CN101917825B - 光电组件与主印制电路板连接方法及连接器件 - Google Patents
光电组件与主印制电路板连接方法及连接器件 Download PDFInfo
- Publication number
- CN101917825B CN101917825B CN2010102368467A CN201010236846A CN101917825B CN 101917825 B CN101917825 B CN 101917825B CN 2010102368467 A CN2010102368467 A CN 2010102368467A CN 201010236846 A CN201010236846 A CN 201010236846A CN 101917825 B CN101917825 B CN 101917825B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- receiving end
- making
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005476 soldering Methods 0.000 claims abstract description 14
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 2
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 238000005336 cracking Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102368467A CN101917825B (zh) | 2010-07-26 | 2010-07-26 | 光电组件与主印制电路板连接方法及连接器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102368467A CN101917825B (zh) | 2010-07-26 | 2010-07-26 | 光电组件与主印制电路板连接方法及连接器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101917825A CN101917825A (zh) | 2010-12-15 |
CN101917825B true CN101917825B (zh) | 2011-12-07 |
Family
ID=43325176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102368467A Expired - Fee Related CN101917825B (zh) | 2010-07-26 | 2010-07-26 | 光电组件与主印制电路板连接方法及连接器件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101917825B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105431006B (zh) * | 2015-11-27 | 2019-01-22 | 武汉光迅科技股份有限公司 | 一种低成本的光电模块 |
CN109729644B (zh) * | 2017-10-27 | 2022-04-29 | 中兴通讯股份有限公司 | 一种光组件在板装置、其装配方法及在板设计装置 |
CN114096142A (zh) * | 2021-12-07 | 2022-02-25 | 华东光电集成器件研究所 | 一种to-247ac封装形式元器件的批量自动贴片托盘 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0938007A2 (en) * | 1998-02-23 | 1999-08-25 | Sumitomo Electric Industries, Ltd. | LD/PD module and LED/PD module |
CN101631428A (zh) * | 2009-08-18 | 2010-01-20 | 成都优博创技术有限公司 | 一种光收发器件与印制电路板的连接方法和装置 |
CN101646311A (zh) * | 2009-09-10 | 2010-02-10 | 成都优博创技术有限公司 | 实现光收发器件与主印制电路板连接的方法和装置 |
CN101652031A (zh) * | 2009-08-26 | 2010-02-17 | 成都优博创技术有限公司 | 可靠连接光收发器件桥接印制电路板的方法与定位组件 |
-
2010
- 2010-07-26 CN CN2010102368467A patent/CN101917825B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0938007A2 (en) * | 1998-02-23 | 1999-08-25 | Sumitomo Electric Industries, Ltd. | LD/PD module and LED/PD module |
CN101631428A (zh) * | 2009-08-18 | 2010-01-20 | 成都优博创技术有限公司 | 一种光收发器件与印制电路板的连接方法和装置 |
CN101652031A (zh) * | 2009-08-26 | 2010-02-17 | 成都优博创技术有限公司 | 可靠连接光收发器件桥接印制电路板的方法与定位组件 |
CN101646311A (zh) * | 2009-09-10 | 2010-02-10 | 成都优博创技术有限公司 | 实现光收发器件与主印制电路板连接的方法和装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101917825A (zh) | 2010-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101917825B (zh) | 光电组件与主印制电路板连接方法及连接器件 | |
CN203241580U (zh) | 一种具有硅基光学基座的光电模块 | |
CN103323921A (zh) | 一种高密集型的并行传输光器件 | |
CN202995094U (zh) | 一种易于封装的并行传输光器件 | |
CN201887179U (zh) | 含有usb接口的电子产品及usb模组 | |
CN204885655U (zh) | 用于自动化测试的模块化插头 | |
CN108907399A (zh) | 用于5g sfp封装类光收发模块焊接的一体化夹具及焊接方法 | |
CN110764196B (zh) | 用于光纤阵列与平面光波导耦合的无导销可插拔对准结构 | |
CN101646311B (zh) | 实现光收发器件与主印制电路板连接的方法和装置 | |
CN208728872U (zh) | 一种用于5g sfp封装类光收发模块焊接的一体化夹具 | |
CN209462693U (zh) | 一种网络模块用线路板 | |
CN201163699Y (zh) | Pcb测试用密度转换器 | |
CN201273946Y (zh) | 单纤双向三端收发组件装置 | |
CN106131380B (zh) | 一种一体化摄像模组及其一体化方法 | |
CN212540794U (zh) | 一种直连式光模块 | |
CN205786708U (zh) | 一种pcba测试针板 | |
CN206758677U (zh) | 一种obd连接结构和obd车载终端 | |
CN210222161U (zh) | 一种用于光通信激光器测试的软带 | |
CN201294295Y (zh) | 一种新型的hdmi连接器插头 | |
CN201038521Y (zh) | 多功能rj45类连接器结构 | |
CN111999828A (zh) | 一种直连式光模块及其装配方法 | |
CN202145703U (zh) | 一种柔性线路板 | |
CN101605002B (zh) | 消除高速差分通道连接器影响的方法及装置 | |
CN201048205Y (zh) | 新型多功能rj45类连接器结构 | |
CN207352218U (zh) | 一种双端面光纤阵列 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SICHUAN SUPERXON INFORMATION TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SUPERXON TECHNOLOGY (CHENGDU) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 7, No. 216, No. 610041 South City Road, Chengdu hi tech Zone, Sichuan, 101, 201 Patentee after: SICHUAN SUPERXON INFORMATION TECHNOLOGY Co.,Ltd. Address before: 7, No. 216, No. 610041 South City Road, Chengdu hi tech Zone, Sichuan, 101, 201 Patentee before: Superxon (Chengdu) Technology Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 7, No. 216, No. 610041 South City Road, Chengdu hi tech Zone, Sichuan, 101, 201 Patentee after: Nine letter asset management Limited by Share Ltd. Address before: 7, No. 216, No. 610041 South City Road, Chengdu hi tech Zone, Sichuan, 101, 201 Patentee before: SICHUAN SUPERXON INFORMATION TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20160708 Address after: 610041, D, 7, Tianfu Software Park, Chengdu hi tech Zone, Sichuan, 201 Patentee after: CHENGDU SUPERXON INFORMATION TECHNOLOGY Co.,Ltd. Address before: 7, No. 216, No. 610041 South City Road, Chengdu hi tech Zone, Sichuan, 101, 201 Patentee before: Nine letter asset management Limited by Share Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20180726 |
|
CF01 | Termination of patent right due to non-payment of annual fee |