CN101929983A - Detection method for interlayer combination of PCB product with metal base - Google Patents
Detection method for interlayer combination of PCB product with metal base Download PDFInfo
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- CN101929983A CN101929983A CN 201010262543 CN201010262543A CN101929983A CN 101929983 A CN101929983 A CN 101929983A CN 201010262543 CN201010262543 CN 201010262543 CN 201010262543 A CN201010262543 A CN 201010262543A CN 101929983 A CN101929983 A CN 101929983A
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Abstract
The embodiment of the invention discloses a detection method for the interlayer combination of a PCB product with a metal base. The detection method comprises the following steps of: a, performing transmission mode scanning on the PCB product with the metal base by using ultrasonic scanning equipment; finishing detecting if the PCB product with the metal base has no layered blister phenomenon; and turning to a step b if the PCB product with the metal base has the layered blister phenomenon; and b, performing reflection mode scanning on the PCB product with the metal base by using the ultrasonic scanning equipment; and determining the position of layered blister. In the detection method provided by the embodiment of the invention, the interlayer combination situation of the PCB product with the metal base can be detected accurately and rapidly on the premise of not damaging a sample.
Description
Technical field
The present invention relates to PCB product detection technique field, more particularly, relate to the detection method of combination between a kind of PCB gas producing formation that has a Metal Substrate.
Background technology
The PCB product that has Metal Substrate refers to have with PCB and presses together by adhesive sheet, plays the PCB product of the derby of heat sinking function.The PCB product that has Metal Substrate is compared with common PCB product, has increased the Metal Substrate that combines with the PCB product, plays good heat-radiation effect.Because the thermal expansivity of adhesive sheet and Metal Substrate, PCB differs bigger, in the following process process of PCB product, because the effect of thermal expansion occurs layering easily and bubbles between PCB, adhesive sheet and the adhesive sheet three.Therefore, in the following process process of PCB, need detect, so that choose the substandard product that layering is bubbled combination between the PCB gas producing formation that has Metal Substrate.
In the existing method between general each layer that adopts the mode of cutting into slices to detect the PCB product that has Metal Substrate whether the phenomenon that layering is bubbled appears, concrete testing process is that the PCB product that has Metal Substrate is cut into slices, and section placed under the metaloscope observe, result according to the observation judges the phenomenon whether section exists layering to bubble.
The interlayer of the above-mentioned PCB product that has a Metal Substrate is in conjunction with in the testing process, owing to adopt section is observed, so in the process of making section, sample must be destroyed, can't guarantee the property finished of sample like this, and in the process of section, may exist artificial reason to damage sample, thereby influence is to the testing result of section.In addition, in the above-mentioned testing process, the process cycle of section is long, has influenced the work efficiency that detects.
Summary of the invention
In view of this, the invention provides the detection method of combination between a kind of PCB gas producing formation that has a Metal Substrate, guaranteeing under the prerequisite of not destroying sample, to the interlayer of the PCB product that has Metal Substrate in conjunction with detecting accurately and rapidly.
For achieving the above object, the invention provides following technical scheme:
The detection method of combination between a kind of PCB gas producing formation that has a Metal Substrate may further comprise the steps:
A, employing ultrasonic scanning equipment penetrate mode scanning to the described PCB product that has Metal Substrate, there is not layering foaming phenomenon if having the PCB product of Metal Substrate, then detect and finish, have layering foaming phenomenon, then enter step b if having the PCB product of Metal Substrate;
B, employing ultrasonic scanning equipment carry out reflective-mode scanning to the PCB product that has Metal Substrate, and the position of definite layering foaming.
Preferably, in the detection method of combination, comprised also that before step a the PCB product that will have Metal Substrate is fixed on the monitor station, and be in the center of the sweep limit of ultrasonic scanning equipment between the above-mentioned PCB gas producing formation that has a Metal Substrate.
Preferably, in the detection method of combination, described ultrasonic scanning equipment is ultrasonic scanner between the above-mentioned PCB gas producing formation that has a Metal Substrate.
From above-mentioned technical scheme as can be seen, between the PCB gas producing formation that has Metal Substrate that provides in the embodiment of the invention in the detection method of combination, by ultrasonic scanning equipment the PCB product that has Metal Substrate is penetrated scanning, determine the problem whether this PCB product that has Metal Substrate exists layering to bubble, adopt reflective-mode that the PCB product that has Metal Substrate is scanned then, determine the position that layering is bubbled.Adopt ultrasonic scanning equipment that the PCB product that has Metal Substrate is scanned among the present invention and need not to destroy sample, guaranteed the integrality of detected sample, avoid the problem that wastes time and energy of cutting into slices and being brought in the existing section detection method simultaneously, improved accuracy and efficient that the PCB product that has Metal Substrate is detected.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The process flow diagram of the detection method of combination between the PCB gas producing formation that has Metal Substrate that Fig. 1 provides for the embodiment of the invention.
Embodiment
In order more clearly the scheme that the embodiment of the invention provided to be understood, make an explanation the technical term among the embodiment as follows below:
PCB: printed circuit board.
Metal Substrate: be used for the derby (steel, iron, aluminium block) of PCB thermolysis, general and PCB presses together by adhesive sheet.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
The embodiment of the invention discloses the detection method of combination between a kind of PCB gas producing formation that has a Metal Substrate, realized under the prerequisite of not destroying sample, to the interlayer of the PCB product that has Metal Substrate in conjunction with detecting accurately and rapidly.
Please refer to accompanying drawing 1, the process flow diagram of the detection method of combination between the PCB gas producing formation that has Metal Substrate that Fig. 1 provides for the embodiment of the invention.
The detection method of combination between the PCB gas producing formation that has Metal Substrate that the embodiment of the invention provides may further comprise the steps:
A, employing ultrasonic scanning equipment penetrate mode scanning to the described PCB product that has Metal Substrate, do not have layering foaming phenomenon if having the PCB product of Metal Substrate, then detect and finish; Have layering foaming phenomenon if having the PCB product of Metal Substrate, then enter step b;
B, employing ultrasonic scanning equipment carry out reflective-mode scanning to the PCB product that has Metal Substrate, and the position of definite layering foaming.
The principle of ultrasonic scanning: when ultrasound wave is propagated in medium, can produce acoustic resistance, ultrasound wave is when passing the intersection of medium and medium, because the variation of acoustic resistance, can cause its reflected energy and projectile energy ratio to change, thereby cause the variation of its acknowledge(ment) signal, in software, then can discern significantly with waveform and image.
The PCB product that has Metal Substrate that provides among the present invention penetrates mode scanning, because ultrasound wave can not propagated in cavity, bubble, if have cavity, bubble so have in the PCB product of Metal Substrate, ultrasonic signal can not enter the receiver of product below so, receiver can not produce any waveform yet, and this moment in the image that software forms, have the figure that produces in figure that the place of cavity, bubble produces and the normal region and have very big difference.
When detecting the PCB product higher slice foaming that has Metal Substrate, adopt ultrasonic scanning equipment that the PCB product that has Metal Substrate is carried out reflective-mode scanning, regulate the focal length of the probe of ultrasonic scanning equipment, ultrasonic signal sends from probe, and navigates to adhesive sheet and since have Metal Substrate the PCB product have sticking tablet, Metal Substrate and three layers of medium of PCB, so when carrying out reflective-mode scanning, because medium changes, the transmitted wave of generation is passed back in the probe, feeds back into image.Because ultrasonic propagation needs medium, if when cavity or bubble, reflection wave will produce a bigger waveform, and feedback is shown as this place on image color is different with the color of other normal region, judges the position of cavity or bubble according to the difference of color of image.
Between the PCB gas producing formation that has Metal Substrate that the foregoing description provides in the detection method of combination, comprised also that before step a the PCB product that will have Metal Substrate is fixed on the monitor station, and be in the center of ultrasonic scanning, realize the PCB product that has Metal Substrate is scanned rapidly and accurately.
In the detection method of combination, the ultrasonic scanning device of employing is a ultrasonic scanner between the PCB gas producing formation that has Metal Substrate that provides in the foregoing description.
Each embodiment adopts the mode of going forward one by one to describe in this instructions, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (3)
1. the detection method of combination between a PCB gas producing formation that has a Metal Substrate is characterized in that, may further comprise the steps:
A, employing ultrasonic scanning equipment penetrate mode scanning to the described PCB product that has Metal Substrate, there is not layering foaming phenomenon if having the PCB product of Metal Substrate, then detect and finish, have layering foaming phenomenon, then enter step b if having the PCB product of Metal Substrate;
B, employing ultrasonic scanning equipment carry out reflective-mode scanning to the PCB product that has Metal Substrate, and the position of definite layering foaming.
2. the detection method of combination is characterized in that between the PCB gas producing formation that has a Metal Substrate according to claim 1, comprises also that before step a the PCB product that will have Metal Substrate is fixed on the monitor station, and is in the center of the sweep limit of ultrasonic scanning equipment.
3. the detection method of combination is characterized in that described ultrasonic scanning equipment is ultrasonic scanner between the PCB gas producing formation that has a Metal Substrate according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010262543 CN101929983A (en) | 2010-08-24 | 2010-08-24 | Detection method for interlayer combination of PCB product with metal base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010262543 CN101929983A (en) | 2010-08-24 | 2010-08-24 | Detection method for interlayer combination of PCB product with metal base |
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| Publication Number | Publication Date |
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| CN101929983A true CN101929983A (en) | 2010-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010262543 Pending CN101929983A (en) | 2010-08-24 | 2010-08-24 | Detection method for interlayer combination of PCB product with metal base |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108008280A (en) * | 2017-11-09 | 2018-05-08 | 上海御渡半导体科技有限公司 | A kind of application method of the electric testing agency of pcb board pressing degree |
| CN108872380A (en) * | 2018-06-04 | 2018-11-23 | 航天特种材料及工艺技术研究所 | The bonding defect detecting method of multi-layer bonded component |
| CN113295768A (en) * | 2021-04-30 | 2021-08-24 | 生益电子股份有限公司 | Hole filling hole detection method, system and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04265855A (en) * | 1991-02-20 | 1992-09-22 | Kawasaki Steel Corp | Method and apparatus for evaluating bonded state of ceramics metal laminated substrate |
| CN1303579A (en) * | 1998-05-28 | 2001-07-11 | 西门子公司 | Method and device for linear positioning and position detection of substrate |
| EP1484608A2 (en) * | 2003-06-05 | 2004-12-08 | EADS Deutschland GmbH | Damage determination of test objects by permanently attached ultrasonic sensors with integrated control circuitry |
-
2010
- 2010-08-24 CN CN 201010262543 patent/CN101929983A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04265855A (en) * | 1991-02-20 | 1992-09-22 | Kawasaki Steel Corp | Method and apparatus for evaluating bonded state of ceramics metal laminated substrate |
| CN1303579A (en) * | 1998-05-28 | 2001-07-11 | 西门子公司 | Method and device for linear positioning and position detection of substrate |
| EP1484608A2 (en) * | 2003-06-05 | 2004-12-08 | EADS Deutschland GmbH | Damage determination of test objects by permanently attached ultrasonic sensors with integrated control circuitry |
Non-Patent Citations (1)
| Title |
|---|
| 《印刷电路信息》 20091231 江京 金属基产品的可靠性检测与分析 , 第z1期 2 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108008280A (en) * | 2017-11-09 | 2018-05-08 | 上海御渡半导体科技有限公司 | A kind of application method of the electric testing agency of pcb board pressing degree |
| CN108008280B (en) * | 2017-11-09 | 2020-05-12 | 上海御渡半导体科技有限公司 | Use method of electrical detection mechanism for PCB pressing degree |
| CN108872380A (en) * | 2018-06-04 | 2018-11-23 | 航天特种材料及工艺技术研究所 | The bonding defect detecting method of multi-layer bonded component |
| CN108872380B (en) * | 2018-06-04 | 2021-10-22 | 航天特种材料及工艺技术研究所 | Method for detecting bonding defect of multilayer bonding member |
| CN113295768A (en) * | 2021-04-30 | 2021-08-24 | 生益电子股份有限公司 | Hole filling hole detection method, system and device |
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Open date: 20101229 |