CN101950923A - Laser diode - Google Patents
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- CN101950923A CN101950923A CN2010102231799A CN201010223179A CN101950923A CN 101950923 A CN101950923 A CN 101950923A CN 2010102231799 A CN2010102231799 A CN 2010102231799A CN 201010223179 A CN201010223179 A CN 201010223179A CN 101950923 A CN101950923 A CN 101950923A
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- zoneofoxidation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18316—Airgap confined
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
- H01S2301/166—Single transverse or lateral mode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18322—Position of the structure
- H01S5/1833—Position of the structure with more than one structure
- H01S5/18333—Position of the structure with more than one structure only above the active layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18358—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] containing spacer layers to adjust the phase of the light wave in the cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2022—Absorbing region or layer parallel to the active layer, e.g. to influence transverse modes
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
A kind of laser diode comprises: first multi-layer mirror in the following order, active layer and second multi-layer mirror; And first the oxidation narrowing layer and the second oxidation narrowing layer.Compare with the second oxidation narrowing layer, the first oxidation narrowing layer forms near active layer, and the described first oxidation narrowing layer comprises first zoneofoxidation not of mesozone in the plane, and comprises first first zoneofoxidation of zoneofoxidation periphery not.The second oxidation narrowing layer be included in towards first not the diameter in the zone of zoneofoxidation less than described first second zoneofoxidation not of zoneofoxidation not, be included in not towards first zoneofoxidation not of the 3rd in the zone of zoneofoxidation not, and be included in second zoneofoxidation and the 3rd second zoneofoxidation of zoneofoxidation periphery not.
Description
The cross reference of related application
The present invention relates to be contained in 2009-164049 number disclosed theme of Japanese patent application of submitting to Japan Patent office on July 10th, 2009, its full content is incorporated into this, as a reference.
Technical field
The present invention relates to a kind of laser diode of on stacked direction, launching laser.
Background technology
(edge emitting laser diode) compares with edge-lit type laser diode, and surface-emitting type laser diode (surface emitting laser diode) has low-power consumption, and can directly modulate.Therefore, in recent years, the surface-emitting type laser diode has been used as the cheap light source of optical communication.
In the surface-emitting type laser diode, usually, be provided with by on substrate by stacking gradually the column platform shape portion (columnar mesa) that bottom DBR layer, lower isolation layer, active layer, upper isolation layer, top DBR layer and contact layer form.In one in bottom DBR layer and top DBR layer, the current narrowing layer with the narrowed structure of current injection area is set, thereby improves electric current injection efficiency, and reduce threshold current to active layer.On each of the back side of the top surface of platform shape portion and substrate, electrode is set.In this laser diode, behind the electric current that injects from electrode that narrowed by current narrowing layer, electric current is injected into active layer, thus launching in conjunction with producing light again by electronics and hole.Reflect this light by bottom DBR layer and top DBR layer, and produce laser generation with predetermined wavelength.This light is used as the top surface emission of laser from platform shape portion.
In above-mentioned surface-emitting type laser diode, be not easy to obtain to have high output and orbicular light beam.In the surface-emitting type laser diode, the current narrowing diameter is approximately 10 μ m, greater than edge-lit type laser diode.Therefore, the gain inequality of transverse mode is very little, is easy to generate multimode oscillation.For example, in order to increase light output, when the electric current that injects the luminous zone increases, except orbicular fundamental transverse mode, the annular high-order transverse mode that also vibrates, the shape multilated of light beam.In the surface-emitting type laser diode, the thickness of active layer is approximately tens nm, and the diameter of the luminous zone of active layer is approximately 10 μ m, and the luminous zone of the volume ratio edge-lit type laser diode of luminous zone is little a lot.Therefore, as mentioned above, when the electric current that injects the luminous zone increased, it is saturated at once that the local heat that produces makes light output in the luminous zone, even when just increasing the electric current injection rate, also is difficult to obtain big light output.
Therefore, the measure of the gain inequality of a large amount of increase transverse modes had been proposed since the past.For example, disclose in 2002-208755 number, propose to reduce to be arranged on the opening diameter (comparing) of the electrode on the platform shape portion top surface with the opening diameter of electrode of the prior art in Japanese unexamined patent.In addition, for example, disclose in 2004-253408 number in Japanese unexamined patent, propose on p side and n side, all to be provided with one by one the oxidation narrowing layer and promote the electric current of pars intermedia to inject, thereby allow to be easy to generate first-harmonic transverse mode vibration (fundamental transversemode oscillation).
Summary of the invention
But, in Japanese unexamined patent discloses 2002-208755 number method,,, have the problem that yields poorly so process allowance is very little because the optical loss in the electrode is very big.In Japanese unexamined patent discloses 2004-253408 number method, owing to dually carried out the electric current compression, so the problem that exists resistance value to increase.In addition, in this method, obtain the vibration of first-harmonic transverse mode, the current narrowing diameter need be decreased to about 5 μ m in order only to compress by electric current.Yet, under the situation that reduces the current narrowing diameter by this way, have the problem that is difficult to obtain big light output that causes by the local heat that produces in the luminous zone.
In view of the above problems, expectation provides a kind of and can obtain the laser diode with high output and orbicular light beam.
According to embodiments of the invention, a kind of laser diode is provided, comprising: first multi-layer mirror in the following order, active layer and second multi-layer mirror; And first the oxidation narrowing layer and the second oxidation narrowing layer.Compare with the second oxidation narrowing layer, the first oxidation narrowing layer forms near active layer.The first oxidation narrowing layer comprises not zoneofoxidation of first in planar the mesozone, and is included in first first zoneofoxidation of zoneofoxidation periphery not.Simultaneously, the second oxidation narrowing layer be included in towards first not the diameter in the zone of zoneofoxidation and comprise not less than first second zoneofoxidation not of the diameter of zoneofoxidation not towards first zoneofoxidation not of the 3rd in the zone of zoneofoxidation not.In addition, the second oxidation narrowing layer is included in second zoneofoxidation and the 3rd second zoneofoxidation of zoneofoxidation periphery not.
In laser diode according to the embodiment of the invention, in the mesozone that is arranged near the first oxidation narrowing layer of active layer, formation has large diameter first zoneofoxidation not, and, form second zoneofoxidation not with minor diameter in the mesozone that is arranged in away from the second oxidation narrowing layer of active layer.Thereby, can suppress the higher order transverse mode oscillation, increase the volume of the luminous zone of active layer simultaneously.In addition, in an embodiment of the present invention, the 3rd not zoneofoxidation be formed in the zone that is not the mesozone in the second oxidation narrowing layer.Therefore, in the second oxidation narrowing layer, the 3rd not zoneofoxidation can be used as current path, thereby, can reduce the resistance value of the second oxidation narrowing layer.
Laser diode according to the embodiment of the invention, first not zoneofoxidation be formed on the first oxidation narrowing layer that is arranged near active layer, second not zoneofoxidation be formed on the second oxidation narrowing layer that is arranged in away from active layer, and the 3rd not zoneofoxidation be formed in the zone that is not the mesozone in the second oxidation narrowing layer.Therefore, can obtain to have high output and orbicular light beam.
Other purpose of the present invention, feature and advantage will show more fully from description subsequently.
Description of drawings
Fig. 1 is the perspective view according to the surface-emitting type laser diode of first embodiment of the invention.
Fig. 2 is the sectional view of the laser diode of Fig. 1.
Fig. 3 is the sectional view of oxidation narrowing layer of the transverse mode of control chart 1.
Fig. 4 A and Fig. 4 B are the sectional view of example of manufacture process of the laser diode of key diagram 1.
Fig. 5 A and Fig. 5 B are the sectional view of the step after key diagram 4A and Fig. 4 B.
Fig. 6 is the current path of laser diode of key diagram 1 and the sectional view of light field.
Fig. 7 is the perspective view of distortion example of the laser diode of Fig. 1.
Fig. 8 is from the observed sectional view of the direction of the arrow A-A of the laser diode of Fig. 7.
Fig. 9 is from the observed sectional view of the direction of the arrow B-B of the laser diode of Fig. 7.
Figure 10 is the sectional view of oxidation narrowing layer of the transverse mode of control chart 7.
Figure 11 is the current path of laser diode of key diagram 7 and the sectional view of light field.
Figure 12 is the perspective view according to the surface-emitting type laser diode of second embodiment of the invention.
Figure 13 is from the observed sectional view of the direction of the arrow A-A of the laser diode of Figure 12.
Figure 14 is from the observed sectional view of the direction of the arrow B-B of the laser diode of Figure 12.
Figure 15 is the sectional view of the oxidation narrowing layer of the transverse mode of control Figure 12.
Figure 16 is the current path of the laser diode of explanation Figure 12 and the sectional view of light field.
Embodiment
Hereinafter, describe embodiments of the invention with reference to the accompanying drawings in detail.Be described in the following order:
1. first embodiment (Fig. 1～Fig. 6)
Wherein in the DBR layer of top, be provided with the example of two-layer oxidation narrowing layer.
Wherein be provided with the example of the groove that runs through the oxidation narrowing layer.
The 2. distortion of first embodiment (Fig. 7～Figure 11)
The example of bridge shape crossbeam (bridge girder) wherein is set in groove.
3. second embodiment (Figure 12～Figure 16)
Wherein two-layer oxidation narrowing layer is separately positioned on the example in top DBR layer and the bottom DBR layer.
1. first embodiment
Fig. 1 shows the surface-emitting type laser diode 1 according to first embodiment of the invention with having an X-rayed.Fig. 2 shows the example of the observed cross section structure of the direction from arrow A-A of laser diode of Fig. 1.Fig. 3 shows the example of adjusting the cross section structure in layer plane of 19 (will describe subsequently) at transverse mode.In addition, Fig. 1 to Fig. 3 is schematic diagrammatic sketch, and actual size is different with the size and dimension in the diagrammatic sketch with true form.
The laser diode 1 of this embodiment comprises semiconductor layer 20, and this semiconductor layer forms by stack gradually bottom DBR layer 11, lower isolation layer 12, active layer 13, upper isolation layer 14, top DBR layer 15 and contact layer 16 on a face of substrate 10.On the top of semiconductor layer 20, especially, in part bottom DBR layer 11, lower isolation layer 12, active layer 13, upper isolation layer 14, top DBR layer 15 and contact layer 16, formed the platform shape portion 17 of column.
In this embodiment, bottom DBR layer 11 is corresponding to the instantiation of " first multi-layer mirror " of the present invention.Top DBR layer 15 is corresponding to the instantiation of " second multi-layer mirror " of the present invention.
Form bottom DBR layer 11 by alternately laminated low-index layer (not shown) and high refractive index layer (not shown).For example, low-index layer is λ by thickness
0/ 4n
1(λ
0Be oscillation wavelength, n
1Be refractive index) n type Al
X1Ga
1-x1As (0＜x1＜1) constitutes.For example, high refractive index layer is λ by thickness
0/ 4n
2(n
2Be refractive index) n type Al
X2Ga
1-x2As (0＜x2＜x1) constitute.
For example, lower isolation layer 12 is by n type Al
X3Ga
1-x3As (0＜x3＜1) constitutes.For example, active layer 13 is by unadulterated Al
X4Ga
1-x4As (0＜x4＜1) constitutes.In active layer 13, become luminous zone 13A towards the zone of current injection area 18A (will subsequently describe).For example, upper isolation layer 14 is by p type Al
X5Ga
1-x5As (0≤x5＜1) constitutes.The example of p type impurity comprises zinc (Zn), magnesium (Mg) and beryllium (Be).
Form top DBR layer 15 by alternately laminated low-index layer (not shown) and high refractive index layer (not shown).For example, low-index layer is λ by thickness
0/ 4n
3(n
3Be refractive index) p type Al
X6Ga
1-x6As (0＜x6＜1) constitutes.For example, high refractive index layer is λ by thickness
0/ 4n
4(n
4Be refractive index) p type Al
X7Ga
1-x7As (0＜x7＜x6) constitute.For example, contact layer 16 is by p type Al
X8Ga
1-x8As (0＜x8＜1) constitutes.
In laser diode 1, for example, current narrowing layer 18 and transverse mode adjustment layer 19 are arranged in the top DBR layer 15.In this embodiment, current narrowing layer 18 is corresponding to the instantiation of " the first oxidation narrowing layer " of the present invention.Transverse mode is adjusted layer 19 instantiation corresponding to " the second oxidation narrowing layer " of the present invention.
Compare with transverse mode adjustment layer 19, current narrowing layer 18 forms near active layer 13.In top DBR layer 15, current narrowing layer 18 replaces low-index layers, for example is arranged on, apart from which floor the position of low-index layer of active layer 13 sides.Current narrowing layer 18 comprises current injection area 18A and electric current compressional zone (current constricting region) 18B.In the current injection area 18A formation mesozone planar.Current injection area 18A has the big diameter than transmitance region 19A (will describe subsequently).Electric current compressional zone 18B is formed on the periphery of current injection area 18A, that is, and and in the outer edge area of current narrowing layer 18.In this embodiment, current injection area 18A is corresponding to the instantiation of " first not zoneofoxidation " of the present invention.Electric current compressional zone 18B is corresponding to the instantiation of " first zoneofoxidation " of the present invention.
For example, current injection area 18A is by p type Al
X9Ga
1-x9As (0＜x9≤1) constitutes.For example, electric current compressional zone 18B comprises aluminium oxide (Al
2O
3), and as described later, be contained in by oxidation package from the side the high concentration Al among the oxidized layer 18D is obtained this electric current compressional zone.Therefore, current narrowing layer 18 has the function of the electric current that narrows.For example, current narrowing layer 18 can be formed in the upper isolation layer 14, perhaps can be formed between upper isolation layer 14 and the DBR layer 15.
Compare with current narrowing layer 18, transverse mode is adjusted layer 19 and is formed away from active layer 13.In top DBR layer 15, transverse mode is adjusted layer 19 and is replaced low-index layers, for example is arranged on, apart from which floor the position of low-index layer of current narrowing layer 18.Transverse mode adjustment floor 19 comprises transmitance region 19A, current injection area 19B and optical loss district 19C.In this embodiment, transmitance region 19A is corresponding to the instantiation of " second not zoneofoxidation " of the present invention.Current injection area 19B is corresponding to the instantiation of " the 3rd not zoneofoxidation " of the present invention.Optical loss district 19C is corresponding to the instantiation of " second zoneofoxidation " of the present invention.
For example, transmitance region 19A is by p type Al
X10Ga
1-x10As (0＜x10≤1) constitutes.For example, current injection area 19B is by p type Al
X11Ga
1-x11As (0＜x11≤1) constitutes.Current injection area 19B can be by constituting with transmitance region 19A identical materials (identical ratio of component).Optical loss district 19C for example comprises aluminium oxide (Al
2O
3), and be contained in by oxidation package from the side the high concentration Al among the oxidized floor 19D is obtained the optical loss district.Therefore, transmitance region 19A and optical loss district 19C have the function that suppresses the middle higher order transverse mode oscillation in plane.Current injection area 19B has the function of outer rim transmission current planar.That is, transverse mode is adjusted layer 19 and is suppressed the middle higher order transverse mode oscillation in plane, and transmission current in the outer rim planar.
Under the situation that the Al ratio of component of the Al ratio of component of transmitance region 19A and current injection area 19B and current injection area 18A is equal to each other, preferably, transverse mode is adjusted the thickness of the thickness (thickness on the stacked direction) of layer 19 less than current narrowing layer 18.Under the situation of Al ratio of component less than the Al ratio of component of current injection area 18A of transmitance region 19A and current injection area 19B, preferably, the thickness (thickness on the stacked direction) of transverse mode adjustment layer 19 equals the thickness of current narrowing layer 18.
In this embodiment, the top in platform shape portion 17 particularly, in top DBR layer 15, has formed groove 30.Groove 30 is formed on not in the zone of electric current compressional zone 18B, particularly, is forming groove 30 between transmitance region 19A and the current injection area 19B and in optical loss district 19C.As shown in figures 1 and 3, for example, when when the top surface of platform shape portion 17 is observed, groove 30 has around the annular shape of electric current compressional zone 18B (or transmitance region 19A).Groove 30 is formed between transmitance region 19A and the current injection area 19B, and its bottom surface is adjusted between the layer 19 in current narrowing layer 18 and transverse mode.That is, groove 30 runs through transverse mode adjusts floor 19 (optical loss district 19C), and has the degree of depth of the degree that does not contact with current narrowing layer 18.
On the top surface (top surface of contact layer 16) of platform shape portion 17, formed annular upper electrode 31, this upper electrode comprises at least at the opening in the zone of current injection area 18A (light exit wound of bullet 31A).The side of platform shape portion 17 and near the surface on, form insulating barrier 32.In insulating barrier 32, on corresponding near the surface the platform shape portion 17, be provided with the electrode pads 33 and the connecting portion 34 that are used to connect the distribution (not shown).Electrode pads 33 and upper electrode 31 are electrically connected to each other by connecting portion 34.On the back side of substrate 10, be provided with lower electrode 35.
Here, insulating barrier 32 for example is made of the insulating material such as oxide or nitride.Upper electrode 31, electrode pads 33 and connecting portion 34 for example form by stacking gradually titanium (Ti), platinum (Pt) and gold (Au), and they are electrically connected to the contact layer 16 that is positioned at platform shape portion 17 tops.For example, lower electrode 35 has the structure that obtains by the alloy that stacks gradually gold (Au) and germanium (Ge) from substrate 10 sides, nickel (Ni) and gold (Au), and is electrically connected to substrate 10.
(manufacture method)
For example, can make the laser diode 1 of this embodiment with following method.
Fig. 4 A, Fig. 4 B, Fig. 5 A and Fig. 5 B show the processing sequence of manufacture method.In addition, Fig. 4 A, Fig. 4 B, Fig. 5 A and Fig. 5 B show respectively by corresponding to the resulting cross section structure of element in the position cutting manufacture process of the line of arrow A-A of Fig. 1.
Here, for example, be formed on compound semiconductor layer on the GaAs substrate 10 by using MOCVD (metal organic chemical vapor deposition) method.At this moment, as the material that is used for the III-V compound semiconductor, for example, use trimethyl aluminium (TMA), trimethyl gallium (TMG), trimethyl indium (TMIn) and arsine (AsH3).As the material that is used for donor impurity, for example, use H
2Se.As the material that is used for acceptor impurity, for example, use zinc methide (DMZ).
Particularly, at first, on substrate 10, stack gradually bottom DBR layer 11, lower isolation layer 12, active layer 13, upper isolation layer 14, top DBR layer 15 and contact layer 16 (Fig. 4 A).At this moment, in part top DBR layer 15, form as follows will be oxidized layer 18D and layer 19D that will be oxidized, that is, and an oxidized layer 19D compared, with the oxidized layer more close active layer of 18D.
With oxidized layer 18D is by the oxidized layer that becomes current narrowing layer 18 in oxidation processes (will describe subsequently), and for example comprises AlAs.With oxidized layer 19D is to become the layer that transverse mode is adjusted layer 19 by oxidized in oxidation processes (will describe subsequently), and for example comprises AlAs.Here, under the situation that the Al ratio of component with the Al ratio of component of oxidized layer 18D and layer 19D that will be oxidized is equal to each other, the thickness setting of just oxidized layer 19D is less than the thickness with oxidized layer 18D.Under with the Al ratio of component of the oxidized layer 18D situation less than the Al ratio of component of layer 19D that will be oxidized, the thickness setting of just oxidized layer 19D is the thickness that is equal to or less than oxidized layer 18D.
Next, on the surface of contact layer 16, formation comprises the photoresist layer (not shown) corresponding to the opening in the zone of the groove 30 that is about to form in reprocessing.Next, for example, (reactive ion etching, RIE) method is optionally removed contact layer 16 and top DBR layer 15 by using reactive ion etching as mask to utilize photoresist layer.At this moment, carry out etching,, then, before reaching, stop oxidized layer 18D until running through with oxidized layer 19D.Thereby, in top DBR layer 15, formed the bottom surface with oxidized layer 18D with the ring-shaped groove 30 (Fig. 4 B) between the oxidized layer 19D.At this moment, oxidized layer 19D is exposed to the inwall of groove 30.After this, remove photoresist layer.
Next, on the surface of contact layer 16, form the circular photoresist layer (not shown) that diameter equals the diameter of platform shape portion 17.Next, for example, utilize mask against corrosion as mask, by use the RIE method optionally remove bottom DBR layer 11, lower isolation layer 12, active layer 13, upper isolation layer 14, top DBR layer 15, contact layer 16, will be oxidized layer 18D and with the part of oxidized layer 19D.Thereby, under circular photoresist layer (not shown), form platform shape 17 (Fig. 5) of portion.At this moment, oxidized layer 18D and layer 19D that will be oxidized are exposed to side in platform shape portion 17.After this, remove above-mentioned photoresist layer.
Next, in steam atmosphere (atmosphere), carry out oxidation processes, from the inwall layer 18D that optionally oxidation will be oxidized of the side of platform shape portion 17 and groove 30 with the Al that is comprised the oxidized layer 19D with high temperature.Therefore, in platform shape portion 17, the rim area of oxidized layer 18D is become insulating barrier (aluminium oxide), thereby form current narrowing layer 18 (Fig. 5 B).In addition, in platform shape portion 17, become insulating barrier (aluminium oxide) near the inwall with the groove 30 among the rim area of oxidized layer 19D and the layer 19D that will be oxidized, adjust layer 19 (Fig. 5 B) thereby form transverse mode.
Next, on whole surface, for example, form by such as silica (SiO
2) insulating barrier 32 (not shown)s made of insulation inorganic material.Next, on whole surface, formed after the photoresist layer (not shown) of the annular opening on the top surface that is included in platform shape portion 17, for example, utilized photoresist layer, optionally removed insulating barrier 32 by using the RIE method as mask.Therefore, in being about to form the part of upper electrode 31, formed the opening (not shown).After this, remove photoresist layer.
Next, for example, by using vacuum vapour deposition stacked above-mentioned metal material on whole surface.After this, for example, form the annular upper portion electrode filling the opening of insulating barrier 32 by using optionally etching, and in insulating barrier 32 corresponding to formation electrode pads 33 near the surface platform shape portion 17.In addition, between upper electrode 31 and electrode pads 33, form connecting portion 34 (with reference to Fig. 1).After adjusting its thickness, form lower electrode 35 (with reference to Fig. 1) at the back side of substrate 10 by the back side of suitable polishing substrate 10.In this way, make the laser diode 1 of this embodiment.
Next, with reference to Fig. 6, will the operation and the effect of the laser diode 1 of this embodiment be described.
(operation and effect)
In the laser diode 1 of this embodiment, when between lower electrode 35 and upper electrode 31, applying predetermined voltage, electric current " I " is injected in the active layer 13 via current injection area 19B in the transverse mode adjustment layer 19 and the current injection area 18A in the current narrowing layer 18, thereby, compound and luminous by electronics and hole.This light is reflected by a pair of bottom DBR layer 11 and top DBR layer 15, thereby produces laser generation with predetermined wavelength.At this moment, the light field Li sensing transverse mode in the laser diode 1 is adjusted transmitance region 19A and the optical loss district 19C in the floor 19.Therefore, suppress the higher order transverse mode oscillation, and produced the vibration of first-harmonic transverse mode.As a result, for example, 31A penetrates positive circular light beam Lo to the outside from light emission outlet.
In this embodiment, in the mesozone that is arranged near the current narrowing layer 18 the active layer 13, formed and had large diameter current injection area 18A, and, formed transmitance region 19A with minor diameter being arranged in the mesozone of adjusting layer 19 away from the transverse mode of active layer 13.Therefore, can suppress the higher order transverse mode oscillation, increase the volume (volume) of the luminous zone 13A of active layer 13 simultaneously.In addition, in this embodiment, current injection area 19B is formed in the zone that is not the mesozone in the transverse mode adjustment layer 19.Therefore, current injection area 19B can be used as the current path in the transverse mode adjustment layer 19, therefore, can reduce the resistance value that transverse mode is adjusted layer 19.As a result, can obtain light beam Lo with high output and positive circular (complete-circular shape).
2. the distortion example of first embodiment
In first embodiment, groove 30 is an annular shape, and in top DBR layer 15, the part in the part of groove 30 inboards and groove 30 outsides is spatial separation.But for example, in top DBR layer 15, the part of groove 30 inboards and groove 30 Outboard Sections can be electrically connected.For example, as Fig. 7～shown in Figure 10, a plurality of bridge shape crossbeams (bridgegirder) 36 grooves are arranged on 30 inboards, and when when the top surface of platform shape portion 17 is observed, groove 30 is formed in the annulus around the transmitance region 19A intermittently.Fig. 7 is the perspective view according to the laser diode of this distortion example.Fig. 8 is from the observed sectional view of the direction of the arrow A-A of the laser diode of Fig. 7, and Fig. 9 is the arrow B-observed sectional view of B direction from the laser diode of Fig. 7.Figure 10 is the sectional view in the plane of transverse mode adjustment layer 19.
As shown in Figure 8, for example, each bridge portion 36 has constituted the part of the top DBR layer 15 in the platform shape portion 17 and the part that transverse mode is adjusted layer 19.Being electrically connected between each bridge portion 36 has set up groove 30 inboards in top DBR layer 15 part 17A and the part 17B in groove 30 outsides.Therefore, for example, as shown in figure 11, electric current " I " not only flows to current injection area 19B, and flows to the transmitance region 19A in the transverse mode adjustment layer 19, therefore, can further reduce the resistance value that transverse mode is adjusted layer 19.
3. second embodiment
Next, will the surface-emitting type laser diode 2 of second embodiment of the invention be described.Figure 12 shows laser diode 2 with having an X-rayed.Figure 13 shows from the example of the observed cross section structure of the direction of the arrow A-A of the laser diode 2 of Figure 12.Figure 14 shows from the example of the observed cross section structure of the direction of the arrow B-B of the laser diode 2 of Figure 12.Figure 15 shows the example of the cross section structure in the plane of transverse mode adjustment layer 37 (will describe subsequently).In addition, Figure 12～Figure 15 is a schematic representation, and actual size is different with the size and dimension in the diagrammatic sketch with true form.
In the laser diode 2 of this embodiment, the difference of the structure of the laser diode 1 among the structure and first embodiment is, be provided with the transverse mode adjustment layer 19 that transverse mode adjustment layer 37 replaces first embodiment, and be provided with the groove 30 that groove 38 replaces first embodiment.Therefore, hereinafter, will mainly describe different with first embodiment, and suitably omit and the description of the common ground of first embodiment.
In first embodiment, though transverse mode adjustment layer 19 is arranged in the top DBR layer 15, transverse mode adjustment layer 37 is arranged on bottom DBR layer 11.That is, transverse mode adjustment layer 3 is provided with 7 in the DBR layer (bottom DBR layer 11) different with the DBR layer that current narrowing layer 18 is set (top DBR layer 15).
Compare with current narrowing layer 18, transverse mode is adjusted layer 37 and is formed away from active layer 13.Transverse mode is adjusted layer 37 and is replaced low-index layer, is arranged on the position that is positioned in the DBR layer 11 away from the low-index layer of current narrowing layer 18.Transverse mode adjustment floor 37 comprises transmitance region 37A, current injection area 37B and optical loss district 37C.In this embodiment, transmitance region 37A is corresponding to the instantiation of " second not zoneofoxidation " of the present invention.Current injection area 37B is corresponding to the instantiation of " the 3rd not zoneofoxidation " of the present invention.Optical loss district 37C is corresponding to the instantiation of " second zoneofoxidation " of the present invention.
For example, transmitance region 37A is by n type Al
X12Ga
1-x12As (0＜x12≤1) constitutes.For example, current injection area 37B is by n type Al
X13Ga
1-x13As (0＜x13≤1) constitutes.In addition, current injection area 37B can be by constituting with transmitance region 37A identical materials (same composition ratio).For example, optical loss district 37C comprises aluminium oxide (Al
2O
3), and be contained in by oxidation package from the side the high concentration Al in the oxidized floor (not shown) is obtained the optical loss district.Therefore, transmitance region 37A and optical loss district 37C have the function that suppresses the higher order transverse mode oscillation under the platform shape portion 17.Current injection area 37B has the function of transmission current on every side under platform shape portion 17.That is, transverse mode adjustment layer 37 has suppressed the higher order transverse mode oscillation under the platform shape portion 17, and the peripheral transmission current under platform shape portion 17.
Under the situation that the Al ratio of component of the Al ratio of component of transmitance region 37A and current injection area 37B and current injection area 18A is equal to each other, preferably, transverse mode is adjusted the thickness of the thickness (thickness on the stacked direction) of layer 37 less than current narrowing layer 18.Under the situation of Al ratio of component less than the Al ratio of component of current injection area 18A of transmission area 37A and current injection area 37B, preferably, the thickness (thickness on the stacked direction) of transverse mode adjustment layer 37 equals the thickness of current narrowing layer 18.
In this embodiment, near platform shape portion 17, particularly, in bottom DBR layer 11, form groove 38.Groove 38 is formed on not in the zone of electric current compressional zone 18B, and particularly, groove 38 is formed between transmitance region 37A and the current injection area 37B among the optical loss district 37C.As shown in figure 15, for example, when when the top surface of platform shape portion 17 is observed, groove 38 intermittently is formed in electric current compressional zone 18B (or the transmitance region 37A) annulus on every side.Groove 38 is formed between transmitance region 37A and the current injection area 37B, and for example its bottom surface is adjusted between layer 37 and the substrate 10 at transverse mode.That is, for example, groove 38 runs through transverse mode adjusts floor 37 (optical loss district 37C), and has the degree of depth of this degree that does not contact with substrate 10.In addition, groove 38 can have the degree of depth that arrives substrate 10.
Next, with reference to Figure 16 in detail, the operation and the effect of the laser diode 2 of this embodiment will be described.
(operation and effect)
In the laser diode 2 of this embodiment, when between lower electrode 35 and upper electrode 31, applying predetermined voltage, electric current " I " is injected in the active layer 13 via the current injection area 18A in the transmitance region 37A in the transverse mode adjustment layer 37 and current injection area 37B and the current narrowing layer 18, thereby, compound and luminous by electronics and hole.This light is reflected by a pair of bottom DBR layer 11 and top DBR layer 15, thereby produces laser generation with predetermined wavelength.At this moment, the light field Li sensing transverse mode in the laser diode 2 is adjusted transmitance region 37A and the optical loss district 37C in the floor 37.Therefore, suppress the higher order transverse mode oscillation, and generated the vibration of first-harmonic transverse mode.As a result, export 31A to the orbicular light beam Lo of external emission from the light emission.
In this embodiment, in the mesozone that is arranged near the current narrowing layer 18 the active layer 13, formation has large diameter current injection area 18A, and, form transmitance region 37A with minor diameter being arranged in the zone of adjusting layer 37 away from the transverse mode of active layer 13 towards current injection area 18A.Therefore, can suppress the higher order transverse mode oscillation, increase the volume of the luminous zone 13A of active layer 13 simultaneously.In addition, in this embodiment, current injection area 37B is formed on and is not that transverse mode adjusts in the layer 37 in the zone under the platform shape portion 17.Therefore, not only transmitance region 37A but also current injection area 37B can be used as the current path in the transverse mode adjustment layer 37, therefore, can reduce the resistance value that transverse mode is adjusted layer 37.As a result, can obtain to have high output and orbicular light beam Lo.
Above,, the invention is not restricted to the foregoing description, can carry out various distortion although described the present invention with reference to a plurality of embodiment.
For example, in the above-described embodiments, although with reference to the case description of AlGaAs compound laser diode the present invention, the present invention can be applicable to other compound laser diode, for example, the laser diode that is constituted by the oxidizable compounds semiconductor.
For a person skilled in the art, be understandable that,, can carry out various modifications, combination, recombinant and replacement, as long as it is within the scope of claims or equivalent the present invention according to designing requirement and other factors.
Claims (7)
1. laser diode comprises:
First multi-layer mirror in the following order, active layer and second multi-layer mirror, and
The first oxidation narrowing layer and the second oxidation narrowing layer, wherein
Compare with the described second oxidation narrowing layer, the described first oxidation narrowing layer forms near described active layer, the described first oxidation narrowing layer comprises in the plane not zoneofoxidation of first in the mesozone, and is included in described first first zoneofoxidation of zoneofoxidation periphery not, and
The described second oxidation narrowing layer be included in towards described first not the diameter in the zone of zoneofoxidation less than described first second zoneofoxidation not of zoneofoxidation not, be included in not towards described first zoneofoxidation not of the 3rd in the zone of zoneofoxidation not, and be included in described second zoneofoxidation and the described the 3rd second zoneofoxidation of zoneofoxidation periphery not.
2. laser diode according to claim 1, wherein, the described the 3rd not the area of zoneofoxidation be set to greater than described second area of zoneofoxidation not.
3. laser diode according to claim 1 further is included in described second zoneofoxidation and the described the 3rd groove between the zoneofoxidation not.
4. laser diode according to claim 3, wherein, described groove has around described second annular shape of zoneofoxidation not, perhaps is formed on around described second not in the annulus of zoneofoxidation intermittently.
5. laser diode according to claim 4, wherein, the described the 3rd not zoneofoxidation have around described second annular shape of zoneofoxidation not.
6. laser diode according to claim 1, wherein, described first oxidation narrowing layer and the described second oxidation narrowing layer are formed in described first multi-layer mirror or described second multi-layer mirror.
7. laser diode according to claim 1, wherein
The described first oxidation narrowing layer is formed in described first multi-layer mirror or described second multi-layer mirror, and
The described second oxidation narrowing layer is formed in one that does not form the described first oxidation narrowing layer in described first multi-layer mirror and described second multi-layer mirror.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009164049A JP2011018855A (en) | 2009-07-10 | 2009-07-10 | Semiconductor laser |
| JP2009-164049 | 2009-07-10 |
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| Publication Number | Publication Date |
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| CN101950923A true CN101950923A (en) | 2011-01-19 |
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|---|---|---|---|
| CN2010102231799A Pending CN101950923A (en) | 2009-07-10 | 2010-07-02 | Laser diode |
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| Country | Link |
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| US (1) | US20110007769A1 (en) |
| JP (1) | JP2011018855A (en) |
| CN (1) | CN101950923A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986487A (en) * | 2009-07-28 | 2011-03-16 | 佳能株式会社 | Surface emitting laser, method for producing surface emitting laser, and image forming apparatus |
| US8265115B2 (en) | 2009-07-28 | 2012-09-11 | Canon Kabushiki Kaisha | Surface emitting laser, method for manufacturing surface emitting laser, and image forming apparatus |
| CN112117639A (en) * | 2019-06-21 | 2020-12-22 | 全新光电科技股份有限公司 | Vertical cavity surface emitting laser diode (VCSEL) with multiple current confinement layers |
| CN118040474A (en) * | 2024-04-07 | 2024-05-14 | 苏州长光华芯光电技术股份有限公司 | Multi-junction vertical cavity surface emitting semiconductor light emitting structure and preparation method thereof |
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| JP4582237B2 (en) | 2008-01-10 | 2010-11-17 | ソニー株式会社 | Surface emitting semiconductor laser |
| US8077752B2 (en) * | 2008-01-10 | 2011-12-13 | Sony Corporation | Vertical cavity surface emitting laser |
| MX340144B (en) * | 2011-01-28 | 2016-06-15 | Stimwave Tech Inc | Neural stimulator system. |
| JP2013045845A (en) * | 2011-08-23 | 2013-03-04 | Fuji Xerox Co Ltd | Surface emitting semiconductor laser, surface emitting semiconductor laser device, optical transmission device and information processing device |
| WO2014144866A2 (en) * | 2013-03-15 | 2014-09-18 | Praevium Research, Inc. | Widely tunable swept source |
| JP7077500B2 (en) * | 2017-01-12 | 2022-05-31 | ローム株式会社 | Surface emitting laser element, optical device |
| JP7044030B2 (en) * | 2018-10-25 | 2022-03-30 | 住友電気工業株式会社 | Manufacturing method of surface emitting laser |
| WO2023112675A1 (en) * | 2021-12-14 | 2023-06-22 | ソニーセミコンダクタソリューションズ株式会社 | Control device, control method, semiconductor laser device, distance-measuring device, and on-vehicle device |
| WO2024095620A1 (en) * | 2022-10-31 | 2024-05-10 | ソニーグループ株式会社 | Surface emitting laser |
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| JP2004207500A (en) * | 2002-12-25 | 2004-07-22 | Furukawa Electric Co Ltd:The | Manufacturing method of surface emitting laser element |
| US20050265415A1 (en) * | 2004-05-28 | 2005-12-01 | Lambkin John D | Laser diode and method of manufacture |
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| KR100490803B1 (en) * | 2002-09-18 | 2005-05-24 | 주식회사 레이칸 | High-power single-mode vertical-cavity surface-emitting laser |
| JP5092533B2 (en) * | 2007-05-11 | 2012-12-05 | 富士ゼロックス株式会社 | Surface emitting semiconductor laser, optical device, light irradiation device, information processing device, light transmission device, space optical transmission device, and light transmission system |
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- 2009-07-10 JP JP2009164049A patent/JP2011018855A/en not_active Abandoned
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2010
- 2010-06-28 US US12/824,377 patent/US20110007769A1/en not_active Abandoned
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| JP2004207500A (en) * | 2002-12-25 | 2004-07-22 | Furukawa Electric Co Ltd:The | Manufacturing method of surface emitting laser element |
| US20050265415A1 (en) * | 2004-05-28 | 2005-12-01 | Lambkin John D | Laser diode and method of manufacture |
| US20080240194A1 (en) * | 2007-03-27 | 2008-10-02 | Sony Corporation | Vertical cavity surface emitting laser and method of manufacturing it |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986487A (en) * | 2009-07-28 | 2011-03-16 | 佳能株式会社 | Surface emitting laser, method for producing surface emitting laser, and image forming apparatus |
| US8188487B2 (en) | 2009-07-28 | 2012-05-29 | Canon Kabushiki Kaisha | Surface emitting laser with trenches to define conductive regions |
| US8265115B2 (en) | 2009-07-28 | 2012-09-11 | Canon Kabushiki Kaisha | Surface emitting laser, method for manufacturing surface emitting laser, and image forming apparatus |
| US8329524B2 (en) | 2009-07-28 | 2012-12-11 | Canon Kabushiki Kaisha | Surface emitting laser, method for producing surface emitting laser, and image forming apparatus |
| CN101986487B (en) * | 2009-07-28 | 2013-09-04 | 佳能株式会社 | Surface emitting laser, method for producing surface emitting laser, and image forming apparatus |
| CN112117639A (en) * | 2019-06-21 | 2020-12-22 | 全新光电科技股份有限公司 | Vertical cavity surface emitting laser diode (VCSEL) with multiple current confinement layers |
| CN118040474A (en) * | 2024-04-07 | 2024-05-14 | 苏州长光华芯光电技术股份有限公司 | Multi-junction vertical cavity surface emitting semiconductor light emitting structure and preparation method thereof |
| CN118040474B (en) * | 2024-04-07 | 2024-06-21 | 苏州长光华芯光电技术股份有限公司 | Multi-junction vertical cavity surface emitting semiconductor light emitting structure and preparation method thereof |
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| Publication number | Publication date |
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| US20110007769A1 (en) | 2011-01-13 |
| JP2011018855A (en) | 2011-01-27 |
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