CN101969741B - Hardware development platform and hardware development method - Google Patents
Hardware development platform and hardware development method Download PDFInfo
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- CN101969741B CN101969741B CN2009100554143A CN200910055414A CN101969741B CN 101969741 B CN101969741 B CN 101969741B CN 2009100554143 A CN2009100554143 A CN 2009100554143A CN 200910055414 A CN200910055414 A CN 200910055414A CN 101969741 B CN101969741 B CN 101969741B
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Abstract
The invention discloses a hardware development platform, which comprises a plurality of functional modules and connecting wires, wherein the connecting wires are used for connecting the plurality of functional modules together; and the connecting wires are connected with the functional modules in a freely-detachable manner. In addition, the invention also provides a hardware development method based on the functional modules. Compared with the prior art, the hardware development platform has the advantages that: due to the free-detachable connection manner of the connecting wires, which are connected between the functional modules, and the functional modules, the connection relationship among functional modules can be changed conveniently for correcting wrong connection in a hardware debugging and test process, so that the debugging is convenient and quick and the remaking process of a board and an entire printed circuit board (PCB) is saved; and thus, the hardware development period is shortened greatly and development cost is saved.
Description
Technical field
The present invention relates to a kind of hardware development platform and a kind of hardware development method.
Background technology
Get into 21 century, the swift and violent development of Information technology, electronic technology, the competition more and more fierce of electronic market.The listing cycle of the quality of product, Products Development cycle, product more and more receives each product development merchant's attention.
The product that function, performance are met customer need is striven in the shortest time, developing in each product development commercial city, and in the shortest time with launch.Otherwise, just maybe be by cruel the eliminating in market.In this case, how to shorten product development cycle as soon as possible, become the problem that each product development merchant high level needs emphasis to consider.
In traditional design of electronic products flow process, the design of PCB is made up of steps such as circuit design, PCB layout design, PCB making, debugging, measurement tests successively.
But, more than traditional development process, have a lot of drawbacks, make, debug this stage at PCB especially.Mainly show following several aspect:
Once need 10-20 days time, labor intensive material resources and finance usually 1.PCB make.
2.PCB manufacturing cost is higher, small and medium size companies, especially ordinary electronic fan and students can't bear financial pressure.
3.PCB in the debug process,, can't measure easily because of cabling has cured in pcb board.
4.PCB in the debug process,, can't make amendment to the connection of mistake easily because of cabling has cured in pcb board.
5.PCB pinpoint the problems in the debug process, generally all need design pcb board again, and make once more, debug.
6. on the common pcb board, use the scolding tin welding, general electrophile or welder be personnel in addition, can't conveniently make amendment to the connection of mistake.
7. common pcb board uses once only, and not reproducible use causes waste.
Given this, in fact be necessary to design a kind ofly save time, money, the hardware development mode of convenient debugging.
Summary of the invention
Therefore, at least one purpose of the present invention is to provide a kind of hardware development platform that can shorten the hardware development cycle greatly and be convenient to debug and hardware development method.
According to an aspect of the present invention, a kind of hardware development platform is provided, comprises: a plurality of functional module group; Be connected lead, said connection lead is used for a plurality of functional module group are interconnected, and wherein, interconnects with the mode that can freely dismantle between said connection lead and the said functional module group.
According to the embodiment of an implementation of the present invention, each said functional module group comprises: pcb board; Be arranged on functional chip and/or function element on the pcb board; Be arranged on the splicing ear on the pcb board; With the lead-in wire that said splicing ear and said functional chip and/or function element are linked together.Said connection lead has mating terminals, and the mating terminals of said connection lead is connected with the splicing ear of said functional module group with the mode that can freely dismantle.
Embodiment according to an implementation of the present invention; The splicing ear of said functional module group is a kind of in jack and the contact pin; The mating terminals of said connection lead is the another kind in jack and the contact pin, so that the splicing ear of said functional module group can be plugged on the mating terminals of said connection lead each other.
Embodiment according to another implementation of the present invention; The splicing ear of said functional module group is a kind of in anchor clamps and the protruding tongue; The mating terminals of said connection lead is the another kind in anchor clamps and the protruding tongue, so that the splicing ear of said functional module group can be clamped together with the said mating terminals that is connected lead each other.
Embodiment according to another implementation of the present invention; One in the splicing ear of said functional module group and the said mating terminals that is connected lead is the magnetic adsorption piece; Another is can be by the part that is adsorbed of said magnetic adsorption piece absorption, so that the splicing ear of said functional module group can be pulled together with the said mating terminals that is connected lead each other.
According to the embodiment of an implementation of the present invention, said functional chip and/or function element all are welded on the pcb board, and perhaps part of functions chip and/or function element are welded on the pcb board, and another part can be arranged on the pcb board with plugging.
According to the embodiment of an implementation of the present invention, at least one in said a plurality of functional module group is the microprocessor module with central processing unit chip.
According to a further aspect in the invention, a kind of hardware development method is provided, comprises the steps:
S1: provide a plurality of functional module group to be connected lead with what a plurality of functional module group interconnected, wherein, interconnect with the mode that can freely dismantle between said connection lead and the said functional module group with being used for;
S2: utilize the connection lead that a plurality of functional module group are interconnected, form the hardware testing circuit;
S3: the hardware testing circuit is tested, if test result does not reach predetermined requirement, execution in step S4 then, otherwise accomplish hardware development;
S4: utilize the connection lead to connect a plurality of functional module group again, form new hardware testing circuit; With
S5: the hardware testing circuit to new is tested, if test result does not reach predetermined requirement, and execution in step S4 then, otherwise accomplish hardware development.
In the prior art, people's needs basis designed circuit figure is in advance made a plate, after making whole PCB; Debug again and test,, must make a plate again if debugging and test are not passed through; Again make whole PCB,, can't change because the cabling of original PCB all solidifies.Compared with prior art, owing to all be connected with the mode that can freely dismantle between connection lead and each functional module group between each functional module group of the present invention, therefore; In the process of hardware debug and test, can change the annexation between each functional module group easily, be convenient to the connection of mistake is made amendment; Therefore so debug convenient and swiftly, and saved plate-making again and the process of making whole PCB again; Shorten the hardware development cycle greatly, practiced thrift development cost.
In a word, the maximum characteristics of hardware development platform of the present invention are can be according to the design demand of product, and each functional module group can combination in any, has thoroughly changed traditional design of electronic products flow process.
Description of drawings
Fig. 1 shows that this functional module group comprises a functional chip according to the functional module group of the embodiment of an exemplary of the present invention;
Fig. 2 shows that this functional module group comprises a plurality of function element according to the functional module group of the embodiment of another exemplary of the present invention;
Fig. 3 shows that this functional module group comprises a functional chip and a function element according to the functional module group of the embodiment of another exemplary of the present invention;
Fig. 4 shows that this functional module group comprises a functional chip according to the functional module group of the embodiment of another exemplary of the present invention;
Fig. 5 shows a hardware simplicity development platform that is made up of to microprocessor module, capacitance/resistance module, serial port function module and power management modules shown in Figure 4 Fig. 1;
Fig. 6 is presented at the schematic diagram that the hardware testing process is made amendment to the incorrect link relation of the hardware development platform among Fig. 5;
Fig. 7 shows the simulation sketch map of a mouse product development platform that is made up of USB functional module group, microprocessor module, capacitance/resistance module, push button function module and photoelectric sensor module; With
Fig. 8 shows the simulation sketch map of a camera product development platform of being made up of USB functional module group, little processing module, capacitance/resistance module, COMS optical sensing functional module group.Reference numeral
Pcb board 101,201,301,401
Splicing ear 103,203,303,403,503,603,703,803
Lead-in wire 104,204,304,404
Embodiment
Describe the embodiment of exemplary of the present invention below in detail, the example of embodiment is shown in the drawings, and wherein same or analogous label is represented same or analogous element.The embodiment that is described with reference to the drawings below is exemplary, is intended to explain the present invention, and can not be interpreted as limitation of the present invention.
Fig. 1 to Fig. 4 shows an independent functional module group respectively; In the present invention; Independent functional module group is the base unit that constitutes hardware development platform of the present invention (hardware development system); That is, whole hardware circuit is to constitute through a plurality of independent functional module group, rather than as constituted through a plurality of chips and element in the past.
Particularly, Fig. 1 shows that this functional module group 1 comprises a functional chip 102 according to the functional module group 1 of the embodiment of an exemplary of the present invention; But; Need to prove that each functional module group also can comprise a plurality of functional chips, this can divide to confirm according to the function of reality.Further, in the present embodiment, for example, this functional chip 102 can be microprocessor chip, and like this, functional module group 1 just becomes the microprocessor module.As shown in Figure 1, functional module group 1 comprises: pcb board 101, the lead-in wire 104 that is arranged on functional chip 102 on the pcb board 101, is arranged on the splicing ear 103 on the pcb board 101 and splicing ear 103 and functional chip 102 are linked together.
Particularly, Fig. 2 shows that this functional module group 2 comprises a plurality of function element 202 according to the functional module group 2 of the embodiment of another exemplary of the present invention; But; Need to prove that each functional module group also can only comprise a function element, this can confirm according to actual needs.Further, in the present embodiment, for example, these a plurality of function element 202 can be capacitance/resistance, and like this, functional module group 2 just becomes the capacitance/resistance module.As shown in Figure 2, functional module group 2 comprises: pcb board 201, the lead-in wire 204 that is arranged on a plurality of function element 202 on the pcb board 201, is arranged on the splicing ear 203 on the pcb board 201 and splicing ear 203 and a plurality of function element 202 are linked together.
Particularly; Fig. 3 shows the functional module group 3 according to the embodiment of another exemplary of the present invention; This functional module group 3 comprises a functional chip 3021 and a function element 3022, still, need to prove; Each functional module group also can comprise a plurality of functional chips and a plurality of function element simultaneously, and this can confirm according to actual needs.Further, in the present embodiment, for example, this functional chip 3021 can be serial port chip, and this function element 3022 can be serial interface, and like this, functional module group 3 just becomes a serial port function module.As shown in Figure 3, functional module group 3 comprises: pcb board 301, be arranged on functional chip 3021 and the function element 3022 on the pcb board 301, the lead-in wire 304 that is arranged on the splicing ear 303 on the pcb board 301 and splicing ear 303 and functional chip 3021 and function element 3022 are linked together.
Particularly, Fig. 4 shows that this functional module group 4 comprises a functional chip 402 according to the functional module group 4 of the embodiment of another exemplary of the present invention; In the present embodiment, for example, this functional chip 402 can be power management chip; Like this, functional module group 4 just becomes power management modules.As shown in Figure 4, functional module group 4 comprises: pcb board 401, the lead-in wire 404 that is arranged on functional chip 402 on the pcb board 401, is arranged on the splicing ear 403 on the pcb board 401 and splicing ear 403 and functional chip 402 are linked together.
In a preferred embodiment of the invention, functional chip among Fig. 1 to Fig. 4 and function element all are welded on the pcb board regularly.But, need to prove that the present invention is not limited to this, in radio-opaque distal marking embodiment, the base of partial function chip and function element is welded on the pcb board, and then, this functional chip and function element are pluggable to be arranged on this base; Perhaps partial function chip and function element directly are arranged on the pcb board with pluggable mode.
Fig. 5 shows a hardware simplicity development platform that is made up of to microprocessor module 1, capacitance/resistance module 2, serial port function module 3 and power management modules 4 shown in Figure 4 Fig. 1.As shown in Figure 5; In the present embodiment; A plurality of functional module group such as microprocessor module 1, capacitance/resistance module 2, serial port function module 3 and power management modules 4 interconnect through connecting lead 10, thereby constitute a simple hardware development platform (hardware development system).Can independent assortment in order to make between each functional module group; Freely change the annexation between them; As shown in Figure 5; In the present embodiment, the two ends (or being called the mating terminals that cooperates with splicing ear 103,203,303,403) that connect lead 10 interconnect with the mode that can freely dismantle with the splicing ear of each functional module group 1,2,3,4 103,203,303,403 respectively.
Particularly; In a preferred embodiment of the invention; The splicing ear 103,203,303,403 of functional module group 1,2,3,4 is a jack; And the two ends (mating terminals) that connect lead 10 are contact pin, and like this, the two ends (mating terminals) that connect lead 10 can be connected with the splicing ear 103,203,303,403 of each functional module group 1,2,3,4 with the mode that freely plugs.But; Need to prove that the present invention is not limited to this, the splicing ear 103,203,303,403 of each functional module group 1,2,3,4 also can be contact pin; And the two ends that connect lead 10 are jack, and these equivalent variations ought to fall in protection scope of the present invention.
Particularly; In another preferred embodiment of the present invention; The splicing ear 103,203,303,403 of functional module group 1,2,3,4 is protruding tongue, and the two ends (mating terminals) of connection lead 10 are anchor clamps, like this; The two ends (mating terminals) that connect lead 10 can grasp the splicing ear 103,203,303,403 of each functional module group 1,2,3,4, thereby realize being electrically connected.But; Need to prove that the present invention is not limited to this, the splicing ear 103,203,303,403 of each functional module group 1,2,3,4 also can be anchor clamps; And the two ends that connect lead 10 are protruding tongue, and these equivalent variations ought to fall in protection scope of the present invention.
Particularly; In another preferred embodiment of the present invention; The splicing ear 103,203,303,403 of functional module group 1,2,3,4 is magnetic adsorption piece (for example magnetizing steel part); And the two ends (mating terminals) that connect lead 10 for can be by this magnetic adsorption piece absorption be adsorbed part (for example ferrous metal spare); Like this, the two ends (mating terminals) that connect lead 10 can be pulled together with the splicing ear 103,203,303,403 of each functional module group 1,2,3,4 each other, thereby realize being electrically connected.But; Need to prove that the present invention is not limited to this, the splicing ear 103,203,303,403 of each functional module group 1,2,3,4 also can be for being adsorbed part; And the two ends that connect lead 10 are the magnetic adsorption piece, and these equivalent variations ought to fall in protection scope of the present invention.
Although the present invention has enumerated three kinds of different " connected modes that can freely dismantle " and has supported " two ends (mating terminals) of connection lead interconnect with the mode can freely dismantling of the splicing ear of functional module group " this upperseat concept; But; " connected mode that can freely dismantle " of the present invention is not limited to above-mentioned three kinds of preferred embodiments that difference is concrete; Can also adopt any suitable connected mode in the prior art; For example, will connect the two ends of lead and the splicing ear of functional module group bonds together, and perhaps draw single line and connect mutually with the two ends that are connected lead from the splicing ear of functional module group with glue; Perhaps use jumper cap to connect, these variations all should fall in protection scope of the present invention.
Fig. 7 shows a mouse product development platform that is made up of USB functional module group 5, microprocessor module 1, capacitance/resistance module 2, push button function module 6 and photoelectric sensor module 7.As shown in Figure 7, in the present embodiment, microprocessor module 1 all can adopt the microprocessor module 1 and capacitance/resistance module 2 shown in Fig. 5 with capacitance/resistance module 2.Like this, just can utilize a cover functional module group to be combined to form multiple different hardware development platform, and need not design the unique functional module group of a cover separately for every kind of hardware development platform.In like manner; In the embodiment of mouse product development platform shown in Figure 7, the two ends (mating terminals) that connect lead 10 interconnect with the mode that can freely dismantle with the splicing ear of each functional module group 1,2,5,6,7 103,203,503,603,703 respectively.
Further, Fig. 8 shows a camera product development platform of being made up of USB functional module group 5, microprocessor module 1, capacitance/resistance module 2, COMS optical sensing functional module group 8.As shown in Figure 8, in the present embodiment, microprocessor module 1, capacitance/resistance module 2 and USB functional module group 5 all can adopt the microprocessor module 1 shown in Fig. 5 and Fig. 7, capacitance/resistance module 2 and USB functional module group 5.Like this, just can utilize a cover functional module group to be combined to form multiple different hardware development platform, and need not design the unique functional module group of a cover separately for every kind of hardware development platform.In like manner, in the embodiment of camera product development platform shown in Figure 8, the two ends (mating terminals) that connect lead 10 interconnect with the mode that can freely dismantle with the splicing ear of each functional module group 1,2,5,8 103,203,503,803 respectively.
1-6 specifies the method for developing hardware based on the above-mentioned functions module below with reference to accompanying drawings, and this method comprises the steps: at least
S1: provide a plurality of functional module group (seeing also accompanying drawing 1-4) to be connected lead 10 (seeing also accompanying drawing 5) with what a plurality of functional module group interconnected with being used for; Wherein, interconnect (seeing also accompanying drawing 5) with the mode that can freely dismantle between connection lead 10 and the functional module group;
S2: utilize connection lead 10 that a plurality of functional module group are interconnected, form hardware testing circuit (seeing also accompanying drawing 5);
S3: the hardware testing circuit is tested, if test result does not reach predetermined requirement, execution in step S4 then, otherwise accomplish hardware development;
S4: utilize connection lead 10 to connect a plurality of functional module group again; Form new hardware testing circuit and (see also accompanying drawing 6; In accompanying drawing 6; Each functional module group 1,2, the annexation between 3 have been changed, the annexation before wherein dotted line is represented to change, the annexation after solid line is represented to change); With
S5: the hardware testing circuit to new is tested, if test result does not reach predetermined requirement, and execution in step S4 then, otherwise accomplish hardware development.
Need to prove, before above-mentioned steps S1, possibly also comprise the step of carrying out the basic circuit design in advance, for example design the circuit diagram of hardware circuit leaved for development in advance with the circuit design software.But, this step not necessarily, the user can be directly directly build actual hardware circuit with functional module group of the present invention, and needn't go out basic circuit diagram with software design earlier.
In addition, also need to prove, after accomplishing hardware development, possibly also comprise according to the step of carrying out circuit plate-making and manufacturing PCB plate through the aforementioned hardware testing circuit of test.But, this step not necessarily, the user fully can according to through the test aforementioned hardware testing circuit directly make circuit board by hand.
Certainly; Under instruction of the present invention, those skilled in the art can carry out various modifications to above-mentioned hardware development method, still; As long as amended hardware development method comprises above-mentioned steps S1 to S5, then this modification or variation all should be considered to fall in protection scope of the present invention.
Although illustrated and described embodiments of the invention; For those of ordinary skill in the art; Be appreciated that under the situation that does not break away from principle of the present invention and spirit and can change that scope of the present invention is limited accompanying claims and equivalent thereof to these embodiment.
Claims (7)
1. a hardware development method comprises the steps:
S1: provide a plurality of functional module group to be connected lead with what a plurality of functional module group interconnected, wherein, interconnect with the mode that can freely dismantle between said connection lead and the said functional module group with being used for;
S2: utilize the connection lead that a plurality of functional module group are interconnected, form the hardware testing circuit;
S3: the hardware testing circuit is tested, if test result does not reach predetermined requirement, execution in step S4 then, otherwise accomplish hardware development;
S4: utilize the connection lead to connect a plurality of functional module group again, form new hardware testing circuit; With
S5: the hardware testing circuit to new is tested, if test result does not reach predetermined requirement, and execution in step S4 then, otherwise accomplish hardware development.
2. hardware development method according to claim 1 is characterized in that,
Each said functional module group comprises:
Pcb board;
Be arranged on functional chip and/or function element on the pcb board;
Be arranged on the splicing ear on the pcb board; With
The lead-in wire that said splicing ear and said functional chip and/or function element are linked together,
Said connection lead has mating terminals, and the mating terminals of said connection lead is connected with the splicing ear of said functional module group with the mode that can freely dismantle.
3. hardware development method according to claim 2 is characterized in that,
The splicing ear of said functional module group is a kind of in jack and the contact pin, and the mating terminals of said connection lead is the another kind in jack and the contact pin, so that the splicing ear of said functional module group can be plugged on the mating terminals of said connection lead each other.
4. hardware development method according to claim 2 is characterized in that,
The splicing ear of said functional module group is a kind of in anchor clamps and the protruding tongue, and the mating terminals of said connection lead is the another kind in anchor clamps and the protruding tongue, so that the splicing ear of said functional module group can be clamped together with the said mating terminals that is connected lead each other.
5. hardware development method according to claim 2 is characterized in that,
One in the splicing ear of said functional module group and the said mating terminals that is connected lead is the magnetic adsorption piece; Another is can be by the part that is adsorbed of said magnetic adsorption piece absorption, so that the splicing ear of said functional module group can be pulled together with the said mating terminals that is connected lead each other.
6. hardware development method according to claim 2; It is characterized in that; Said functional chip and/or function element all are welded on the pcb board, and perhaps part of functions chip and/or function element are welded on the pcb board, and another part can be arranged on the pcb board with plugging.
7. hardware development method according to claim 2 is characterized in that, at least one in said a plurality of functional module group is the microprocessor module with central processing unit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100554143A CN101969741B (en) | 2009-07-27 | 2009-07-27 | Hardware development platform and hardware development method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009100554143A CN101969741B (en) | 2009-07-27 | 2009-07-27 | Hardware development platform and hardware development method |
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| Publication Number | Publication Date |
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| CN101969741A CN101969741A (en) | 2011-02-09 |
| CN101969741B true CN101969741B (en) | 2012-04-25 |
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| CN2009100554143A Expired - Fee Related CN101969741B (en) | 2009-07-27 | 2009-07-27 | Hardware development platform and hardware development method |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4661921A (en) * | 1984-04-23 | 1987-04-28 | Kontron Electronics, Inc. | Adapter for simultaneous use of logic analyzer and in circuit emulator |
| CN1809960A (en) * | 2003-06-24 | 2006-07-26 | 松下电器产业株式会社 | Device and method for matching output impedance in signal transmission system |
-
2009
- 2009-07-27 CN CN2009100554143A patent/CN101969741B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4661921A (en) * | 1984-04-23 | 1987-04-28 | Kontron Electronics, Inc. | Adapter for simultaneous use of logic analyzer and in circuit emulator |
| CN1809960A (en) * | 2003-06-24 | 2006-07-26 | 松下电器产业株式会社 | Device and method for matching output impedance in signal transmission system |
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| CN101969741A (en) | 2011-02-09 |
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