1 or 2, it is characterized in that, yielding stress is more than the 650MPa, electric conductivity is more than the 50%IACS, and the value (R/t) of expression bendability is below 1.5 at the sample parallel with rolling direction and with vertical sample two sides of rolling direction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008074650 | 2008-03-21 | ||
| JP2008-074650 | 2008-03-21 | ||
| PCT/JP2009/055531 WO2009116649A1 (en) | 2008-03-21 | 2009-03-19 | Copper alloy material for electric and electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101978081A true CN101978081A (en) | 2011-02-16 |
| CN101978081B CN101978081B (en) | 2014-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980110059.3A Expired - Fee Related CN101978081B (en) | 2008-03-21 | 2009-03-19 | Copper alloy material for electric/electronic parts |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110005644A1 (en) |
| EP (1) | EP2267172A1 (en) |
| JP (1) | JP5065478B2 (en) |
| CN (1) | CN101978081B (en) |
| WO (1) | WO2009116649A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133765A (en) * | 2018-01-15 | 2018-06-08 | 郑家法 | A kind of cable copper alloy conductive material and preparation method thereof |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4672804B1 (en) * | 2010-05-31 | 2011-04-20 | Ｊｘ日鉱日石金属株式会社 | Cu-Co-Si based copper alloy for electronic materials and method for producing the same |
| JP4834781B1 (en) | 2010-08-24 | 2011-12-14 | Ｊｘ日鉱日石金属株式会社 | Cu-Co-Si alloy for electronic materials |
| JP2012144789A (en) * | 2011-01-13 | 2012-08-02 | Jx Nippon Mining & Metals Corp | Cu-Co-Si-Zr ALLOY MATERIAL |
| JP5544316B2 (en) * | 2011-02-14 | 2014-07-09 | Ｊｘ日鉱日石金属株式会社 | Cu-Co-Si-based alloys, copper products, electronic parts, and connectors |
| JP5514762B2 (en) * | 2011-03-29 | 2014-06-04 | Ｊｘ日鉱日石金属株式会社 | Cu-Co-Si alloy with excellent bending workability |
| US9159985B2 (en) * | 2011-05-27 | 2015-10-13 | Ostuka Techno Corporation | Circuit breaker and battery pack including the same |
| JP5802150B2 (en) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | Copper alloy |
| CN105734337A (en) * | 2016-05-05 | 2016-07-06 | 太仓小小精密模具有限公司 | Wearing-resistant cooper alloy mold material |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63307232A (en) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | Copper alloy |
| JPH02277735A (en) * | 1989-04-20 | 1990-11-14 | Sumitomo Metal Mining Co Ltd | Copper alloy for lead frame |
| US7182823B2 (en) * | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
| JP4068626B2 (en) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
| JP2007169765A (en) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | Copper alloy and its production method |
| JP4943095B2 (en) * | 2006-08-30 | 2012-05-30 | 三菱電機株式会社 | Copper alloy and manufacturing method thereof |
| JP2008074650A (en) | 2006-09-20 | 2008-04-03 | Covalent Materials Corp | Single crystal manufacturing apparatus and method for controlling the same |
| JP5085908B2 (en) * | 2006-10-03 | 2012-11-28 | Ｊｘ日鉱日石金属株式会社 | Copper alloy for electronic materials and manufacturing method thereof |
-
2009
- 2009-03-19 EP EP09722228A patent/EP2267172A1/en not_active Withdrawn
- 2009-03-19 WO PCT/JP2009/055531 patent/WO2009116649A1/en active Application Filing
- 2009-03-19 JP JP2010503942A patent/JP5065478B2/en not_active Expired - Fee Related
- 2009-03-19 CN CN200980110059.3A patent/CN101978081B/en not_active Expired - Fee Related
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2010
- 2010-09-20 US US12/886,268 patent/US20110005644A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133765A (en) * | 2018-01-15 | 2018-06-08 | 郑家法 | A kind of cable copper alloy conductive material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110005644A1 (en) | 2011-01-13 |
| CN101978081B (en) | 2014-09-10 |
| WO2009116649A1 (en) | 2009-09-24 |
| EP2267172A1 (en) | 2010-12-29 |
| JPWO2009116649A1 (en) | 2011-07-21 |
| JP5065478B2 (en) | 2012-10-31 |
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