The preparation method of LED lamp cooling structure
Technical field:
The present invention relates to the LED technical field, refer in particular to the preparation method of LED lamp cooling structure.
Background technology:
LED is a kind of light emitting semiconductor device, is used as indicator lamp, display screen etc. widely.White light LEDs be described as replace fluorescent lamps and incandescent lamp the 4th generation lighting source.LED changed the incandescent lamp tungsten filament luminous with the luminous principle of fluorescent lamp tricolor powder, utilize electroluminescence, have that light efficiency height, radiationless, life-span are long, an advantage of low-power consumption and environmental protection.A kind of traditional approach that forms white light LEDs is that blue light or ultraviolet chip excite the fluorescent material that is covering on chip, and the light stimulus fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.For the LED encapsulation, heat radiation is a key technical problem, and the quality of the effect of heat dissipation technology will directly have influence on the performance of LED.
At present, LED includes radiator, LED wafer, secondary optical lens module, power module and lamp housing etc.During encapsulation, wafer is placed in the reflector in the lamp housing, lamp housing is not only as the carrier of reflector but also as electrode and electrode pin use, wafer is connected with the radiator contact, make the heat of wafer can pass through radiator heat-dissipation, but this radiator structure is complicated, the processing technology complexity, make inconvenience, and radiating efficiency is not good.
Summary of the invention:
Purpose of the present invention is exactly to provide a kind of preparation method of utilizing the heat radiation laminated film to improve the LED lamp cooling structure of thermal conductivity factor, raising radiating efficiency, simplification manufacture craft at the deficiency of prior art existence.
To achieve these goals, the technical solution used in the present invention is:
The preparation method of LED lamp cooling structure, it may further comprise the steps:
A, uncut LED wafer or substrate toasted remove moisture;
B, carry out the surface treatment of electricity slurry;
C, in the mode of sputter or evaporation at LED wafer or substrate back plating one deck heat radiation laminated film;
D, carry out temper.
Wherein, step C is specially:
C1, load onto sputter or vapor deposition mask and location for LED wafer or substrate;
C2, LED wafer or substrate are placed the vacuum chamber of evaporator and bleed;
C3, carry out sputter or evaporation, form one deck heat radiation laminated film at LED wafer or substrate back.
Described heat radiation laminated film is copper aluminium laminated film or diamond-like carbon film.
The thickness of described heat radiation laminated film is 1~3 μ m.
Beneficial effect of the present invention is: the present invention includes step: A, uncut LED wafer or substrate toasted remove moisture; B, carry out the surface treatment of electricity slurry; C, in the mode of sputter or evaporation at LED wafer or substrate back plating one deck heat radiation laminated film; D, carry out temper; The present invention plates the processing of heat radiation laminated film at LED wafer or substrate back, the heat radiation laminated film has higher thermal conductivity factor, the LED wafer can rapidly, efficiently be delivered to heat on the substrate by the heat radiation laminated film, increase radiating efficiency and reduce the heat radiation cost of LED light fixture, and radiator structure is simple, simplify manufacture craft, reduced LED light fixture volume and weight.
The specific embodiment:
The preparation method of LED lamp cooling structure may further comprise the steps:
1, uncut LED wafer or substrate are toasted removes moisture;
2, carry out the surface treatment of electricity slurry;
3, be that LED wafer or substrate are loaded onto sputter or vapor deposition mask and location;
4, LED wafer or substrate are placed the vacuum chamber of evaporator and be pumped to vacuum;
5, carry out sputter or evaporation, form the heat radiation laminated film that a layer thickness is 1~3 μ m at LED wafer or substrate back, the heat radiation laminated film is the film of copper aluminium laminated film, diamond-like carbon film or other perfect heat-dissipating.
6, take out LED wafer or substrate and carry out temper;
7, on the LED wafer, paste blue patch;
8, the LED wafer is cut.
Wherein, thin more its radiating effect of heat radiation laminated film is relatively just poor more, and thick more its radiating effect is relatively just good more, and heat radiation laminated film thickness is that 1~3 μ m has preferable combination property, as being 1 μ m, 1.5 μ m, 2 μ m, 3 μ m etc., is preferably 2 μ m.
The present invention plates the processing of heat radiation laminated film at LED wafer or substrate back, reduce the thermal resistance between LED wafer bottom and the substrate, increase the thermal conductivity factor between them, the heat that inner node produces when making the LED wafer work can rapidly, efficiently be delivered on the substrate and derivation by the heat radiation laminated film, the life-span of the light efficiency of so real raising LED light fixture, prolongation LED light fixture, increase radiating efficiency and reduce the heat radiation cost of LED light fixture, and radiator structure is simple, simplify manufacture craft, reduced LED light fixture volume and weight.
Certainly, the above only is a better embodiment of the present invention, so all equivalences of doing according to the described structure of patent claim of the present invention, feature and principle change or modify, is included in the patent claim of the present invention.