CN101934637A - Thermal print head and preparation method thereof - Google Patents
Thermal print head and preparation method thereof Download PDFInfo
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- CN101934637A CN101934637A CN2009100166491A CN200910016649A CN101934637A CN 101934637 A CN101934637 A CN 101934637A CN 2009100166491 A CN2009100166491 A CN 2009100166491A CN 200910016649 A CN200910016649 A CN 200910016649A CN 101934637 A CN101934637 A CN 101934637A
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Abstract
The invention relates to the field of thermal printers, in particular to a thermal print head comprising a substrate made from an insulated material. A partial or full ground glaze layer is formed on the surface of the substrate, the surface of the ground glaze layer or the substrate is provided with a heating resistor body and an electrode lead, wherein the heating resistor body is powered through the electrode lead, and a protective layer covers at least one part of the heating resistor body and the electrode lead connected with the heating resistor body. The thermal print head is characterized in that the surface of the substrate is provided with the ground glaze layer comprising a lower glaze layer and an upper glaze layer which are evenly distributed with air bubbles and respectively made from glaze pulp with different softening point temperatures and high-temperature viscosities, the upper glaze layer is melted early than the lower glaze layer during sintering, and the melted upper glaze layer prevents gases generated during the sintering of lower glaze layer from emitting. In addition, the lower glaze layer adopts the glaze pulp with higher viscosity at a high temperature so that the gases in the lower glaze layer are hardly emitted during sintering, and the gases which are not emitted are kept and exist in the glaze layer in an air bubble mode. Accordingly, due to the existence of the air bubbles, the heat conductivity coefficient of the ground glaze layer is reduced, heat is prevented from transferring in the ground glaze layer, the energy loss is reduced and the energy-saving effect is achieved.
Description
Technical field
The present invention relates to the thermal printer field, at length say it is a kind of thermal printing head and production method thereof that can reduce thermal losses, save the printing energy.
Background technology
As everyone knows; generally speaking; the ceramic substrate of thermal printing head (thermal print head) uses the glaze slurry; adopt printing; the method of sintering (to call thick film in the following text) forms ground glaze layer on insulated substrate; on ground glaze layer and substrate, adopt methods such as thick film or spraying plating to form electrode cable; the heating resistor that on ground glaze layer, adopts modes such as thick film or spraying plating to form; the protective layer that adopts methods such as thick film or spraying plating to form on heating resistor and at least a portion and the electrode cable that heating resistor is connected; the coefficient of heat conduction of ground glaze layer material is far smaller than the coefficient of heat conduction of ceramic substrate; the heat that can delay the heating resistor generation is passed to the loss that ceramic substrate causes through ground glaze layer; for reducing thermal losses, need to increase the thickness of ground glaze layer usually.
Yet, adopt the thermal printing head of said structure, the heat that resistance heater produces scatters and disappears by ground glaze layer and remains the principal element of thermal printing head consume energy, when thermal printer adopts battery as driving power, above-mentioned thermal printing head is because energy dissipation is big, also can very fast decay for the electric weight of the battery of its power supply, cause energy dissipation, increased use cost.
Summary of the invention
The objective of the invention is provides a kind of new thermal printing head and production method thereof in order to solve the high technical deficiency of existing thermal printing head power consumption, to reduce the energy loss of thermal printing head, satisfies when battery-operated requirement to the printhead low energy consumption.
The present invention solves the technical scheme that above-mentioned technical deficiency adopts:
A kind of thermal printing head; comprise the substrate that insulating materials constitutes; substrate surface is formed with part or comprehensive ground glaze layer; ground glaze layer or substrate surface are provided with heating resistor and electrode cable; power to heating resistor by electrode cable; heating resistor and the electrode cable at least a portion that links to each other with heating resistor are coated with protective layer; it is characterized in that substrate surface is provided with the ground glaze layer that is formed by following glaze layer and glazing layer; be distributed with bubble in the ground glaze layer equably, to reduce the thermal conductivity factor of ground glaze layer.
The present invention only substrate under heating resistor is provided with the ground glaze layer that is formed by glaze layer and glazing layer down, reducing production costs,
Bubble of the present invention is evenly distributed on down in the glaze layer, passes to matrix with the heat that stops heating resistor to produce.
Production method of the present invention is:
1, adopt glaze layer under the silk screen print method printing on the insulated substrate, and carrying out drying, following glaze layer employing high softening-point, the glaze slurry that high temperature viscosity is high, following glaze layer can be located on the substrate of heating resistor bottom partly
2, adopt silk screen print method printing glazing layer on dried down glaze layer and insulated substrate, and carry out drying, glazing layer adopts and descends glaze layer low softening point, glaze slurry that high temperature viscosity is low relatively,
3, carry out sintering then, following glaze layer and glazing layer form ground glaze layer jointly behind oversintering, are distributed with bubble in the ground glaze layer equably, particularly descend the bubble in the glaze layer many, pass to matrix with the heat that stops heating resistor to produce better, also reduced the thermal conductivity factor of ground glaze layer
4, on ground glaze layer and insulated substrate, adopt modes such as thick film or spraying plating to form electrode cable and heating resistor
5, the protective layer that on heating resistor and at least a portion and electrode cable that heating resistor is connected, adopts methods such as thick film or spraying plating to form.
Glaze layer down of the present invention can be reached the effect of the interior many bubble of glaze layer down by add the diatomite or the materials such as aluminium oxide, silica of an amount of porous in glaze slurry 1.
The present invention is because following glaze layer is selected the softening point temperature glaze slurry different with high temperature viscosity respectively for use with glazing layer, glazing layer is melted prior to following glaze layer during sintering, the discharge of the gas that the glazing layer after the fusion has produced when having hindered time glaze layer sintering, in addition, the higher glaze slurry of viscosity when following glaze layer adopts high temperature, be not easy to be discharged from during gas sintered in the following glaze layer, the gas that can not be discharged from is stayed the interior form with bubble of glaze layer and is existed, like this, the existence of bubble has reduced the thermal conductivity factor of ground glaze layer, hinder the transmission of heat in ground glaze layer, reduced the loss of energy, reached energy-conservation effect.
Description of drawings
Accompanying drawing is a kind of structural representation of the present invention.
Mark among the figure: following glaze layer 10 glazing layer 20, insulated substrate 30, electrode cable 40, heating resistor 50. protective layer 60.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is further described:
As shown in the figure: a kind of thermal printing head; comprise the substrate 30 that insulating materials constitutes; substrate 30 surfaces are formed with part or comprehensive ground glaze layer; ground glaze layer or substrate 30 surfaces are provided with some electrode cables 40 and several heating resistors 50; electrode cable 40 is heating resistor 50 power supplies; the protective layer 60 that on the electrode cable 40 of heater resistive element 50 and at least a portion, adopts thick film or metallikon to form; the invention is characterized in that substrate 30 is provided with the ground glaze layer that is formed by following glaze layer 10 and glazing layer 20; be furnished with bubble in the glaze layer equably, with the thermal conductivity factor of further reduction ground glaze layer.
The present invention can be provided with the ground glaze layer that is formed by following glaze layer 10 and glazing layer 20 comprehensively on substrate 30, for reducing production costs, also only the substrate surface below heating resistor 50 is provided with glaze layer 10 down, printing glazing layer 20 on glaze layer and the substrate down then, bubble is evenly distributed on down in the glaze layer 10, pass to substrate with the heat that stops heating resistor to produce, also reduced the thermal conductivity factor of ground-coat enamel.
Production method of the present invention is:
One, adopt glaze layer 10 under the silk screen print method printing on the insulated substrate 30, and carrying out drying, following glaze layer 10 employing high softening-point, the glaze slurry that high temperature viscosity is high,
Two, adopt silk screen print method printing glazing layer 20 on dried down glaze layer 10 and insulated substrate 30, and carry out drying, glazing layer 20 adopts and descends glaze layer 10 low softening point, glaze slurry that high temperature viscosity is low relatively,
Three, carry out sintering then, down glaze layer 10 and the glazing layer 20 common ground glaze layers that form behind oversintering are distributed with bubble equably in the ground glaze layer, particularly descend the bubble in the glaze layer 10 many, pass to substrate with the heat that stops the heating resistor generation better,
Four, on ground glaze layer and insulated substrate 30, adopt modes such as thick film or spraying plating to form electrode cable 40 and heating resistor 50,
Five, the protective layer 60 that on heating resistor 50 and at least a portion and electrode cable that heating resistor 50 is connected, adopts methods such as thick film or spraying plating to form.
The present invention is because following glaze layer is selected the softening point temperature glaze slurry different with high temperature viscosity respectively for use with glazing layer, glazing layer is melted prior to following glaze layer during sintering, the discharge of the gas that the glazing layer after the fusion has produced when having hindered time glaze layer sintering, in addition, the higher glaze slurry of viscosity when following glaze layer adopts high temperature, be not easy to be discharged from during gas sintered in the following glaze layer, the gas that can not be discharged from is stayed the interior form with bubble of glaze layer and is existed, like this, the existence of bubble reduces the thermal conductivity factor of ground glaze layer, hinder the transmission of heat in ground glaze layer, reduced the loss of energy, reached energy-conservation effect.
Claims (5)
1. thermal printing head; comprise the substrate that insulating materials constitutes; substrate surface is formed with part or comprehensive ground glaze layer; ground glaze layer or substrate surface are provided with heating resistor and electrode cable; power to heating resistor by electrode cable; heating resistor and the electrode cable at least a portion that links to each other with heating resistor are coated with protective layer, it is characterized in that substrate surface is provided with the ground glaze layer that is made of following glaze layer and glazing layer, is distributed with bubble equably in the ground glaze layer.
2. a kind of thermal printing head according to claim 1 is characterized in that being provided with on the substrate under the heating resistor at least by following glaze layer.
3. a kind of thermal printing head according to claim 1 is characterized in that bubble is evenly distributed on down in the glaze layer.
4. the production method of a thermal printing head is characterized in that
One, adopt glaze layer under the silk screen print method printing on the insulated substrate, and carrying out drying,
Two, on dried glaze layer down and insulated substrate, adopt silk screen print method printing glazing layer, and carry out drying,
Three, carry out sintering then, following glaze layer and glazing layer form ground glaze layer jointly behind oversintering, are distributed with bubble in the ground glaze layer equably, particularly descend the bubble in the glaze layer many, pass to matrix with the heat that stops heating resistor to produce better, with the thermal conductivity factor of further reduction ground glaze layer
Four, on ground glaze layer and insulated substrate, adopt modes such as thick film or spraying plating to form electrode cable and heating resistor,
Five, the protective layer that on heating resistor and at least a portion and electrode cable that heating resistor is connected, adopts methods such as thick film or spraying plating to form.
5. the production method of a kind of thermal printing head according to claim 4 is added the diatomite or the materials such as aluminium oxide, silica of an amount of porous in the glaze layer glaze slurry under it is characterized in that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100166491A CN101934637A (en) | 2009-06-30 | 2009-06-30 | Thermal print head and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100166491A CN101934637A (en) | 2009-06-30 | 2009-06-30 | Thermal print head and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101934637A true CN101934637A (en) | 2011-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100166491A Pending CN101934637A (en) | 2009-06-30 | 2009-06-30 | Thermal print head and preparation method thereof |
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| CN (1) | CN101934637A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108025559A (en) * | 2015-09-26 | 2018-05-11 | 京瓷株式会社 | Thermal head and thermo printer |
| CN109484039A (en) * | 2018-12-03 | 2019-03-19 | 山东华菱电子股份有限公司 | A kind of manufacturing method of thermal printing head heating base plate |
| CN110014750A (en) * | 2019-05-10 | 2019-07-16 | 武汉晖印半导体有限公司 | A kind of film thermal printing head that thickness membrane process combines |
| CN111231521A (en) * | 2020-03-24 | 2020-06-05 | 山东华菱电子股份有限公司 | Splicing type thermal printing head capable of improving printing effect at splicing position |
| CN111361295A (en) * | 2020-04-16 | 2020-07-03 | 山东华菱电子股份有限公司 | Thermal printing head substrate of MO heating resistor body and manufacturing method |
| CN114379238A (en) * | 2021-07-02 | 2022-04-22 | 山东华菱电子股份有限公司 | Energy-resistant, corrosion-resistant and wear-resistant thermosensitive printing head heating substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01272783A (en) * | 1988-04-25 | 1989-10-31 | Fujikura Ltd | Enameled base plate and production thereof |
| JPH02212158A (en) * | 1989-02-13 | 1990-08-23 | Rohm Co Ltd | Production of thermal head |
| JPH08192526A (en) * | 1994-11-18 | 1996-07-30 | Fuji Photo Film Co Ltd | Thermal head and production thereof |
| JPH106541A (en) * | 1996-06-21 | 1998-01-13 | Fuji Photo Film Co Ltd | Thermal head and its manufacture |
| WO2006134927A1 (en) * | 2005-06-13 | 2006-12-21 | Rohm Co., Ltd. | Thermal print head |
-
2009
- 2009-06-30 CN CN2009100166491A patent/CN101934637A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01272783A (en) * | 1988-04-25 | 1989-10-31 | Fujikura Ltd | Enameled base plate and production thereof |
| JPH02212158A (en) * | 1989-02-13 | 1990-08-23 | Rohm Co Ltd | Production of thermal head |
| JPH08192526A (en) * | 1994-11-18 | 1996-07-30 | Fuji Photo Film Co Ltd | Thermal head and production thereof |
| JPH106541A (en) * | 1996-06-21 | 1998-01-13 | Fuji Photo Film Co Ltd | Thermal head and its manufacture |
| WO2006134927A1 (en) * | 2005-06-13 | 2006-12-21 | Rohm Co., Ltd. | Thermal print head |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108025559A (en) * | 2015-09-26 | 2018-05-11 | 京瓷株式会社 | Thermal head and thermo printer |
| CN108025559B (en) * | 2015-09-26 | 2019-09-27 | 京瓷株式会社 | Thermal head and thermo printer |
| CN109484039A (en) * | 2018-12-03 | 2019-03-19 | 山东华菱电子股份有限公司 | A kind of manufacturing method of thermal printing head heating base plate |
| CN110014750A (en) * | 2019-05-10 | 2019-07-16 | 武汉晖印半导体有限公司 | A kind of film thermal printing head that thickness membrane process combines |
| CN110014750B (en) * | 2019-05-10 | 2020-07-10 | 沈阳晖印电子科技有限公司 | Thin film thermal printing head combined with thick film process |
| CN111231521A (en) * | 2020-03-24 | 2020-06-05 | 山东华菱电子股份有限公司 | Splicing type thermal printing head capable of improving printing effect at splicing position |
| CN111361295A (en) * | 2020-04-16 | 2020-07-03 | 山东华菱电子股份有限公司 | Thermal printing head substrate of MO heating resistor body and manufacturing method |
| CN111361295B (en) * | 2020-04-16 | 2021-03-16 | 山东华菱电子股份有限公司 | Organometallic compound resistor thermal print head substrate and manufacturing method thereof |
| CN114379238A (en) * | 2021-07-02 | 2022-04-22 | 山东华菱电子股份有限公司 | Energy-resistant, corrosion-resistant and wear-resistant thermosensitive printing head heating substrate |
| WO2023274202A1 (en) * | 2021-07-02 | 2023-01-05 | 山东华菱电子股份有限公司 | Energy-resistant, corrosion-resistant and abrasion-resistant heat-generating substrate of thermal print head |
| CN114379238B (en) * | 2021-07-02 | 2023-02-28 | 山东华菱电子股份有限公司 | Energy-resistant, corrosion-resistant and wear-resistant thermosensitive printing head heating substrate |
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Application publication date: 20110105 |