CN101958166B - Manufacture method of solid insulating circuit device - Google Patents
Manufacture method of solid insulating circuit device Download PDFInfo
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- CN101958166B CN101958166B CN 201010269998 CN201010269998A CN101958166B CN 101958166 B CN101958166 B CN 101958166B CN 201010269998 CN201010269998 CN 201010269998 CN 201010269998 A CN201010269998 A CN 201010269998A CN 101958166 B CN101958166 B CN 101958166B
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Abstract
The invention discloses a manufacture method of a solid insulating circuit device, which comprises the steps of: cleaning the surface of an electric conductor of a circuit device, preheating and then placing into a heated mould, and injecting a liquid epoxy resin composite material composed of silicon micropowder, epoxy resin and a curing agent into the mould; and taking a molded solid insulating circuit device blank from the mould after the epoxy resin composite material in the mould is cured, placing the blank into a baking oven for post-curing treatment, then carrying out sand blasting treatment on the surface of the blank except the part of the interface of the electric conductor to be insulated, coating a layer of conductive coating, carrying out evaporation treatment in the air, and then carrying out curing treatment in the baking oven to complete the manufacture of the solid insulating circuit device. Compared with the prior art, the invention can be used for effectively decreasing partial discharge values inside the solid insulating circuit device and surface inductive voltage of a product.
Description
Technical field
The present invention relates to a kind of high-voltage electrical equipment manufacturing technology field, especially a kind of production technology that adopts epoxide resin material sealing high pressure electric conductor outer surface.
Background technology
In high-voltage electrical equipment; In order to prevent alternate electrical breakdown, or disruptive discharge failed because relatively, need be to the isolation of insulating of the surface of electrification in high voltage electric conductor; Prevent short circuit and electric shock people and animals; Existing insulation mode has gas medium insulation, liquid medium insulation and solid dielectric insulation, and wherein the insulation of solid dielectric is high with dielectric strength, and the insulation isolation distance is little and exceed and come into one's own and use; It is to adopt epoxide resin material to serve as that existing solid dielectric insulation material has a kind of; The manufacturing process of this solid insulation device is just like " a kind of circuit breaker polar, its manufacturing approach " (patent publication No. is CN101140836, open day is: on 03 12nd, 2008), and this method is earlier a plurality of electrification in high voltage electric conductors to be assembled; Put it into then and adopt epoxy resin to form its pressure as a whole in the mould; After treating the demoulding, in epoxy resin housing (2) circumferential surface spray or be coated with last layer conductive silicon rubber layer, its sheet resistance value is 5k Ω-20k Ω behind silastic-layer (11) complete cure.Though this process can so that the surface coverage of electrification in high voltage electric conductor in the epoxy resin solid insulating material; Realize external isolated insulation; But the concrete component and the fabrication process parameters of used epoxide resin material are not disclosed; The material that does not also disclose the conductive silicon rubber layer constitutes; This technology can't prevent well that the high pressure electric conductor from the epoxy resins insulation layer partial discharge taking place, and also can't guarantee the bond strength of the conductive silicon rubber layer of epoxy resins insulation layer and outer surface.
Summary of the invention
Problem to be solved by this invention provides a kind of electric conductor that improves partial discharge takes place in solid insulating layer, and reduces the manufacturing approach of the solid insulation circuit devcie of product surface induced voltage.
In order to address the above problem, the manufacturing approach of this solid insulation circuit devcie is:
A, elder generation clean the processing of deoiling with the surface of the electric conductor of circuit devcie;
B, the said electric conductor after the surface treatment is heated to 90 ℃～130 ℃; Make its heat penetration; Putting into temperature to the said electric conductor of preheating is in 120～140 ℃ the mould; In mould, inject liquid epoxy resin composite material then; Under 130～140 ℃ temperature heat preservation solidification 10～40 minutes, during heat preservation solidification, keep-up pressure at 0.2～0.4MPa, the solid insulation circuit devcie base substrate that will solidify then takes out from mould, said epoxide resin material is that silicon powder and epoxy resin and the curing agent of 5～15 μ m formed by particle diameter;
C, solid insulation circuit devcie base substrate is put into temperature is the back cured that 135～145 ℃ of baking ovens carried out 8～12 hours;
D, through after the solid insulation circuit devcie base substrate of cured remove the release agent on surface; After the surface of epoxy resins insulation layer except that the interface that said electric conductor need insulate of having solidified carried out blasting treatment; Coat the semi-conductive paint layer, this semi-conductive paint layer material is made up of carbon black fine particle and resin varnish mixing;
E, outer surface application the said solid insulation circuit devcie base substrate of semi-conductive paint layer after dry 20～30 minutes, insert temperature and be 100～120 ℃ baking oven and be cured to handle and obtained the solid insulation circuit devcie in 30～60 minutes.
In the technical scheme of the invention described above; Can also be: said electric conductor be before cleaning is deoiled processing; Earlier the electric conductor surface that needs solid insulation is carried out blasting treatment and then cleaned the processing of deoiling, said electric conductor needs the surfaces coated last layer semi-conductive paint layer in blasting treatment, 0.5 ± 0.1 millimeter of thickness before inserting mould; The incubator preheating of putting into temperature then and be 120 ± 5 ℃ was solidified 25～30 minutes; In the said semi-conductive paint layer: the particle diameter of carbon black fine particle is 5～30 μ m, and the weight ratio in said semi-conductive paint layer of carbon black fine particle is 2～30%, and coupling agent is made up of silane coupler or titanate coupling agent; This coupling agent includes weight ratio in said semi-conductive paint layer be 0.2～1%, and all the other are resin varnish adhesive and ether solvent; Said method is when the said semi-conductive paint layer of application, and making the scope of the resistance value R of the every cm distance of its outer surface through the thickness of controlling said semiconductive material layer is 500 ohm≤R≤10000 ohm.
The present invention who has adopted such scheme compared with prior art has following beneficial effect:
1, to adopt by particle diameter be silicon powder and the epoxy resin of 5～15 μ m and the epoxy resin composite material that curing agent is formed to solid insulating layer; Make the solid insulating layer that solidify to form have comparatively suitable thermal coefficient of expansion; Under applying working condition, be difficult for producing micro-crack during variations in temperature; Inner each parts faying face is bonding good, is difficult for peeling off and produces air gap, thereby can suppress to produce between electric conductor and the insulating barrier partial discharge that air gap produces preferably; Its partial discharge value has tangible reduction than prior art; Under the 12kV electric pressure, generally be not more than 1pC, and be not more than 5pC as baroque insulating part partial discharge values such as solid insulation circuit breaker polars like the uncomplicated insulation device of structure partial discharge values such as solid insulation buses;
2, at the earthy semi-conductive paint layer of solid insulating layer external coating; Resistance value through control semi-conductive paint layer make the solid insulation device in use the induced voltage of its outer surface be controlled in the safe voltage scope; Not only can prevent accidental shock near personnel touching or the non-touching; Can also prevent next door equipment, parts electric shock are damaged, can effectively prevent alternate arcing and the diffusion mutually of striding of avoiding fault; And this semi-conductive paint layer mixes by carbon black fine particle and resin varnish and constitutes, and after dried through 100～120 ℃ baking-curing, make this layer solid insulating layer bond strength good, do not cause and peel off because of expanding with heat and contract with cold.
Fig. 1 is the structural representation of solid insulation bus manufactured goods in the embodiment of the invention.
Description of drawings
Fig. 1 is the structural representation of the solid insulation bus manufactured goods of the embodiment of the invention 1;
Fig. 2 is the structural front view of the high-voltage terminal sleeve pipe manufactured goods of the embodiment of the invention 2;
Fig. 3 is the structure left view of the high-voltage terminal sleeve pipe manufactured goods of the embodiment of the invention 2;
Fig. 4 is the structural representation of the circuit breaker polar manufactured goods of the embodiment of the invention 3.
Embodiment
Below in conjunction with accompanying drawing embodiment the utility model is made and to be further specified.
Embodiment 1: the manufacturing approach of solid insulation bus, finished product is as shown in Figure 1.
The first step: electric conductor 3 and the electric conductor 6 that processes sprayed noisy the processing; The sandblast position for figure in except that electric conductor 3 two ends as the part of plug and the part electric conductor 6 bottoms; Carry out oil removal treatment then; Add the oil stain that is stained with man-hour with washing agent flush away electric conductor 3 and electric conductor 6, adopt bolt 4 to be fastenedly connected electric conductor 3 and electric conductor 6 again;
Second step: be coated with last layer thickness in the outside of electric conductor that assembles 3 and electric conductor 6 and be 0.5 ± 0.1 millimeter be about carbon black fine particle, 0.2% titanate esters, 60% resin varnish adhesive, 24% xylenes and 6% butanols that 10% particle diameter is 5～10 μ m by weight ratio and mix the semi-conductive paint layer 1 that constitutes; The incubator preheating of putting into temperature again and be 120 ± 5 ℃ was solidified 40 minutes; Receive temperature even inside and outside making electric conductor 3 and electric conductor 6, and make semi-conductive paint layer dry solidification;
The 3rd step: application semi-conductive paint layer and to put into temperature through electric conductor 3 that preheating has been solidified and electric conductor 6 and voltage sensor electrode 7 be in 135 ± 5 ℃ the mould; In mould, inject liquid epoxy resin composite material then; Epoxy resin composite material is that weight ratio is that 45% Hensel steps board CW229CI type epoxy resin, 45% Hensel steps board HW229CI type curing agent and 10% particle diameter is the mixture of the silicon powder of 5 μ m; Then under 135 ± 5 ℃ of temperature heat preservation solidification 40 minutes, during heat preservation solidification, keep-up pressure at 0.3 ± 0.1MPa; Obtain having formed the solid insulation bus base substrate of solid insulating layer 2 then in electric conductor 3 and electric conductor 6 outsides; Solid insulation bus base substrate is taken out from mould, and the finishing overlap makes smooth outer surface smooth;
The 4th step: it is the back cured that 140 ± 5 ℃ of baking ovens carried out 10 hours that solid insulation bus base substrate is put into temperature;
The 5th step: the surperficial release agent of solid insulation bus base substrate removal of cured through the back; After the surface of epoxy resins insulation layer 2 except that the interface that said electric conductor need insulate of having solidified carried out blasting treatment; Coat the semi-conductive paint layer 8 that thickness is about 0.5 millimeter, this semi-conductive paint layer 8 is about carbon black fine particle, 0.2% titanate esters, 60% resin varnish adhesive, 24% xylenes and the mixing of 6% butanols that 10% particle diameter is 5～10 μ m by weight ratio and constitutes;
The 6th step: the outer surface application solid insulation bus base substrate of semi-conductive paint layer 8 after dry 30 minutes; Insert temperature and be 110 ± 10 ℃ baking oven and be cured to handle and obtained solid insulation bus finished product in 60 minutes, the resistance value of semi-conductive paint layer 8 every cm distance of outer surface can be controlled between 500～1000 ohm.
Embodiment 2: the manufacturing approach of high-voltage terminal sleeve pipe, finished product such as Fig. 2, shown in Figure 3
The first step: the electric conductor 2 that processes is sprayed noisy the processing, and the part into plug is made for removing electric conductor 2 two ends among the figure in the sandblast position, carries out oil removal treatment then, adds the oil stain that is stained with man-hour with washing agent flush away electric conductor 2;
Second step: the outer surface of electric conductor 2 except that both ends of the surface be coated with last layer thickness be 0.5 ± 0.1 millimeter by be about the semi-conductive paint layer 3 that carbon black fine particle that 10% particle diameter is 5～10 μ m, 0.2% titanate esters, 60% resin varnish adhesive, 24% xylenes and the mixing of 6% butanols constitute by weight ratio; The incubator preheating of putting into temperature again and be 125 ± 10 ℃ was solidified 25 minutes; Receive temperature even inside and outside making electric conductor 2, and make semi-conductive paint layer 3 dry solidification;
The 3rd step: the layer of application semi-conductive paint 3 and to put into temperature through electric conductor 2 that preheating has been solidified and voltage sensor electrode 4 be in 135 ± 5 ℃ the mould; In mould, inject liquid epoxy resin composite material then; Epoxy resin composite material is that weight ratio is that 45% Hensel steps board CW229CI type epoxy resin, 45% Hensel steps board HW229CI type curing agent and 10% particle diameter is the mixture of the silicon powder of 5 μ m; Then under 135 ± 5 ℃ of temperature heat preservation solidification 10 minutes, during heat preservation solidification, keep-up pressure at 0.3 ± 0.1MPa; Obtain having formed the high-voltage terminal sleeve pipe base substrate of solid insulating layer 1 then in electric conductor 2 outsides; High-voltage terminal sleeve pipe base substrate is taken out from mould, and the finishing overlap makes smooth outer surface smooth;
The 4th step: it is the back cured that 135 ± 5 ℃ of baking ovens carried out 12 hours that high-voltage terminal sleeve pipe base substrate is put into temperature;
The 5th step: the surperficial release agent of solid insulation bus base substrate removal of cured through the back; After the surface of epoxy resins insulation layer except that the interface that said electric conductor need insulate of having solidified carried out blasting treatment; Coat thickness and be 0.5 ± 0.1 millimeter semi-conductive paint layer 5, this semi-conductive paint layer 5 is about carbon black fine particle, 0.2% titanate esters, 60% resin varnish adhesive, 24% xylenes and 6% butanols that 10% particle diameter is 5～10 μ m by weight ratio and mixes and constitute;
The 6th step: the outer surface application solid insulation bus base substrate of semi-conductive paint layer 5 after dry 30 minutes; Insert temperature and be 110 ± 10 ℃ baking oven and be cured to handle and obtained solid insulation bus finished product in 60 minutes, the resistance value of semi-conductive paint layer 5 every cm distance on surface can be controlled between 500～1000 ohm.
Embodiment 3: the manufacturing approach of circuit breaker polar, finished product is as shown in Figure 4.
The first step: the conducting terminal 2 that processes is sprayed noisy the processing, and oil removal treatment is carried out then for the part except that conducting terminal 2 top inner hole walls and middle part inner hole wall among the figure in the sandblast position, adds the oil stain that is stained with man-hour with washing agent flush away conducting terminal 2;
Second step: being coated with last layer thickness at the outer surface of conducting terminal 2 is 0.5 ± 0.1 millimeter being about carbon black fine particle, 0.2% titanate esters, 60% resin varnish adhesive, 24% xylenes and 6% butanols that 10% particle diameter is 5～10 μ m by weight ratio and mixing the semi-conductive paint layer 3 that constitutes; The incubator preheating of putting into temperature again and be 120 ± 5 ℃ was solidified 40 minutes, made semi-conductive paint layer dry solidification;
The 3rd step: conducting terminal 2 that will the layer of application semi-conductive paint uses the screws prepackage with equal casting dies 5 and puts into temperature is 120 ± 5 ℃ incubator preheating curing 40 minutes, receives temperature even inside and outside making conducting terminal 2.The assembling of vacuum interrupter 1, sliding conduction spare 7 usefulness screw rods, and to put into temperature be that 120 ± 5 ℃ incubator preheating was solidified 40 minutes, receives temperature even inside and outside making vacuum interrupter 1 and sliding conduction spare 7.
The 4th step: the conducting terminal 2 of above-mentioned preheating, equal casting die 5 and vacuum interrupter 1, sliding conduction spare 7 usefulness elastic conduction rings 8 are electrically connected assembling; Put into temperature and be in 135 ± 5 ℃ the mould; And in mould, load onto pre-buried connector 4; In mould, inject liquid epoxy resin composite material then; Epoxy resin composite material is that weight ratio is that 60% Hensel steps board CW5859CI type epoxy resin, 30% Hensel steps board HW5859CI type curing agent and 10% particle diameter is the mixture of the silicon powder of 5 μ m; Then under 135 ± 5 ℃ of temperature heat preservation solidification 40 minutes, during heat preservation solidification, keep-up pressure at 0.3 ± 0.1MPa, obtain having formed the solid insulation circuit breaker polar base substrate of solid insulating layer 9 then in conducting terminal 2 and vacuum interrupter 1 outside, solid insulation solid insulation circuit breaker polar base substrate is taken out from mould; The finishing overlap makes smooth outer surface smooth;
The 4th step: it is the back cured that 140 ± 5 ℃ of baking ovens carried out 10 hours that solid insulation circuit breaker polar base substrate is put into temperature;
The 5th step: the surperficial release agent of solid insulation circuit breaker polar base substrate removal of cured through the back; After the outer surface of epoxy resins insulation layer 9 except that the interface that electric conductor need insulate that has solidified carried out blasting treatment; Coat the semi-conductive paint layer 10 that thickness is about 0.5 millimeter, this semi-conductive paint layer is about carbon black fine particle, 0.2% titanate esters, 60% resin varnish adhesive, 24% xylenes and the mixing of 6% butanols that 10% particle diameter is 5～10 μ m by weight ratio and constitutes;
The 6th step: the outer surface application solid insulation circuit breaker polar base substrate of semi-conductive paint layer after dry 30 minutes; Inserting temperature and be 110 ± 10 ℃ baking oven is cured to handle and obtained solid insulation circuit breaker polar finished product in 60 minutes; The resistance value of semi-conductive paint layer 10 every cm distance on surface is controlled between 500～1000 ohm the double threaded screw assembly 6 of packing at last.
Claims (3)
1. the manufacturing approach of a solid insulation circuit devcie is characterized in that processing step is:
A, pretreatment stage elder generation clean the processing of deoiling with the surface of the electric conductor of circuit devcie;
B, the said electric conductor after the surface treatment is heated to 90 ℃～130 ℃; Make its heat penetration; Putting into temperature to the said electric conductor of preheating is in 120～140 ℃ the mould; In mould, inject liquid epoxy resin composite material then; Under 130～140 ℃ temperature heat preservation solidification 10～40 minutes, during heat preservation solidification, keep-up pressure at 0.2～0.4MPa, the solid insulation circuit devcie base substrate that will solidify then takes out from mould, said epoxy resin composite material is that silicon powder and epoxy resin and the curing agent of 5～15 μ m formed by particle diameter;
C, solid insulation circuit devcie base substrate is put into temperature is the back cured that 135～145 ℃ of baking ovens carried out 8～12 hours;
D, through after the solid insulation circuit devcie base substrate of cured remove the release agent on surface; After the surface of epoxy resins insulation layer except that the interface that said electric conductor need insulate of having solidified carried out blasting treatment; Be coated with last layer semi-conductive paint layer, this semi-conductive paint layer is made up of carbon black fine particle and resin varnish mixing;
E, outer surface application the said solid insulation circuit devcie base substrate of semi-conductive paint layer after dry 20～30 minutes, insert temperature and be 100～120 ℃ baking oven and be cured to handle and obtained the solid insulation circuit devcie in 30～60 minutes.
2. the manufacturing approach of solid insulation circuit devcie according to claim 1; It is characterized in that: said electric conductor is before cleaning is deoiled processing; Earlier the electric conductor surface that needs solid insulation is carried out blasting treatment and then cleaned the processing of deoiling, said electric conductor needs the surfaces coated last layer semi-conductive paint layer in blasting treatment, 0.5 ± 0.1 millimeter of thickness before inserting mould; The incubator preheating of putting into temperature then and be 120 ± 5 ℃ was solidified 25～30 minutes; In the said semi-conductive paint layer: the particle diameter of carbon black fine particle is 5～30 μ m, and the weight ratio of carbon black fine particle in said semi-conductive paint layer is 2～30%, and coupling agent is made up of silane coupler or titanate coupling agent; The weight ratio of this coupling agent in said semi-conductive paint layer is 0.2～1%, and all the other are resin varnish adhesive and solvent.
3. the manufacturing approach of solid insulation circuit devcie according to claim 1 and 2 is characterized in that: the thickness through semi-conductive paint layer described in the controlled step D makes the scope of the resistance value R of the every cm distance of its outer surface be: 500 ohm≤R≤10000 ohm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010269998 CN101958166B (en) | 2010-09-02 | 2010-09-02 | Manufacture method of solid insulating circuit device |
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| CN 201010269998 CN101958166B (en) | 2010-09-02 | 2010-09-02 | Manufacture method of solid insulating circuit device |
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| CN101958166B true CN101958166B (en) | 2012-05-23 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102211375B (en) * | 2011-05-26 | 2013-10-16 | 麦克奥迪（厦门）电气股份有限公司 | Method for producing insulator or contact box with temperature and/or voltage sensor |
| CN102938279B (en) * | 2012-11-26 | 2014-11-05 | 浙江理工大学 | Preparation method of heat-resistant epoxy resin insulator |
| JPWO2014148071A1 (en) * | 2013-03-22 | 2017-02-16 | 株式会社オートネットワーク技術研究所 | Covered wire with terminal |
| CN104124005A (en) * | 2014-08-12 | 2014-10-29 | 北海银河开关设备有限公司 | Semi-conductive layer processing technique for solid insulation switches |
| CN105469877A (en) * | 2015-12-18 | 2016-04-06 | 苏州翠南电子科技有限公司 | Novel composite silicone rubber solid insulation bus |
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| CN101140836A (en) * | 2007-09-06 | 2008-03-12 | 北海银河高科技产业股份有限公司 | Circuit breakers pole column and manufacturing method thereof |
| CN101447262A (en) * | 2008-12-31 | 2009-06-03 | 中国西电电气股份有限公司 | Composite insulated bushing of electrical appliance lead wire |
| CN101694793B (en) * | 2009-10-19 | 2011-10-05 | 山东彼岸电力科技有限公司 | Insulating supporting rod for high-voltage electrical appliance and production method thereof |
| CN101812217A (en) * | 2010-04-15 | 2010-08-25 | 河南许绝电工绝缘材料有限公司 | Partial discharge resistant epoxy casting resin |
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