CN101945568A - Electronic compound mounting device - Google Patents

Electronic compound mounting device Download PDF

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Publication number
CN101945568A
CN101945568A CN2010102202175A CN201010220217A CN101945568A CN 101945568 A CN101945568 A CN 101945568A CN 2010102202175 A CN2010102202175 A CN 2010102202175A CN 201010220217 A CN201010220217 A CN 201010220217A CN 101945568 A CN101945568 A CN 101945568A
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China
Prior art keywords
required time
unit
adsorption mouth
absorption
electronic unit
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CN2010102202175A
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CN101945568B (en
Inventor
粟野元一郎
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Juki Corp
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Juki Corp
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Abstract

The invention relates to an electronic compound mounting device for preventing absorption error and leading-back of electronic compounds. The electronic compound mounting device (100) is provided with: a pressure detection unit (125) detecting the inner pressure of an adsorption nozzle (105); and an acquisition control unit (30) of absorption required time, wherein the absorption action of the absorption nozzle is carried out through a negative pressure supply unit (122) in a compound supply part (102) relative to each electronic compound when mounting action control is not carried out, and the pressure detection unit measures and stores the absorption required time till the detection pressure becomes the target absorption pressure, and the absorption nozzle is raised after the absorption of each electronic compound is continuous through the negative supply unit according to the absorption required time obtained by the acquisition control unit of absorption required time when the action control unit is installed on the electronic compound.

Description

Electronic component mounting apparatus
Technical field
The present invention relates to a kind of electronic component mounting apparatus that utilizes adsorption mouth attract electrons parts and install.
Background technology
Existing electronic component mounting apparatus, has the boarded head that carries adsorption mouth and can on X-Y plane, move freely, by making the feed appliance attract electrons parts of adsorption mouth from electronic unit, boarded head is moved to the parts installation site of substrate, in adsorption mouth, supply with malleation in the installation site and discharge electronic unit, carry out the installation of electronic unit thus.
But along with the difference of electronic unit, differences such as the size of electronic unit, weight, surfacing sometimes in when absorption, from producing escape of air (gas leakage) between adsorption mouth front end and the electronic unit surface, thereby can't obtain sufficient confining force.
Therefore, in the electronic component mounting apparatus that for example patent documentation 1 is put down in writing, each electronic unit is preestablished the escape of air parameter of expression leakiness, with this escape of air parameter accordingly, the control that the translational speed of boarded head is reduced, prevent electronic unit fall or with respect to the offset of adsorption mouth.
In addition, there is following problems, promptly, tack between the electronic unit that has and the front end of adsorption mouth is too high, can't separate at electronic unit when this front end is released, directly under the state of attract electrons parts, boarded head is moved to next destination locations, the promptly so-called problem of taking back.
Therefore, in the electronic component mounting apparatus that for example patent documentation 2 is put down in writing,, reduce the slippage of adsorption mouth, or the adsorption mouth when reducing absorption prevents to take back to the control of the pressing force (tack) of electronic unit to being easy to generate the electronic unit of taking back.
Patent documentation 1: TOHKEMY 2007-242818 communique
Patent documentation 2: TOHKEMY 2007-250795 communique
Summary of the invention
But, because in the prior art shown in the above-mentioned patent documentation 1, adopt the method that reduces the translational speed of boarded head according to the escape of air parameter, so can't prevent from the supply unit attract electrons parts of electronic unit and the error when mentioning.
In addition, in the prior art of above-mentioned patent documentation 1,2, the parameter of carrying out producing with leakage parameters and expression the easiness take back is a benchmark, prevent the countermeasure leaking and take back, but be difficult to each electronic unit, predicting that in advance leakage parameters and expression produce the parameter of the easiness of taking back, in practice, is to handle after the generation accident carrying.
In addition, the parameter of easiness is taken back in leakage parameters and expression, must be conceived to each phenomenon by user itself, sets at each electronic unit, and is pretty troublesome.
The objective of the invention is to, before the installation of carrying out electronic unit, suppress with respect to the absorption affinity reduction of adsorption mouth or the generation of taking back, and, do not need to be undertaken the setting operation of electronic component characteristic by the operating personnel.
The invention of technical scheme 1 record is a kind of electronic component mounting apparatus, and it has: substrate maintaining part, its maintenance are carried out the substrate that electronic unit is installed; The parts supply unit, described a plurality of electronic units that its supply will be installed; Boarded head, it has liftable adsorption mouth, and this adsorption mouth is used to adsorb the electronic unit that carries to described substrate; The negative pressure feeding unit, it applies negative pressure to described adsorption mouth; The malleation feed unit, it applies malleation to described adsorption mouth; Boarded head travel mechanism, it makes in the zone of described boarded head till comprising from described parts supply unit to described substrate maintaining part, running fix at random; And action control unit, it carries out the installation action control with respect to described substrate based on installation data, it is characterized in that having: pressure sensing cell, and it detects the internal pressure of described adsorption mouth; And the absorption required time is obtained control unit, it is not when carrying out the control of described installation action, at described each electronic unit, parts receiving position at described parts supply unit, carry out the absorption action of described adsorption mouth by described negative pressure feeding unit, and, measure and store the absorption required time till the detected pressure of described pressure sensing cell reaches the target adsorptive pressure, described action control unit, when the installation of electronic unit, according to obtaining the absorption required time that control unit is obtained by described absorption required time, by described negative pressure feeding unit each electronic unit is continued absorption after, described adsorption mouth is risen.
The invention of technical scheme 2 records is characterised in that, has the identical structure of invention with technical scheme 1 record, and, after described absorption required time is obtained control unit and is measured described absorption required time, the absorption of carrying out electronic unit by described malleation feed unit discharges, and described adsorption mouth is risen.
The invention of technical scheme 3 records is characterised in that, has the identical structure of invention with technical scheme 1 or 2 records, and, have the required time of release and obtain control unit, it is not carried out installation action when control described, at each electronic unit that becomes mounting object in the described installation data, parts receiving position at described parts supply unit, make the absorption action that becomes the target adsorptive pressure in the described adsorption mouth by described negative pressure feeding unit, and, measure and store and make in the described adsorption mouth from the release required time of described target adsorptive pressure till becoming the target release pressure by described malleation feed unit, described action control unit, when the installation of electronic unit, according to obtaining the release required time that control unit is obtained by described release required time, after the absorption that continues to carry out each electronic unit by described malleation feed unit discharges, described adsorption mouth is risen.
The invention of technical scheme 4 records is characterised in that, has the identical structure of invention with technical scheme 3 records, and, described release required time is obtained control unit, obtain control unit from described absorption required time and make the state that becomes the target adsorptive pressure in the described adsorption mouth for the measurement of adsorbing required time, execution makes the action control that becomes the target release pressure in the described adsorption mouth by described malleation feed unit, thereby measures described release required time.
The invention of technical scheme 5 records is characterised in that, has the identical structure of invention with technical scheme 3 records, and, described release required time is obtained control unit, become the state of target adsorptive pressure in the described adsorption mouth, carrying out malleation by described malleation feed unit with the release required time of predicting supplies with, in described adsorption mouth, do not become under the situation of target release pressure, the release required time that makes described prediction changes with unit interval of regulation and carries out above-mentioned action repeatedly, thereby obtains the described release required time that is used to become described target release pressure.
The invention of technical scheme 6 records is characterised in that to have the identical structure of putting down in writing with technical scheme 3 of invention, and, have: parts absorption detecting unit, it to whether being adsorbed with electronic unit on the described adsorption mouth detects; And the release required time is confirmed control unit, it makes becomes the target adsorptive pressure and the attract electrons parts in the described adsorption mouth, under the state that this adsorption mouth is risen, based on obtaining the release required time that control unit is obtained by described release required time, carrying out malleation supplies with, and, after stopping to begin through the stand-by time of stipulating from this malleation supply, judge by described parts absorption detecting unit whether described electronic unit is released, described release required time is confirmed control unit, by described stand-by time being changed with the unit interval of stipulating and carrying out above-mentioned action repeatedly, till described electronic unit is released, obtain suitable stand-by time thus, and, described action control unit is when the installation of electronic unit, according to described release required time, the absorption of carrying out each electronic unit by described malleation feed unit discharges, then, after through the stand-by time that obtains by described release required time affirmation control unit, described adsorption mouth is risen.
The effect of invention
In the invention of technical scheme 1 record, because at each electronic unit that becomes mounting object, obtain the absorption required time that becomes till the target of the absorption adsorptive pressure, when installation action is controlled, continue absorption according to the absorption required time of obtaining, so under the state that reaches the target adsorptive pressure, carry out the rising of electronic unit and move, the falling of error in the time of can suppressing to adsorb, the electronic unit in moving, with respect to the generation of the offset of adsorption mouth front end etc., realize the reliability of action and the raising of installation site precision.
In addition, because when not carrying out installation action control, obtain the absorption required time that becomes till the target of the absorption adsorptive pressure, to make a mistake and identify this for the first time when installation action be the electronic unit that is easy to generate the escape of air of electronic unit so be different from, thereby implement to leak the situation of countermeasure, even each electronic unit is not carried out under the situation of leakage characteristics identification the operating personnel, also can be automatically with leakage characteristics accordingly, carry out installation action, and reduce wrong generation more.
In addition, do not need the operating personnel that the leakage characteristics of each electronic unit is set the input operation, can eliminate miscellaneous property of setting operation.
In addition, in technical scheme 1, for example in installation data etc., set respectively under the situation of " target adsorptive pressure " at each electronic unit, measurement reaches the absorption required time till the target adsorptive pressure of each electronic unit, with electronic unit irrespectively under the situation of " the target adsorptive pressure " of setting general-purpose, at each electronic unit, measure the absorption required time till the target adsorptive pressure reach identical.
In the invention of technical scheme 2 records, because the absorption required time is obtained the measurement of the absorption required time in the control, parts receiving position at the parts supply unit carries out, and, after measurement, carry out the absorption release of electronic unit by the malleation feed unit after, electronic unit adsorption mouth risen, so can not be removed its result from the parts supply unit, can avoid that the electricity wasting subassembly can be realized the raising of economy for the measurement of adsorbing required time.
In the invention of technical scheme 3 records, because with respect to each electronic unit that becomes mounting object, obtain from adsorbed state and begin the release required time that supply by malleation makes to be become in the adsorption mouth till the target release pressure, when installation action is controlled, according to the release required time of obtaining, the release of adsorbing so can suppress taking back of electronic unit, realizes the raising of reliable in action.
In addition, because when not carrying out installation action control, obtain by the malleation feed unit and become release required time till the target release pressure, to make a mistake and identify this for the first time when installation action be the electronic unit of taking back that is easy to generate electronic unit so be different from, thereby implement the situation of countermeasure, even each electronic unit is not identified under the situation that is easy to generate the characteristic of taking back the operating personnel, also can automatically avoid the installation action taken back, and reduce wrong generation more.
In addition, do not need the operating personnel whether to be easy to generate and take back and set the input operation, can eliminate miscellaneous property of setting operation at each electronic unit.
And, owing to discharge the measurement that required time is obtained the release required time in the control, be after the parts receiving position of parts supply unit carries out, adsorption mouth is risen, even so under the situation of the measurement that discharges required time, electronic unit can not be removed from the parts supply unit, its result, can avoid that the electricity wasting subassembly can be realized the raising of economy for the measurement that discharges required time.
In addition, so-called " target release pressure " is to be used to make the electronic unit that is adsorbed from the pressure that adsorption mouth breaks away from, the pressure in the scope till being preferably from atmospheric pressure to the malleation critical value.In addition, so-called malleation critical value is meant when electronic unit breaks away from, and does not make this electronic unit or is installed in the pressure of electronic unit on every side because of the degree of jet occurrence positions skew.
In addition, in technical scheme 3, for example in installation data etc., set respectively under the situation of " target release pressure " at each electronic unit, measurement reaches the absorption required time till the target release pressure of each electronic unit, with electronic unit irrespectively under the situation of " the target release pressure " of setting general-purpose, at each electronic unit, measure the release required time till the target release pressure reach identical.
In the invention of technical scheme 4 records, obtain control unit owing to utilize the release required time, from making the state that becomes the target adsorptive pressure in the adsorption mouth in order to obtain the measurement that control unit adsorbs required time by described absorption required time, supply with the action control that execution becomes the target release pressure by the malleation of malleation feed unit, measure and discharge required time, so the absorption required time is obtained the measurement of the absorption required time of control unit, with discharge required time and obtain the measurement of the release required time of control unit, in a series of control, carry out, with adsorb required time respectively and obtain making of control unit and become negative pressure feeding action till the target adsorptive pressure in the adsorption mouth, with discharge required time and obtain making of control unit and become in the adsorption mouth situation of the negative pressure feeding action till the target adsorptive pressure and compare, can shorten the absorption required time significantly and discharge needed time of obtaining of required time.
In the invention of technical scheme 5 records, discharge required time and obtain control unit, become the state of target adsorptive pressure in the adsorption mouth, make the malleation of malleation feed unit supply with unit interval with regulation and change and carry out retry, obtaining becomes the release of target release pressure required time.Discharge the measurement of required time, also can the detected pressures of pressure sensing cell be monitored, measurement begins to the time that reaches till the target release pressure from the supply of malleation, but under the situation of carrying out actual malleation supply by action control and stopping, be easy to generate the time difference, even control according to Measuring Time, the value that neither measure of the interior pressure of adsorption mouth sometimes.Therefore, implement if adopt by actual set release required time, and carry out the method whether adsorption mouth becomes the retry of target adsorptive pressure repeatedly, then because the needed time is controlled in the action that stops from being supplied to of malleation is reflected in and discharges the required time, so from just comprising at first the influence of time difference, therefore, can be discharged required time accurately.
Thus, can measure the release required time more accurately, more effectively prevent taking back of electronic unit, and, the offset of other electronic units in the time of can preventing installation action.
In the invention of technical scheme 6 records, owing to obtain release back stand-by time by discharging required time affirmation control unit, and, action control unit, from making adsorption mouth become the state of target release pressure by adsorbing to discharge, wait for through after the stand-by time, adsorption mouth is risen, so can prevent taking back of electronic unit more reliably.
Description of drawings
Fig. 1 is the vertical view of the integral body of the related electronic component mounting apparatus of expression present embodiment.
Fig. 2 is the block diagram of the control system of expression electronic component mounting apparatus.
Fig. 3 is the front view of the boarded head of electronic component mounting apparatus.
Fig. 4 is the flow chart that the absorption required time is obtained control.
Fig. 5 is that expression is from switching the switching with electromagnetically operated valve, the line chart of the state that the pressure in the adsorption mouth changes.
Fig. 6 discharges the flow chart that required time is obtained control.
Fig. 7 is under the situation of the internal pressure that the is illustrated in adsorption mouth target adsorptive pressure that is in three phases, makes switching carry out switching controls with electromagnetically operated valve and carries out the line chart of the state that the pressure in the adsorption mouth under the situation that malleation supplies with changes with the predetermined stand-by period.
Fig. 8 discharges the flow chart that required time is confirmed control.
Fig. 9 is the flow chart of electronic unit installation and control.
Embodiment
(working of an invention mode)
Based on Fig. 1 to Fig. 9, embodiments of the present invention are described.Below, as shown shown in,
To in horizontal plane, be made as X-direction and Y direction respectively by orthogonal both direction.
In addition, will be made as Z-direction with the vertical of their quadratures.
Electronic component mounting apparatus 100 has as shown in Figure 1: the first parts supply unit 102, and it will be supplied with as a plurality of electronic unit feed appliances 101 of the electronic unit of mounting object and arrange and maintenance along X-direction; The second parts supply unit 104, its configuration are used for the pallet 103 of the various electronic units of mounting; Substrate supply unit 108, it is along the X-direction conveying substrate; Substrate maintaining part (not shown), it is arranged on the substrate transport path of this substrate supply unit 108, is used to carry out the electro part carrying operation with respect to substrate K; Boarded head 106, it liftably keeps a plurality of, 6 adsorption mouth 105 for example, carries out the maintenance of electronic unit T; As the X-Y portal frame 107 of boarded head travel mechanism, it drives conveying with boarded head 106 to comprising 2 parts supply units 102,104 and the substrate maintaining part optional position in interior operating area; Pedestal 114, it carries and supports above-mentioned each structure; Pneumatics loop 120, it becomes less than atmospheric atmospheric pressure state (negative pressure) with more than or equal to atmospheric atmospheric pressure state (malleation) each adsorption mouth 105; And action control unit 10, it carries out the action control of above-mentioned each structure.
The action control unit 10 of above-mentioned electronic component mounting apparatus 100, preserve the installation data of the record various setting contents relevant with the installation of electronic unit, from above-mentioned installation data, read electronic unit that expression should install and the parts receiving position of position and the data of the installation site on the substrate etc. are set based on the electronic unit feed appliance 101 of electronic unit.In addition, 10 pairs of X-Y portal frames 107 of above-mentioned action control unit are controlled, boarded head 106 is carried to the receiving position and the installation site of electronic unit, boarded head 106 is controlled, carry out the lifting action and the absorption-release movement of adsorption mouth 105 in the position.In addition, above-mentioned action control unit 10 in the conveying of boarded head 106, is used component recognition apparatus 113 described later, the angle of the position of the electronic unit when adsorbing and adsorption mouth rotation detects, and action controls such as executing location correction and angular adjustment.
(substrate supply unit and substrate maintaining part)
Substrate supply unit 108 has not shown conveyer belt, utilizes this conveyer belt that substrate K is carried along X-direction.
In addition, as noted above, on the substrate transport path of substrate supply unit 108, the shown position of the substrate K in Fig. 1 is the job position place, is provided with to be used for electronic unit is being fixed the substrate maintaining part that keeps to substrate K when substrate K carries.Substrate supply unit 108 is delivered to the substrate maintaining part with substrate K and stops, and utilizes not shown maintaining body to carry out the maintenance of substrate K.That is, be held at substrate K under the state of mechanism's maintenance, carry out stable electro part carrying operation.
(first and second parts supply unit)
The first parts supply unit 102 is arranged on Y direction one end of pedestal 114, is the zone along X-direction that a plurality of electronic unit feed appliances 101 arrangements can be carried.Upper surface in the par of the first parts supply unit 102, a plurality of electronic unit feed appliances 101 are arranged and mounting is installed along X-direction.In addition, on each electronic unit feed appliance 101, latching mechanism is set, by the operation of latching mechanism, can be on the first parts supply unit attaching/detaching.
Above-mentioned electronic unit feed appliance 101 maintains tep reel (omitting diagram) in the rearward end side, it is reeled the accommodate band of electronic unit all uniformly-spaced to enclose in a large number, and, near leading section, as noted above, have the transport unit 101a that transmits electronic unit to boarded head 106.
When the installation action of electronic unit, boarded head 106 is positioned at adsorption mouth 105 on the transport unit 101a as the electronic unit feed appliance 101 that carries object, carries out the transmission of electronic unit.
The second parts supply unit 104, on pedestal 114, be arranged on along Y direction across substrate supply unit 108 and with the end of the first parts supply unit, 102 opposite sides on.
The pallet that is configured on this second parts supply unit 104 has a plurality of recesses, alignment arrangements electronic unit in each recess.
In addition, when the installation action of electronic unit, boarded head 106 is positioned at the recess place that stores as the electronic unit that carries object with adsorption mouth 105, carries out the transmission of electronic unit.
(X-Y portal frame)
X-Y portal frame 107 has: X-axis guide rail 107a, and it moves along X-direction guiding boarded head 106; Two Y-axis guide rail 107b, it guides with this X-axis guide rail 107a boarded head 106 along Y direction; As the X-axis motor 109 of drive source, it makes boarded head 106 move along X-direction; And as the Y-axis motor 110 of drive source, it is via X-axis guide rail 107a, and boarded head 106 is moved along Y direction.
In addition, by the driving of each motor 109,110, the roughly whole zone of boarded head 106 between two Y-axis guide rail 107b can be carried.
In addition, each motor 109,110 is moved control unit 10 identifications by making separately rotation amount, is controlled to the rotation amount into expectation, carries out the location of adsorption mouth 105 thus via boarded head 106.
In addition, according to the needs of electronic unit installation exercise, above-mentioned first and second parts supply unit 102,104, substrate maintaining part all are configured in the zone of the boarded head carried 106 of X-Y portal frame 107.
In addition, in this zone that can carry, be provided with and produce the discarded discarded case 116 of electronic unit of bad grade.
(boarded head)
Fig. 3 is the front view from the boarded head of observing along the sight line of Y direction 106.Be provided with at boarded head 106: six adsorption mouth 105, utilize air to attract to keep electronic unit T at its leading section; Six Z axle motor 111 (only in Fig. 2, illustrating), it makes each adsorption mouth 105 respectively along the Z-direction lifting; Six turning motors 112, it is used to make each adsorption mouth 105 to rotate respectively, around Z-direction the electronic unit that is kept is carried out angular adjustment; Mark identification camera 115, it is used for the mark of substrate K is taken, thus the identification substrate position; And component recognition apparatus 113, it detects with respect to the position of adsorption mouth leading section and the angle of Z axle rotation the electronic unit that is adsorbed on each adsorption mouth 105.In addition, in Fig. 2,, but in fact, each motor 111,112 is set at each adsorption mouth 105 of carrying on boarded head 106 only to an adsorption mouth 105 each motor 111,112 of diagram.
Above-mentioned each adsorption mouth 105 is with the state along Z-direction, and liftable and rotatably being supported on the boarded head 106 can carry out the reception or the installation of electronic unit by lifting, and the angular adjustment of carrying out electronic unit by rotation.
In addition, component recognition apparatus 113, from arrange a plurality of light sources that are provided with along X-direction, carry out laser radiation along Y direction to the electronic unit of the front end of adsorption mouth 105, by receiving its reverberation, according to obtaining reverberation in which scope on X-direction, can discern the position and the angle of the electronic unit of adsorption mouth front end.
In addition, this component recognition apparatus 113 can be according to having or not this reverberation, and whether the attract electrons parts detect to the leading section in adsorption mouth 105, work as " parts absorption detecting unit ".
(pneumatics loop)
Pneumatics loop 120 has: positive pressure source 121, and it produces the pneumatics of malleation; Negative pressure generation device 122, it utilizes the air miscarriage of positive pressure source to give birth to negative pressure; Decompressor 123, it is made of the electric air conditioner that the malleation that produces from positive pressure source 121 is reduced pressure and be adjusted to authorized pressure; Switch with electromagnetically operated valve 124, its switching is supplied with to each adsorption mouth 105 from the negative pressure of negative pressure generation device 122 generations and the malleation of exporting from decompressor 123; And pressure sensing cell 125, its internal pressure to each adsorption mouth 105 detects.
Above-mentioned positive pressure source 121 and decompressor 123 work as the malleation feed unit that applies malleation to adsorption mouth 105, and above-mentioned negative pressure generation device 122 works as the negative pressure feeding unit that applies negative pressure to adsorption mouth 105.
Above-mentioned switching with electromagnetically operated valve 124 can switch to negative pressure feeding state, malleation supply condition, with these three positions of loop closing state, this change action is controlled by action control unit 10.By said structure, when the absorption of electronic unit is carried out in adsorption mouth 105 in pneumatics loop 120, make to switch and carry out switching controls with electromagnetically operated valve 124, so that negative pressure generation device 122 is connected with adsorption mouth 105, carries out the supply of negative pressure and become adsorbable state.
In addition, when the adsorbed state from the electronic unit of adsorption mouth 105 discharges, switch and carry out switching controls,, carry out the supply of malleation and electronic unit is discharged so that decompressor 123 is connected with adsorption mouth 105 with electromagnetically operated valve 124.
In addition, omit the diagram in pneumatics loop 120, but in fact, a plurality of adsorption mouth 105 are prepared pneumatics loop 120 respectively.
(action control unit)
As shown in Figure 2, action control unit 10 mainly has: CPU 30, its control program is according to the rules carried out various processing and control to the switching in X-axis motor 109, the Y-axis motor 110 of X-Y portal frame 107, the Z axle motor 111 that carries out the lifting of adsorption mouth 105 on boarded head 106, the turning motor 112 that carries out the rotation of adsorption mouth 105, pneumatics loop 120 with electromagnetically operated valve 124, pressure sensing cell 125, component recognition apparatus 113 and mark identification camera 115; System ROM 12, and its storage is used to carry out the program of various processing and control; RAM 13, and it becomes the operating area of various processing by store various kinds of data; I/F (interface) 14, its realization CPU 30 is connected with various device; Nonvolatile memory devices 17, its storage is controlled required installation data and other set informations etc. to installation actions such as the tabulation of the electronic unit of substrate installation, the installation site of each electronic unit, the receiving positions of electronic unit; Guidance panel 15, the input that it is used to carry out various settings or operates required data; And display 18, it carries out prompting of various setting contents and necessary information etc.In addition, above-mentioned each motor 109~112 all is the servomotors with encoder, is connected with I/F 14 via not shown servo-driver.
Above-mentioned CPU 30, when the installation exercise of electronic unit, read in installation data from storage device 17, from this installation data, obtain the tabulation, the receiving position of each electronic unit and the information of installation site that become with respect to the various electronic units of the mounting object of substrate.
Then, 30 pairs of X-axis of CPU and Y-axis motor 109,110 are controlled, boarded head 106 is carried to the receiving position of this electronic unit, Z axle motor is controlled, adsorption mouth 105 is descended, the attract electrons parts rise adsorption mouth 105, then boarded head 106 are delivered to the installation site.
In addition, CPU 30 uses parts gesture recognition unit in the conveying of installation site, carries out adsorbed electronic unit with respect to the position of adsorption mouth and the detection of the adsorption mouth anglec of rotation, and turning motor 112 is controlled, and carries out angle correct.In addition, with boarded head 106 when locate the installation site, consider that electronic unit proofreaies and correct with respect to the position of adsorption mouth.
Then, utilize Z axle motor that adsorption mouth 105 is descended, finish the installation of electronic unit.
All electronic units that CPU 30 subtend substrates carry are carried out above-mentioned action repeatedly.
In addition, CPU 30 is according to the various programs that are stored among the ROM of system 12, adsorb required time and obtain control, discharge required time and obtain control, discharge required time and confirm control, to obtain the relevant important setting information of absorption action in the installation with electronic unit.Below, describe these control in detail.
(the absorption required time is obtained control)
The absorption required time is obtained control, it is the processing that CPU 30 carries out according to the program in the ROM of system 12, for example carry out following processing: after the main power source of device rigidly connects logical back or just obtained new installation data, wait when not carrying out installation action and controlling, at each electronic unit that becomes mounting object in the installation data, the transport unit 101a (the perhaps recess of pallet 103) that adsorption mouth 105 is positioned at electronic unit feed appliance 101 locates, in this position, make adsorption mouth 105 drop to the absorption height, carry out negative pressure feeding by switching solenoid valve 124, under the state of attract electrons parts, CPU 30 monitor pressures detecting units 125, measurement arrives the absorption required time till the target adsorptive pressure that adsorbs.
In addition, this processing is carried out all electronic units of each the parts supply unit 102,104 that becomes mounting object in the installation data, and the absorption required time of each electronic unit is stored in the storage device 17.
In addition, the target adsorptive pressure of above-mentioned absorption is the pressure that can make adsorption mouth 105 risings that are adsorbed with electronic unit, can carry out setting value by guidance panel 15.
In this example, example shows for electronic unit, and the target adsorptive pressure is set at the situation of general fiducial value, but for example, also can be at each electronic unit, and the stability when considering to depend on the absorption of its weight, shape etc., and set respectively.
Fig. 4 is the flow chart that the absorption required time is obtained control.According to this figure, illustrate that adsorbing required time obtains control.
At first, 30 pairs of X-axis motor 109 of CPU and Y-axis motor 110 are controlled, with with certain adsorption mouth 105 on the boarded head 106, the transport unit 101a (the perhaps recess of pallet 103) that is positioned at as the electronic unit feed appliance 101 of the electronic unit of object locates (step S1).
Then,, make adsorption mouth 105 drop to the absorption height (step S2) of electronic unit,, in adsorption mouth 105, carry out negative pressure feeding (step S3) by the switching of switching solenoid valve 124 by the driving of Z axle motor 111.Thus, the electronic unit in the transport unit 101a of electronic unit feed appliance 101 (the perhaps recess of pallet 103) is adsorbed mouth 105 absorption.
Then, with negative pressure feeding side by side, the output of CPU 30 monitor pressures detecting units 125 was measured the time that reaches till the target adsorptive pressure, obtained absorption required time (step S4).
The line chart of the state of the pressure variation in Fig. 5 adsorption mouth 105 that to be expression begin from the switching of switching with electromagnetically operated valve 124.Curve A is represented the common electronic unit that escape of air is less, and curve B represents to leak more electronic unit.In addition, in this line chart, expression air pressure in longitudinal axis top reduces, longitudinal axis below expression pressure rises.
As shown, if under the state of the upper surface butt of the leading section of adsorption mouth 105 and each electronic unit, begin negative pressure feeding, then under the situation of electronic unit arbitrarily, all after switch switching timing with electromagnetically operated valve 124 and produce some delays, produce the reduction of adsorption mouth internal pressure, under the situation of the electronic unit that escape of air is arranged, shown in curve B, the slope that reduces of this pressure slows down as can be known, and the time (absorption required time) that reaches till the target adsorptive pressure is elongated.
And, after reaching the target adsorptive pressure, stop negative pressure feeding (step S5) by the action of switching with electromagnetically operated valve 124, then, switch to malleation supply (step S6) by the action of switching with electromagnetically operated valve 124.Then, supply with, then will switch with electromagnetically operated valve 124 and close and stop malleation supply (step S7) if carry out malleation with the predefined time.Thus, the inside of adsorption mouth 105 returns to atmospheric pressure, and electronic unit is released from adsorbed state.Under above-mentioned state, Z axle motor 111 is controlled, so that adsorption mouth 105 rises to standby height (step S8), obtain control for the absorption required time of an electronic unit and finish.
In addition, above-mentioned absorption required time is obtained control and is carried out repeatedly, till all electronic units of preparing in to electronic component mounting apparatus 100 are all finished.
CPU 30 works as " the absorption required time is obtained control unit " by carrying out above-mentioned control.
(discharge required time and obtain control)
Discharging required time and obtain control, is the processing that CPU 30 carries out according to the program in the ROM of system 12.For example carry out following processing: after the main power source of device rigidly connects logical back or just obtained new installation data, wait when not carrying out installation action and controlling, at each electronic unit that becomes mounting object in the installation data, the transport unit 101a (the perhaps recess of pallet 103) that adsorption mouth 105 is positioned at electronic unit feed appliance 101 locates, in this position, utilize adsorption mouth 105 attract electrons parts, the target adsorptive pressure will be made as in the adsorption mouth, begin the supply of malleation from above-mentioned state, measure the release required time till returning to the target release pressure.
In addition, this processing is carried out all electronic units of each the parts supply unit 102,104 that becomes mounting object in the installation data, and the release required time of each electronic unit is stored in the storage device 17.
In Fig. 6, illustrate that discharging required time obtains control.
At first, 30 pairs of X-axis motor 109 of CPU and Y-axis motor 110 are controlled, a certain adsorption mouth 105 on the boarded head 106 is positioned at as the transport unit 101a of the electronic unit feed appliance 101 of the electronic unit of object or the recess place (step S31) of pallet 103.
Then,, make adsorption mouth 105 drop to the absorption height (step S32) of electronic unit, then,, in adsorption mouth 105, carry out negative pressure feeding (step S33) by the switching of switching solenoid valve 124 by the driving of Z axle motor 111.Thus, the electronic unit in the recess of the transport unit 101a of electronic unit feed appliance 101 or pallet 103 is adsorbed mouth 105 absorption.
Then, with negative pressure feeding side by side, the output (step S34) of CPU 30 monitor pressures detecting units 125 reaches the timing of target adsorptive pressure in adsorption mouth 105, utilize to switch to stop negative pressure feeding (step S35) with electromagnetically operated valve 124.
In addition, under the situation that obtains the absorption required time, also can be in step S34, the monitor pressures detecting unit 125, and after waiting for through the absorption required time, stop negative pressure feeding in step S35.
Then, 30 couples of CPU supply with the time (release required time) that the inside that makes adsorption mouth 105 reaches till the target release pressure by malleation and measure.
Also can carry out timing in the above-mentioned measurement to beginning to be supplied to the elapsed time that pressure sensing cell 125 expression reached till the target release pressure from malleation, if but after wait detects the target release pressure by pressure sensing cell 125, switch switching, then sometimes owing to its response postpones with electromagnetically operated valve 124.
Therefore, obtain in the control at this release required time, control with electromagnetically operated valve 124 switching, so that at first, the state that reaches the target adsorptive pressure in the adsorption mouth 105 begins through predetermined time n[ms] after carry out malleation and supply with, its result, according to the detected pressures in the adsorption mouth 105 that obtains, judge that initial malleation service time n is long or too short, judge accordingly with this, on malleation service time n, add or deduct the unit interval of regulation, retry repeatedly, the best malleation service time that will be in adsorption mouth 105 boosts in the scope of atmospheric pressure till the malleation critical value (with this scope as " target release pressure ") is obtained as discharging required time.
In addition, the initial value of malleation service time n can utilize guidance panel 15 at random to set.In addition, the malleation critical value also can utilize guidance panel 15 at random to set, but must be set at more than or equal to atmospheric pressure, and does not make the electronic unit of installation because of air stream and be installed in the scope of its electronic unit generation offset on every side.
Fig. 7 is under the situation of the internal pressure that the is illustrated in adsorption mouth 105 target adsorptive pressure that is in three phases, switches with electromagnetically operated valve 124 to carry out switching controls and carry out the line chart of the state of the adsorption mouth 105 internal pressures variation under the situation that malleation supplies with predetermined stand-by period n.
Curve C is represented to change from the pressure that the target adsorptive pressure of negative pressure begins to apply under the situation of malleation, in the case, supplies with even carry out malleation with malleation service time n, also can not reach atmospheric pressure, and electronic unit can not be released from adsorption mouth 105.
In addition, curve D is represented to change from compare the pressure that becomes slightly under the situation that the target of malleation adsorptive pressure begins to apply malleation with C, in the case, if carrying out malleation with malleation service time n supplies with, then can reach atmospheric pressure, and be no more than the critical value of malleation, can carry out good adsorption and discharge.
In addition, curve E represents to change from compare the pressure that further becomes under the situation that the target of malleation adsorptive pressure begins to apply malleation with D, in the case, if carrying out malleation with malleation service time n supplies with, then can surpass atmospheric pressure, and surpass the critical value of malleation, electronic unit is discharged, but owing to may produce on every side jet, so electronic unit and near electronic unit thereof may be blown away.
As noted above, determine best malleation service time n accordingly with the target adsorptive pressure, obtain in the control discharging required time, malleation service time n is changed successively and explore optimum value.
Specifically, the supply of malleation begins (step S36), through behind the malleation service time n (step S37), by switching the control with electromagnetically operated valve 124, stops the supply (step S38) of malleation.Then, whether the adsorption mouth 105 interior detected pressures of judging the pressure sensing cell 125 of this moment are negative pressure (step S39), under the situation of negative pressure, think malleation service time deficiency, to on n, add 1[ms] and the value that obtains as new stand-by period (step S40), make to handle and return step S33.
Then, supply with negative pressure once more, till becoming the target adsorptive pressure after, with new malleation service time n[ms] supply with malleation, whether the internal pressure of judging adsorption mouth 105 is negative pressure (step S33~S39).The circulation of this step S33~S40 is carried out repeatedly, till the internal pressure of adsorption mouth 105 is more than or equal to atmospheric pressure.
In addition, in step S39, detect adsorption mouth 105 pressure inside, whether this internal pressure is judged (step S41) less than above-mentioned malleation critical value not under the situation of negative pressure.
Its result under the situation more than or equal to the malleation critical value, thinks that the malleation service time is long, will deduct 1[ms from n] and the value that obtains is set (step S42) as new malleation service time, makes to handle to return step S33.
Then, supply with negative pressure once more, till becoming the target adsorptive pressure after, with new malleation service time n[ms] supply with malleation, judge whether the internal pressure of adsorption mouth 105 is negative pressure, perhaps whether be not greater than or equal to malleation critical value (step S33~S41).The circulation of this step S33~S42 is carried out repeatedly, until the malleation critical value less than adsorption mouth 105.
By carrying out above-mentioned retry repeatedly, can obtain supplying with and make in the adsorption mouth 105 more than or equal to atmospheric pressure and less than the malleation service time of malleation critical value by malleation, it is obtained as discharging required time.
Thus, the inside of adsorption mouth 105 becomes the target release pressure, and electronic unit is released from adsorbed state.Under above-mentioned state, Z axle motor 111 is controlled, so that adsorption mouth 105 rises to standby height (step S43), the release required time of an electronic unit is obtained control finish.In addition, above-mentioned release required time is obtained control and is carried out repeatedly, till all electronic units of preparing in to electronic component mounting apparatus 100 are all finished.
CPU 30 works as " discharge required time and obtain control unit " by carrying out above-mentioned control.
(discharge required time and confirm control)
Discharge required time and confirm that control is the processing that CPU 30 carries out according to the programs in the ROM of system 12, when not carrying out installation action control and above-mentioned release required time obtain and carry out after control is carried out.
Discharging required time at this confirms in the control, for each electronic unit that becomes mounting object in the installation data, locate to adsorb at the transport unit 101a of electronic unit feed appliance 101 (the perhaps recess of pallet 103), and adsorption mouth 105 is risen, move and standby above discarded case 116 by boarded head, carry out the malleation supply to obtain the release required time of obtaining in the control release time, and, after stand-by time through regulation, utilize component recognition apparatus 113, whether exist electronic unit to judge leading section in adsorption mouth 105.
Then, adsorbing at the leading section that detects adsorption mouth 105 under the situation of electronic unit, unit interval with regulation is carried out add operation to stand-by time, utilize the target adsorptive pressure to adsorb once more, adsorb release to discharge required time, and carry out the detection of electronic unit, stand-by time was prolonged with the unit interval, retry repeatedly is till confirming that electronic unit does not exist.
Thus, can obtain the malleation that is used to adsorb release supply with after stopping, the stand-by time till electronic unit separates from adsorption mouth 105.
In addition, this processing is carried out all electronic units of each the parts supply unit 102,104 that becomes mounting object in the installation data, and the stand-by time of each electronic unit is stored in the storage device 17.
In addition, discharging required time at this confirms in the control, because each electronic unit is consumed one, do not discharge required time and obtain the execution of control and necessarily carry out this releases required time and confirm to control so be not set to be accompanied by, for example can only at random carry out in the following cases, that is,, also produce under the situation about taking back of electronic unit based on when discharging required time and obtain release required time that control obtains and carry out the installation action of electronic unit.
In Fig. 8, illustrate that discharging required time confirms control.
At first, 30 pairs of X-axis motor 109 of CPU and Y-axis motor 110 are controlled, and locate (step S61) with the transport unit 101a (the perhaps recess of pallet 103) that certain adsorption mouth 105 on the boarded head 106 is positioned at as the electronic unit feed appliance 101 of the electronic unit of object.
Then,, make adsorption mouth 105 drop to the absorption height (step S62) of electronic unit,, in adsorption mouth 105, carry out negative pressure feeding (step S63) by the switching of switching solenoid valve 124 by the driving of Z axle motor 111.Thus, the electronic unit in the recess of the transport unit 101a of electronic unit feed appliance 101 or pallet 103 is adsorbed mouth 105 absorption.
Then, with negative pressure feeding side by side, the output (step S64) of CPU 30 monitor pressures detecting units 125, driving by Z axle motor 11, adsorption mouth 105 is risen (step S65),, boarded head 106 is moved to discarded case 116 places (step S66) by the driving of X, Y-axis motor 109,110, by the driving of Z axle motor 111, make adsorption mouth 105 drop to discarded height (step S67) once more.
Then, during these action controls,, then stop negative pressure feeding (step S68) if adsorption mouth 105 inside reach the target adsorptive pressure.In addition, under the situation that is obtaining the absorption required time, also can be in step S64 monitor pressures detecting unit 125 not, but the timing that begins to adsorb required time in step S68, waits for through behind the absorption required time, and the supply of negative pressure is stopped.
Then, above discarded case 116, the supply (step S69) of beginning malleation waiting for through by (step S70) after discharging required time to obtain the release required time that control obtains, stops the supply (step S71) of malleation.
Then,, carry out negative pressure feeding (step S73), make adsorption mouth 105 rise to the identification height (step S74) of the component recognition apparatus 113 of lift-launch on boarded head 105 being supplied to wait through (step S72) behind the initial stand-by time m from stopping malleation.
Then, utilizing the result after component recognition apparatus 113 detects to be, even carried out the malleation supply, also detecting electronic unit is adsorbed under the situation of leading section of adsorption mouth 105 (step S75), think the stand-by time deficiency, to on m, add 1[ms] and the value that obtains as new stand-by time (step S76), make to handle and return step S67.Then, supply with negative pressure once more, after becoming the target adsorptive pressure, stop negative pressure feeding, and, supply with malleation to discharge required time, after stopping, after with new stand-by time m standby, judge whether electronic unit exists (step S67~S75).The circulation of this step S67~S76 is carried out repeatedly, until confirming that electronic unit does not exist.
Then, in step S75, there is not electronic unit in the front end that detects adsorption mouth 105 and under the situation about having fallen, the stand-by time m that finally obtains is stored in the storage device 17 end process.
In addition, above-mentioned release required time is confirmed control execution repeatedly, till all electronic units of preparing in to electronic component mounting apparatus 100 are all finished.
CPU 30 works as " discharge required time and confirm control unit " by carrying out above-mentioned control.
(control of electronic unit installation action)
Below, based on the flow chart of Fig. 9, the installation action control of the electronic unit that CPU 30 carries out according to the program that is stored among the ROM of system 12 is described.
At first, 30 pairs of X-axis motor 109 of CPU and Y-axis motor 110 are controlled, and locate (step S101) with the transport unit 101a (the perhaps recess of pallet 103) that certain adsorption mouth 105 on the boarded head 106 is positioned at as the electronic unit feed appliance 101 of the electronic unit of object.
Then,, make adsorption mouth 105 drop to the absorption height (step S102) of electronic unit,, in adsorption mouth 105, carry out negative pressure feeding (step S103) by the switching of switching solenoid valve 124 by the driving of Z axle motor 111.Thus, the electronic unit in the transport unit 101a of electronic unit feed appliance 101 (the perhaps recess of pallet 103) is adsorbed mouth 105 absorption.
Then, with negative pressure feeding side by side, 30 couples of CPU absorption required time carries out timing (step S104), through obtained the timing of the absorption required time that control obtains by the absorption required time, utilizes to switch stopping negative pressure feeding (step S105) with electromagnetically operated valve 124.
Then, driving by Z axle motor 111, make adsorption mouth 105 rise to delivery head (step S106), X-axis motor 109 and Y-axis motor 110 are controlled, the adsorption mouth 105 of boarded head 106 is positioned at the installation site (step S107) of substrate K.
Then, by the driving of Z axle motor 111, make adsorption mouth 105 drop to setting height(from bottom) (step S108).
Then, the beginning malleation is supplied with (step S109), waiting for through by (step S110) after discharging required time to obtain the release required time that control obtains, stops the supply (step S111) of malleation.
In addition, after the malleation supply stops, waiting for through confirming to control the stand-by time (step S112) that obtains by discharging required time, then, by the driving of Z axle motor 111, make adsorption mouth 105 rise to delivery head (step S106), to the installation action control end of an electronic unit.
In addition, to becoming all electronic units of mounting object, carry out processing repeatedly from above-mentioned S101 to S113.
(effect of execution mode)
In above-mentioned electronic component mounting apparatus 100, owing to obtain control by the absorption required time, at each electronic unit, obtain and become the absorption of target adsorptive pressure required time in the adsorption mouth 105, when installation action is controlled, according to the absorption required time of obtaining, continue absorption, so reaching under the state of suitable target adsorptive pressure, carry out the rising of adsorption mouth 105 and move, error in the time of can suppressing to adsorb, falling of electronic unit in moving, generation with respect to the offset of adsorption mouth front end etc. realizes the reliability of action and the raising of installation site precision.
In addition, obtain control owing to outside installation action, implement the absorption required time individually, so by for example implementing to adsorb required time in the past and obtained control carrying out installation action, therefore be different from following situation, promptly, making a mistake and identify this for the first time when installation action is the electronic unit that is easy to generate the escape of air of electronic unit, thereby implement to leak the situation of countermeasure, thereby, even each electronic unit is not carried out under the situation of leakage characteristics identification the operating personnel, also can be automatically with leakage characteristics accordingly, carry out installation action, and reduce wrong generation more.
In addition, owing to obtain the execution of control by the absorption required time, to adsorb required time at each electronic unit and automatically be stored in the storage device 17,, can eliminate miscellaneous property of setting operation so do not need the operating personnel that the leakage characteristics of each electronic unit is set the input operation.
In addition, because the absorption required time is obtained the measurement of the absorption required time in the control, be in the recess of the transport unit 101a of electronic unit feed appliance 101 or pallet 103, to carry out, and, after measurement, supply with malleation, after the absorption of carrying out electronic unit discharges, adsorption mouth 105 is risen, so electronic unit can not be raised, therefore, obtain in the control at the absorption required time at least, can not produce discarding of electronic unit etc., can prevent the waste of electronic unit, realize the raising of economy.
In addition, owing to obtain the execution of control by discharging required time, can be at each electronic unit that becomes mounting object, obtaining the inside that makes adsorption mouth 105 becomes from atmospheric pressure release required time of (target release pressure) to the scope between the malleation critical value, so when installation action is controlled, according to the release required time of obtaining, the release of adsorbing thus, can discharge electronic unit more reliably, suppress taking back of electronic unit, can realize the raising of reliable in action.
In addition, because when not carrying out installation action control, carry out the release required time and obtain control, obtain control so for example before installation action, carry out the release required time in advance, therefore be different from following situation, promptly, making a mistake and identify this for the first time when installation action is the electronic unit of taking back that is easy to generate electronic unit, thereby implement the situation of countermeasure, thereby, even each electronic unit is not identified under the situation that is easy to generate the characteristic of taking back, also can automatically avoid the installation action taken back, and reduce wrong generation more the operating personnel.
In addition, because for discharging required time, also obtain control and the time automatically be stored in the storage device 17, do not take back and set the input operation, can eliminate miscellaneous property of setting operation so do not need the operating personnel whether to be easy to generate at each electronic unit at it.
In addition, owing to obtain in the control at above-mentioned release required time, make and discharge little by little variation of required time, retry repeatedly, obtain and make the adsorption mouth internal pressure become suitable release required time, so can under the state that comprises by the influence of switching the time difference that causes with electromagnetically operated valve 124, obtain the release required time, under the situation about in the action control of installing, implementing, also can reproduce identical result.
Therefore, can measure the release required time more accurately, more effectively prevent taking back of electronic unit, and, the offset of other electronic units in the time of can preventing installation action.
In addition, owing to confirm that by discharging required time control obtains stand-by time, and, when installation action, adsorbing by the supply of malleation on the basis of release, adsorption mouth 105 is risen during stand-by time, but make its standby, so can prevent taking back of electronic unit more reliably.
(other)
In addition, in above-mentioned action control unit 10, implement the absorption required time respectively and obtain control and discharge required time and obtain control, but also can be by a series of action control, and obtain absorption required time and release required time the two.
Promptly, owing to when discharging the obtaining of required time, must in adsorption mouth 105, carry out negative pressure feeding, after becoming the target adsorptive pressure, the beginning malleation is supplied with, and become suitable pressure, so also can in making adsorption mouth 105, become the target adsorptive pressure time, the service time of negative pressure is measured, obtain the absorption required time, then, carry out malleation with preset time and supply with, judge the processing in the scope that whether becomes the target release pressure in the adsorption mouth.
Be described more specifically, the negative pressure feeding of step S33 from Fig. 6 picks up counting when beginning, in step S34, monitor adsorption mouth pressure,, can obtain the absorption required time by measuring the time that in step S35, becomes till the target adsorptive pressure stops negative pressure feeding.After step S36 after, as noted above control obtained the release required time thus.In addition, because step S39 and S41 are the judgement of "Yes", and carry out under the situation of retry, processing for the later step S33~S35 that circulates for the second time, preferably do not carry out timing, but, control so that negative pressure feeding stops by supervision to pressure sensing cell 125.
As noted above, the absorption required time is obtained control and the release required time is obtained control by carrying out in a processing, can not need the absorption required time of Fig. 4 of carrying out separately to obtain control, shortening obtains the absorption required time and discharges the needed time of required time significantly.

Claims (6)

1. electronic component mounting apparatus, it has:
The substrate maintaining part, it keeps installing the substrate of electronic unit;
The parts supply unit, a plurality of described electronic unit that its supply will be installed;
Boarded head, it has liftable adsorption mouth, and this adsorption mouth is used to adsorb the electronic unit that carries to described substrate;
The negative pressure feeding unit, it applies negative pressure to described adsorption mouth;
The malleation feed unit, it applies malleation to described adsorption mouth;
Boarded head travel mechanism, it makes in the zone of described boarded head till comprising from described parts supply unit to described substrate maintaining part, running fix at random; And
Action control unit, it carries out the installation action control with respect to described substrate based on installation data,
It is characterized in that having:
Pressure sensing cell, it detects the internal pressure of described adsorption mouth; And
The absorption required time is obtained control unit, it is not when carrying out the control of described installation action, at described electronic unit, respectively at the parts receiving position of described parts supply unit, carry out the absorption action of described adsorption mouth by described negative pressure feeding unit, and, measure and store the absorption required time till the detected pressure of described pressure sensing cell reaches the target adsorptive pressure
Described action control unit, when the installation of electronic unit, according to obtaining the absorption required time that control unit is obtained by described absorption required time, by described negative pressure feeding unit each electronic unit is continued absorption after, described adsorption mouth is risen.
2. electronic component mounting apparatus according to claim 1 is characterized in that,
Described absorption required time is obtained control unit, after measuring described absorption required time, after the absorption of carrying out electronic unit by described malleation feed unit discharges, described adsorption mouth is risen.
3. electronic component mounting apparatus according to claim 1 and 2 is characterized in that,
Have the required time of release and obtain control module; It is not when carrying out described installation action control; For each electronic unit that becomes mounting object in the described installation data; Parts receiving position at described parts supply unit; Make the absorption action that becomes the target adsorptive pressure in the described adsorption mouth by described negative pressure feeding unit; And; Measure and store and make in the described adsorption mouth from described target adsorptive pressure until the release required time till becoming the target release pressure by described malleation feed unit
Described action control unit, when the installation of electronic unit, according to obtaining the release required time that control unit is obtained, after the absorption that continues to carry out each electronic unit by described malleation feed unit discharges, described adsorption mouth is risen by described release required time.
4. electronic component mounting apparatus according to claim 3 is characterized in that,
Described release required time is obtained control unit, obtain control unit from described absorption required time and make the state that becomes the target adsorptive pressure in the described adsorption mouth for the measurement of adsorbing required time, execution makes the action control that becomes the target release pressure in the described adsorption mouth by described malleation feed unit, thereby measures described release required time.
5. electronic component mounting apparatus according to claim 3 is characterized in that,
Described release required time is obtained control unit, become the state of target adsorptive pressure in the described adsorption mouth, carrying out malleation by described malleation feed unit with the release required time of predicting supplies with, in described adsorption mouth, do not become under the situation of target release pressure, the release required time that makes described prediction changes with unit interval of regulation and carries out above-mentioned action repeatedly, thereby obtains the described release required time that is used to become described target release pressure.
6. electronic component mounting apparatus according to claim 3 is characterized in that having:
Parts absorption detecting unit, it to whether being adsorbed with electronic unit on the described adsorption mouth detects; And
Discharge required time and confirm control unit, it makes becomes the target adsorptive pressure and the attract electrons parts in the described adsorption mouth, under the state that this adsorption mouth is risen, based on obtaining the release required time that control unit is obtained by described release required time, carry out malleation and supply with, and, after stopping to begin through the stand-by time of stipulating from this malleation supply, judge by described parts absorption detecting unit whether described electronic unit is released
Described release required time is confirmed control unit, by described stand-by time being changed with the unit interval of stipulating and carrying out above-mentioned action repeatedly, till described electronic unit is released, obtains suitable stand-by time thus, and,
Described action control unit is when the installation of electronic unit, according to described release required time, the absorption of carrying out each electronic unit by described malleation feed unit discharges, then, after through the stand-by time that obtains by described release required time affirmation control unit, described adsorption mouth is risen.
CN201010220217.5A 2009-07-06 2010-07-06 Electronic compound mounting device Active CN101945568B (en)

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CN105794333A (en) * 2013-10-21 2016-07-20 富士机械制造株式会社 Method for mounting an electronic-component onto a substrate and electronic-component mounting machine
CN105794333B (en) * 2013-10-21 2018-12-21 株式会社富士 The method and electronic components mounting machine that electronic component is installed on substrate
CN109315089A (en) * 2016-06-14 2019-02-05 株式会社富士 Electronic part mounting and electronic component separation method
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CN108430206B (en) * 2017-02-15 2021-08-13 松下知识产权经营株式会社 Component mounting device and component mounting method
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